CN203589082U - Fully-automatic LED packaging device - Google Patents
Fully-automatic LED packaging device Download PDFInfo
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- CN203589082U CN203589082U CN201320665968.7U CN201320665968U CN203589082U CN 203589082 U CN203589082 U CN 203589082U CN 201320665968 U CN201320665968 U CN 201320665968U CN 203589082 U CN203589082 U CN 203589082U
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- unit
- photocuring
- bonding wire
- die bond
- glue
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- Expired - Lifetime
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- 238000004806 packaging method and process Methods 0.000 title abstract 4
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000007599 discharging Methods 0.000 claims abstract description 10
- 238000000016 photochemical curing Methods 0.000 claims description 90
- 239000003292 glue Substances 0.000 claims description 60
- 239000004744 fabric Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000003848 UV Light-Curing Methods 0.000 abstract 5
- 238000004026 adhesive bonding Methods 0.000 abstract 5
- 238000005476 soldering Methods 0.000 abstract 5
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000005265 energy consumption Methods 0.000 abstract 1
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000000047 product Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000004020 luminiscence type Methods 0.000 description 6
- 239000011265 semifinished product Substances 0.000 description 6
- 239000000741 silica gel Substances 0.000 description 6
- 229910002027 silica gel Inorganic materials 0.000 description 6
- 238000012536 packaging technology Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000001723 curing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
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Abstract
The utility model discloses an fully-automatic LED packaging device comprising a machine box, a wafer mounting unit, a wire soldering unit, a gluing unit, a discharging unit, and at least one UV-light curing unit, wherein the wafer mounting unit, the wire soldering unit, the gluing unit, the discharging unit, and the at least one UV-light curing unit are all installed in the machine box and are in mutual cooperation. The UV-light curing unit is arranged between the wafer mounting unit and the wire soldering unit and between the gluing unit and the discharging unit. The wafer mounting unit corresponds to the charging port of the machine box and the discharging unit corresponds to the discharging port of the machine box. Each of the wafer mounting unit, the wire soldering unit, the gluing unit, the discharging unit, and the UV-light curing unit is equipped with at least one mechanical arm. The mechanical arms are connected via a transmission device on which a clamp used for clamping material or products is installed. The fully-automatic LED packaging device combines and assembles the wafer mounting unit, the wire soldering unit, the gluing unit, the discharging unit, and the UV-light curing unit together to form an automatic production line in order to effectively increase work efficiency. Additionally, the fully-automatic LED packaging device is economical in energy consumption, environmentally friendly, beneficial to decrease in production cost, and capable of enhancing market competitiveness.
Description
Technical field:
The utility model relates to LED sealed in unit technical field, refers in particular to a kind of integral type assembling design, environmental protection, energy-conservation, and can effectively enhance productivity and the full-automatic LED sealed in unit of the quality of production.
Background technology:
Along with day by day manifesting of the energy and environmental problem, Energy Saving Industry and products thereof more and more comes into one's own, and the energy-saving effect of semiconductor diode (LED) illumination is recognized.
LED (Light Emitting Diode, light-emitting diode) is a kind of solid-state semiconductor device that can be visible ray by electric energy conversion, and it can be directly luminous energy electric energy conversion.LED is being widely used as a kind of new lighting source material.And LED encapsulation technology has played a very crucial effect to the light extraction efficiency of light-emitting diode.
Traditional LED packaging technology, generally comprises step and is: die bond, hot curing, bonding wire, some glue, hot curing moulding.In die bond step, refer to the crystal bonding area point crystal-bonding adhesive on a support, and then luminescence chip is positioned in crystal bonding area, wherein, some glue crystal-bonding adhesive used is heat reactive resin.In thermal cure step, the above-mentioned support that is placed with luminescence chip is placed in an oven heat and is toasted, the temperature of oven heat is 150 ℃, baking time is at least 60 minutes, and heat reactive resin is solidified, and can make luminescence chip firmly be connected with support.In bonding wire step, utilize bonding equipment that the utmost point of luminescence chip is connected by plain conductor with the utmost point of support.In a glue step, be all generally in LED semi-finished product, on luminescence chip, to make luminescence chip by gel coated silica gel (silica gel) embedding; In last hot curing forming step, there are the LED semi-finished product of silica gel to be placed in an oven heat above-mentioned embedding and toast, the temperature of oven heat is 150 ℃, baking time is 120～300 minutes, and hot silica gel is solidified, and forms LED finished product.
