CN101175375A - Production method of flexible circuit board - Google Patents
Production method of flexible circuit board Download PDFInfo
- Publication number
- CN101175375A CN101175375A CNA2006100634055A CN200610063405A CN101175375A CN 101175375 A CN101175375 A CN 101175375A CN A2006100634055 A CNA2006100634055 A CN A2006100634055A CN 200610063405 A CN200610063405 A CN 200610063405A CN 101175375 A CN101175375 A CN 101175375A
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- circuit board
- flexible circuit
- stamping procedure
- stiffening plate
- plate
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Abstract
The present invention discloses a manufacturing method for flexible line with a stiffening plate at the back of the golden finger of a flexible line board. The first step is that the golden finger part is formed on one surface of the corresponding flexible line board on a connecting plate. The second step is the working procedure of gluing stiffening plate, namely that the stiffening plate is glued on the other surface corresponding to the surface provided with the golden finger on each flexible line board. The third step is a stamping process for punching external form, namely that the working procedure of punching external form is carried on to each flexible line glued with stiffening plate on the connecting plate. In particular that after the first step is finished, a stamping process for punching opening is added, namely that an opening is punched correspondingly on the flexible line board at the two ends of the junction line of the height difference formed on the surfaces of the stiffening plate and the flexible line board, then the work of the second step is started. The manufacturing method can effectively solve the problem that the two ends of the junction line of the height difference formed between the stiffening plate on the flexible line board and the flexible line board are torn.
Description
Technical field
The present invention relates to a kind of manufacture method of flexible circuit board, particularly relate to the manufacture method that the flexible circuit board of stiffening plate is arranged at the golden finger back side of flexible circuit board.
Background technology
At present, the flexible circuit board 1 that is used to peg graft, one row's golden finger 2 generally all can be arranged, be used for pegging graft with other electrical component, so will be formed with relatively on the flexible circuit board 1 on the another side of golden finger 1, increase a thickness thicker stiffening plate 3 with respect to product, play the effect (see figure 1) that improves intensity.When the flexible circuitry panel products that manufacturing is used to peg graft, generally be on a whole plate, to form several earlier to have the flexible circuitry panel products of golden finger, fixing stiffening plate 3 on the whole plate of this piece then, again this monoblock is carried out stamping-out at last, promptly dash the profile of flexible circuitry panel products, at this moment will rush out together with the stiffening plate 3 at the product back side with golden finger 2.But, so just there is a problem (see figure 2), be that product is having reinforcement and do not having the place of reinforcement to exist a height difference H, in the process of punch extermal form, in order to guarantee to peg graft flexible circuit board 1, burr 21 directions at golden finger 2 places need towards the one side that does not form golden finger 2 on the product, the one side that therefore the product increase can only be had stiffening plate 3 during punching press is towards down, be placed on the counterdie 4 of mould and carry out punch extermal form, and industry is when Mold Making, general all have dodging of difference in height 5 all to be made on the patrix 6, and the stiffening plate 3 on the flexible circuitry panel products of golden finger 2 is towards counterdie 4, therefore stress just is concentrated in the place of difference in height during punching press, causes flexible circuit board 1 tearing phenomenon forming the appearance that the height difference H places have a common boundary with stiffening plate 3, thereby causes scrapping of product; Otherwise, change stamping surface to, be that stiffening plate 3 on the flexible circuit board 1 dodges 5 towards patrix 6, product can be set level on mould, do not have height difference H during punching press on the product, also the problem of tearing with regard to not occurring, but burr 21 directions that golden finger 2 places can occur are towards the one side (see figure 3) that is formed with golden finger 2, the client very easily causes golden finger 2 flange when grafting flexible circuit board 1, golden finger 2 is separated with base material, causes bigger potential safety hazard.If 5 be made on the counterdie 4 at dodging of stiffening plate 3 places, make product in the process of punching press, not have height difference H like this, also can solve the problem of tearing that product occurs in the place that height difference H is arranged, but increase along with grinding tool punch extermal form number of times, counterdie 4 meeting wearing and tearing gradually, dodging of stiffening plate 3 places 5 will be not enough, need constant modification mould, increase by 5 height of dodging of stiffening plate 3, this is pain in the neck feelings very under the situation that does not have special equipment for general skilled worker, make and dodge very accurate that 5 height has no idea again to do, improve the manufacturing cost of product simultaneously.
