WO2015123928A1 - Production process method for led light bar - Google Patents
Production process method for led light bar Download PDFInfo
- Publication number
- WO2015123928A1 WO2015123928A1 PCT/CN2014/078038 CN2014078038W WO2015123928A1 WO 2015123928 A1 WO2015123928 A1 WO 2015123928A1 CN 2014078038 W CN2014078038 W CN 2014078038W WO 2015123928 A1 WO2015123928 A1 WO 2015123928A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- bracket
- light bar
- led light
- wafer
- production process
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 239000003292 glue Substances 0.000 claims description 25
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 238000012360 testing method Methods 0.000 claims description 12
- 238000005476 soldering Methods 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 8
- 230000002950 deficient Effects 0.000 claims description 6
- 238000013461 design Methods 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 238000004078 waterproofing Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 6
- 230000001070 adhesive effect Effects 0.000 abstract 6
- 239000011324 bead Substances 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Definitions
- the invention relates to the manufacture of LEDs, in particular to a method for producing LED light strips. Background technique
- the traditional LED strip light strip production process is based on customer requirements, the circuit board is designed in advance, and then a plurality of single LED lamp beads and other electronic components are fixed on the circuit board by soldering, according to the process requirements, each The lamp bead and all electronic components must pass high temperature soldering of about 220 degrees, and the production process of the circuit board is a highly polluting enterprise. The production process is inevitably polluted by the environment. All the lamp beads need to be fixed on the line by soldering.
- the board also greatly increases the complexity of the production process and the material cost, and reduces the production efficiency and increases the total production cost.
- the object of the present invention is to provide a production process method for an LED light bar which is simple in production process and low in production cost, in view of the above-mentioned drawbacks of the prior art.
- a method for producing an LED light bar comprising the following steps:
- the rear part can be used according to the different uses of various products, the corresponding surface insulation and waterproof anti-bumping treatment to complete the production process of the entire strip light strip.
- the temperature of the third oven is selected within the following range: 80 ° C to 150 ° C.
- the baking time of the baking box of the third crucible is selected within the following range: 60 min to 150 min.
- the temperature of the oven of the sixth crucible is selected within the following range: 80 ° C to 150 ° C.
- the sixth crucible is roasted
- the box baking time is selected within the following range: 120min ⁇ 260 min.
- the invention has the beneficial effects that the manufacturing process of the invention is simple, the cumbersome processing cost of the conventional LED lamp fixed on the circuit board by multiple welding is omitted, and the cost and the elimination of most of the tin material are omitted.
- the invention directly adopts the LED lamp bead bracket and the metal leg of the related electronic component itself as a connecting wire, and directly adopts a semiconductor packaging technology to form one or more LED strip lights with a string and a circuit, and does not need to be connected by a circuit board to fix the LED lamp. Beads and other related electronic originals.
- Embodiment 1 A method for manufacturing an LED light bar, comprising the following steps:
- the dispenser is used on the surface of the wafer according to the appearance and color. Require the corresponding glue
- the baking time is set to 250 min, bake to glue to dry;
- the rear part can be used according to the different uses of various products, the corresponding surface insulation and waterproof anti-bumping treatment to complete the production process of the entire strip light strip.
- Embodiment 2 A method for producing an LED light bar, comprising the following steps:
- the baking time is set to 120min, then the oven temperature is adjusted to 150 degrees, the baking time is set to 180min, baked to glue drying;
- the rear part can be used according to the different uses of various products, the corresponding surface insulation and waterproof anti-bumping treatment to complete the production process of the entire strip light strip.
- Embodiment 3 A method for manufacturing an LED light bar, comprising the following steps:
- the baking time is set to 180 min, bake to glue to dry; (7), after drying, put it into the mold which has opened the circuit structure in advance;
- the rear part can be used according to the different uses of various products, the corresponding surface insulation and waterproof anti-bumping treatment to complete the production process of the entire strip light strip.
