CN107231763B - A kind of golden finger wiring board preparation method and device - Google Patents
A kind of golden finger wiring board preparation method and device Download PDFInfo
- Publication number
- CN107231763B CN107231763B CN201710516421.3A CN201710516421A CN107231763B CN 107231763 B CN107231763 B CN 107231763B CN 201710516421 A CN201710516421 A CN 201710516421A CN 107231763 B CN107231763 B CN 107231763B
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- Prior art keywords
- golden finger
- wiring board
- die
- finger position
- milling plate
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a kind of golden finger wiring board preparation method and devices, by in wiring board sharp processing mode milling plate technique and both die process among the advantages of combine, using the method that first will carry out again local punch die after the local milling plate of wiring board progress, the shortcomings that avoiding low caused production efficiency when using milling plate in original process, wasting manpower and material resources, improve the problem of punch die causes larger edges of boards burr, hickie layering simultaneously, especially there is improvement to the sharp processing of high-end golden finger wiring board.
Description
Technical field
This application involves printed circuit board manufacturing field more particularly to a kind of golden finger wiring board preparation method and devices.
Background technique
At present the high-end golden finger board provided in part start be applied to optical communication device field, such supplier be telecommunication equipment,
Optics is shown, security system, medical instrument, environmental protection equipment, aviation and defense system provide optical module, module and subsystem.
Assembling of such product due to being applied to Electronic product precision system, generally requires outer dimension tolerance+50um；Simultaneously to gold
The reliability of finger proposes harsh requirement, as hickie layering occurs in golden finger side, burr crosses senior general and causes golden finger position
Proof voltage is insufficient with insulation resistance and electric property is caused to be affected.The strict demand of these outer dimensions and electric property,
It is a stern challenge for printed board manufactory.
There are mainly two types of from the point of view of golden finger wiring board tradition sharp processing mode.One is milling plate molding, shape marginal rays
Sliding impulse- free robustness is adapted to all products processing, but for the wiring board of outer dimension tolerance ± 50um, generally require by
Once rough mill with a finish-milling, or even using gong machine single shaft milling plate could reach reluctantly size requirement, cause in this way operation at
This is higher, production efficiency is low.Another is die stamp, and yield is high, and cost is relatively low, but is easy to appear in die process white
The quality problems such as spot is layered, edges of boards burr is larger.
Summary of the invention
The embodiment of the invention provides a kind of golden finger wiring board preparation method and devices, golden in the prior art to solve
Finger wiring board preparation cost is high, production efficiency is low, and is easy to appear hickie layer and the big problem of edges of boards burr.
Its specific technical solution is as follows:
A kind of golden finger wiring board preparation method, which comprises
Determine the golden finger position and non-golden finger position on wiring board；
By golden finger milling plate mode, milling plate molding is carried out to the golden finger position；
Based on preset wiring board punching die, die stamp is carried out to the non-golden finger position.
Optionally, the golden finger position and non-golden finger position on wiring board are determined, comprising:
According to preset formula, coordinate position of the golden finger on the wiring board is determined；
Using the coordinate position as golden finger position, and using rest position on the wiring board as the non-golden finger
Position.
Optionally, it is based on preset wiring board punching die, die stamp is carried out to the non-golden finger position, specifically
Are as follows:
Based on preset wiring board punching die and outer dimension tolerance is formulated, the non-golden finger position is rushed
Mold forming.
Optionally, it is being based on preset wiring board punching die, before carrying out die stamp to the non-golden finger position,
The method also includes:
Detection whether there is abnormal position to golden finger milling plate molding on the wiring board；
If it exists, then it after rearmost position is completed, returns to abnormal position and continues milling plate molding；
If it is not, then starting the die stamp to the non-golden finger position.
A kind of golden finger wiring board preparation facilities, described device include:
Determining module, for determining golden finger position and non-golden finger position on wiring board；
Milling plate molding machine, for carrying out milling plate molding to the golden finger position by golden finger milling plate mode；
Die forming device carries out punch die to the non-golden finger position for being based on preset wiring board punching die
Molding.