Summary of the invention
In view of above-mentioned deficiency, main purpose of the present invention is to provide a kind of place, two ends that can effectively solve the boundary line of the difference in height that forms between stiffening plate and the flexible circuit board to tear the manufacture method of the flexible circuit board of problem.
The objective of the invention is to be achieved through the following technical solutions:
The invention provides a kind of manufacture method of flexible circuit board, may further comprise the steps: the first step forms the golden finger position on the one side of corresponding each flexible circuit board on the connecting plate; Second step, reinforcing plate operation, i.e. lamination reinforcement plate on the another side that is formed with golden finger on each flexible circuit board relatively; In the 3rd step, the stamping procedure of punch extermal form is promptly gone out the operation of profile to each flexible circuit board of having been pasted stiffening plate on the connecting plate; Especially: after the first step is finished, increase the stamping procedure of washing mouth together open again, promptly on the face of stiffening plate and flexible circuit board, form the place, two ends of the boundary line of difference in height, on flexible circuit board, go out the stamping procedure of an opening accordingly respectively, and then enter the work in second step.
In said method, wherein:
Before the stamping procedure of washing mouth open, carry out drilling process, promptly form required location hole in the subsequent handling by puncher.Wherein, described subsequent handling is meant the stamping procedure washed open mouthful and the stamping procedure of punch extermal form.
In the described stamping procedure of washing open mouthful, can be formed with on the connecting plate for required location hole in reinforcing plate operation.
The present invention is compared to prior art, and its advantage is, the present invention is having flexible circuit board stiffening plate and do not having the two ends that the place forms boundary line that are connected of stiffening plate before the reinforcing plate, little opening of subpunch respectively, and then reinforcement sticked.Experiment showed, that in the process that stiffening plate and flexible circuit board are gone out simultaneously the phenomenon that the two ends of this boundary line just can not occur being torn has also guaranteed the directionality problem of golden finger burr simultaneously, need not to change the structure of existing mold, and mold repair is convenient.
Description of drawings
In order to be easy to explanation, the present invention is done to describe in detail by following preferred embodiment and accompanying drawing.
Fig. 1 is the structural representation of existing a kind of flexible circuit board.
Fig. 2 is the structural representation when the punch extermal form to existing flexible circuit board.
Fig. 3 is the perspective view of existing flexible circuit board.
Fig. 4 be in the manufacture method of a kind of flexible circuit board of the present invention punching press be formed with the structural representation of the connecting plate of anti-tear-off opening.
Embodiment
Flexible circuit board generally is by on the one side of basement membrane, closes fixedly one deck Copper Foil with sticker then, and one deck coverlay forms by fitting fixedly above the Copper Foil at this again, and this technology is a prior art, so be not described in detail at this.
The manufacture method of a kind of flexible circuit board of the present invention, it is the manufacture method that the flexible circuitry of stiffening plate 3 is arranged about a kind of at golden finger 2 back sides of flexible circuit board 1, may further comprise the steps: the first step wherein, be on the one side of upward corresponding each flexible circuit board 1 of connecting plate 10 (please refer to Fig. 4, all is the little connecting plate that is arranged with a plurality of flexible circuitry panel products according to certain rule with generally), to form golden finger position 2 earlier; Second step, reinforcing plate operation, i.e. lamination reinforcement plate 3 on the another side that is formed with golden finger 2 on each flexible circuit board 1 relatively; In the 3rd step, the stamping procedure of punch extermal form is promptly gone out the operation of profile to each flexible circuit board 1 of having been pasted stiffening plate 3 on the connecting plate.