- Embodiment 4 A method for manufacturing an LED light bar, comprising the following steps:
- the baking time is set to 240 min, bake to glue to dry;
- the rear part can be used according to the different uses of various products, the corresponding surface insulation and waterproof anti-bumping treatment to complete the production process of the entire strip light strip.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Disclosed is a production process method for an LED light bar, comprising the following steps: manufacturing a bracket stamping mould for an LED light bar and preparing a raw material of the LED light bar; placing the moulded bracket on a die bonder, and fixing an LED wafer to the bracket using the die bonder; placing the bracket onto which the wafer has been fixed into an oven to conduct baking; as for the dried bracket onto which the wafer has been fixed, connecting the wafer to the bracket via a conducting wire using a wire welding machine; after the wafer is connected to the bracket, and according to appearance and colour requirements, dispensing a corresponding adhesive onto the surface of the wafer using an adhesive dispenser; after the adhesive is dispensed, and according to the curing condition of the corresponding adhesive, placing the wafer into the oven, and baking same until the adhesive is dried; and then, placing same into a mould in which a line structure is provided in advance to conduct stamping after the adhesive is dried. The present invention has a simple manufacturing process, omits the complex step where a traditional LED lamp is fixed to a circuit board by way of welding many times, saves most of the tin materials and reduces the costs of all the circuit boards.
Description
说 明 书 一种 LED灯条的生产工艺方法 Description of the production process of an LED light bar
技术领域 Technical field
本发明涉及 LED的制作，特别涉及一种 LED灯条的生产工艺方法。 背景技术 The invention relates to the manufacture of LEDs, in particular to a method for producing LED light strips. Background technique
传统的 LED灯条灯带生产工艺是根据客户要求，事先设计好线路 板，再把多个单颗 LED灯珠和其他电子元件用锡焊接的方式固定在线 路板上， 根据工艺要求， 每个灯珠和所有电子元件都必须经过 220度 左右的高温锡焊， 并且线路板的生产工艺是属于高污染企业， 生产过 程难免会对环境造成污染，所有灯珠需用锡焊的方式固定在线路板上 也大大的增加了生产工艺的复杂度和材料成本， 且降低了生产效率， 加大了总的生产成本。 The traditional LED strip light strip production process is based on customer requirements, the circuit board is designed in advance, and then a plurality of single LED lamp beads and other electronic components are fixed on the circuit board by soldering, according to the process requirements, each The lamp bead and all electronic components must pass high temperature soldering of about 220 degrees, and the production process of the circuit board is a highly polluting enterprise. The production process is inevitably polluted by the environment. All the lamp beads need to be fixed on the line by soldering. The board also greatly increases the complexity of the production process and the material cost, and reduces the production efficiency and increases the total production cost.
发明内容 Summary of the invention
本发明的目的是针对现有技术的上述缺陷，提供一种生产过程简 单、 制作成本低廉的 LED灯条的生产工艺方法。 SUMMARY OF THE INVENTION The object of the present invention is to provide a production process method for an LED light bar which is simple in production process and low in production cost, in view of the above-mentioned drawbacks of the prior art.