Corresponding with traditional LED packaging technology, traditional LED sealed in unit generally comprises: die bond machine, oven heat, bonding equipment, point gum machine.Because heat reactive resin used in die bond step only at least toasts 60 minutes in oven heat (temperature is 150 ℃), just can make heat reactive resin solidify; Moreover, silica gel used in a glue step, it toasts 120～300 minutes in oven heat (temperature is 150 ℃), just can make silica gel solidify, therefore, for the division of labor better, to enhance productivity, above-mentioned die bond machine, oven heat, bonding equipment, point gum machine can not fit together, but be installed separately, die bond machine, oven heat, bonding equipment, point gum machine are assemblied in respectively different workshops.In use, need to, by product ordinal shift to thering is respectively the different workshop of die bond machine, oven heat, bonding equipment, point gum machine, to realize, produce LED.
From the above mentioned, traditional LED sealed in unit comes with some shortcomings: because die bond machine, oven heat, bonding equipment, point gum machine do not fit together, causes taking larger space, yet, in the situation that current room rate is high, the producer is caused to great puzzlement.Moreover material or semi-finished product, when moving or being transported to other workshop, may cause material or semi-finished product to produce displacement, cause final product quality not high, or directly become waste product.In addition, because the time of baking is longer, cause production efficiency lowly and the higher electric energy of needs, need higher production cost, so that can not meet the demand of modernization development and improve the market competitiveness.
Utility model content:
The purpose of this utility model is to overcome the deficiencies in the prior art, and a kind of integral type assembling design, environmental protection, energy-conservation are provided, and can effectively enhance productivity and the full-automatic LED sealed in unit of the quality of production.
In order to solve the problems of the technologies described above, the utility model has adopted following technical proposals: this full-automation LED sealed in unit comprises: a cabinet and the die bond unit, bonding wire unit, some glue unit, blanking unit and at least one the UV photocuring unit that are installed in cabinet and cooperatively interact, wherein, UV photocuring unit is arranged between die bond unit and bonding wire unit, and between a glue unit and blanking unit; Described die bond unit and blanking unit are corresponding with charging aperture and the discharging opening of cabinet respectively; Described die bond unit, bonding wire unit, some glue unit, blanking unit, UV photocuring unit are provided with at least one mechanical arm, and by conveyer, connect between it, are provided with for clamping the fixture of material or product on this conveyer.
Furthermore, in technique scheme, the quantity of described UV photocuring unit is one.
Furthermore, in technique scheme, described die bond unit, bonding wire unit, UV photocuring unit, some glue unit, blanking unit are longitudinally annular spread in described cabinet, wherein, blanking unit and die bond unit are upper and lower double-layer separate cloth, point glue unit and bonding wire unit are upper and lower double-layer separate cloth, blanking unit and die bond unit lay respectively at a glue unit and bonding wire unit side, described UV photocuring unit between described die bond unit and bonding wire unit, and extend to blanking unit and some glue unit between.
Furthermore, in technique scheme, the conveyer between described die bond unit and UV photocuring unit, between UV photocuring unit and bonding wire unit, between Yu Dianjiao unit, bonding wire unit, between some glue unit and UV photocuring unit, described in being respectively arranged with between UV photocuring unit and blanking unit.
Furthermore, in technique scheme, described die bond unit, bonding wire unit, UV photocuring unit, some glue unit, blanking unit annular spread are in horizontal direction in described cabinet, wherein, blanking unit and die bond unit are positioned at a side, point glue unit and bonding wire unit are positioned at opposite side, and UV photocuring unit is positioned at mid portion, and simultaneously between die bond unit and bonding wire unit and between some glue unit and blanking unit.