Optionally, the determining module is specifically used for determining golden finger in the wiring board according to preset formula
On coordinate position；Using the coordinate position as golden finger position, and using rest position on the wiring board as described non-
Golden finger position.
Optionally, the die forming device is specifically used for based on preset wiring board punching die and formulates shape
Dimensional tolerance carries out die stamp to the non-golden finger position.
Optionally, described device further include:
Processing module whether there is abnormal position to golden finger milling plate molding on the wiring board for detecting；If it exists,
Then after rearmost position is completed, returns to abnormal position and continue milling plate molding；If it is not, then starting is to the non-golden finger position
Die stamp.
Method provided by the invention, by wiring board sharp processing mode milling plate technique and both die process among
Advantage combines, and using wiring board is first carried out the method for carrying out local punch die again after local milling plate, avoids in original process
The shortcomings that caused production efficiency is low when using milling plate, wasting manpower and material resources, at the same improve punch die cause edges of boards burr it is larger,
The problem of hickie is layered especially has improvement to the sharp processing of high-end golden finger wiring board.
Detailed description of the invention
Fig. 1 is a kind of flow chart of the preparation method of golden finger wiring board in the embodiment of the present invention；
Fig. 2 is the schematic diagram in the embodiment of the present invention after the molding of wiring board milling plate；
Fig. 3 is the structural schematic diagram of the rear board of die stamp in the embodiment of the present invention；
Fig. 4 is the finished product schematic of golden finger wiring board in the embodiment of the present invention；
Fig. 5 is a kind of structural schematic diagram of the preparation facilities of golden finger wiring board in the embodiment of the present invention.
Specific embodiment
Technical solution of the present invention is described in detail below by attached drawing and specific embodiment, it should be understood that this hair
Particular technique feature in bright embodiment and embodiment is the explanation to technical solution of the present invention, rather than is limited, not
In the case where conflict, the particular technique feature in the embodiment of the present invention and embodiment be can be combined with each other.
It is as shown in Figure 1 a kind of flow chart of the preparation method of golden finger wiring board in the embodiment of the present invention, this method packet
It includes:
S101 determines golden finger position and non-golden finger position on wiring board；
S102 carries out milling plate molding to the golden finger position by golden finger milling plate mode；
S103 is based on preset wiring board punching die, carries out die stamp to the non-golden finger position.
Specifically, in embodiments of the present invention, determine golden finger in the circuit board according to preset formula first
Coordinate position.Using coordinate position as golden finger position, and using rest position on wiring board as non-golden finger position.
After determining the golden finger position and non-golden finger position on wiring board, by golden finger milling plate mode to gold
Finger position carries out milling plate molding.Need exist for explanation make, due to golden finger position require good proof voltage and absolutely
Edge resistance electrical performance, so there can be no burr and hickie lamination problems, so milling plate molding is carried out to golden finger position,
The schematic diagram being illustrated in figure 2 after the molding of wiring board milling plate.
After completing milling plate molding, it is based on preset wiring board punching die, the non-golden finger position is rushed
Mold forming, what needs to be explained here is that, non-golden finger location graphic is complex, and outer dimension tolerance is the premise of ± 50um
Under, so needing through punching die, die stamp is carried out to the non-golden finger position.General precision die precision is higher,
Its outer dimension tolerance is can be controlled within the scope of ± 50um, while the electric property risk of remaining position is lower, while punch die adds
Work is high-efficient, at low cost, therefore the scheme of precision die punch die is used to process, be illustrated in figure 3 in the embodiment of the present invention punch die at
The structural schematic diagram of the rear board of type.
After completing above-mentioned milling plate molding and die stamp, golden finger wiring board is ultimately formed as shown in figure 4, figure
4 be the finished product schematic of golden finger wiring board.
