CN101175375A - A method of manufacturing a flexible circuit board - Google Patents

A method of manufacturing a flexible circuit board Download PDF

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CN101175375A
CN101175375A CNA2006100634055A CN200610063405A CN101175375A CN 101175375 A CN101175375 A CN 101175375A CN A2006100634055 A CNA2006100634055 A CN A2006100634055A CN 200610063405 A CN200610063405 A CN 200610063405A CN 101175375 A CN101175375 A CN 101175375A
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flexible circuit
circuit board
punching
reinforcing plate
manufacturing
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CN100576969C (en
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赵冬梅
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Shenzhen Holitech Optoelectronics Co Ltd
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BYD Co Ltd
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Abstract

本发明公开了一种在柔性线路板的金手指背面有补强板的柔性线路的制造方法，第一步，在连板上相应的每一柔性线路板的一面上形成金手指部位；第二步，贴补强板工序，即在每一柔性线路板上相对形成有金手指的另一面上贴合补强板；第三步，冲外形的冲压工序，即对连板上每一被贴了补强板的柔性线路板进行冲出外形的工序；尤其是在第一步完成之后，再增加一道冲开口的冲压工序，即在补强板与柔性线路板的面上形成高度差的交界线的两端处，对应地在柔性线路板上分别冲出一开口的冲压工序，然后再进入第二步的工作。这种制造方法，能够有效的解决柔性线路板上的补强板与柔性线路板之间所形成高度差的交界线的两端处撕裂的问题。

The invention discloses a method for manufacturing a flexible circuit with a reinforcing plate on the back of the gold finger of the flexible circuit board. The first step is to form a gold finger on one side of each flexible circuit board corresponding to the connecting board; the second The first step is the process of pasting the reinforcing plate, that is, attaching the reinforcing plate on the other side of each flexible circuit board opposite to the gold finger; the third step is the stamping process of punching the shape, that is, each The process of punching out the shape of the flexible circuit board of the reinforcement board; especially after the first step is completed, a stamping process for punching the opening is added, that is, a junction line of height difference is formed on the surface of the reinforcement board and the flexible circuit board Correspondingly punch out an opening on the flexible circuit board at both ends of the flexible circuit board, and then enter the second step of work. This manufacturing method can effectively solve the problem of tearing at both ends of the boundary line formed by the height difference between the reinforcing plate on the flexible circuit board and the flexible circuit board.

Description

一种柔性线路板的制造方法 A method of manufacturing a flexible circuit board

技术领域technical field

本发明涉及一种柔性线路板的制造方法，特别是涉及到在柔性线路板的金手指背面有补强板的柔性线路板的制造方法。The invention relates to a method for manufacturing a flexible circuit board, in particular to a method for manufacturing a flexible circuit board with a reinforcing plate on the back of a golden finger of the flexible circuit board.

