CN103826430A - Production process method for LED light bar - Google Patents
Production process method for LED light bar Download PDFInfo
- Publication number
- CN103826430A CN103826430A CN201410057509.XA CN201410057509A CN103826430A CN 103826430 A CN103826430 A CN 103826430A CN 201410057509 A CN201410057509 A CN 201410057509A CN 103826430 A CN103826430 A CN 103826430A
- Authority
- CN
- China
- Prior art keywords
- wafer
- support
- lamp bar
- led lamp
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 239000003292 glue Substances 0.000 claims abstract description 24
- 239000002994 raw material Substances 0.000 claims abstract description 13
- 239000007787 solid Substances 0.000 claims description 18
- 238000012360 testing method Methods 0.000 claims description 12
- 238000005516 engineering process Methods 0.000 claims description 10
- 238000013461 design Methods 0.000 claims description 7
- 239000004819 Drying adhesive Substances 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- 230000002950 deficient Effects 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 238000004080 punching Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 abstract description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 239000011049 pearl Substances 0.000 description 7
- 238000005476 soldering Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a production process method for an LED light bar. The production process method comprises the steps that a support stamping die of the LED light bar is manufactured, raw materials of the LED light bar are manufactured; a formed support is placed on a wafer fixing machine, and an LED wafer is fixed to the support through the wafer fixing machine; the support where the wafer is fixed is placed into an oven to be baked; the dried support where the wafer is fixed is connected with the wafer through a wire by using a welding line machine; after the wafer is connected with the support, a glue dispenser is used for dispensing corresponding glue on the surface of the wafer according to the requirement for the appearance and color; after the glue is dispensed, the wafer is placed into the oven according to the curing conditions of the corresponding glue and is baked till the glue is dried; after the glue is dried, the wafer is placed in a die to be stamped, wherein a line structure is formed in the die in advance. According to the production process method for the LED light bar, the manufacturing process is simple, the verbose step that traditional LED lights are fixed to circuit boards by means of multiple times of welding is omitted, most tin materials are saved, and cost of all circuit boards is reduced.
Description
Technical field
The present invention relates to the making of LED, particularly a kind of manufacturing technique method of LED lamp bar.
Background technology
Traditional LED lamp bar lamp band production technology is according to customer requirement, design in advance wiring board, again fixing in the circuit board by the mode of tin welding to multiple single LED lamp pearls and other electronic components, according to technological requirement, each lamp pearl and all electronic components must be through the high temperature solderings of 220 degree left and right, and the production technology of wiring board is to belong to high pollution enterprise, production process unavoidably can be to environment, all lamp pearls need be fixed the complexity and the material cost that have also increased greatly in the circuit board production technology by the mode of soldering, and reduce production efficiency, strengthen total production cost.
Summary of the invention
The object of the invention is the above-mentioned defect for prior art, the manufacturing technique method of the LED lamp bar that a kind of production process is simple, cost of manufacture is cheap is provided.
For solving the above-mentioned defect of prior art, the technical scheme that the present invention will solve is: a kind of manufacturing technique method of LED lamp bar, comprises the following steps:
(1), get the raw materials ready, be first made into the bracket stamping die of LED lamp bar and be mixed with the raw material of LED lamp bar;
(2), the support of moulding is placed on die bond machine, LED wafer is fixed on support with die bond machine;
(3), the support of solid good wafer put into baking box the inside toast, oven temperature is adjusted to suitable temperature, be baked to after certain hour, take out the support of solid good wafer;
(4), the support of solid good wafer after drying is connected wafer with bonding equipment with support wire;
(5), after wafer is connected with support, require corresponding glue on point in wafer surface according to outward appearance and color with point gum machine;
(6), put after glue and put into baking box the inside according to the condition of cure of corresponding glue, be transferred to suitable temperature, be baked to drying adhesive;
(7), after oven dry, put into again the mould the inside punching press of holding in advance line construction successfully;
(8), test classification after punch forming, if find that there is defective products again with flatiron with engrave cutting tool and keep in repair;
(9), test sort out after, complete light source and the line design groundwork of lamp bar lamp band;
(10), rear portion can be according to the purposes difference of various products, do corresponding surface insulation and waterproof anti-collide with to process completed the production technology of whole lamp bar lamp band.