Furthermore, in technique scheme, the conveyer between described die bond unit and UV photocuring unit, between UV photocuring unit and bonding wire unit, between Yu Dianjiao unit, bonding wire unit, between some glue unit and UV photocuring unit, described in being respectively arranged with between UV photocuring unit and blanking unit.
Furthermore, in technique scheme, the quantity of described UV photocuring unit is two, comprises a UV photocuring unit and the 2nd UV photocuring unit.
Furthermore, in technique scheme, described die bond unit, a UV photocuring unit, bonding wire unit, some glue unit, the 2nd UV photocuring unit, blanking unit are a straight line and are distributed in described cabinet.
Furthermore, in technique scheme, between described die bond unit, a UV photocuring unit, bonding wire unit, some glue unit, the 2nd UV photocuring unit, blanking unit, be respectively arranged with described conveyer.
Furthermore, in technique scheme, described conveyer is conveyer belt or chain.
Adopt after technique scheme, the utility model has following beneficial effect compared with prior art: the utility model is assemblied in die bond unit, bonding wire unit, some glue unit, blanking unit and UV photocuring unit combination in a cabinet, form integral type assembling design, greatly saved taking up room of total, and automaticity is high, can meet the demand of modern development.Moreover, structure of the present utility model can make die bond, UV photocuring, bonding wire, some glue, UV photocuring and the disposable automation of blanking step in LED packaging technology complete, and do not need material or semi-finished product to move or be transported to other workshop, guarantee the quality of product, reduced largely waste product incidence.In addition, because the time of UV photocuring is very short, can greatly reduce the time of whole production, consequently die bond unit, bonding wire unit, some glue unit, blanking unit and UV photocuring unit combination can be assembled together, form an automatic production line, can effectively improve operating efficiency of the present utility model like this, and energy-conserving and environment-protective, be conducive to reduce production costs, improve the market competitiveness.
Accompanying drawing explanation:
Fig. 1 is the schematic diagram of embodiment mono-in the utility model;
Fig. 2 is the schematic diagram of embodiment bis-in the utility model;
Fig. 3 is the schematic diagram of embodiment tri-in the utility model;
Embodiment:
Below in conjunction with specific embodiments and the drawings, the utility model is further illustrated.
Embodiment mono-:
Shown in Figure 1, sketch for a kind of full-automatic LED sealed in unit, this full-automation LED sealed in unit comprises: a cabinet 100 and the die bond unit 1 that is installed in cabinet 100 and cooperatively interacts, bonding wire unit 2, point glue unit 3, blanking unit 4 and at least one UV photocuring unit 5, wherein, UV photocuring unit 5 is arranged between die bond unit 2 and bonding wire unit 3, and between described some glue unit 3 and blanking unit 4, described rear UV photocuring unit used, rear He Dianjiao unit, UV photocuring unit 3 used, die bond unit 2 is same UV photocuring unit.
Described die bond unit 1 and blanking unit 4 are corresponding with charging aperture and the discharging opening of cabinet 100 respectively.
Described die bond unit 1, bonding wire unit 2, some glue unit 3, blanking unit 4, UV photocuring unit 5 are provided with at least one mechanical arm, and between described die bond unit 1, bonding wire unit 2, some glue unit 3, blanking unit 4, UV photocuring unit 5, by conveyer, connect, on this conveyer, be provided with for clamping the fixture of material or product.
In the present embodiment one, the quantity of described UV photocuring unit 5 is one.Described conveyer is conveyer belt or chain.
Described die bond unit 1, bonding wire unit 2, UV photocuring unit 5, some glue unit 3, blanking unit 4 are longitudinally annular spread in described cabinet 100, wherein, blanking unit 4 and die bond unit 1 are upper and lower double-layer separate cloth, point glue unit 3 and bonding wire unit 2 are upper and lower double-layer separate cloth, blanking unit 4 and die bond unit 1 lay respectively at a glue unit 3 and bonding wire unit 2 sides, described UV photocuring unit 5 between described die bond unit 1 and bonding wire unit 2, and extend to blanking unit 4 and some glue unit 3 between.
