CN203589064U - Integrated device for automatically pouring LED packaging adhesive and discharging material - Google Patents
Integrated device for automatically pouring LED packaging adhesive and discharging material Download PDFInfo
- Publication number
- CN203589064U CN203589064U CN201320660024.0U CN201320660024U CN203589064U CN 203589064 U CN203589064 U CN 203589064U CN 201320660024 U CN201320660024 U CN 201320660024U CN 203589064 U CN203589064 U CN 203589064U
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- China
- Prior art keywords
- unit
- blanking
- discharging
- led packaging
- conveyer
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- Expired - Lifetime
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 238000007599 discharging Methods 0.000 title claims abstract description 13
- 239000000463 material Substances 0.000 title claims abstract description 11
- 239000000853 adhesive Substances 0.000 title abstract description 4
- 230000001070 adhesive effect Effects 0.000 title abstract description 4
- 239000003292 glue Substances 0.000 claims description 30
- 238000000016 photochemical curing Methods 0.000 claims description 25
- 230000010354 integration Effects 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 230000007613 environmental effect Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000004026 adhesive bonding Methods 0.000 abstract 6
- 238000003848 UV Light-Curing Methods 0.000 abstract 5
- 239000000047 product Substances 0.000 description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000004020 luminiscence type Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000011265 semifinished product Substances 0.000 description 6
- 239000000741 silica gel Substances 0.000 description 6
- 229910002027 silica gel Inorganic materials 0.000 description 6
- 238000012536 packaging technology Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000001723 curing Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- -1 by mechanical arm Substances 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
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Abstract
The utility model discloses an integrated device for automatically pouring LED packaging adhesive and discharging material. The apparatus comprises a machine box, a gluing unit, a UV-light curing unit, and a discharging unit, wherein the gluing unit, the UV-light curing unit, and the discharging unit are all installed in the machine box and are in mutual cooperation. The UV-light curing unit is arranged between the gluing unit and the discharging unit. The gluing unit corresponds to the charging port of the machine box and the discharging unit corresponds to the discharging port of the machine box. Every two of the gluing unit, the UV-light curing unit, and the discharging unit are connected via a conveying device on which a clamp used for clamping material or products is installed. The integrated device combines and assembles the gluing unit, the UV-light curing unit, and the discharging unit together to form integrated assembling design. Therefore, the integrated device greatly saves space occupied by an entire structure, achieves high automation degree, high work efficiency, and energy reduction and environmental friendliness, and is beneficial to decrease in production cost and increase in market competitiveness so as to be capable of satisfying the requirement of modern development.
Description
Technical field:
The utility model relates to LED sealed in unit technical field, refers in particular to a kind of integral type assembling design, environmental protection, energy-conservation, and can effectively enhance productivity and automation LED packaging plastic embedding and the blanking integration apparatus of the quality of production.
Background technology:
Along with day by day manifesting of the energy and environmental problem, Energy Saving Industry and products thereof more and more comes into one's own, and the energy-saving effect of semiconductor diode (LED) illumination is recognized.
LED (Light Emitting Diode, light-emitting diode) is a kind of solid-state semiconductor device that can be visible ray by electric energy conversion, and it can be directly luminous energy electric energy conversion.LED is being widely used as a kind of new lighting source material.And LED encapsulation technology has played a very crucial effect to the light extraction efficiency of light-emitting diode.
Traditional LED packaging technology, generally comprises step and is: die bond, hot curing, bonding wire, some glue, hot curing moulding.In die bond step, refer to the crystal bonding area point crystal-bonding adhesive on a support, and then luminescence chip is positioned in crystal bonding area, wherein, some glue crystal-bonding adhesive used is heat reactive resin.In thermal cure step, the above-mentioned support that is placed with luminescence chip is placed in an oven heat and is toasted, the temperature of oven heat is 150 ℃, baking time is at least 60 minutes, and heat reactive resin is solidified, and can make luminescence chip firmly be connected with support.In bonding wire step, utilize bonding equipment that the utmost point of luminescence chip is connected by plain conductor with the utmost point of support.In a glue step, be all generally in LED semi-finished product, on luminescence chip, to make luminescence chip by gel coated silica gel (silica gel) embedding; In last hot curing forming step, there are the LED semi-finished product of silica gel to be placed in an oven heat above-mentioned embedding and toast, the temperature of oven heat is 150 ℃, baking time is 120~300 minutes, and hot silica gel is solidified, and forms LED finished product.
Corresponding with traditional LED packaging technology, traditional LED sealed in unit generally comprises: die bond machine, oven heat, bonding equipment, point gum machine.Because heat reactive resin used in die bond step only at least toasts 60 minutes in oven heat (temperature is 150 ℃), just can make heat reactive resin solidify; Moreover, silica gel used in a glue step, it toasts 120~300 minutes in oven heat (temperature is 150 ℃), just can make silica gel solidify, therefore, for the division of labor better, to enhance productivity, above-mentioned die bond machine, oven heat, bonding equipment, point gum machine can not fit together, but be installed separately, die bond machine, oven heat, bonding equipment, point gum machine are assemblied in respectively different workshops.In use, need to, by product ordinal shift to the different workshop respectively with die bond machine, oven heat, bonding equipment, point gum machine, to realize, produce LED.