Method provided by the embodiment of the present invention, by the milling plate technique and die process two in wiring board sharp processing mode
The advantages of among person, combines, and using wiring board is first carried out the method for carrying out local punch die again after local milling plate, avoids
The shortcomings that caused production efficiency is low, wasting manpower and material resources when using milling plate in original process, while improving punch die and causing edges of boards side
The problem of burr is larger, hickie is layered, especially has improvement to the sharp processing of high-end golden finger wiring board.
A kind of golden finger wiring board preparation method in the embodiment of the present invention is corresponded to, additionally provides one kind in the embodiment of the present invention
Golden finger wiring board preparation facilities is illustrated in figure 5 a kind of structure of golden finger wiring board preparation facilities in the embodiment of the present invention
Schematic diagram, the device include:
Determining module 501, for determining golden finger position and non-golden finger position on wiring board；
Milling plate molding machine 502, for carrying out milling plate molding to the golden finger position by golden finger milling plate mode；
Die forming device 503 rushes the non-golden finger position for being based on preset wiring board punching die
Mold forming.
Further, in embodiments of the present invention, the determining module 501 is specifically used for according to preset formula, really
Coordinate position of the deposit finger on the wiring board；Using the coordinate position as golden finger position, and by the wiring board
Upper rest position is as the non-golden finger position.
Further, in embodiments of the present invention, the die forming device 503 is specifically used for being based on preset wiring board
Punching die and formulation outer dimension tolerance carry out die stamp to the non-golden finger position.
Further, in embodiments of the present invention, described device further include:
Processing module whether there is abnormal position to golden finger milling plate molding on the wiring board for detecting；If it exists,
Then after rearmost position is completed, returns to abnormal position and continue milling plate molding；If it is not, then starting is to the non-golden finger position
Die stamp.
Although the preferred embodiment of the application has been described, but one of ordinary skilled in the art once knows substantially
Creative concept, then additional changes and modifications may be made to these embodiments.It is wrapped so the following claims are intended to be interpreted as
It includes preferred embodiment and falls into all change and modification of the application range.
Obviously, those skilled in the art can carry out various modification and variations without departing from the essence of the application to the application
Mind and range.In this way, if these modifications and variations of the application belong to the range of the claim of this application and its equivalent technologies
Within, then the application is also intended to include these modifications and variations.
Claims (8)
1. a kind of golden finger wiring board preparation method, which is characterized in that the described method includes:
Determine the golden finger position and non-golden finger position on wiring board；
By golden finger milling plate mode, milling plate molding is carried out to the golden finger position；
Based on preset wiring board punching die, die stamp is carried out to the non-golden finger position.
2. the method as described in claim 1, which is characterized in that determine the golden finger position on wiring board and non-golden finger position
It sets, comprising:
According to preset formula, coordinate position of the golden finger on the wiring board is determined；
Using the coordinate position as golden finger position, and using rest position on the wiring board as the non-golden finger position
It sets.
3. the method as described in claim 1, which is characterized in that preset wiring board punching die is based on, to the non-golden hand
Refer to that position carries out die stamp, specifically:
Based on preset wiring board punching die and formulate outer dimension tolerance, to the non-golden finger position carry out punch die at
Type.
4. the method as described in claim 1, which is characterized in that preset wiring board punching die is being based on, to the non-gold
Before finger position carries out die stamp, the method also includes:
Detection whether there is abnormal position to golden finger milling plate molding on the wiring board；
If it exists, then it after rearmost position is completed, returns to abnormal position and continues milling plate molding；
If it is not, then starting the die stamp to the non-golden finger position.
5. a kind of golden finger wiring board preparation facilities, which is characterized in that described device includes:
Determining module, for determining golden finger position and non-golden finger position on wiring board；
Milling plate molding machine, for carrying out milling plate molding to the golden finger position by golden finger milling plate mode；
Die forming device carries out die stamp to the non-golden finger position for being based on preset wiring board punching die.
