CN104470214B - A kind of flexible and hard combined circuit board soft board external form processing method - Google Patents
A kind of flexible and hard combined circuit board soft board external form processing method Download PDFInfo
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- CN104470214B CN104470214B CN201410693447.1A CN201410693447A CN104470214B CN 104470214 B CN104470214 B CN 104470214B CN 201410693447 A CN201410693447 A CN 201410693447A CN 104470214 B CN104470214 B CN 104470214B
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Abstract
The invention discloses a kind of flexible and hard combined circuit board soft board external form processing method, the hardboard of Rigid Flex, intermediate layer, bottom, glue-line, soft board are pre-processed first, it is laminated, then rigid-flex external form is processed, includes the milling and the punching of soft board of hardboard.It is an advantage of the invention that being improved existing Rigid Flex technique, stamp process in original soft board processing is eliminated.After Rigid Flex is laminated, hardboard is first milled out into profile, then is punched soft board profile, soft board is solved because slotting length is longer, middle hollow out is more, easily deformed in bonding processes, cause rear process hole drill high less than product percent defective on disk, is caused, the problem of production efficiency is low, soft board stamp process is reduced simultaneously, is saved production cost, is improved production efficiency.
Description
Technical field
The present invention relates to a kind of processing method of wiring board external form, the soft board external form of particularly a kind of flexible and hard combined circuit board
Processing method.
Background technology
At present, when being more than 100mm to soft board length and being less than three layers of 400mm soft or hard knot tying and process, need to soft board stamp,
Individually its external form is processed, specific form is just to be gone out when doing soft board in jet-bedding form, then is laminated.But, existing work
In skill, have the shortcomings that as follows：Slotting length is longer, and soft board can be more and yielding because of middle hollow out in follow-up bonding processes,
Cause rear process hole drill high less than product percent defective on disk, is caused, and production efficiency is low.
The content of the invention
Goal of the invention：In view of the above-mentioned problems, being unlikely to deform it is an object of the invention to provide a kind of pressing of soft board and improving life
Produce the Rigid Flex external form processing method of efficiency.
Technical scheme：A kind of flexible and hard combined circuit board soft board external form processing method, first by the hardboard of Rigid Flex, in
Interbed, bottom, glue-line, soft board are pre-processed, and are laminated, then rigid-flex external form is processed, and are comprised the following steps：
(1) hardboard milling：External form at hardboard is milled out with 1.5mm milling cutters, and to extending 1.0mm at soft board；
(2) soft board is punched：The soft board is cut with etching knife stamping, the etching cutting die need to keep away position in the hardboard region.
Further, in above-mentioned steps (2), 0.5mm is added to keep away the thickness that bit depth is hardboard.
Further, above-mentioned Rigid Flex is 3 layers of board.
Further, in above-mentioned Rigid Flex, the length of soft board is 100-400mm.
Beneficial effect：Compared with prior art, it is an advantage of the invention that being improved existing Rigid Flex technique,
Eliminate stamp process in original soft board processing.After Rigid Flex is laminated, hardboard is first milled out into profile, then be punched outside soft board
Shape, solves soft board because slotting length is longer, middle hollow out is more, is easily deformed in bonding processes, causes rear process hole
Bore less than product percent defective height, the problem of production efficiency is low on disk, is caused, while reducing soft board stamp process, save life
Cost is produced, production efficiency is improved.
Brief description of the drawings
Fig. 1 is the structural representation of Rigid Flex of the present invention；
Fig. 2 is the schematic diagram that hardboard milling is processed；
Fig. 3 is partial enlarged drawing at A in Fig. 2；
Fig. 4 is the schematic diagram of soft board Punching Technology；
Fig. 5 is partial enlarged drawing at B in Fig. 4.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment, the present invention is furture elucidated, it should be understood that these embodiments are merely to illustrate
The present invention rather than limitation the scope of the present invention, after the present invention has been read, those skilled in the art are each to the present invention's
The modification for planting the equivalent form of value falls within the application appended claims limited range.
