CN110708876A - Method for punching covering film by cutting die based on segmented drilling - Google Patents
Method for punching covering film by cutting die based on segmented drilling Download PDFInfo
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- CN110708876A CN110708876A CN201910949553.4A CN201910949553A CN110708876A CN 110708876 A CN110708876 A CN 110708876A CN 201910949553 A CN201910949553 A CN 201910949553A CN 110708876 A CN110708876 A CN 110708876A
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- cutting
- die
- drilling
- punching
- film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a method for punching a cover film by a cutting die based on segmented drilling, which comprises the following steps: step S1, selecting a cover film with the size larger than 680 mm; step S2, cutting and cutting the covering film, and packaging the laminated film in sequence; step S3, making two drilling data for the cover film with the processing size larger than or equal to 650mm and implementing subsection drilling; step S4, selecting a cutting die with a model corresponding to the size of the covering film; step S5, sleeving the drilled covering film on a cutting die, and punching the covering film by using the cutting die; and step S6, checking whether the quality of the punched covering film meets the requirement or not, and enabling the covering film to be attached to the main board. The method can effectively save the manufacturing cost of the steel die by matching the segmented drilling positioning with the die cutting and one-step forming, two sets of die segmented die cutting are required for the original die cutting, the forming effect can be realized by only one set of die cutting, and the die manufacturing cost is obviously reduced.
Description
Technical Field
The invention relates to the technical field of FPC (flexible printed circuit) production and manufacturing, in particular to a method for punching a cover film by a cutting die based on segmented drilling.
Background
The circuit board used by new energy automobile products is mainly used for connecting each electronic device and a power supply and monitoring the operation condition of each electronic device, and is characterized in that the size of a single piece is relatively long, the length is 400-1500 mm, the common processing range of a machine in a common circuit board processing factory is the size less than or equal to 650mm, the size more than or equal to 650mm can be processed and manufactured only by a method of laser sectional cutting or die sectional punching, so that the manufacturing cost is increased, the production efficiency is relatively low, and in order to reduce the manufacturing cost and improve the production efficiency, a method of one-time punching molding by using a large table top punch in combination with a cutting die is necessary to be researched.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
For the reasons, the applicant proposes a method for punching a covering film by a cutting die based on segmented drilling, and aims to solve the problems.
Disclosure of Invention
In order to meet the requirements, the invention aims to provide a method for punching a cover film by using a cutting die based on segmented drilling, and aims to optimize the flow, reduce the production cost and improve the production efficiency when a circuit board with overlong size needs to be processed and manufactured.
In order to achieve the purpose, the invention adopts the following technical scheme:
the method for punching the cover film by the cutting die based on segmented drilling comprises the following steps:
step S1, selecting a cover film with the size larger than 680 mm;
step S2, cutting and cutting the covering film, and packaging the laminated film in sequence;
step S3, making two drilling data for the cover film with the processing size larger than or equal to 650mm and implementing subsection drilling;
step S4, selecting a cutting die with a model corresponding to the size of the covering film;
step S5, sleeving the drilled covering film on a cutting die, and punching the covering film by using the cutting die;
and step S6, checking whether the quality of the punched covering film meets the requirement or not, and enabling the covering film to be attached to the main board.
The further technical scheme is that the step drilling comprises the steps of drilling a positioning hole and a part of windowing used in punching in the range of the cover film smaller than 650mm, and positioning according to the positioning hole to perform second-step drilling on the part of the cover film larger than 650 mm.
The further technical scheme is that the number of the positioning holes is at least 4.
The further technical scheme is that the step of punching the covering film by using the cutting die comprises the step of punching by matching the cutting die with a large-table-board punch.
The further technical scheme is that the processing range of the large-table-board punch press is at least 1500 mm.
The further technical scheme is that the length of the covering film is at least 680 mm.