6. device as claimed in claim 5, which is characterized in that the determining module is specifically used for according to preset journey
Formula determines coordinate position of the golden finger on the wiring board；Using the coordinate position as golden finger position, and by the line
Rest position is as the non-golden finger position on the plate of road.
7. device as claimed in claim 5, which is characterized in that the die forming device is specifically used for being based on preset line
Road plate punching die and formulation outer dimension tolerance carry out die stamp to the non-golden finger position.
8. device as claimed in claim 5, which is characterized in that described device further include:
Processing module whether there is abnormal position to golden finger milling plate molding on the wiring board for detecting；If it exists, then exist
After rearmost position is completed, returns to abnormal position and continue milling plate molding；If it is not, then starting the punch die to the non-golden finger position
Molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710516421.3A CN107231763B (en) | 2017-06-29 | 2017-06-29 | A kind of golden finger wiring board preparation method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710516421.3A CN107231763B (en) | 2017-06-29 | 2017-06-29 | A kind of golden finger wiring board preparation method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107231763A CN107231763A (en) | 2017-10-03 |
| CN107231763B true CN107231763B (en) | 2019-06-18 |
Family
ID=59935589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710516421.3A Active CN107231763B (en) | 2017-06-29 | 2017-06-29 | A kind of golden finger wiring board preparation method and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107231763B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109822294B (en) * | 2018-12-29 | 2022-03-01 | 广州兴森快捷电路科技有限公司 | PCB (printed Circuit Board) appearance processing method and device and readable storage medium |
| CN112188744B (en) * | 2020-10-29 | 2022-05-17 | 惠州市特创电子科技股份有限公司 | Circuit board and processing method thereof |
| CN113518514B (en) * | 2021-03-17 | 2022-06-17 | 东莞联桥电子有限公司 | Manufacturing process of high-frequency circuit board |
| CN113473741B (en) * | 2021-05-31 | 2022-10-28 | 广州广合科技股份有限公司 | Processing method of golden finger lead and circuit board |
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|---|---|---|---|---|
| CN101175375A (en) * | 2006-10-31 | 2008-05-07 | 比亚迪股份有限公司 | Production method of flexible circuit board |
| CN101636039A (en) * | 2008-07-22 | 2010-01-27 | 南亚电路板股份有限公司 | Printed circuit board before being formed and cut and manufacturing method thereof |
| CN104470257A (en) * | 2014-12-12 | 2015-03-25 | 东莞市康庄电路有限公司 | Machining method for improving pluggable position precision of PCB golden fingers |
| CN104540335A (en) * | 2014-12-25 | 2015-04-22 | 胜宏科技（惠州）股份有限公司 | Method for routing golden finger area in circuit board |
| CN104582259A (en) * | 2013-10-23 | 2015-04-29 | 北大方正集团有限公司 | Golden finger plate with bevel edge chamfer and processing method for golden finger plate |
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2017
- 2017-06-29 CN CN201710516421.3A patent/CN107231763B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101175375A (en) * | 2006-10-31 | 2008-05-07 | 比亚迪股份有限公司 | Production method of flexible circuit board |
| CN101636039A (en) * | 2008-07-22 | 2010-01-27 | 南亚电路板股份有限公司 | Printed circuit board before being formed and cut and manufacturing method thereof |
| CN104582259A (en) * | 2013-10-23 | 2015-04-29 | 北大方正集团有限公司 | Golden finger plate with bevel edge chamfer and processing method for golden finger plate |
| CN104470257A (en) * | 2014-12-12 | 2015-03-25 | 东莞市康庄电路有限公司 | Machining method for improving pluggable position precision of PCB golden fingers |
| CN104540335A (en) * | 2014-12-25 | 2015-04-22 | 胜宏科技（惠州）股份有限公司 | Method for routing golden finger area in circuit board |
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| Publication number | Publication date |
|---|---|
| CN107231763A (en) | 2017-10-03 |
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