CN103094454B - A kind of method for packing of LED matrix - Google Patents
A kind of method for packing of LED matrix Download PDFInfo
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- CN103094454B CN103094454B CN201310004021.6A CN201310004021A CN103094454B CN 103094454 B CN103094454 B CN 103094454B CN 201310004021 A CN201310004021 A CN 201310004021A CN 103094454 B CN103094454 B CN 103094454B
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Abstract
The present invention relates to a kind of method for packing of LED matrix, comprise the following steps, light-source encapsulation: adopt COB packaging technology to be encapsulated in by LED light source in light-source encapsulation district; Drive circuit encapsulates: by the drive circuit encapsulation region on all for drive circuit original papers also direct packaged light source circuit board; Input line pad: input line pad is printed on cable-through hole two ends, conveniently welds input power cord; Light-source encapsulation district and drive circuit encapsulation region fixing: drive circuit encapsulation region is fixed in light-source encapsulation district, the main body of composition LED matrix.This method for packing achieves the optoelectronic integration module of high integration, in this method for designing, light source adopts COB packaging technology, eliminate secondary encapsulation and device timbering material, cost significantly reduces, and encapsulation simple flow, volume also significantly reduces, LED light source luminous efficiency is improved, and the method for designing of light source and driving integration, special position of placing driving is eliminated when whole lamp is designed, mounting process simplifies, and whole lamp is installed and production cost significantly reduces, and is applicable to automated production in enormous quantities.
Description
Technical field
The present invention relates to field of LED illumination, particularly a kind of method for packing of LED matrix.
Background technology
LED(Light Emitting Diode, light-emitting diode) be a kind of by electric energy conversion can be the solid-state semiconductor of visible ray during, it can be directly luminous energy electric energy conversion.LED is widely used as a kind of new lighting source material.In field of LED illumination, the encapsulation technology of LED matrix and the luminous efficiency (light extraction efficiency) of method to light-emitting diode serve a crucial effect.Roughly can be divided into following several to the encapsulation technology of the luminous efficiency of the illuminating high-power LED device of raising and method in prior art:
One, directly adopt the LED that luminous efficiency is higher as raw material, adopt the luminous efficiency that can improve this lighting device in this way in limited scope, but the luminous efficiency of each LED is limited after all, and the use cost that the LED selecting luminous efficiency high brings uprises simultaneously;
Two: adopt and smear bulky grain fluorescent material as substrate, but bulky grain fluorescent material easily precipitates, thus cause hot spot to walk one, make the color temperature difference of LED light device more serious;
Three: adopt external all kinds of drive circuit, keep consistency with the electric current making each light-emitting diode receive, thus ensure the consistency of the color colour temperature of LED light device, adopt this kind of method, connect one drive circuit parts more in addition in the outside of LED light device, drive circuit parts include all kinds of drive circuit, so not only need secondary encapsulation, but also need the materials such as the mounting bracket of circuit board, make the monnolithic case of LED light device huge, and encapsulation flow process is loaded down with trivial details, also wastes a large amount of raw material, is unfavorable for large batch of production and use.
In sum, also there is a lot of weak points in prior art, awaits further improving.
Summary of the invention
The object of the invention is to solve prior art Problems existing, especially solve LED matrix in prior art and, in encapsulation process, cause the problem that luminous efficiency is low, encapsulation flow process is loaded down with trivial details, waste of raw materials is serious.
For reaching above object, the present invention adopts following technical scheme to be achieved:
A method for packing for LED matrix, comprises the following steps:
The encapsulation of light source: adopt COB packaged type to be directly encapsulated in the light-source encapsulation district of ceramic substrate LED light source wafer;
The encapsulation of drive circuit: directly adopt bare chip to be encapsulated in the drive circuit encapsulation region of ceramic substrate all for drive circuit devices;
The setting of input line pad: input line pad adopts printed wire technique, is directly printed on the input line pad locations of ceramic substrate;
The setting of circuit board cable-through hole: open position, a hole in the middle of ceramic substrate, from then on input power cord is passed position, hole, is connected on input line pad.
Further, in the encapsulation step of described light source, directly COB packaging technology is adopted to be bundled on the circuit of ceramic substrate LED light source wafer, then in the line pad on the terminals of routing connecting wafer and ceramic substrate, after light source wafer die bond, routing complete in light-source encapsulation region with fluorescent glue on point gum machine point.
Further, in the encapsulation step of described drive circuit, the all devices of drive circuit adopt bare chip, the circuit of drive circuit is printed in the drive circuit encapsulation region of ceramic substrate, the bare chip of driving element is directly bundled on ceramic substrate, then routing, device pin terminals and line pad are coupled together, after driving element has been bound, drive circuit packaging area is fixed.