One as the manufacturing technique method of LED lamp bar of the present invention is improved, and oven temperature is selected in following scope described in the 3rd step: 80 ℃～150 ℃.
One as the manufacturing technique method of LED lamp bar of the present invention is improved, and baking box baking time is selected in following scope described in the 3rd step: 60min～150 min.
One as the manufacturing technique method of LED lamp bar of the present invention is improved, and oven temperature is selected in following scope described in the 6th step: 80 ℃～150 ℃.
One as the manufacturing technique method of LED lamp bar of the present invention is improved, and baking box baking time is selected in following scope described in the 6th step: 120min～260 min.
The invention has the beneficial effects as follows: manufacturing process of the present invention is simple, saved traditional LED lamp is fixed on the processing cost of the loaded down with trivial details step on circuit board through multiple welding, the cost and the cost that has saved all wiring boards of most tin material are saved, and avoid LED lamp pearl to cause the harmful effect to LED lamp pearl through the hot environment of soldering, thereby improve greatly the useful life of lamp band, simultaneously reduce greatly manufacturing cost, be particluarly suitable for promoting in the production of existing LED illuminating product.The present invention directly adopts the metal leg of LED lamp pearl support and relevant electronic component itself as being connected wire, directly adopt semiconductor packaging, form one or more LED lamp bar lamp band strings circuit, do not need to be connected and fixed by wiring board the electronic original part that LED lamp pearl is relevant with other.
Embodiment
Just with specific embodiment, the invention will be further described below.
Embodiment mono-: a kind of manufacturing technique method of LED lamp bar, comprises the following steps:
(1), get the raw materials ready, be first made into the bracket stamping die of LED lamp bar and be mixed with the raw material of LED lamp bar;
(2), the support of moulding is placed on die bond machine, LED wafer is fixed on support with die bond machine;
(3), the support of solid good wafer put into baking box the inside toast, oven temperature is adjusted to 150 ℃, baking time is decided to be 130min, takes out the support of solid good wafer;
(4), the support of solid good wafer after drying is connected wafer with bonding equipment with support wire;
(5), after wafer is connected with support, require corresponding glue on point in wafer surface according to outward appearance and color with point gum machine;
(6), put after glue and put into baking box the inside according to the condition of cure of corresponding glue, be transferred to 150 ℃, baking time is decided to be 250min, is baked to drying adhesive;
(7), after oven dry, put into again the mould the inside punching press of holding in advance line construction successfully;
(8), test classification after punch forming, if find that there is defective products again with flatiron with engrave cutting tool and keep in repair;
(9), test sort out after, complete light source and the line design groundwork of lamp bar lamp band;
(10), rear portion can be according to the purposes difference of various products, do corresponding surface insulation and waterproof anti-collide with to process completed the production technology of whole lamp bar lamp band.
Embodiment bis-: a kind of manufacturing technique method of LED lamp bar, comprises the following steps:
(1), get the raw materials ready, be first made into the bracket stamping die of LED lamp bar and be mixed with the raw material of LED lamp bar;
(2), the support of moulding is placed on die bond machine, LED wafer is fixed on support with die bond machine;
(3), the support of solid good wafer put into baking box the inside toast, oven temperature is adjusted to 150 ℃, baking time is decided to be 120min, takes out the support of solid good wafer;
(4), the support of solid good wafer after drying is connected wafer with bonding equipment with support wire;
(5), after wafer is connected with support, require corresponding glue on point in wafer surface according to outward appearance and color with point gum machine;
(6), put after glue and put into baking box the inside according to the condition of cure of corresponding glue, be transferred to 80 ℃, baking time is decided to be 120min, then oven temperature is transferred to 150 degree, baking time is decided to be 180min, is baked to drying adhesive;
(7), after oven dry, put into again the mould the inside punching press of holding in advance line construction successfully;
(8), test classification after punch forming, if find that there is defective products again with flatiron with engrave cutting tool and keep in repair;
(9), test sort out after, complete light source and the line design groundwork of lamp bar lamp band;
(10), rear portion can be according to the purposes difference of various products, do corresponding surface insulation and waterproof anti-collide with to process completed the production technology of whole lamp bar lamp band.