背景技术Background technique

目前，用于插接的柔性线路板1，一般都会有一排金手指2，用来与其它电元器件进行插接，这样一来就会需要在柔性线路板1上相对形成有金手指1的另一面上，增加一块厚度相对于产品来说较厚的补强板3，来起到提高强度的作用(见图1)。在制造用于插接的柔性线路板产品时，一般是在一块整板上先形成若干个具有金手指的柔性线路板产品，然后在该块整板上固定补强板3，最后再对该整块进行冲裁，即冲具有金手指2的柔性线路板产品的外形，这时就会连同产品背面的补强板3一起冲出来。但是，这样就存在一个问题(见图2)，即产品在有补强与没有补强的地方存在着一个高度差H，在冲外形的过程中，为了保证插接柔性线路板1时，产品上金手指2处的毛边21方向需朝向未形成金手指2的一面，因此冲压时只能将产品增加有补强板3的一面朝向下，放在模具的下模4上进行冲外形，而业界在模具制作时，一般所有有高度差的避让5均做在上模6上，而金手指2的柔性线路板产品上的补强板3朝向下模4，因此冲压时应力就会集中在有高度差的地方，造成柔性线路板1在与补强板3形成高度差H处交界的出现撕裂现象，从而造成产品的报废；反之，改变冲压面向，即柔性线路板1上的补强板3朝向上模6的避让5，使产品在模具上能够放平，冲压时产品上没有高度差H，也就不会出现的撕裂问题，但又会出现金手指2处的毛边21方向朝向形成有金手指2的一面(见图3)，客户在插接柔性线路板1时极易造成金手指2翻边，使金手指2与基材分离，造成更大的安全隐患。如果针对补强板3处的避让5做在下模4上，这样使产品在冲压的过程中没有高度差H，也可以解决产品在有高度差H的地方出现的撕裂问题，但是随着磨具冲外形次数的增加，下模4会逐渐的磨损，补强板3处的避让5就会不够，需要经常不断的修改模具，增加补强板3的避让5高度，这对于一般的技工在没有专门的设备的情况下是很头痛的事情，使避让5的高度又没有办法做的很精准，同时提高产品的制造成本。At present, the flexible circuit board 1 used for plugging generally has a row of golden fingers 2 for plugging in with other electrical components. On the other side, add a thicker reinforcing plate 3 with respect to the product to improve the strength (see Figure 1). When manufacturing flexible circuit board products for plugging, generally a number of flexible circuit board products with gold fingers are formed on a whole board, and then the reinforcement board 3 is fixed on the whole board, and finally the The entire piece is punched out, that is, the shape of the flexible circuit board product with the gold finger 2 is punched out together with the reinforcing plate 3 on the back of the product. However, there is a problem in this way (see Figure 2), that is, there is a height difference H between the product with reinforcement and the place without reinforcement. The direction of the burrs 21 at the upper gold finger 2 must face the side where the gold finger 2 is not formed, so when stamping, only the side with the reinforcing plate 3 facing downwards is placed on the lower die 4 of the mold to punch out the shape, while During mold making in the industry, generally all reliefs 5 with height differences are made on the upper mold 6, while the reinforcing plate 3 on the flexible circuit board product of Gold Finger 2 faces the lower mold 4, so the stress will be concentrated on the upper mold 6 during stamping. Where there is a height difference, the flexible circuit board 1 will tear at the junction of the height difference H formed with the reinforcing board 3, thereby causing the product to be scrapped; otherwise, change the stamping face, that is, the reinforcement on the flexible circuit board 1 The plate 3 faces the avoidance 5 of the upper die 6, so that the product can be placed flat on the die, and there is no height difference H on the product during stamping, so there will be no tearing problem, but there will be a burr 21 direction at the gold finger 2 Facing the side where the gold finger 2 is formed (see FIG. 3 ), it is very easy for the customer to cause the gold finger 2 to flang when inserting the flexible circuit board 1, so that the gold finger 2 is separated from the base material, causing a greater safety hazard. If the avoidance 5 at the reinforcing plate 3 is made on the lower die 4, so that the product has no height difference H in the stamping process, it can also solve the tearing problem of the product at the place with the height difference H, but with the grinding With the increase in the number of punching shapes, the lower mold 4 will gradually wear out, and the relief 5 at the reinforcing plate 3 will not be enough. It is necessary to modify the mold frequently and increase the height of the relief 5 of the reinforcing plate 3, which is very important for ordinary technicians. It is a headache without special equipment, so that the height of the avoidance 5 cannot be done very accurately, and at the same time, the manufacturing cost of the product is increased.

发明内容Contents of the invention

鉴于上述不足，本发明的主要目的在于提供一种能够有效的解决补强板与柔性线路板之间所形成高度差的交界线的两端处发生撕裂问题的柔性线路板的制造方法。In view of the above disadvantages, the main purpose of the present invention is to provide a flexible circuit board manufacturing method that can effectively solve the problem of tearing at both ends of the boundary line formed by the height difference between the reinforcing plate and the flexible circuit board.

本发明的目的是通过以下技术方案来实现的：The purpose of the present invention is achieved through the following technical solutions:

本发明提供一种柔性线路板的制造方法，包括以下步骤：第一步，在连板上相应的每一柔性线路板的一面上形成金手指部位；第二步，贴补强板工序，即在每一柔性线路板上相对形成有金手指的另一面上贴合补强板；第三步，冲外形的冲压工序，即对连板上每一被贴了补强板的柔性线路板进行冲出外形的工序；尤其是：在第一步完成之后，再增加一道冲开口的冲压工序，即在补强板与柔性线路板的面上形成高度差的交界线的两端处，对应地在柔性线路板上分别冲出一开口的冲压工序，然后再进入第二步的工作。The invention provides a method for manufacturing a flexible circuit board, which includes the following steps: the first step is to form a gold finger part on one side of each flexible circuit board corresponding to the connecting board; the second step is to attach a reinforcing board, that is, The other side of each flexible circuit board with the gold fingers formed on it is attached with a reinforcement board; the third step is the stamping process of punching the shape, that is, punching each flexible circuit board with a reinforcement board on the connecting board. The process of drawing out the shape; especially: after the first step is completed, add another stamping process for punching the opening, that is, at both ends of the boundary line forming a height difference between the reinforcing plate and the surface of the flexible circuit board, correspondingly in the The stamping process of punching out an opening on the flexible circuit board, and then enter the second step of work.