Wherein, after the above-mentioned first step is finished, need carry out drilling process, promptly form required location hole 9 in the subsequent handling (as wash open mouthful the stamping procedure and the stamping procedure of punch extermal form), with the reinforcement machining accuracy by puncher (scheming not shown); Next, increase the stamping procedure of washing mouth 8 together open again, promptly on the face of stiffening plate 3 and flexible circuit board 1, form the place, two ends of the boundary line of height difference H, on flexible circuit board 1, go out the stamping procedure of an opening 8 (please refer to Fig. 4) accordingly respectively, wash open in the stamping procedure of mouth 8 at this, simultaneously (this is because the applying precision during reinforcing plate 3 is not very too high for location hole 9 required in the operation of reinforcing plate 3 can being formed with on the connecting plate, simultaneously in order to increase the value of the mould of washing mouth 8 open, alleviate the burden of automatic punching and so be provided with), with the precision of the operation process of strengthening reinforcing plate 3, and then the work that entered for second step.Like this, (go out stiffening plate 3 and flexible circuit board 1 simultaneously) when carrying out the operation of punch extermal form, the suffered stress in the place that height difference H is arranged has just loose in opening 8 punishment, therefore just can not cause and tear phenomenon.
Claims (4)
1. the manufacture method of a flexible circuit board may further comprise the steps:
The first step forms the golden finger position on the one side of corresponding each flexible circuit board on the connecting plate;
Second step, reinforcing plate operation, i.e. lamination reinforcement plate on the another side that is formed with golden finger on each flexible circuit board relatively;
In the 3rd step, the stamping procedure of punch extermal form is promptly gone out the operation of profile to each flexible circuit board of having been pasted stiffening plate on the connecting plate;
It is characterized in that: after the first step is finished, increase the stamping procedure of washing mouth together open again, promptly on the face of stiffening plate and flexible circuit board, form the place, two ends of the boundary line of difference in height, on flexible circuit board, go out the stamping procedure of an opening accordingly respectively, and then enter the work in second step.
2. according to the manufacture method of the described a kind of flexible circuit board of claim 1, it is characterized in that: before the stamping procedure of washing mouth open, carry out drilling process, promptly form required location hole in the subsequent handling by puncher.
3. according to the manufacture method of the described a kind of flexible circuit board of claim 2, it is characterized in that: described subsequent handling is meant the stamping procedure washed open mouthful and the stamping procedure of punch extermal form.
4. according to the manufacture method of claim 1 or 2 described a kind of flexible circuit board, it is characterized in that: in the described stamping procedure of washing open mouthful, can be formed with on the connecting plate for required location hole in reinforcing plate operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610063405A CN100576969C (en) | 2006-10-31 | 2006-10-31 | A kind of manufacture method of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610063405A CN100576969C (en) | 2006-10-31 | 2006-10-31 | A kind of manufacture method of flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101175375A true CN101175375A (en) | 2008-05-07 |
| CN100576969C CN100576969C (en) | 2009-12-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200610063405A Expired - Fee Related CN100576969C (en) | 2006-10-31 | 2006-10-31 | A kind of manufacture method of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100576969C (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101959368A (en) * | 2009-07-17 | 2011-01-26 | 天津北科精工自动化科技发展有限责任公司 | Soft PCB (Printed Circuit Board) bending device with insulating film |
| CN102014579A (en) * | 2010-11-24 | 2011-04-13 | 深南电路有限公司 | Gold-plating method of long and short golden fingers |
| CN102458052A (en) * | 2010-10-28 | 2012-05-16 | 比亚迪股份有限公司 | Reinforcing and gluing method of flexible circuit board |