Embodiment tri-: a kind of manufacturing technique method of LED lamp bar, comprises the following steps:
(1), get the raw materials ready, be first made into the bracket stamping die of LED lamp bar and be mixed with the raw material of LED lamp bar;
(2), the support of moulding is placed on die bond machine, LED wafer is fixed on support with die bond machine;
(3), the support of solid good wafer put into baking box the inside toast, oven temperature is adjusted to 120 ℃, baking time is decided to be 150min, takes out the support of solid good wafer;
(4), the support of solid good wafer after drying is connected wafer with bonding equipment with support wire;
(5), after wafer is connected with support, require corresponding glue on point in wafer surface according to outward appearance and color with point gum machine;
(6), put after glue and put into baking box the inside according to the condition of cure of corresponding glue, be transferred to 150 ℃, baking time is decided to be 180min, is baked to drying adhesive;
(7), after oven dry, put into again the mould the inside punching press of holding in advance line construction successfully;
(8), test classification after punch forming, if find that there is defective products again with flatiron with engrave cutting tool and keep in repair;
(9), test sort out after, complete light source and the line design groundwork of lamp bar lamp band;
(10), rear portion can be according to the purposes difference of various products, do corresponding surface insulation and waterproof anti-collide with to process completed the production technology of whole lamp bar lamp band.
Embodiment tetra-: a kind of manufacturing technique method of LED lamp bar, comprises the following steps:
(1), get the raw materials ready, be first made into the bracket stamping die of LED lamp bar and be mixed with the raw material of LED lamp bar;
(2), the support of moulding is placed on die bond machine, LED wafer is fixed on support with die bond machine;
(3), the support of solid good wafer put into baking box the inside toast, oven temperature is adjusted to 150 ℃, baking time is decided to be 120min, takes out the support of solid good wafer;
(4), the support of solid good wafer after drying is connected wafer with bonding equipment with support wire;
(5), after wafer is connected with support, require corresponding glue on point in wafer surface according to outward appearance and color with point gum machine;
(6), put after glue and put into baking box the inside according to the condition of cure of corresponding glue, be transferred to 150 ℃, baking time is decided to be 240min, is baked to drying adhesive;
(7), after oven dry, put into again the mould the inside punching press of holding in advance line construction successfully;
(8), test classification after punch forming, if find that there is defective products again with flatiron with engrave cutting tool and keep in repair;
(9), test sort out after, complete light source and the line design groundwork of lamp bar lamp band;
(10), rear portion can be according to the purposes difference of various products, do corresponding surface insulation and waterproof anti-collide with to process completed the production technology of whole lamp bar lamp band.
The announcement of book and instruction according to the above description, those skilled in the art in the invention can also carry out suitable change and modification to above-mentioned execution mode.Therefore, the present invention is not limited to embodiment disclosed and described above, also should fall in the protection range of claim of the present invention modifications and changes more of the present invention.In addition,, although used some specific terms in this specification, these terms just for convenience of description, do not form any restriction to the present invention.
Claims (5)
1. a manufacturing technique method for LED lamp bar, is characterized in that, comprises the following steps:
(1), get the raw materials ready, be first made into the bracket stamping die of LED lamp bar and be mixed with the raw material of LED lamp bar;
(2), the support of moulding is placed on die bond machine, LED wafer is fixed on support with die bond machine;
(3), the support of solid good wafer put into baking box the inside toast, oven temperature is adjusted to suitable temperature, be baked to after certain hour, take out the support of solid good wafer;
(4), the support of solid good wafer after drying is connected wafer with bonding equipment with support wire;
(5), after wafer is connected with support, require corresponding glue on point in wafer surface according to outward appearance and color with point gum machine;
(6), put after glue and put into baking box the inside according to the condition of cure of corresponding glue, be transferred to suitable temperature, be baked to drying adhesive;
(7), after oven dry, put into again the mould the inside punching press of holding in advance line construction successfully;
(8), test classification after punch forming, if find that there is defective products again with flatiron with engrave cutting tool and keep in repair;
(9), test sort out after, complete light source and the line design groundwork of lamp bar lamp band;
(10), rear portion can be according to the purposes difference of various products, do corresponding surface insulation and waterproof anti-collide with to process completed the production technology of whole lamp bar lamp band.
2. the manufacturing technique method of LED lamp bar according to claim 1, is characterized in that, oven temperature is selected in following scope described in the 3rd step: 80 ℃～150 ℃.