为解决现有技术的上述缺陷， 本发明要解决的技术方案是： 一种 LED灯条的生产工艺方法， 包括以下歩骤： In order to solve the above-mentioned drawbacks of the prior art, the technical solution to be solved by the present invention is: A method for producing an LED light bar, comprising the following steps:
( 1 )、 备料， 首先制作成 LED灯条的支架冲压模具和配制成 LED 灯条的原材料； (1), preparing materials, first making a bracket stamping die for LED strips and raw materials for LED strips;
( 2 )、将成型的支架放在固晶机上， 把 LED晶片用固晶机固定在 支架上；
(3 )、把已固好晶片的支架放入烤箱里面进行烘烤， 将烤箱温度 调节至合适温度， 烘烤到一定时间后， 取出已固好晶片的支架；(2) placing the formed bracket on the die bonding machine, and fixing the LED chip to the bracket by using a die bonding machine; (3) Put the rack with the fixed wafer into the oven for baking, adjust the temperature of the oven to a suitable temperature, and after baking for a certain period of time, take out the bracket with the fixed wafer;
(4)、将烤干后已固好晶片的支架用焊线机把晶片与支架用导线 连接； (4) connecting the wafer to the support wire with a wire bonding machine for the bracket which has been solidified after baking;
(5 )、 晶片与支架连接后， 用点胶机在晶片表面根据外观和颜色 要求点上相应的胶水； (5) After the wafer is connected to the bracket, use a dispenser to point the corresponding glue on the surface of the wafer according to the appearance and color requirements;
(6)、 点好胶水后根据相应胶水的固化条件放入烤箱里面， 调到 合适温度， 烘烤至胶水烘干； (6), after putting the glue into place, put it into the oven according to the curing conditions of the corresponding glue, adjust it to the appropriate temperature, and bake it to the glue to dry;
( 7)、 烘干后再放入事先开好线路结构的模具里面冲压； (7), after drying, put it into the mold which has opened the circuit structure in advance;
(8)、冲压成型后进行测试归类， 如果发现有不良品再用烙铁和 镌切工具进行维修； (8) After the stamping and forming, the test is classified, and if it is found that there is a defective product, the soldering iron and the cutting tool are used for maintenance;
(9)、进行测试归类后， 完成灯条灯带的光源和线路设计主要工 作； (9) After the test is classified, the light source and circuit design of the strip light strip are completed;
( 10 )、 后部可以根据各种产品的用途不同， 做相应的表面绝缘 和防水防磕碰处理即完成整个灯条灯带的生产工艺了。 (10), the rear part can be used according to the different uses of various products, the corresponding surface insulation and waterproof anti-bumping treatment to complete the production process of the entire strip light strip.
作为本发明 LED灯条的生产工艺方法的一种改进，第三歩所述烤 箱温度在以下范围内选择： 80°C〜150°C。 As an improvement of the production process of the LED light bar of the present invention, the temperature of the third oven is selected within the following range: 80 ° C to 150 ° C.
作为本发明 LED灯条的生产工艺方法的一种改进，第三歩所述烤 箱烘烤时间在以下范围内选择： 60min〜150 min。 As an improvement of the production process of the LED light bar of the present invention, the baking time of the baking box of the third crucible is selected within the following range: 60 min to 150 min.
作为本发明 LED灯条的生产工艺方法的一种改进，第六歩所述烤 箱温度在以下范围内选择： 80°C〜150°C。 As an improvement of the production process of the LED light bar of the present invention, the temperature of the oven of the sixth crucible is selected within the following range: 80 ° C to 150 ° C.
作为本发明 LED灯条的生产工艺方法的一种改进， 第六歩所述烤
箱烘烤时间在以下范围内选择： 120min〜260 min。 As an improvement of the production process of the LED light bar of the present invention, the sixth crucible is roasted The box baking time is selected within the following range: 120min~260 min.
本发明的有益效果是： 本发明制作过程简单、省去了传统 LED灯 经过多次焊接固定在电路板上的繁琐歩骤的加工成本，省去了大部分 的锡材料的成本和省去了所有线路板的成本，并避免了 LED灯珠经过 锡焊的高温环境造成对 LED灯珠的不良影响，从而大大的提高了灯带 的使用寿命， 同时大大的降低了生产制造成本， 尤其适合在现有的 LED照明产品的生产中推广。 本发明直接采用 LED灯珠支架和相关的 电子元件本身的金属脚作为连接导线， 直接采用半导体封装技术， 组 成一个或多个 LED灯条灯带串并电路， 不需要靠线路板连接固定 LED 灯珠和其他相关的电子原件。 The invention has the beneficial effects that the manufacturing process of the invention is simple, the cumbersome processing cost of the conventional LED lamp fixed on the circuit board by multiple welding is omitted, and the cost and the elimination of most of the tin material are omitted. The cost of all circuit boards, and avoiding the adverse effects of LED lamp beads on the LED lamp beads caused by the high temperature environment of soldering, thereby greatly improving the service life of the lamp strips, and greatly reducing the manufacturing cost, especially suitable for The existing LED lighting products are promoted in the production. The invention directly adopts the LED lamp bead bracket and the metal leg of the related electronic component itself as a connecting wire, and directly adopts a semiconductor packaging technology to form one or more LED strip lights with a string and a circuit, and does not need to be connected by a circuit board to fix the LED lamp. Beads and other related electronic originals.