| CN102658394A (en) * | 2012-04-25 | 2012-09-12 | 深南电路有限公司 | Method and device for profile forming of packaging substrate |
| CN102883539A (en) * | 2012-10-17 | 2013-01-16 | 厦门爱谱生电子科技有限公司 | Manufacturing process improvement method for pluggable flexible printed circuit (FPC) |
| CN103167722A (en) * | 2011-12-13 | 2013-06-19 | 富士康(昆山)电脑接插件有限公司 | Flexible printed circuit board and method for manufacturing flexible printed circuit board provided with terminals |
| CN107231763A (en) * | 2017-06-29 | 2017-10-03 | 珠海杰赛科技有限公司 | A kind of golden finger wiring board preparation method and device |
| CN108617074A (en) * | 2018-04-02 | 2018-10-02 | 深圳市新宇腾跃电子有限公司 | A kind of flexible circuitry board machining process |
| CN110012603A (en) * | 2018-12-27 | 2019-07-12 | 瑞声科技(新加坡)有限公司 | The method for die cutting and flexible circuit board of flexible circuit board |
| CN110933848A (en) * | 2019-12-02 | 2020-03-27 | 昆山圆裕电子科技有限公司 | FPC (Flexible printed Circuit) cable pasting process |
| CN115070869A (en) * | 2022-05-10 | 2022-09-20 | 盐城维信电子有限公司 | Flexible plate with golden finger pull ring and manufacturing method thereof |
-
2006
- 2006-10-31 CN CN200610063405A patent/CN100576969C/en not_active Expired - Fee Related
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101959368A (en) * | 2009-07-17 | 2011-01-26 | 天津北科精工自动化科技发展有限责任公司 | Soft PCB (Printed Circuit Board) bending device with insulating film |
| CN102458052A (en) * | 2010-10-28 | 2012-05-16 | 比亚迪股份有限公司 | Reinforcing and gluing method of flexible circuit board |
| CN102458052B (en) * | 2010-10-28 | 2014-03-19 | 比亚迪股份有限公司 | Reinforcing and gluing method of flexible circuit board |
| CN102014579A (en) * | 2010-11-24 | 2011-04-13 | 深南电路有限公司 | Gold-plating method of long and short golden fingers |
| CN103167722B (en) * | 2011-12-13 | 2016-08-31 | 富士康(昆山)电脑接插件有限公司 | Flexible PCB and manufacture have the method for the flexible PCB of terminal |
| CN103167722A (en) * | 2011-12-13 | 2013-06-19 | 富士康(昆山)电脑接插件有限公司 | Flexible printed circuit board and method for manufacturing flexible printed circuit board provided with terminals |
| CN102658394A (en) * | 2012-04-25 | 2012-09-12 | 深南电路有限公司 | Method and device for profile forming of packaging substrate |
| CN102658394B (en) * | 2012-04-25 | 2014-03-26 | 深南电路有限公司 | Method and device for profile forming of packaging substrate |
| CN102883539B (en) * | 2012-10-17 | 2015-04-08 | 厦门爱谱生电子科技有限公司 | Manufacturing process improvement method for pluggable flexible printed circuit (FPC) |
| CN102883539A (en) * | 2012-10-17 | 2013-01-16 | 厦门爱谱生电子科技有限公司 | Manufacturing process improvement method for pluggable flexible printed circuit (FPC) |
| CN107231763A (en) * | 2017-06-29 | 2017-10-03 | 珠海杰赛科技有限公司 | A kind of golden finger wiring board preparation method and device |
| CN107231763B (en) * | 2017-06-29 | 2019-06-18 | 珠海杰赛科技有限公司 | A kind of golden finger wiring board preparation method and device |
| CN108617074A (en) * | 2018-04-02 | 2018-10-02 | 深圳市新宇腾跃电子有限公司 | A kind of flexible circuitry board machining process |
| CN110012603A (en) * | 2018-12-27 | 2019-07-12 | 瑞声科技(新加坡)有限公司 | The method for die cutting and flexible circuit board of flexible circuit board |
| CN110933848A (en) * | 2019-12-02 | 2020-03-27 | 昆山圆裕电子科技有限公司 | FPC (Flexible printed Circuit) cable pasting process |
| CN115070869A (en) * | 2022-05-10 | 2022-09-20 | 盐城维信电子有限公司 | Flexible plate with golden finger pull ring and manufacturing method thereof |
| CN115070869B (en) * | 2022-05-10 | 2023-09-12 | 盐城维信电子有限公司 | Flexible plate with golden finger pull ring and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100576969C (en) | 2009-12-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen BYD Electronic Component Co., Ltd. Assignor: Biyadi Co., Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: Manufacture method of soft circuit board License type: Exclusive license Record date: 20080504 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14 Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
|
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150930 Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen BYD Electronic Component Co., Ltd. Address before: Kwai Chung town Yanan Road, BYD Industrial Park in Longgang District of Shenzhen City, Guangdong province 518119 Patentee before: Biyadi Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091230 Termination date: 20201031 |