在上述方法中，其中：In the above method, where:

在进行冲开口的冲压工序之前进行打孔工序，即通过打孔机形成后续工序中所需的定位孔。其中，所述后续工序是指冲开口的冲压工序与冲外形的冲压工序。The punching process is carried out before the stamping process of punching the opening, that is, the positioning holes required in the subsequent process are formed by a punching machine. Wherein, the subsequent process refers to the stamping process of punching the opening and the stamping process of punching the shape.

所述冲开口的冲压工序中，在连板上会形成有供在贴补强板工序中所需的定位孔。In the stamping process of punching the opening, positioning holes required in the process of sticking and reinforcing the reinforcing plate are formed on the connecting plate.

本发明相较于现有技术，其的优点在于，本发明在贴补强板前，将柔性线路板在有补强板与没有补强板的连接处所形成交界线的两端，分别先冲一个小开口，然后再将补强贴上。实验证明，在补强板与柔性线路板同时冲出的过程中，该交界线的两端就不会出现被撕裂的现象，同时还保证了金手指毛边的方向问题，无需改变现有模具的结构，且模具维修方便。Compared with the prior art, the present invention has the advantage that before pasting the reinforcing board, the two ends of the boundary line formed by the flexible circuit board at the connection between the reinforcing board and the non- Open the opening, and then attach the reinforcement. Experiments have proved that when the reinforcing board and the flexible circuit board are punched out at the same time, the two ends of the junction will not be torn, and at the same time, the direction of the gold finger burr is guaranteed without changing the existing mold The structure, and the mold maintenance is convenient.

附图说明Description of drawings

为了易于说明，本发明由下述的较佳实施例及附图作以详细描述。For ease of illustration, the present invention is described in detail by the following preferred embodiments and accompanying drawings.

图1是现有一种柔性线路板的结构示意图。FIG. 1 is a schematic structural diagram of a conventional flexible circuit board.

图2是对现有柔性线路板的在冲外形时的结构示意图。Fig. 2 is a structural schematic diagram of the existing flexible circuit board during punching.

图3是现有柔性线路板的立体结构示意图。Fig. 3 is a three-dimensional schematic diagram of a conventional flexible circuit board.

图4是本发明一种柔性线路板的制造方法中已冲压形成有防撕裂开口的连板的结构示意图。FIG. 4 is a structural schematic diagram of a connecting plate that has been punched and formed with tear-proof openings in a method for manufacturing a flexible circuit board according to the present invention.

具体实施方式Detailed ways

柔性线路板一般是通过在基膜的一面上，然后用胶贴合固定一层铜箔，再在该铜箔的上面通过贴合固定一层覆盖膜而形成，此项技术为现有技术，故在此不作详细描述。Flexible circuit boards are generally formed by bonding and fixing a layer of copper foil on one side of the base film, and then bonding and fixing a layer of cover film on the top of the copper foil. This technology is an existing technology. Therefore, it will not be described in detail here.

本发明一种柔性线路板的制造方法，是关于一种在柔性线路板1的金手指2背面有补强板3的柔性线路的制造方法，包括以下步骤：其中第一步，是先在连板10(请参考图4，一般都是用一张按照一定规律排列有多个的柔性线路板产品的小连板)上相应的每一柔性线路板1的一面上形成金手指部位2；第二步，贴补强板工序，即在每一柔性线路板1上相对形成有金手指2的另一面上贴合补强板3；第三步，冲外形的冲压工序，即对连板上每一被贴了补强板3的柔性线路板1进行冲出外形的工序。The invention relates to a method for manufacturing a flexible circuit board, which relates to a method for manufacturing a flexible circuit with a reinforcing plate 3 on the back of the golden finger 2 of the flexible circuit board 1. Board 10 (please refer to FIG. 4, generally a small connecting board with a plurality of flexible circuit board products arranged according to a certain rule) forms a gold finger part 2 on one side of each flexible circuit board 1 correspondingly; The second step is the process of pasting the reinforcing plate, that is, attaching the reinforcing plate 3 on the other side of each flexible circuit board 1 opposite to the gold finger 2; the third step is the stamping process of punching the shape, that is, each A process of punching out the shape of the flexible circuit board 1 pasted with the reinforcement board 3 .