Conveyer between described die bond unit 1 and UV photocuring unit 5, between UV photocuring unit 5 and bonding wire unit 2, between bonding wire unit 2 and some glue unit 3, between some glue unit 3 and UV photocuring unit 5, described in being respectively arranged with between UV photocuring unit 5 and blanking unit 4, on this conveyer, be provided with described for clamping the fixture of material or product, and coordinate conveyer and fixture that material or semifinished or finished goods are sent to next unit from a upper unit by mechanical arm, and move smooth and easy.
The utility model is assemblied in die bond unit, bonding wire unit, some glue unit, blanking unit and UV photocuring unit combination in a cabinet, form integral type assembling design, greatly saved taking up room of total, and automaticity is high, can meets the demand of modern development.Moreover, structure of the present utility model can make die bond, UV photocuring, bonding wire, some glue, UV photocuring and the disposable automation of blanking step in LED packaging technology complete, and do not need material or semi-finished product to move or be transported to other workshop, guarantee the quality of product, reduced largely waste product incidence.In addition, because the time of UV photocuring is very short, can greatly reduce the time of whole production, consequently die bond unit, bonding wire unit, some glue unit, blanking unit and UV photocuring unit combination can be assembled together, form an automatic production line, can effectively improve operating efficiency of the present utility model like this, and energy-conserving and environment-protective, be conducive to reduce production costs, improve the market competitiveness.
Embodiment bis-: the present embodiment two is with the difference of above-described embodiment one:
Shown in Fig. 2, described die bond unit 1, bonding wire unit 2, UV photocuring unit 5, point glue unit 3, blanking unit 4 annular spread is in horizontal direction in described cabinet 100, wherein, blanking unit 4 and die bond unit 1 are positioned at a side, point glue unit 3 and bonding wire unit 2 are positioned at opposite side, UV photocuring unit 5 is positioned at mid portion, and simultaneously between die bond unit 1 and bonding wire unit 2 and between some glue unit 3 and blanking unit 4, described rear UV photocuring unit used, rear He Dianjiao unit, UV photocuring unit 3 used, die bond unit 2 is same UV photocuring unit.
In the present embodiment two, the quantity of described UV photocuring unit 5 is one.
Shown in Fig. 3, conveyer between described die bond unit 1 and UV photocuring unit 5, between UV photocuring unit 5 and bonding wire unit 2, between bonding wire unit 2 and some glue unit 3, between some glue unit 3 and UV photocuring unit 5, described in being respectively arranged with between UV photocuring unit 5 and blanking unit 4, on this conveyer, be provided with describedly for clamping the fixture of material or product, and described die bond unit 1, bonding wire unit 2, some glue unit 3, blanking unit 4, UV photocuring unit 5 are provided with at least one mechanical arm.
The present embodiment two has advantages of described in above-described embodiment one equally.
Embodiment tri-: the present embodiment two is with the difference of above-described embodiment one:
The quantity of described UV photocuring unit 5 is two, comprises a UV photocuring unit 51 and the 2nd UV photocuring unit 52.Described die bond unit 1, a UV photocuring unit 51, bonding wire unit 2, some glue unit 3, the 2nd UV photocuring unit 52, blanking unit 4 are a straight line and are distributed in described cabinet 100.
Between described die bond unit 1, a UV photocuring unit 51, bonding wire unit 2, some glue unit 3, the 2nd UV photocuring unit 52, blanking unit 4, be respectively arranged with described conveyer, on this conveyer, be provided with described for clamping the fixture of material or product.Described die bond unit 1, bonding wire unit 2, some glue unit 3, blanking unit 4, UV photocuring unit 5 are provided with at least one mechanical arm.
The present embodiment three has advantages of described in above-described embodiment one equally.
