CN207217530U - A kind of electrical integrated module of LED light - Google Patents
A kind of electrical integrated module of LED light Download PDFInfo
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- CN207217530U CN207217530U CN201721233676.0U CN201721233676U CN207217530U CN 207217530 U CN207217530 U CN 207217530U CN 201721233676 U CN201721233676 U CN 201721233676U CN 207217530 U CN207217530 U CN 207217530U
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Abstract
The utility model discloses a kind of electrical integrated module of LED light, including light-source encapsulation area（1）, drive circuit encapsulation region（2）, input line pad（3）, circuit board cable-through hole（4）, it is characterised in that：The circuit board cable-through hole（4）It is arranged at circuit board center, the light-source encapsulation area（1）, drive circuit encapsulation region（2）, input line pad（3）It is all disposed within circuit board, the light-source encapsulation area（1）Place is provided with light source chip, the drive circuit encapsulation region（2）Chip of the place provided with driving element, the input line pad（3）Bonding wire is provided with, the bonding wire is gold thread or aluminum steel.The utility model uses COB packaging technologies, directly by light source wafer package on ceramic substrate, drive circuit also all using device wafer directly and light source wafer package on a circuit board, eliminate secondary encapsulation and device timbering material, it is low with cost, simple flow is encapsulated, the advantages that small volume.
Description
Technical field
It the utility model is related to LED technology field, more particularly to a kind of electrical integrated module of LED light.
Background technology
LED（Light Emitting Diode, light emitting diode）It is that a kind of can convert electrical energy into consolidating for visible ray
During the semiconductor of state, electric energy directly can be converted into luminous energy by it.LED extensively should as a kind of new lighting source material
With.In field of LED illumination, the luminous efficiency of the encapsulation technology and method of LED matrix to light emitting diode（Light extraction efficiency）Rise
The effect crucial to one.In the prior art to the encapsulation technology for the luminous efficiency for improving illuminating high-power LED device
It can substantially be divided into method following several：
First, can be carried in this way in limited scope as raw material directly using the higher LED of luminous efficiency
The luminous efficiency of the high lighting device, but each LED luminous efficiency is limited after all, and from the high LED institutes band of luminous efficiency
The use cost come uprises simultaneously；
Two：Using smearing bulky grain fluorescent material as substrate, but bulky grain fluorescent material easily precipitates, so as to cause hot spot
Step one, makes the color temperature difference of LED light device than more serious；
Three：Using external all kinds of drive circuits, so that the being consistent property of electric current that each light emitting diode is received, so as to protect
The uniformity of the color colour temperature of LED light device is demonstrate,proved, adopts this method, is to connect one again in addition in the outside of LED light device
Drive circuit component, drive circuit component include all kinds of drive circuits, so not only need secondary encapsulation, and also need to circuit
The materials such as the mounting bracket of plate so that the monnolithic case of LED light device is huge, and encapsulation flow is cumbersome, also wastes substantial amounts of
Raw material, it is unfavorable for large batch of production and use.
In summary, also there is many weak points in prior art, up for further improving.
Utility model content
Technical problem to be solved in the utility model is to provide one kind and uses COB packaging technologies, directly by light source chip
Be encapsulated on ceramic substrate, drive circuit also all using device wafer directly and light source wafer package on a circuit board,
Secondary encapsulation and device timbering material are eliminated, has cost low, encapsulates simple flow, the LED photovoltaic one the advantages that small volume
Body module.
In order to solve the above technical problems, the utility model provides a kind of electrical integrated module of LED light, including light-source encapsulation
Area, drive circuit encapsulation region, input line pad, circuit board cable-through hole, it is characterised in that：The circuit board cable-through hole is arranged on electricity
At the plate center of road, the light-source encapsulation area, drive circuit encapsulation region, input line pad are all disposed within circuit board, the light source
It is provided with light source chip at encapsulation region, is provided with the chip of driving element at the drive circuit encapsulation region, on the input line pad
Provided with bonding wire, the bonding wire is gold thread or aluminum steel.
The electrical integrated module of LED light of the present utility model, including following packaging technology flow：
(1) printed wire and high temperature sintering；The required circuit of circuit board is printed on ceramic substrate or aluminium base,
Solidified on circuit boards by printed circuit by high temperature sintering；
(2) light source and driving element die bond；The chip of light source chip and driving element is fixed on circuit boards；
(3) bonding wire；With gold thread or the both positive and negative polarity of aluminum steel connection chip both positive and negative polarity and circuit connection；
(4) box dam glue is applied；Punctuated with point gum machine inside and outside light-source encapsulation area box dam glue；
(5) fluorescent glue is applied；With point gum machine fluorescent glue is applied in light-source encapsulation area；
(6) heat conductive silica gel is applied；With point gum machine heat conductive silica gel is applied in driving encapsulation region；
(7) toast；Circuit board is sent to make various glue coagulation formings to high temperature oven；
(8) encapsulated moulding；Surface treatment and identification printing shaping.
