CN201804862U - Single three-chip LED particle - Google Patents

Single three-chip LED particle Download PDF

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Publication number
CN201804862U
CN201804862U CN 201020150437 CN201020150437U CN201804862U CN 201804862 U CN201804862 U CN 201804862U CN 201020150437 CN201020150437 CN 201020150437 CN 201020150437 U CN201020150437 U CN 201020150437U CN 201804862 U CN201804862 U CN 201804862U
Authority
CN
China
Prior art keywords
chips
chip
led particle
during
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201020150437
Other languages
Chinese (zh)
Inventor
朱会兴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henan Tenghuang Electronic Technology Co Ltd
Original Assignee
Henan Tenghuang Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henan Tenghuang Electronic Technology Co Ltd filed Critical Henan Tenghuang Electronic Technology Co Ltd
Priority to CN 201020150437 priority Critical patent/CN201804862U/en
Application granted granted Critical
Publication of CN201804862U publication Critical patent/CN201804862U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Abstract

The utility model relates to a single three-chip LED particle. The single three-chip LED particle is characterized in that three chips are fixed in the same reflection cup, wherein each chip is respectively connected with a positive and negative electrode support through a gold wire by adopting a triangular distributed structure, and then the chips are packaged and molded with colloid after being coated with a fluorescent powder. Since the three chips are fixed in the same reflection cup respectively, the brightness of the single LED particle can be enhanced to a great extent during the working process; and the distance between every two chips is equal by adopting the triangular distributed structure of the chips, so that the heat generated by the three chips during the work can be released evenly and rapidly, and the service life of the LED (light emitting diode) during the normal work can be ensured.

Description

Single three chip LED particle
Technical field
The utility model relates to a kind of LED particle.
Background technology
At present, light-emitting diode is because of power saving, the fields such as illumination, demonstration that have been widely used in bright in luster.As solar lighting, room lighting and LED display etc.They are made up of a plurality of light-emitting diode particles.Existing LED particle is to adopt single-chip package, large chip encapsulation and multicore sheet packaging technology to make, single-chip package, large chip encapsulation can not have been satisfied present demand to LED brightness, and the encapsulation of multicore sheet, because chip is too concentrated, heat can not be derived rapidly during operate as normal, quicken the aging of LED particle, shortened the useful life of particle, limited the development of LED.
Summary of the invention
The purpose of this utility model is: provide a kind of light-emitting diode of new construction, to overcome the deficiencies in the prior art.
Realize that the technical scheme that the utility model purpose is taked is: three chips are fixed in the same reflector, adopt the triangle distributed architecture, each chip is connected on the positive and negative electrode support with gold thread.
Good effect of the present utility model is: three chips are fixed in the same reflector, can improve the brightness of single LEDs particle during work to a great extent; The triangle distributed architecture of chip makes the distance between every chips impartial, and the heat that is produced in the time of can making the work of three chips is drained evenly, rapidly, can guarantee the useful life of light-emitting diode operate as normal.
Description of drawings
Accompanying drawing 1 is a schematic diagram of the present utility model; Accompanying drawing 2 is the schematic top plan view of accompanying drawing 1.
Embodiment
The utility model is fixed on three chips 5 in the same reflector 4 as shown in Figure 1, adopts the triangle distributed architecture, and each chip 5 usefulness gold thread 3 is connected on the positive and negative electrode support 6,2, be covered with fluorescent material after, usefulness colloid 1 encapsulated moulding.

Claims (1)

1. one kind single three chip LED particle is characterized in that: three chips are fixed in the same reflector, adopt the triangle distributed architecture, each chip is connected on the positive and negative electrode support with gold thread.
CN 201020150437 2010-03-26 2010-03-26 Single three-chip LED particle Expired - Fee Related CN201804862U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201020150437 CN201804862U (en) 2010-03-26 2010-03-26 Single three-chip LED particle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201020150437 CN201804862U (en) 2010-03-26 2010-03-26 Single three-chip LED particle

Publications (1)

Publication Number Publication Date
CN201804862U true CN201804862U (en) 2011-04-20

Family

ID=43874365

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201020150437 Expired - Fee Related CN201804862U (en) 2010-03-26 2010-03-26 Single three-chip LED particle

Country Status (1)

Country Link
CN (1) CN201804862U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105591013A (en) * 2016-03-25 2016-05-18 深圳市九洲光电科技有限公司 SMD outer package type LED
CN106597751A (en) * 2017-01-20 2017-04-26 马跃 Liquid crystal display with wide color gamut and color temperature adjustment method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105591013A (en) * 2016-03-25 2016-05-18 深圳市九洲光电科技有限公司 SMD outer package type LED
CN105591013B (en) * 2016-03-25 2018-11-13 深圳市九洲光电科技有限公司 A kind of SMD outer packages formula LED
CN106597751A (en) * 2017-01-20 2017-04-26 马跃 Liquid crystal display with wide color gamut and color temperature adjustment method thereof

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110420

Termination date: 20160326