Compared with the prior art, the invention has the beneficial effects that:
1. the method can effectively save the manufacturing cost of the steel die by positioning the sectional drilling and matching with the die cutting and one-step molding, two sets of dies need to be opened for sectional die cutting in the prior art, the molding effect can be realized by only opening one set of die, and the manufacturing cost of the die is obviously reduced;
2. compared with the laser cutting appearance, the cost is obviously reduced through the method, the equipment cost of the laser cutting machine is high, the processing cost generated by laser is more than or equal to 10 times of the die cutting cost, and the processing cost is effectively reduced;
3. compared with laser cutting or steel die punching, the efficiency of the method is obviously improved, the steel die punching needs two sets of dies to be punched twice, only one-time punching is needed, the efficiency is improved by 100%, the processing time of each piece of laser cutting is 7 minutes, the processing time of each piece of cutting die punching is 2 minutes, and the efficiency is improved by 350%.
The invention is further described below with reference to the accompanying drawings and specific embodiments.
Drawings
Fig. 1 is a schematic flow chart of an embodiment of a method for punching a cover film by a cutting die based on sectional drilling according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and the detailed description.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.
As shown in the schematic flow chart of the method shown in fig. 1, a specific embodiment of the method for punching the cover film by using the cutting die based on the sectional drilling of the present invention includes the following steps:
step S1, selecting a cover film with the size larger than 680 mm;
step S2, cutting and cutting the covering film, and packaging the laminated film in sequence;
step S3, making two drilling data for the cover film with the processing size larger than or equal to 650mm and implementing subsection drilling;
step S4, selecting a cutting die with a model corresponding to the size of the covering film;
step S5, sleeving the drilled covering film on a cutting die, and punching the covering film by using the cutting die;
and step S6, checking whether the quality of the punched covering film meets the requirement or not, and enabling the covering film to be attached to the main board.
The cutting die mold can also include but is not limited to etching treatment so as to meet the processing requirement of the covering film.
The method is suitable for processing and manufacturing all single-sided and double-sided FPC flexible board cover films under the condition of meeting the principle of opening a cutting die, and compared with the original steel die punching or laser cutting cover films, the method not only achieves the problem of reducing the cost, but also improves the production efficiency.
In a preferred embodiment, the step of drilling comprises the step of drilling a positioning hole and a partial window used for punching in the range of less than 650mm of the cover film, and the step of drilling a second section of the cover film in the range of more than 650mm according to the positioning hole.
Optionally, the number of the positioning holes is at least 4, wherein the number of the positioning holes can be adjusted according to actual needs, and a person skilled in the art can modify the number of the positioning holes with comprehensive accuracy and time cost.
As a preferred embodiment, the punching the cover film by using a cutting die includes that the cutting die cooperates with a large-table punch press to perform punching. The purpose is to punch and form the residual opening of the covering film at one time so as to meet the production requirement.
In a preferred embodiment, the processing range of the large-table punch press is at least 1500 mm. To meet the length of the alternative processed cover film.
In summary, the method adopting the scheme has the following advantages:
1. the method can effectively save the manufacturing cost of the steel die by positioning the sectional drilling and matching with the die cutting and one-step molding, two sets of dies need to be opened for sectional die cutting in the prior art, the molding effect can be realized by only opening one set of die, and the manufacturing cost of the die is obviously reduced;
2. compared with the laser cutting appearance, the cost is obviously reduced through the method, the equipment cost of the laser cutting machine is high, the processing cost generated by laser is more than or equal to 10 times of the die cutting cost, and the processing cost is effectively reduced;
3. compared with laser cutting or steel die punching, the efficiency of the method is obviously improved, the steel die punching needs two sets of dies to be punched twice, only one-time punching is needed, the efficiency is improved by 100%, the processing time of each piece of laser cutting is 7 minutes, the processing time of each piece of cutting die punching is 2 minutes, and the efficiency is improved by 350%.
Various other modifications and changes may be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes should fall within the scope of the claims of the present invention.