具体实施方式 detailed description
下面就以具体实施例对本发明作进一歩说明。 The invention will now be further described by way of specific examples.
实施例一： 一种 LED灯条的生产工艺方法， 包括以下歩骤： Embodiment 1 A method for manufacturing an LED light bar, comprising the following steps:
( 1 )、 备料， 首先制作成 LED灯条的支架冲压模具和配制成 LED 灯条的原材料； (1), preparing materials, first making a bracket stamping die for LED strips and raw materials for LED strips;
( 2 )、将成型的支架放在固晶机上， 把 LED晶片用固晶机固定在 支架上； (2) placing the formed bracket on the die bonding machine, and fixing the LED chip on the bracket with a die bonding machine;
( 3 )、把已固好晶片的支架放入烤箱里面进行烘烤， 将烤箱温度 调节至 150°C， 烘烤时间定为 130min， 取出已固好晶片的支架； (3) Put the rack with the fixed wafer into the oven for baking, adjust the temperature of the oven to 150 ° C, and set the baking time to 130 min, and take out the bracket with the fixed wafer;
(4)、将烤干后已固好晶片的支架用焊线机把晶片与支架用导线 连接； (4) connecting the wafer to the support wire with a wire bonding machine for the bracket which has been solidified after baking;
( 5 )、 晶片与支架连接后， 用点胶机在晶片表面根据外观和颜色
要求点上相应的胶水； (5) After the wafer is connected to the bracket, the dispenser is used on the surface of the wafer according to the appearance and color. Require the corresponding glue;
(6)、 点好胶水后根据相应胶水的固化条件放入烤箱里面， 调到 150°C， 烘烤时间定为 250min， 烘烤至胶水烘干； (6), after putting the glue into place, put it into the oven according to the curing condition of the corresponding glue, adjust to 150 ° C, the baking time is set to 250 min, bake to glue to dry;
( 7)、 烘干后再放入事先开好线路结构的模具里面冲压； (7), after drying, put it into the mold which has opened the circuit structure in advance;
(8)、冲压成型后进行测试归类， 如果发现有不良品再用烙铁和 镌切工具进行维修； (8) After the stamping and forming, the test is classified, and if it is found that there is a defective product, the soldering iron and the cutting tool are used for maintenance;
(9)、进行测试归类后， 完成灯条灯带的光源和线路设计主要工 作； (9) After the test is classified, the light source and circuit design of the strip light strip are completed;
( 10 )、 后部可以根据各种产品的用途不同， 做相应的表面绝缘 和防水防磕碰处理即完成整个灯条灯带的生产工艺了。 (10), the rear part can be used according to the different uses of various products, the corresponding surface insulation and waterproof anti-bumping treatment to complete the production process of the entire strip light strip.