From the above mentioned, traditional LED sealed in unit comes with some shortcomings: because die bond machine, oven heat, bonding equipment, point gum machine do not fit together, causes taking larger space, but, in the situation that current room rate is high, the producer is caused to great puzzlement.Moreover material or semi-finished product, when moving or being transported to other workshop, may cause material or semi-finished product to produce displacement, cause final product quality not high, or directly become waste product.In addition, because the time of baking is longer, cause production efficiency lowly and the higher electric energy of needs, need higher production cost, so that can not meet the demand of modernization development and improve the market competitiveness.
Utility model content:
The purpose of this utility model is to overcome the deficiencies in the prior art, and a kind of integral type assembling design, environmental protection, energy-conservation are provided, and can effectively enhance productivity and automation LED packaging plastic embedding and the blanking integration apparatus of the quality of production.
In order to solve the problems of the technologies described above, the utility model has adopted following technical proposals: this automation LED packaging plastic embedding and blanking integration apparatus comprise: a cabinet and the some glue unit, UV photocuring unit, the blanking unit that are installed in cabinet and cooperatively interact, wherein, UV photocuring unit is arranged between a glue unit and blanking unit; Described some glue unit and blanking unit are corresponding with charging aperture and the discharging opening of cabinet respectively; Described some glue unit, UV photocuring unit are connected by conveyer respectively between any two with blanking unit, and the fixture for clamping material or product is installed on conveyer.
Furthermore, in technique scheme, described some glue unit, UV photocuring unit, blanking unit is a plane and straight line and is distributed in described cabinet.
Furthermore, in technique scheme, in described some glue unit, be provided with at least one mechanical arm, this mechanical arm is positioned at conveyer side.
Furthermore, in technique scheme, in described UV photocuring unit, be provided with at least one mechanical arm, this mechanical arm is positioned at conveyer side.
Furthermore, in technique scheme, be provided with at least one mechanical arm in described blanking unit, this mechanical arm is positioned at conveyer side.
Furthermore, in technique scheme, described conveyer is conveyer belt or chain.
Adopt after technique scheme, the utility model has following beneficial effect compared with prior art: the utility model is assemblied in a glue unit, UV photocuring unit and blanking unit combination in a cabinet, form integral type assembling design, greatly saved taking up room of total, and automaticity is high, can meet the demand of modern development.Moreover, structure of the present utility model can make LED packaging technology mid point glue, UV photocuring and the disposable automation of blanking step complete, and do not need material or semi-finished product to move or be transported to other workshop, guaranteed the quality of product, reduced largely waste product incidence.In addition, because the time of UV photocuring is very short, can greatly reduce the time of whole production, so that a glue unit, UV photocuring unit and blanking unit combination can be assembled together, form an automatic production line, can effectively improve like this operating efficiency of the present utility model and energy-conserving and environment-protective, be conducive to reduce production costs, improve the market competitiveness.
Accompanying drawing explanation:
Fig. 1 is the schematic diagram in the utility model;
Embodiment:
Below in conjunction with specific embodiments and the drawings, the utility model is further illustrated.
Shown in Figure 1, for the structure diagram of a kind of automation LED packaging plastic embedding and blanking integration apparatus, this automation LED packaging plastic embedding and blanking integration apparatus comprise: a cabinet 100 and the some glue unit 1, UV photocuring unit 2, the blanking unit 3 that are installed in cabinet 100 and cooperatively interact, wherein, UV photocuring unit 2 is arranged between a glue unit 1 and blanking unit 3.
Described some glue unit 1 and blanking unit 3 are corresponding with charging aperture and the discharging opening of cabinet 100 respectively; Described some glue unit 1, UV photocuring unit 2 are connected by conveyer respectively between any two with blanking unit 3, and the fixture for clamping material or product is installed on conveyer.
Described some glue unit 1, UV photocuring unit 2, blanking unit 3 is a plane and straight line and is distributed in described cabinet 100.
In described some glue unit 1, be provided with at least one mechanical arm, this mechanical arm is positioned at conveyer side.After 1 of glue unit glue, by mechanical arm, product is clamped, and product is transferred in the fixture on conveyer, and by conveyer, product is sent to UV photocuring unit 2.
In described UV photocuring unit 2, be provided with at least one mechanical arm, this mechanical arm is positioned at conveyer side.After 2 work of UV photocuring unit, by mechanical arm, product is clamped, and product is transferred in the fixture on conveyer, and by conveyer, product is sent to blanking unit 3.
In described blanking unit 3, be provided with at least one mechanical arm, this mechanical arm is positioned at conveyer side.After blanking unit 3 work, by mechanical arm, product is clamped, and product is transferred in the fixture on conveyer, and by conveyer, product is sent to the discharging opening of cabinet 100.