Further, when drive circuit packaging area is fixed, ability point gum machine is fixed it.
Further, described point gum machine adopts heat conductive silica gel, heat-conducting resin glue or anti-clone's glue to be fixed.
The invention discloses a kind of method for packing of LED matrix, LED matrix is divided into light-source encapsulation district by this method for packing, drive circuit encapsulation region, the parts such as input line pad, achieve the optoelectronic integration module of high integration, in this method for designing, light source adopts COB packaging technology, directly by light source wafer package on ceramic substrate, drive circuit also all adopt device wafer directly and light source wafer package on a circuit board, eliminate secondary encapsulation and device timbering material, cost significantly reduces, and encapsulation simple flow, volume also significantly reduces, whole LED light source eliminates one deck thermal resistance, reduce the junction temperature of LED light source, LED light source luminous efficiency is improved high, and the method for designing of light source and driving integration, special position of placing driving is eliminated when whole lamp is designed, facilitate the appearance design of light fixture, mounting process simplifies, whole lamp is installed and production cost significantly reduces, be applicable to automated production in enormous quantities.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the block diagram of embodiment provided by the present invention.
Fig. 2 is the overall package schematic layout pattern of embodiment provided by the present invention.
Fig. 3 is the overall package FB(flow block) of embodiment provided by the present invention.
Drawing reference numeral explanation
1-light-source encapsulation district; 2-drive circuit encapsulation region; 3-input line pad;
4-circuit board cable-through hole.
Embodiment
For making the object of the embodiment of the present invention, technical scheme and advantage clearly, below in conjunction with the embodiment of the present invention and accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described.It should be noted that, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not paying the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described.
As depicted in figs. 1 and 2, a kind of method for packing of LED matrix, comprising:
The encapsulation of light source: adopt COB packaged type to be directly encapsulated in the light-source encapsulation district 1 of ceramic substrate LED light source wafer;
The encapsulation of drive circuit: directly adopt bare chip to be encapsulated in the drive circuit encapsulation region 2 of ceramic substrate all for drive circuit devices;
The setting of input line pad 3: input line pad 3 adopts printed wire technique, is directly printed on input line pad 3 position of ceramic substrate;
The setting of circuit board cable-through hole 4: open position, a hole in the middle of ceramic substrate, from then on input power cord is passed position, hole, is connected on input line pad 3.
As preferably, in the encapsulation step of described light source, directly COB packaging technology is adopted to be bundled on the circuit of ceramic substrate LED light source wafer, then on the input line pad 3 on the terminals of routing connecting wafer and ceramic substrate, after light source wafer die bond, routing complete in light-source encapsulation district 1 with fluorescent glue on point gum machine point.
As preferably, in the encapsulation step of described drive circuit, the all devices of drive circuit adopt bare chip, the circuit of drive circuit is printed in the drive circuit encapsulation region 2 of ceramic substrate, the bare chip of driving element is directly bundled on ceramic substrate, then routing, device pin terminals and input line pad 3 are coupled together, after driving element has been bound, drive circuit encapsulation region 2 is fixed.
As preferably, when drive circuit encapsulation region 2 is fixed, ability point gum machine is fixed it.
As preferably, described point gum machine adopts heat conductive silica gel, heat-conducting resin glue or anti-clone's glue to be fixed.
Principle, the method that the present embodiment provides is set forth above, below in conjunction with an instantiation, the method that the present embodiment provides is described in detail:
As shown in Figure 3, the encapsulation that the present embodiment provides can be divided into following steps in detail:
Printed wire and high temperature sintering: be printed on by the circuit required for circuit board on ceramic substrate or aluminium base, by high temperature sintering, allow printed circuit solidify on circuit boards;
Light source and driving element die bond: by fixing on circuit boards for the wafer of light source wafer and driving element.
Bonding wire: with the both positive and negative polarity of gold thread or aluminum steel connecting wafer both positive and negative polarity and circuit connection.
Be coated with box dam glue: to punctuate inside and outside light-source encapsulation district 1 box dam glue with point gum machine.
Be coated with fluorescent glue: be coated with fluorescent glue with point gum machine in light-source encapsulation district 1.
Be coated with heat conductive silica gel: be coated with heat conductive silica gel with point gum machine in driving encapsulation region 2.
Baking: send circuit board to high temperature oven, make various glue coagulation forming.
Encapsulated moulding: surface treatment and identification printing shaping.