Claims (5)
1. The method for punching the covering film by the cutting die based on segmented drilling is characterized by comprising the following steps of:
step S1, selecting a cover film with the size larger than 680 mm;
step S2, cutting and cutting the covering film, and packaging the laminated film in sequence;
step S3, making two drilling data for the cover film with the processing size larger than or equal to 650mm and implementing subsection drilling;
step S4, selecting a cutting die with a model corresponding to the size of the covering film;
step S5, sleeving the drilled covering film on a cutting die, and punching the covering film by using the cutting die;
and step S6, checking whether the quality of the punched covering film meets the requirement or not, and enabling the covering film to be attached to the main board.
2. The method for punching the cover film by the cutting die based on the sectional drilling as claimed in claim 1, wherein the sectional drilling comprises drilling a positioning hole and a partial windowing for the range of the cover film smaller than 650mm, and performing a second section drilling for the portion of the cover film larger than 650mm according to the positioning hole.
3. The method for die cutting the cover film by the segmented drilling based cutter die as claimed in claim 2, wherein the number of the positioning holes is at least 4.
4. The method for punching the cover film by using the cutting die based on the sectional drilling as claimed in claim 1, wherein the punching the cover film by using the cutting die comprises that the cutting die cooperates with a large-table punch press to perform punching.
5. The method for punching the cover film by the segmented drilling-based cutting die according to claim 4, wherein the processing range of the large-table punch press is at least 1500 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910949553.4A CN110708876A (en) | 2019-10-08 | 2019-10-08 | Method for punching covering film by cutting die based on segmented drilling |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910949553.4A CN110708876A (en) | 2019-10-08 | 2019-10-08 | Method for punching covering film by cutting die based on segmented drilling |
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| CN110708876A true CN110708876A (en) | 2020-01-17 |
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| CN201910949553.4A Pending CN110708876A (en) | 2019-10-08 | 2019-10-08 | Method for punching covering film by cutting die based on segmented drilling |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113411973A (en) * | 2021-06-17 | 2021-09-17 | 珠海景旺柔性电路有限公司 | High-alignment-precision processing technology and manufacturing technology applied to laser fiber welding FPC |
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| CN103079353A (en) * | 2012-12-27 | 2013-05-01 | 深圳市博敏电子有限公司 | Method for improving overlength high frequency circuit board hole site working accuracy |
| CN104802214A (en) * | 2015-03-27 | 2015-07-29 | 深圳市五株科技股份有限公司 | Drilling method of overlength printed circuit board |
| CN105072810A (en) * | 2015-07-15 | 2015-11-18 | 恩达电路(深圳)有限公司 | Method for producing double-surface thick copper flexible working board |
| CN108319072A (en) * | 2017-12-26 | 2018-07-24 | 江西合力泰科技有限公司 | A kind of FPC board manufacturing methods and backlight module for backlight module |
| CN108656212A (en) * | 2018-05-04 | 2018-10-16 | 深圳市伟铂瑞信科技有限公司 | A kind of sectionally smooth join processing method |
-
2019
- 2019-10-08 CN CN201910949553.4A patent/CN110708876A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079353A (en) * | 2012-12-27 | 2013-05-01 | 深圳市博敏电子有限公司 | Method for improving overlength high frequency circuit board hole site working accuracy |
| CN104802214A (en) * | 2015-03-27 | 2015-07-29 | 深圳市五株科技股份有限公司 | Drilling method of overlength printed circuit board |
| CN105072810A (en) * | 2015-07-15 | 2015-11-18 | 恩达电路(深圳)有限公司 | Method for producing double-surface thick copper flexible working board |
| CN108319072A (en) * | 2017-12-26 | 2018-07-24 | 江西合力泰科技有限公司 | A kind of FPC board manufacturing methods and backlight module for backlight module |
| CN108656212A (en) * | 2018-05-04 | 2018-10-16 | 深圳市伟铂瑞信科技有限公司 | A kind of sectionally smooth join processing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113411973A (en) * | 2021-06-17 | 2021-09-17 | 珠海景旺柔性电路有限公司 | High-alignment-precision processing technology and manufacturing technology applied to laser fiber welding FPC |
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Application publication date: 20200117 |