In sum, structure described in above-mentioned three embodiment is all that die bond unit, bonding wire unit, some glue unit, blanking unit and UV photocuring unit combination are assembled together, form an automatic production line, can effectively improve operating efficiency of the present utility model like this, and energy-conserving and environment-protective, be conducive to reduce production costs, improve the market competitiveness.Wherein, the area that the structure described in embodiment mono-need to take is minimum, and the structure described in embodiment bis-is taken second place, and executes the area that the structure described in example one need take maximum, and therefore, the structure described in embodiment mono-is optimum structure.
Certainly, the foregoing is only specific embodiment of the utility model, be not to limit the utility model practical range, all according to equivalence variation or modification that described in the utility model claim, structure, feature and principle are done, all should be included in the utility model claim.
Claims (10)
1. full-automatic LED sealed in unit, it is characterized in that: comprising: a cabinet (100) and the die bond unit (1), bonding wire unit (2), some glue unit (3), blanking unit (4) and at least one the UV photocuring unit (5) that are installed in cabinet (100) and cooperatively interact, wherein, UV photocuring unit (5) is arranged between die bond unit (2) and bonding wire unit (3), and is positioned between a glue unit (3) and blanking unit (4); Described die bond unit (1) and blanking unit (4) are corresponding with charging aperture and the discharging opening of cabinet (100) respectively; In described die bond unit (1), bonding wire unit (2), some glue unit (3), blanking unit (4), UV photocuring unit (5), be provided with at least one mechanical arm, and between it, by conveyer, connect, on this conveyer, be provided with for clamping the fixture of material or product.
2. full-automatic LED sealed in unit according to claim 1, is characterized in that: the quantity of described UV photocuring unit (5) is one.
3. full-automatic LED sealed in unit according to claim 2, it is characterized in that: described die bond unit (1), bonding wire unit (2), UV photocuring unit (5), point glue unit (3), blanking unit (4) is longitudinally annular spread in described cabinet (100), wherein, blanking unit (4) and die bond unit (1) are upper and lower double-layer separate cloth, point glue unit (3) and bonding wire unit (2) are upper and lower double-layer separate cloth, blanking unit (4) and die bond unit (1) lay respectively at a glue unit (3) and bonding wire unit (2) side, described UV photocuring unit (5) is positioned between described die bond unit (1) and bonding wire unit (2), and extend between blanking unit (4) and some glue unit (3).
4. full-automatic LED sealed in unit according to claim 3, is characterized in that: the conveyer between described die bond unit (1) and UV photocuring unit (5), between UV photocuring unit (5) and bonding wire unit (2), between bonding wire unit (2) and some glue unit (3), between some glue unit (3) and UV photocuring unit (5), described in being respectively arranged with between UV photocuring unit (5) and blanking unit (4).
5. full-automatic LED sealed in unit according to claim 2, it is characterized in that: described die bond unit (1), bonding wire unit (2), UV photocuring unit (5), point glue unit (3), blanking unit (4) annular spread is in horizontal direction in described cabinet (100), wherein, blanking unit (4) and die bond unit (1) are positioned at a side, point glue unit (3) and bonding wire unit (2) are positioned at opposite side, UV photocuring unit (5) is positioned at mid portion, and be positioned between die bond unit (1) and bonding wire unit (2) and between some glue unit (3) and blanking unit (4) simultaneously.
6. full-automatic LED sealed in unit according to claim 5, is characterized in that: the conveyer between described die bond unit (1) and UV photocuring unit (5), between UV photocuring unit (5) and bonding wire unit (2), between bonding wire unit (2) and some glue unit (3), between some glue unit (3) and UV photocuring unit (5), described in being respectively arranged with between UV photocuring unit (5) and blanking unit (4).
7. full-automatic LED sealed in unit according to claim 1, is characterized in that: the quantity of described UV photocuring unit (5) is two, comprises a UV photocuring unit (51) and the 2nd UV photocuring unit (52).