Compared with prior art, the invention discloses a kind of method for packing of LED matrix, LED matrix is divided into light-source encapsulation district by this method for packing, drive circuit encapsulation region, the parts such as input line pad, achieve the optoelectronic integration module of high integration, in this method for designing, light source adopts COB packaging technology, directly by light source wafer package on ceramic substrate, drive circuit also all adopt device wafer directly and light source wafer package on a circuit board, eliminate secondary encapsulation and device timbering material, cost significantly reduces, and encapsulation simple flow, volume also significantly reduces, whole LED light source eliminates one deck thermal resistance, reduce the junction temperature of LED light source, LED light source luminous efficiency is improved high, and the method for designing of light source and driving integration, special position of placing driving is eliminated when whole lamp is designed, facilitate the appearance design of light fixture, mounting process simplifies, whole lamp is installed and production cost significantly reduces, be applicable to automated production in enormous quantities.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (1)
1. a method for packing for LED matrix, is characterized in that, comprises the following steps:
The encapsulation of light source: adopt COB packaging technology to be bundled on the circuit of ceramic substrate LED light source wafer, then in the line pad on the terminals of routing connecting wafer and ceramic substrate, after light source wafer die bond, routing complete, in light-source encapsulation region, be coated with fluorescent glue with point gum machine, be coated with box dam glue in the outer ring in light-source encapsulation district with point gum machine;
The encapsulation of drive circuit: all devices of drive circuit adopt bare chip, the circuit of drive circuit is printed in the drive circuit encapsulation region of ceramic substrate, the bare chip of driving element is directly bundled on ceramic substrate, then routing, device pin terminals and line pad are coupled together, after driving element has been bound, be fixed drive circuit encapsulation region with point gum machine, point gum machine adopts heat conductive silica gel, heat-conducting resin glue or anti-clone's glue to be fixed; The setting of input line pad: input line pad adopts printed wire technique, by high temperature sintering, printed circuit is solidificated in the input line pad locations of ceramic substrate;
The setting of circuit board cable-through hole: open position, a hole in the middle of ceramic substrate, from then on input power cord is passed position, hole, is connected on input line pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310004021.6A CN103094454B (en) | 2013-01-06 | 2013-01-06 | A kind of method for packing of LED matrix |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310004021.6A CN103094454B (en) | 2013-01-06 | 2013-01-06 | A kind of method for packing of LED matrix |
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| Publication Number | Publication Date |
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| CN103094454A CN103094454A (en) | 2013-05-08 |
| CN103094454B true CN103094454B (en) | 2015-10-21 |
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| CN201310004021.6A Expired - Fee Related CN103094454B (en) | 2013-01-06 | 2013-01-06 | A kind of method for packing of LED matrix |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103346247B (en) * | 2013-06-18 | 2018-09-28 | 上海鼎晖科技股份有限公司 | A kind of flexibility COB encapsulation LED and preparation method thereof |
| CN103311419A (en) * | 2013-06-24 | 2013-09-18 | 量一光电科技(惠州)有限公司 | Method of improving lighting effect of COB (chip on board) light source |
| CN103400930A (en) * | 2013-07-23 | 2013-11-20 | 沈阳利昂电子科技有限公司 | High-efficiency wide-optical angle LED (Light-Emitting Diode) module silicone lens structure and manufacturing method |
| CN103779347B (en) * | 2013-09-26 | 2017-03-22 | 深圳市迈克光电子科技有限公司 | High-brightness dimmable COB light source, spot lamp COB process and fluorescent lamp COB process |
| CN103594464A (en) * | 2013-11-25 | 2014-02-19 | 广东威创视讯科技股份有限公司 | COB packaging structure of light-emitting diode |
| CN104702340A (en) * | 2015-02-15 | 2015-06-10 | 长芯盛（武汉）科技有限公司 | Optical transmission terminal |
| CN105609620B (en) * | 2015-11-26 | 2018-08-28 | 东莞市盈伸电子科技有限公司 | A kind of preparation method of LED light engine encapsulating structure |
| CN106195659B (en) * | 2016-07-27 | 2020-03-20 | 佛山市国星光电股份有限公司 | COB light source, integrated module and lamp |
| CN110290650A (en) * | 2019-05-14 | 2019-09-27 | 广州视源电子科技股份有限公司 | LED lamp panel and packaging method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214649A (en) * | 2011-05-25 | 2011-10-12 | 映瑞光电科技(上海)有限公司 | LED (light-emitting diode) packaging structure and manufacturing method thereof |
| CN102395236A (en) * | 2011-11-30 | 2012-03-28 | 陈卫平 | LED (light-emitting diode) lamp panel adopting COB (Chip On Board) technology |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006212825A (en) * | 2005-02-01 | 2006-08-17 | Oki Data Corp | Wiring board and led head |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214649A (en) * | 2011-05-25 | 2011-10-12 | 映瑞光电科技(上海)有限公司 | LED (light-emitting diode) packaging structure and manufacturing method thereof |
| CN102395236A (en) * | 2011-11-30 | 2012-03-28 | 陈卫平 | LED (light-emitting diode) lamp panel adopting COB (Chip On Board) technology |
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