其中，在上述的第一步完成之后，需要进行打孔工序，即通过打孔机(图未示出)形成后续工序(如冲开口的冲压工序与冲外形的冲压工序)中所需的定位孔9，以加强加工精度；接下来，再增加一道冲开口8的冲压工序，即在补强板3与柔性线路板1的面上形成高度差H的交界线的两端处，对应地在柔性线路板1上分别冲出一开口8(请参考图4)的冲压工序，在该冲开口8的冲压工序中，同时在连板上会形成有供在贴补强板3的工序中所需的定位孔9(这是由于贴补强板3时的贴合精度不算太高，同时为了增加冲开口8的模具的利用价值，减轻自动打孔的负担而如此设置)，以加强贴补强板3的工序过程的精度，然后再进入第二步的工作。这样，在进行冲外形的工序时(即同时冲出补强板3与柔性线路板1)，在有高度差H的地方的所受到的应力就在开口8处分散了，因此就不会造成撕裂现象。Wherein, after the above-mentioned first step is completed, a punching process needs to be carried out, that is, a punching machine (not shown) is used to form the required positioning in the subsequent process (such as the stamping process of punching the opening and the stamping process of punching the shape). Hole 9, to enhance the processing accuracy; Next, add a stamping process for punching the opening 8, that is, at the two ends of the boundary line forming the height difference H on the surface of the reinforcing plate 3 and the surface of the flexible circuit board 1, correspondingly The stamping process of punching out an opening 8 (please refer to FIG. 4 ) on the flexible circuit board 1, in the stamping process of the punching opening 8, at the same time, there will be formed on the connecting plate for the process of attaching the reinforcing plate 3. positioning hole 9 (this is because the lamination accuracy is not too high when the reinforcing plate 3 is pasted, and at the same time, it is set in this way in order to increase the utilization value of the mold for punching the opening 8 and reduce the burden of automatic punching), so as to strengthen the pasting of the reinforcing plate 3. The accuracy of the process of the process, and then enter the second step of work. In this way, when performing the process of punching out the shape (that is, punching out the reinforcing plate 3 and the flexible circuit board 1 at the same time), the stress received at the place where there is a height difference H is dispersed at the opening 8, so it will not cause tear phenomenon.

Claims (4)

1.一种柔性线路板的制造方法，包括以下步骤：1. A method for manufacturing a flexible circuit board, comprising the following steps: 第一步，在连板上相应的每一柔性线路板的一面上形成金手指部位；The first step is to form golden fingers on one side of each flexible circuit board corresponding to the connecting board; 第二步，贴补强板工序，即在每一柔性线路板上相对形成有金手指的另一面上贴合补强板；The second step is the process of pasting the reinforcing plate, that is, attaching the reinforcing plate on the other side of each flexible circuit board opposite to the gold finger; 第三步，冲外形的冲压工序，即对连板上每一被贴了补强板的柔性线路板进行冲出外形的工序；The third step is the stamping process of punching out the shape, that is, the process of punching out the shape of each flexible circuit board with a reinforcing plate attached to the connecting board; 其特征在于：在第一步完成之后，再增加一道冲开口的冲压工序，即在补强板与柔性线路板的面上形成高度差的交界线的两端处，对应地在柔性线路板上分别冲出一开口的冲压工序，然后再进入第二步的工作。It is characterized in that: after the first step is completed, a stamping process for punching the opening is added, that is, at both ends of the boundary line forming a height difference between the reinforcing plate and the surface of the flexible circuit board, correspondingly on the flexible circuit board The stamping process of punching out an opening respectively, and then enter the second step of work. 2.根据权利要求1所述一种柔性线路板的制造方法，其特征是：在进行冲开口的冲压工序之前进行打孔工序，即通过打孔机形成后续工序中所需的定位孔。2. A method for manufacturing a flexible circuit board according to claim 1, characterized in that: the punching process is performed before the punching process, that is, the positioning holes required in the subsequent process are formed by a punching machine. 3.根据权利要求2所述一种柔性线路板的制造方法，其特征是：所述后续工序是指冲开口的冲压工序与冲外形的冲压工序。3. A method for manufacturing a flexible circuit board according to claim 2, characterized in that: said subsequent process refers to the stamping process of punching the opening and the stamping process of punching the shape. 4.根据权利要求1或2所述一种柔性线路板的制造方法，其特征是：所述冲开口的冲压工序中，在连板上会形成有供在贴补强板工序中所需的定位孔。4. A method for manufacturing a flexible circuit board according to claim 1 or 2, characterized in that: in the stamping process of the punching opening, the connecting plate will be formed with the positioning required in the process of pasting and reinforcing the reinforcing plate hole.
CN200610063405A 2006-10-31 2006-10-31 A method of manufacturing a flexible circuit board Expired - Fee Related CN100576969C (en)

