CN107046773A - Illuminating module wiring board high efficiency preparation method - Google Patents
Illuminating module wiring board high efficiency preparation method Download PDFInfo
- Publication number
- CN107046773A CN107046773A CN201611151927.0A CN201611151927A CN107046773A CN 107046773 A CN107046773 A CN 107046773A CN 201611151927 A CN201611151927 A CN 201611151927A CN 107046773 A CN107046773 A CN 107046773A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- illuminating module
- module wiring
- high efficiency
- bending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
Abstract
The present invention is a kind of illuminating module wiring board high efficiency preparation method, is comprised the following steps：1) in progress straight line typesetting in diel；2) punching press draws straight path plate；3) need to set on straight path plate using bending equipment progress pressurization reflexed at knuckle cabling, and obtain required illuminating module wiring board.The illuminating module wiring board high efficiency preparation method of the present invention, it can efficiently carry out the preparation of illuminating module wiring board, and without the use of many secondary diels, reduction production cost is wasted improves production efficiency simultaneously.
Description
Technical field
The present invention relates to electronic equipment component technology of preparing, especially upper technical field of circuit board, specifically, it is opened up
Show a kind of illuminating module wiring board high efficiency preparation method.
Background technology
With the development of society, electronic product develops towards the direction such as fashion, attractive in appearance, novel, corresponding electronic product
Internal structure also becomes increasingly complex；
To avoid other components inside electronic product, the wiring board used can set its cabling position in 90 ° straight
Angle, it is to avoid interfere other components in electronic product during assembling；
Prepared by wiring board at this stage, reference picture 1：
Punch forming is carried out using according to finished product structure, simultaneously because cabling angle 100 is 90 °, it is impossible to pass through a secondary punching
Compression mould carries out external form and all gone out, and wastes production cost；
Therefore, it is necessary to provide a kind of illuminating module wiring board high efficiency preparation method to solve the above problems.
The content of the invention
It is an object of the invention to provide a kind of illuminating module wiring board high efficiency preparation method, it can efficiently carry out luminous mould
The preparation of group wiring board, and without the use of many secondary diels, reduction production cost is wasted improves production efficiency simultaneously.
The present invention is achieved through the following technical solutions above-mentioned purpose：
A kind of illuminating module wiring board high efficiency preparation method, comprises the following steps：
1) in progress straight line typesetting in diel；
2) punching press draws straight path plate；
3) need to set on straight path plate using bending equipment progress pressurization reflexed at knuckle cabling, and obtain required hair
Optical mode group wiring board.
Further, step 3) in bending be set to bender.
Further, step 3) comprise the following steps：
3a) straight path plate is placed in get ready platform carry out bending part get ready；
Straight path plate after 3b) getting ready is placed in bender intracavitary, rear to carry out the folding that place is got in bending ready using bender
It is curved.
Further, step 1) include it is such when step：
1a) the length of conversion illuminating module wiring board, and stamping die is set with this length；
1b) the stamped groove in the arrangement stamping die of maximal efficiency；
1c) place illuminating module circuit board raw material.
Wherein：
1) obtained by straight line typesetting punching press after straight path plate, the bending of bending part, straight line are carried out using bending equipment
Typesetting maximized can carry out the punch forming of wiring board, and be not required to outer at diel guarantee bending cabling using overpaying
Type is gone out, and straight line typesetting punching press can disposably obtain the larger straight path plate of quantity, after pass through bending equipment bending phase
Bending part should be needed to obtain required illuminating module wiring board, production efficiency prepared by illuminating module wiring board is improved, simultaneously
And be not required to go out the waste reduced to the resources of production using the external form overpaied at diel guarantee bending cabling.
Compared with prior art, illuminating module wiring board high efficiency preparation method of the invention, it can efficiently be lighted
The preparation of module wiring board, and without the use of many secondary diels, reduce production cost waste and improve production efficiency simultaneously.
Brief description of the drawings
Fig. 1 is existing wiring board punch forming typesetting schematic diagram；
Fig. 2 is the straight path plate typesetting schematic diagram of embodiments of the invention；
Numeral is represented in figure：
100 cabling angles；
1 straight path plate.
Embodiment
Embodiment:
The present embodiment shows a kind of illuminating module wiring board high efficiency preparation method, comprises the following steps：
1) reference picture 2, in progress straight line typesetting in diel；
2) punching press draws straight path plate 1；
3) need to set on straight path plate 1 using bending equipment progress pressurization reflexed at knuckle cabling, and obtain required
Illuminating module wiring board.