实施例二： 一种 LED灯条的生产工艺方法， 包括以下歩骤： Embodiment 2: A method for producing an LED light bar, comprising the following steps:
( 1 )、 备料， 首先制作成 LED灯条的支架冲压模具和配制成 LED 灯条的原材料； (1), preparing materials, first making a bracket stamping die for LED strips and raw materials for LED strips;
(2 )、将成型的支架放在固晶机上， 把 LED晶片用固晶机固定在 支架上； (2) placing the formed bracket on the die bonding machine, and fixing the LED chip to the bracket by using a die bonding machine;
(3 )、把已固好晶片的支架放入烤箱里面进行烘烤， 将烤箱温度 调节至 150°C， 烘烤时间定为 120min， 取出已固好晶片的支架； (3) Put the rack with the fixed wafer into the oven for baking, adjust the temperature of the oven to 150 ° C, and set the baking time to 120 min, and take out the bracket with the fixed wafer;
(4)、将烤干后已固好晶片的支架用焊线机把晶片与支架用导线 连接； (4) connecting the wafer to the support wire with a wire bonding machine for the bracket which has been solidified after baking;
(5 )、 晶片与支架连接后， 用点胶机在晶片表面根据外观和颜色 要求点上相应的胶水； (5) After the wafer is connected to the bracket, use a dispenser to point the corresponding glue on the surface of the wafer according to the appearance and color requirements;
(6)、 点好胶水后根据相应胶水的固化条件放入烤箱里面， 调到
80°C， 烘烤时间定为 120min， 再把烤箱温度调到 150度， 烘烤时间 定为 180min， 烘烤至胶水烘干； (6), after putting the glue into place, put it into the oven according to the curing conditions of the corresponding glue, adjust to 80 ° C, the baking time is set to 120min, then the oven temperature is adjusted to 150 degrees, the baking time is set to 180min, baked to glue drying;
( 7)、 烘干后再放入事先开好线路结构的模具里面冲压； (7), after drying, put it into the mold which has opened the circuit structure in advance;
(8)、冲压成型后进行测试归类， 如果发现有不良品再用烙铁和 镌切工具进行维修； (8) After the stamping and forming, the test is classified, and if it is found that there is a defective product, the soldering iron and the cutting tool are used for maintenance;
(9)、进行测试归类后， 完成灯条灯带的光源和线路设计主要工 作； (9) After the test is classified, the light source and circuit design of the strip light strip are completed;
( 10 )、 后部可以根据各种产品的用途不同， 做相应的表面绝缘 和防水防磕碰处理即完成整个灯条灯带的生产工艺了。 (10), the rear part can be used according to the different uses of various products, the corresponding surface insulation and waterproof anti-bumping treatment to complete the production process of the entire strip light strip.
实施例三： 一种 LED灯条的生产工艺方法， 包括以下歩骤： Embodiment 3: A method for manufacturing an LED light bar, comprising the following steps:
( 1 )、 备料， 首先制作成 LED灯条的支架冲压模具和配制成 LED 灯条的原材料； (1), preparing materials, first making a bracket stamping die for LED strips and raw materials for LED strips;
(2 )、将成型的支架放在固晶机上， 把 LED晶片用固晶机固定在 支架上； (2) placing the formed bracket on the die bonding machine, and fixing the LED chip to the bracket by using a die bonding machine;
(3 )、把已固好晶片的支架放入烤箱里面进行烘烤， 将烤箱温度 调节至 120°C， 烘烤时间定为 150min， 取出已固好晶片的支架； (3) Put the rack with the fixed wafer into the oven for baking, adjust the temperature of the oven to 120 ° C, and set the baking time to 150 min, and take out the bracket with the fixed wafer;
(4)、将烤干后已固好晶片的支架用焊线机把晶片与支架用导线 连接； (4) connecting the wafer to the support wire with a wire bonding machine for the bracket which has been solidified after baking;
(5 )、 晶片与支架连接后， 用点胶机在晶片表面根据外观和颜色 要求点上相应的胶水； (5) After the wafer is connected to the bracket, use a dispenser to point the corresponding glue on the surface of the wafer according to the appearance and color requirements;
(6)、 点好胶水后根据相应胶水的固化条件放入烤箱里面， 调到 150°C， 烘烤时间定为 180min， 烘烤至胶水烘干；
( 7)、 烘干后再放入事先开好线路结构的模具里面冲压； (6), after putting the glue into place, put it into the oven according to the curing condition of the corresponding glue, adjust to 150 ° C, the baking time is set to 180 min, bake to glue to dry; (7), after drying, put it into the mold which has opened the circuit structure in advance;
(8)、冲压成型后进行测试归类， 如果发现有不良品再用烙铁和 镌切工具进行维修； (8) After the stamping and forming, the test is classified, and if it is found that there is a defective product, the soldering iron and the cutting tool are used for maintenance;
(9)、进行测试归类后， 完成灯条灯带的光源和线路设计主要工 作； (9) After the test is classified, the light source and circuit design of the strip light strip are completed;
( 10 )、 后部可以根据各种产品的用途不同， 做相应的表面绝缘 和防水防磕碰处理即完成整个灯条灯带的生产工艺了。 (10), the rear part can be used according to the different uses of various products, the corresponding surface insulation and waterproof anti-bumping treatment to complete the production process of the entire strip light strip.