3. the manufacturing technique method of LED lamp bar according to claim 1, is characterized in that, baking box baking time is selected in following scope described in the 3rd step: 60min～150 min.
4. the manufacturing technique method of LED lamp bar according to claim 1, is characterized in that, oven temperature is selected in following scope described in the 6th step: 80 ℃～150 ℃.
5. the manufacturing technique method of LED lamp bar according to claim 1, is characterized in that, baking box baking time is selected in following scope described in the 6th step: 120min～260 min.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410057509.XA CN103826430A (en) | 2013-11-12 | 2014-02-20 | Production process method for LED light bar |
| PCT/CN2014/078038 WO2015123928A1 (en) | 2014-02-20 | 2014-05-21 | Production process method for led light bar |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310561449 | 2013-11-12 | ||
| CN201310561449.0 | 2013-11-12 | ||
| CN201410057509.XA CN103826430A (en) | 2013-11-12 | 2014-02-20 | Production process method for LED light bar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103826430A true CN103826430A (en) | 2014-05-28 |
Family
ID=53879264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410057509.XA Pending CN103826430A (en) | 2013-11-12 | 2014-02-20 | Production process method for LED light bar |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103826430A (en) |
| WO (1) | WO2015123928A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107046773A (en) * | 2016-12-14 | 2017-08-15 | 昆山圆裕电子科技有限公司 | Illuminating module wiring board high efficiency preparation method |
| CN107366838A (en) * | 2017-07-05 | 2017-11-21 | 佛山杰致信息科技有限公司 | A kind of LED manufacture craft |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112242471A (en) * | 2019-07-16 | 2021-01-19 | 王定锋 | Circuit board module manufactured by LED (light-emitting diode) surface-mounted lamp beads packaged by lens glue only and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1945803A (en) * | 2006-10-27 | 2007-04-11 | 杭州中宙光电有限公司 | Packaging method for high power LED expansion light source device |
| CN1949553A (en) * | 2006-11-23 | 2007-04-18 | 保定市宝新世纪路灯厂 | LED of sodium imitation light source and mfg. technique thereof |
| CN101404260A (en) * | 2008-10-14 | 2009-04-08 | 江苏稳润光电有限公司 | LED display packaging method |
| CN101752468A (en) * | 2008-12-17 | 2010-06-23 | 四川柏狮光电技术有限公司 | Suspending manufacture process of light emitting diode (LED) fluorescent powder |
| CN102569553A (en) * | 2011-12-31 | 2012-07-11 | 深圳市蓝科电子有限公司 | Packaging technology for LED (light-emitting diode) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103531671A (en) * | 2012-07-08 | 2014-01-22 | 深圳市蓝科电子有限公司 | Production process of light-emitting diode and light-emitting diode |
| CN103545423A (en) * | 2013-10-28 | 2014-01-29 | 江门市亮大照明有限公司 | LED encapsulation method |
-
2014
- 2014-02-20 CN CN201410057509.XA patent/CN103826430A/en active Pending
- 2014-05-21 WO PCT/CN2014/078038 patent/WO2015123928A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1945803A (en) * | 2006-10-27 | 2007-04-11 | 杭州中宙光电有限公司 | Packaging method for high power LED expansion light source device |
| CN1949553A (en) * | 2006-11-23 | 2007-04-18 | 保定市宝新世纪路灯厂 | LED of sodium imitation light source and mfg. technique thereof |
| CN101404260A (en) * | 2008-10-14 | 2009-04-08 | 江苏稳润光电有限公司 | LED display packaging method |
| CN101752468A (en) * | 2008-12-17 | 2010-06-23 | 四川柏狮光电技术有限公司 | Suspending manufacture process of light emitting diode (LED) fluorescent powder |
| CN102569553A (en) * | 2011-12-31 | 2012-07-11 | 深圳市蓝科电子有限公司 | Packaging technology for LED (light-emitting diode) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107046773A (en) * | 2016-12-14 | 2017-08-15 | 昆山圆裕电子科技有限公司 | Illuminating module wiring board high efficiency preparation method |
| CN107366838A (en) * | 2017-07-05 | 2017-11-21 | 佛山杰致信息科技有限公司 | A kind of LED manufacture craft |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015123928A1 (en) | 2015-08-27 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20140528 |