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CN101959368A (en) * 2009-07-17 2011-01-26 天津北科精工自动化科技发展有限责任公司 Soft PCB (Printed Circuit Board) bending device with insulating film
CN102014579A (en) * 2010-11-24 2011-04-13 深南电路有限公司 Gold-plating method of long and short golden fingers
CN102458052A (en) * 2010-10-28 2012-05-16 比亚迪股份有限公司 Reinforcing and gluing method of flexible circuit board
CN102658394A (en) * 2012-04-25 2012-09-12 深南电路有限公司 Method and device for profile forming of packaging substrate
CN102883539A (en) * 2012-10-17 2013-01-16 厦门爱谱生电子科技有限公司 Manufacturing process improvement method for pluggable flexible printed circuit (FPC)
CN103167722A (en) * 2011-12-13 2013-06-19 富士康(昆山)电脑接插件有限公司 Flexible circuit board and method of manufacturing flexible circuit board with terminals
CN107231763A (en) * 2017-06-29 2017-10-03 珠海杰赛科技有限公司 A kind of golden finger wiring board preparation method and device
CN108617074A (en) * 2018-04-02 2018-10-02 深圳市新宇腾跃电子有限公司 A kind of flexible circuitry board machining process
CN110012603A (en) * 2018-12-27 2019-07-12 瑞声科技(新加坡)有限公司 The method for die cutting and flexible circuit board of flexible circuit board
CN110933848A (en) * 2019-12-02 2020-03-27 昆山圆裕电子科技有限公司 FPC (Flexible printed Circuit) cable pasting process
CN115070869A (en) * 2022-05-10 2022-09-20 盐城维信电子有限公司 Flexible plate with golden finger pull ring and manufacturing method thereof

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101959368A (en) * 2009-07-17 2011-01-26 天津北科精工自动化科技发展有限责任公司 Soft PCB (Printed Circuit Board) bending device with insulating film
CN102458052A (en) * 2010-10-28 2012-05-16 比亚迪股份有限公司 Reinforcing and gluing method of flexible circuit board
CN102458052B (en) * 2010-10-28 2014-03-19 比亚迪股份有限公司 Reinforcing and gluing method of flexible circuit board
CN102014579A (en) * 2010-11-24 2011-04-13 深南电路有限公司 Gold-plating method of long and short golden fingers
CN103167722B (en) * 2011-12-13 2016-08-31 富士康(昆山)电脑接插件有限公司 Flexible PCB and manufacture have the method for the flexible PCB of terminal
CN103167722A (en) * 2011-12-13 2013-06-19 富士康(昆山)电脑接插件有限公司 Flexible circuit board and method of manufacturing flexible circuit board with terminals
CN102658394A (en) * 2012-04-25 2012-09-12 深南电路有限公司 Method and device for profile forming of packaging substrate
CN102658394B (en) * 2012-04-25 2014-03-26 深南电路有限公司 Method and device for profile forming of packaging substrate
CN102883539B (en) * 2012-10-17 2015-04-08 厦门爱谱生电子科技有限公司 Manufacturing process improvement method for pluggable flexible printed circuit (FPC)
CN102883539A (en) * 2012-10-17 2013-01-16 厦门爱谱生电子科技有限公司 Manufacturing process improvement method for pluggable flexible printed circuit (FPC)
CN107231763A (en) * 2017-06-29 2017-10-03 珠海杰赛科技有限公司 A kind of golden finger wiring board preparation method and device
CN107231763B (en) * 2017-06-29 2019-06-18 珠海杰赛科技有限公司 A kind of golden finger wiring board preparation method and device
CN108617074A (en) * 2018-04-02 2018-10-02 深圳市新宇腾跃电子有限公司 A kind of flexible circuitry board machining process
CN110012603A (en) * 2018-12-27 2019-07-12 瑞声科技(新加坡)有限公司 The method for die cutting and flexible circuit board of flexible circuit board
CN110933848A (en) * 2019-12-02 2020-03-27 昆山圆裕电子科技有限公司 FPC (Flexible printed Circuit) cable pasting process
CN115070869A (en) * 2022-05-10 2022-09-20 盐城维信电子有限公司 Flexible plate with golden finger pull ring and manufacturing method thereof
CN115070869B (en) * 2022-05-10 2023-09-12 盐城维信电子有限公司 Flexible plate with golden finger pull ring and manufacturing method thereof

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