Step 3) in bending be set to bender.
Step 3) comprise the following steps：
3a) straight path plate 1 is placed in get ready platform carry out bending part get ready；
Straight path plate 1 after 3b) getting ready is placed in bender intracavitary, rear to carry out the folding that place is got in bending ready using bender
It is curved.
Step 1) include it is such when step：
1a) the length of conversion illuminating module wiring board, and stamping die is set with this length；
1b) the stamped groove in the arrangement stamping die of maximal efficiency；
1c) place illuminating module circuit board raw material.
Wherein：
1) obtained by straight line typesetting punching press after straight path plate 1, the bending of bending part, straight line are carried out using bending equipment
Typesetting maximized can carry out the punch forming of wiring board, and be not required to outer at diel guarantee bending cabling using overpaying
Type is gone out, and straight line typesetting punching press can disposably obtain the larger straight path plate 1 of quantity, after pass through bending equipment bending phase
Bending part should be needed to obtain required illuminating module wiring board, production efficiency prepared by illuminating module wiring board is improved, simultaneously
And be not required to go out the waste reduced to the resources of production using the external form overpaied at diel guarantee bending cabling.
Compared with prior art, the illuminating module wiring board high efficiency preparation method of the present embodiment, it can efficiently be sent out
The preparation of optical mode group wiring board, and without the use of many secondary diels, reduce production cost waste and improve production efficiency simultaneously.
Above-described is only some embodiments of the present invention.For the person of ordinary skill of the art, not
On the premise of departing from the invention design, various modifications and improvements can be made, these belong to the protection model of the present invention
Enclose.
Claims (4)
1. a kind of illuminating module wiring board high efficiency preparation method, it is characterised in that：
Comprise the following steps：
1) in progress straight line typesetting in diel；
2) punching press draws straight path plate；
3) need to set on straight path plate using bending equipment progress pressurization reflexed at knuckle cabling, and obtain required luminous mould
Group wiring board.
2. a kind of illuminating module wiring board high efficiency preparation method according to claim 1, it is characterised in that：
Step 3) in bending be set to bender.
3. a kind of illuminating module wiring board high efficiency preparation method according to claim 1 or 2, it is characterised in that：Step 3)
Comprise the following steps：
3a) straight path plate is placed in get ready platform carry out bending part get ready；
Straight path plate after 3b) getting ready is placed in bender intracavitary, rear to carry out the bending that place is got in bending ready using bender.
4. a kind of illuminating module wiring board high efficiency preparation method according to claim 3, it is characterised in that：Step 1) include
Step when so：
1a) the length of conversion illuminating module wiring board, and stamping die is set with this length；
1b) the stamped groove in the arrangement stamping die of maximal efficiency；
1c) place illuminating module circuit board raw material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611151927.0A CN107046773A (en) | 2016-12-14 | 2016-12-14 | Illuminating module wiring board high efficiency preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611151927.0A CN107046773A (en) | 2016-12-14 | 2016-12-14 | Illuminating module wiring board high efficiency preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107046773A true CN107046773A (en) | 2017-08-15 |
Family
ID=59543831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611151927.0A Pending CN107046773A (en) | 2016-12-14 | 2016-12-14 | Illuminating module wiring board high efficiency preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107046773A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103826430A (en) * | 2013-11-12 | 2014-05-28 | 吴启武 | Production process method for LED light bar |
| CN203951680U (en) * | 2014-06-27 | 2014-11-19 | 昆山圆裕电子科技有限公司 | FPC multiple tracks bending process tool |
| CN204090309U (en) * | 2014-08-05 | 2015-01-07 | 苏州恒迈精密机械有限公司 | A kind of Flexible Printed Circuit apparatus for bending |
| CN105880380A (en) * | 2016-04-18 | 2016-08-24 | 昆山电子羽电业制品有限公司 | Bending die for lamp strip |
-
2016
- 2016-12-14 CN CN201611151927.0A patent/CN107046773A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103826430A (en) * | 2013-11-12 | 2014-05-28 | 吴启武 | Production process method for LED light bar |
| CN203951680U (en) * | 2014-06-27 | 2014-11-19 | 昆山圆裕电子科技有限公司 | FPC multiple tracks bending process tool |
| CN204090309U (en) * | 2014-08-05 | 2015-01-07 | 苏州恒迈精密机械有限公司 | A kind of Flexible Printed Circuit apparatus for bending |
| CN105880380A (en) * | 2016-04-18 | 2016-08-24 | 昆山电子羽电业制品有限公司 | Bending die for lamp strip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170815 |