实施例四： 一种 LED灯条的生产工艺方法， 包括以下歩骤： Embodiment 4: A method for manufacturing an LED light bar, comprising the following steps:
( 1 )、 备料， 首先制作成 LED灯条的支架冲压模具和配制成 LED 灯条的原材料； (1), preparing materials, first making a bracket stamping die for LED strips and raw materials for LED strips;
(2 )、将成型的支架放在固晶机上， 把 LED晶片用固晶机固定在 支架上； (2) placing the formed bracket on the die bonding machine, and fixing the LED chip to the bracket by using a die bonding machine;
(3 )、把已固好晶片的支架放入烤箱里面进行烘烤， 将烤箱温度 调节至 150°C， 烘烤时间定为 120min， 取出已固好晶片的支架； (3) Put the rack with the fixed wafer into the oven for baking, adjust the temperature of the oven to 150 ° C, and set the baking time to 120 min, and take out the bracket with the fixed wafer;
(4)、将烤干后已固好晶片的支架用焊线机把晶片与支架用导线 连接； (4) connecting the wafer to the support wire with a wire bonding machine for the bracket which has been solidified after baking;
(5 )、 晶片与支架连接后， 用点胶机在晶片表面根据外观和颜色 要求点上相应的胶水； (5) After the wafer is connected to the bracket, use a dispenser to point the corresponding glue on the surface of the wafer according to the appearance and color requirements;
(6)、 点好胶水后根据相应胶水的固化条件放入烤箱里面， 调到 150°C， 烘烤时间定为 240min， 烘烤至胶水烘干； (6), after putting the glue into place, put it into the oven according to the curing condition of the corresponding glue, adjust to 150 ° C, the baking time is set to 240 min, bake to glue to dry;
( 7)、 烘干后再放入事先开好线路结构的模具里面冲压； (7), after drying, put it into the mold which has opened the circuit structure in advance;
(8)、冲压成型后进行测试归类， 如果发现有不良品再用烙铁和
镌切工具进行维修； (8) Test and classify after stamping, if there is a defective product and then use a soldering iron and Cutting tools for maintenance;
( 9 )、进行测试归类后， 完成灯条灯带的光源和线路设计主要工 作； (9) After the test is classified, the light source and circuit design of the strip light strip are completed;
( 10 )、 后部可以根据各种产品的用途不同， 做相应的表面绝缘 和防水防磕碰处理即完成整个灯条灯带的生产工艺了。 (10), the rear part can be used according to the different uses of various products, the corresponding surface insulation and waterproof anti-bumping treatment to complete the production process of the entire strip light strip.
根据上述说明书的揭示和教导，本发明所属领域的技术人员还可 以对上述实施方式进行适当的变更和修改。 因此， 本发明并不局限于 上面揭示和描述的具体实施方式，对本发明的一些修改和变更也应当 落入本发明的权利要求的保护范围内。此外， 尽管本说明书中使用了 一些特定的术语， 但这些术语只是为了方便说明， 并不对本发明构成 任何限制。
Modifications and modifications of the above-described embodiments can be made by those skilled in the art in light of the above disclosure. Therefore, the present invention is not limited to the specific embodiments disclosed and described, and the modifications and variations of the invention are intended to fall within the scope of the appended claims. In addition, although specific terms are used in the specification, these terms are merely for convenience of description and do not limit the invention.