Above-mentioned conveyer is conveyer belt or chain.
The utility model is assemblied in a glue unit, UV photocuring unit and blanking unit combination in a cabinet, forms integral type assembling design, greatly saved taking up room of total, and automaticity is high, can meet the demand of modern development.Moreover, structure of the present utility model can make LED packaging technology mid point glue, UV photocuring and the disposable automation of blanking step complete, and do not need material or semi-finished product to move or be transported to other workshop, guaranteed the quality of product, reduced largely waste product incidence.In addition, because the time of UV photocuring is very short, can greatly reduce the time of whole production, so that a glue unit, UV photocuring unit and blanking unit combination can be assembled together, form an automatic production line, can effectively improve like this operating efficiency of the present utility model and energy-conserving and environment-protective, be conducive to reduce production costs, improve the market competitiveness.
Certainly, the foregoing is only specific embodiment of the utility model, be not to limit the utility model practical range, all according to equivalence variation or modification that described in the utility model claim, structure, feature and principle are done, all should be included in the utility model claim.
Claims (6)
1. the embedding of automation LED packaging plastic and blanking integration apparatus, it is characterized in that: it comprises: a cabinet (100) and the some glue unit (1), UV photocuring unit (2), the blanking unit (3) that are installed in cabinet (100) and cooperatively interact, wherein, UV photocuring unit (2) are arranged between a glue unit (1) and blanking unit (3); Described some glue unit (1) and blanking unit (3) are corresponding with charging aperture and the discharging opening of cabinet (100) respectively; Described some glue unit (1), UV photocuring unit (2) and blanking unit (3) are connected by conveyer respectively between any two, and the fixture for clamping material or product is installed on conveyer.
2. automation LED packaging plastic embedding according to claim 1 and blanking integration apparatus, is characterized in that: described some glue unit (1), UV photocuring unit (2), blanking unit (3) is a plane and straight line and is distributed in described cabinet (100).
3. automation LED packaging plastic embedding according to claim 2 and blanking integration apparatus, is characterized in that: in described some glue unit (1), be provided with at least one mechanical arm, this mechanical arm is positioned at conveyer side.
4. automation LED packaging plastic embedding according to claim 2 and blanking integration apparatus, is characterized in that: in described UV photocuring unit (2), be provided with at least one mechanical arm, this mechanical arm is positioned at conveyer side.
5. automation LED packaging plastic embedding according to claim 2 and blanking integration apparatus, is characterized in that: in described blanking unit (3), be provided with at least one mechanical arm, this mechanical arm is positioned at conveyer side.
6. according to automation LED packaging plastic embedding and blanking integration apparatus described in claim 1-5 any one, it is characterized in that: described conveyer is conveyer belt or chain.
Priority Applications (1)
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CN201320660024.0U CN203589064U (en) | 2013-10-24 | 2013-10-24 | Integrated device for automatically pouring LED packaging adhesive and discharging material |
Applications Claiming Priority (1)
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CN201320660024.0U CN203589064U (en) | 2013-10-24 | 2013-10-24 | Integrated device for automatically pouring LED packaging adhesive and discharging material |
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CN203589064U true CN203589064U (en) | 2014-05-07 |
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CN201320660024.0U Expired - Lifetime CN203589064U (en) | 2013-10-24 | 2013-10-24 | Integrated device for automatically pouring LED packaging adhesive and discharging material |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104576454A (en) * | 2014-11-28 | 2015-04-29 | 佛山市多谱光电科技有限公司 | Tunnel-type hardening furnace for semiconductor device |
CN108682644A (en) * | 2018-06-15 | 2018-10-19 | 佛山宝芯智能科技有限公司 | A kind of semiconductor prosthetic full-automatic assembly line work production method and system |
CN111916370A (en) * | 2020-05-29 | 2020-11-10 | 佛山市顺德区蚬华多媒体制品有限公司 | Die bonder and semiconductor device packaging method thereof |
-
2013
- 2013-10-24 CN CN201320660024.0U patent/CN203589064U/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104576454A (en) * | 2014-11-28 | 2015-04-29 | 佛山市多谱光电科技有限公司 | Tunnel-type hardening furnace for semiconductor device |
CN104576454B (en) * | 2014-11-28 | 2019-04-26 | 佛山市多谱光电科技有限公司 | A kind of semiconductor devices tunnel hardening furnace |
CN108682644A (en) * | 2018-06-15 | 2018-10-19 | 佛山宝芯智能科技有限公司 | A kind of semiconductor prosthetic full-automatic assembly line work production method and system |
CN111916370A (en) * | 2020-05-29 | 2020-11-10 | 佛山市顺德区蚬华多媒体制品有限公司 | Die bonder and semiconductor device packaging method thereof |
CN111916370B (en) * | 2020-05-29 | 2023-09-05 | 佛山市顺德区蚬华多媒体制品有限公司 | Die bonder and semiconductor device packaging method thereof |
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Legal Events
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
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Granted publication date: 20140507 |