8. full-automatic LED sealed in unit according to claim 7, is characterized in that: described die bond unit (1), a UV photocuring unit (51), bonding wire unit (2), some glue unit (3), the 2nd UV photocuring unit (52), blanking unit (4) are a straight line and are distributed in described cabinet (100).
9. full-automatic LED sealed in unit according to claim 8, is characterized in that: between described die bond unit (1), a UV photocuring unit (51), bonding wire unit (2), some glue unit (3), the 2nd UV photocuring unit (52), blanking unit (4), be respectively arranged with described conveyer.
10. according to the full-automatic LED sealed in unit described in claim 1-9 any one, it is characterized in that: described conveyer is conveyer belt or chain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320665968.7U CN203589082U (en) | 2013-10-24 | 2013-10-24 | Fully-automatic LED packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320665968.7U CN203589082U (en) | 2013-10-24 | 2013-10-24 | Fully-automatic LED packaging device |
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| Publication Number | Publication Date |
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| CN203589082U true CN203589082U (en) | 2014-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320665968.7U Expired - Lifetime CN203589082U (en) | 2013-10-24 | 2013-10-24 | Fully-automatic LED packaging device |
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| CN (1) | CN203589082U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105289924A (en) * | 2014-07-14 | 2016-02-03 | 昆山捷凌电子科技有限公司 | UV adhesive dispensing, irradiating and detecting integrated machine |
| CN106216268A (en) * | 2016-09-13 | 2016-12-14 | 浙江舜宇光学有限公司 | For detecting equipment and the method for detection camera module thereof of camera module |
| CN108682644A (en) * | 2018-06-15 | 2018-10-19 | 佛山宝芯智能科技有限公司 | A kind of semiconductor prosthetic full-automatic assembly line work production method and system |
| CN108807642A (en) * | 2018-06-15 | 2018-11-13 | 佛山宝芯智能科技有限公司 | A kind of semiconductor module package system and packaging method |
| CN109509823A (en) * | 2017-09-15 | 2019-03-22 | 深圳市炫硕智造技术有限公司 | LED intelligent plant |
| CN109742215A (en) * | 2019-01-10 | 2019-05-10 | 广东品美电子科技有限公司 | A kind of LED support preparation process |
| CN112687786A (en) * | 2020-04-21 | 2021-04-20 | 广州晶伦自动化设备有限公司 | Processing device for LED packaging and LED packaging process |
-
2013
- 2013-10-24 CN CN201320665968.7U patent/CN203589082U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105289924A (en) * | 2014-07-14 | 2016-02-03 | 昆山捷凌电子科技有限公司 | UV adhesive dispensing, irradiating and detecting integrated machine |
| CN106216268A (en) * | 2016-09-13 | 2016-12-14 | 浙江舜宇光学有限公司 | For detecting equipment and the method for detection camera module thereof of camera module |
| CN106216268B (en) * | 2016-09-13 | 2018-07-17 | 浙江舜宇光学有限公司 | The method of equipment and its detection camera module for detecting camera module |
| CN109509823A (en) * | 2017-09-15 | 2019-03-22 | 深圳市炫硕智造技术有限公司 | LED intelligent plant |
| CN108682644A (en) * | 2018-06-15 | 2018-10-19 | 佛山宝芯智能科技有限公司 | A kind of semiconductor prosthetic full-automatic assembly line work production method and system |
| CN108807642A (en) * | 2018-06-15 | 2018-11-13 | 佛山宝芯智能科技有限公司 | A kind of semiconductor module package system and packaging method |
| CN108807642B (en) * | 2018-06-15 | 2024-03-29 | 佛山宝芯智能科技有限公司 | Semiconductor modularized packaging system and packaging method |
| CN109742215A (en) * | 2019-01-10 | 2019-05-10 | 广东品美电子科技有限公司 | A kind of LED support preparation process |
| CN112687786A (en) * | 2020-04-21 | 2021-04-20 | 广州晶伦自动化设备有限公司 | Processing device for LED packaging and LED packaging process |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140507 |