Claims
1、 一种 LED灯条的生产工艺方法， 其特征在于， 包括以下歩骤：1. A production process method for an LED light bar, which is characterized by including the following steps:
( 1 )、 备料， 首先制作成 LED灯条的支架冲压模具和配制成 LED 灯条的原材料； (1). Prepare materials. First, make the bracket stamping mold for the LED light bar and prepare the raw materials for the LED light bar;
(2 )、将成型的支架放在固晶机上， 把 LED晶片用固晶机固定在 支架上； (2) Place the formed bracket on the die bonding machine, and fix the LED chip on the bracket with the die bonding machine;
(3 )、把已固好晶片的支架放入烤箱里面进行烘烤， 将烤箱温度 调节至合适温度， 烘烤到一定时间后， 取出已固好晶片的支架； (3) Put the holder with the chip fixed into the oven for baking, adjust the oven temperature to a suitable temperature, and after baking for a certain period of time, take out the holder with the chip fixed;
(4)、将烤干后已固好晶片的支架用焊线机把晶片与支架用导线 连接； (4) Use a wire bonding machine to connect the chip and the bracket with wires after drying and fixing the chip;
(5 )、 晶片与支架连接后， 用点胶机在晶片表面根据外观和颜色 要求点上相应的胶水； (5) After the chip is connected to the bracket, use a glue dispensing machine to apply the corresponding glue on the surface of the chip according to the appearance and color requirements;
(6)、 点好胶水后根据相应胶水的固化条件放入烤箱里面， 调到 合适温度， 烘烤至胶水烘干； (6) After dotting the glue, place it in the oven according to the curing conditions of the corresponding glue, adjust to the appropriate temperature, and bake until the glue is dry;
( 7)、 烘干后再放入事先开好线路结构的模具里面冲压； (7). After drying, place it into a mold with a pre-opened circuit structure for stamping;
(8)、冲压成型后进行测试归类， 如果发现有不良品再用烙铁和 镌切工具进行维修； (8) Test and classify after stamping. If any defective products are found, use soldering iron and engraving tools to repair them;
(9)、进行测试归类后， 完成灯条灯带的光源和线路设计主要工 作； (9) After testing and classification, complete the main work of light source and circuit design of the light strip;
( 10 )、 后部可以根据各种产品的用途不同， 做相应的表面绝缘 和防水防磕碰处理即完成整个灯条灯带的生产工艺了。
2、 根据权利要求 1所述的 LED灯条的生产工艺方法， 其特征在 于， 第三歩所述烤箱温度在以下范围内选择： 80°C〜150°C。 (10). According to the different uses of various products, the rear part can be provided with corresponding surface insulation, waterproofing and anti-collision treatment to complete the production process of the entire light strip. 2. The production process of the LED light bar according to claim 1, characterized in that the oven temperature in the third step is selected within the following range: 80°C~150°C.
3、 根据权利要求 1所述的 LED灯条的生产工艺方法， 其特征在 于， 第三歩所述烤箱烘烤时间在以下范围内选择： 60min〜150 min。 3. The production process of the LED light bar according to claim 1, characterized in that the oven baking time in the third step is selected within the following range: 60 min ~ 150 min.
4、 根据权利要求 1所述的 LED灯条的生产工艺方法， 其特征在 于， 第六歩所述烤箱温度在以下范围内选择： 80°C〜150°C。 4. The production process method of the LED light bar according to claim 1, characterized in that the oven temperature in the sixth step is selected within the following range: 80°C~150°C.
5、 根据权利要求 1所述的 LED灯条的生产工艺方法， 其特征在 于， 第六歩所述烤箱烘烤时间在以下范围内选择： 120min〜260 min。
5. The production process method of the LED light bar according to claim 1, characterized in that the oven baking time in the sixth step is selected within the following range: 120 min~260 min.
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