Compared with prior art, the beneficial effects of the utility model are：
The utility model solves the problems such as existing LED lamp scheme cost is high, packaging technology is complicated, short life, and this one
Body LED photovoltaic module includes the parts such as light-source encapsulation area, drive circuit encapsulation region, input line pad, realizes high integration
Optoelectronic integration module, light source uses COB packaging technologies in the design method, directly by light source wafer package in ceramic substrate
On, drive circuit also all using device wafer directly and light source wafer package on a circuit board, eliminate secondary encapsulation
With device timbering material, cost is greatly lowered, and encapsulates simple flow, and volume also significantly reduces, and whole LED light source eliminates
One layer of thermal resistance, reduce the junction temperature of LED light source so that LED light source luminous efficiency greatly improves, and light source and driving integration
Design method, the special position for placing driving is eliminated when designing whole lamp, facilitates the appearance design of light fixture, mounting process letter
Change, whole lamp installation and production cost are greatly reduced, and are adapted to high-volume automated production.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is overall package process flow diagram of the present utility model.
Label in figure：
1- light-source encapsulations area 2- drive circuits encapsulation region
3- input line pad 4- circuit board cable-through holes.
Embodiment
Below to being elaborated with reference to accompanying drawing to preferred embodiment of the present utility model, so that the advantages of the utility model
It can be easier to be readily appreciated by one skilled in the art with feature, it is apparent clear and definite so as to be made to the scope of protection of the utility model
Define.
It is shown in Figure 1, a kind of electrical integrated module of LED light, including it is light-source encapsulation area 1, drive circuit encapsulation region 2, defeated
Entering wire bonding disk 3, circuit board cable-through hole 4, the circuit board cable-through hole 4 is arranged at circuit board center, the light-source encapsulation area 1,
Drive circuit encapsulation region 2, input line pad 3 are all disposed within circuit board, and light source chip, institute are provided with the light-source encapsulation area 1
The chip that driving element is provided with drive circuit encapsulation region 2 is stated, the input line pad 1 is provided with bonding wire, and the bonding wire is gold
Line or aluminum steel.
Shown in Figure 2, the electrical integrated module of LED light of the present utility model uses COB packaging technologies, including following encapsulation
Technological process：
(1) printed wire and high temperature sintering；The required circuit of circuit board is printed on ceramic substrate or aluminium base,
Solidified on circuit boards by printed circuit by high temperature sintering；
(2) light source and driving element die bond；The chip of light source chip and driving element is fixed on circuit boards；
(3) bonding wire；With gold thread or the both positive and negative polarity of aluminum steel connection chip both positive and negative polarity and circuit connection；
(4) box dam glue is applied；Punctuated with point gum machine inside and outside light-source encapsulation area box dam glue；
(5) fluorescent glue is applied；With point gum machine fluorescent glue is applied in light-source encapsulation area；
(6) heat conductive silica gel is applied；With point gum machine heat conductive silica gel is applied in driving encapsulation region；
(7) toast；Circuit board is sent to make various glue coagulation formings to high temperature oven；
(8) encapsulated moulding；Surface treatment and identification printing shaping.
To sum up shown, the utility model uses COB packaging technologies, directly by light source wafer package on ceramic substrate, drives
Dynamic circuit also all using device wafer directly and light source wafer package on a circuit board, eliminate secondary encapsulation and device
Timbering material, have cost low, simple flow is encapsulated, the advantages that small volume.
Better embodiment of the present utility model is the foregoing is only, the scope of protection of the utility model is not with above-mentioned reality
The mode of applying is limited, as long as equivalent modification that those of ordinary skill in the art are made according to the utility model disclosure or change
Change, should all include in the protection domain described in claims.
Claims (4)
1. a kind of electrical integrated module of LED light, including light-source encapsulation area（1）, drive circuit encapsulation region（2）, input line pad
（3）, circuit board cable-through hole（4）, it is characterised in that：The circuit board cable-through hole（4）It is arranged at circuit board center, the light source
Encapsulation region（1）, drive circuit encapsulation region（2）, input line pad（3）It is all disposed within circuit board, the light-source encapsulation area（1）Place
Provided with light source chip, the drive circuit encapsulation region（2）Chip of the place provided with driving element, the input line pad（3）On set
There is bonding wire, the bonding wire is gold thread or aluminum steel.
A kind of 2. electrical integrated module of LED light according to claim 1, it is characterised in that：The light-source encapsulation area（1）Place
Scribble fluorescent glue.
A kind of 3. electrical integrated module of LED light according to claim 1, it is characterised in that：The drive circuit encapsulation region
（2）Place scribbles heat conductive silica gel.
A kind of 4. electrical integrated module of LED light according to claim 1, it is characterised in that：The light source chip and driving
The chip of device all encapsulates on a circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721233676.0U CN207217530U (en) | 2017-09-25 | 2017-09-25 | A kind of electrical integrated module of LED light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721233676.0U CN207217530U (en) | 2017-09-25 | 2017-09-25 | A kind of electrical integrated module of LED light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207217530U true CN207217530U (en) | 2018-04-10 |
Family
ID=61822998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721233676.0U Active CN207217530U (en) | 2017-09-25 | 2017-09-25 | A kind of electrical integrated module of LED light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207217530U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108986669A (en) * | 2018-09-18 | 2018-12-11 | 武汉华星光电技术有限公司 | Display panel and its manufacturing method |
-
2017
- 2017-09-25 CN CN201721233676.0U patent/CN207217530U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108986669A (en) * | 2018-09-18 | 2018-12-11 | 武汉华星光电技术有限公司 | Display panel and its manufacturing method |
| CN108986669B (en) * | 2018-09-18 | 2024-01-30 | 武汉华星光电技术有限公司 | Display panel and manufacturing method thereof |
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