A kind of Rigid Flex external form processing method, enters to hardboard, intermediate layer overlay film, bottom overlay film, pure glue, soft board first
Row pre-treatment.Carried out according to following technological process, hardboard：Sawing sheet, deburring (mill FR4 faces), the pure glue of patch, cold pressing, groove milling, turn pressure
Close；Intermediate layer overlay film：Sawing sheet, drilling, windowing, turn pressing；Bottom overlay film：Sawing sheet, drilling, turn pressure and；Pure glue：Sawing sheet, turn plus
Work；Soft board：Sawing sheet, drilling, internal layer pre-treatment, press dry film, exposure, DES, AOI, internal layer pre-treatment, patch CVL, pressing, baking,
Target punching, roughening, turn pressing.
After pre-treatment is finished, by the above-mentioned hardboard through pre-treatment, intermediate layer overlay film, bottom overlay film, pure glue, soft board lamination,
It is laminated, is pressed into 3 layers of Rigid Flex as shown in Figure 1, the wherein length of soft board is controlled in 100-400mm.After lamination,
X-Ray is carried out, then carries out the sharp processing of milling side, i.e. rigid-flex, is carried out as follows：
As shown in Figure 2 and Figure 3, first to hardboard milling：External form at hardboard is milled out with 1.5mm milling cutters, and prolonged at soft board
Stretch 1.0mm；Again as shown in Figure 4, Figure 5, then soft board is punched：The soft board is cut with etching knife stamping, the etching cutting die is needed
Position is kept away in the hardboard region, wherein keep away the depth of position adds 0.5mm for the thickness of hardboard.
After Rigid Flex external form is disposed, drilled, it is deburring, desmearing, heavy copper, whole plate copper facing, IQC, outer
Layer pre-treatment, press dry film, exposure, DES, AOI, IQC, heavy tin, flying probe, milling external form, cleaning, punching, FQC, FQA, packaging,
Storage.
Claims (3)
1. a kind of flexible and hard combined circuit board soft board external form processing method, first by the hardboard of Rigid Flex, intermediate layer, bottom,
Glue-line, soft board are pre-processed, and are laminated, then rigid-flex external form is processed, and are comprised the following steps：
(1) hardboard milling：External form at hardboard is milled out with 1.5mm milling cutters, and to extending 1.0mm at soft board；
(2) soft board is punched：The soft board is cut with etching knife stamping, the etching cutting die need to keep away position in the hardboard region, keep away position
Depth adds 0.5mm for the thickness of the hardboard.
2. a kind of flexible and hard combined circuit board soft board external form processing method according to claim 1, it is characterised in that：It is described soft
The plywood that hardens is 3 layers of board.
3. a kind of flexible and hard combined circuit board soft board external form processing method according to claim 1, it is characterised in that：It is described soft
Harden in plywood, soft board length is 100-400mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410693447.1A CN104470214B (en) | 2014-11-25 | 2014-11-25 | A kind of flexible and hard combined circuit board soft board external form processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410693447.1A CN104470214B (en) | 2014-11-25 | 2014-11-25 | A kind of flexible and hard combined circuit board soft board external form processing method |
Publications (2)
| Publication Number | Publication Date |
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| CN104470214A CN104470214A (en) | 2015-03-25 |
| CN104470214B true CN104470214B (en) | 2017-09-01 |
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| CN201410693447.1A Active CN104470214B (en) | 2014-11-25 | 2014-11-25 | A kind of flexible and hard combined circuit board soft board external form processing method |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105246271B (en) * | 2015-10-26 | 2018-08-10 | 江苏弘信华印电路科技有限公司 | A kind of manufacturing method for the rigid-flex combined board for having an isolated island formula hardboard |
| CN105246274B (en) * | 2015-10-26 | 2018-09-25 | 江苏弘信华印电路科技有限公司 | A kind of overall thickness is more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board production method |
| CN105228380B (en) * | 2015-10-26 | 2018-04-06 | 江苏弘信华印电路科技有限公司 | A kind of gross thickness is less than four layer rigid-flex combined board preparation method of the 0.32mm grafting hand in centre |
| CN105246272B (en) * | 2015-10-26 | 2018-04-06 | 江苏弘信华印电路科技有限公司 | A kind of outer layer rigidity plate thickness is more than the rigid-flex combined board preparation method of 0.4mm internal layers lettering symbol |
| CN105228370B (en) * | 2015-10-26 | 2018-08-10 | 江苏弘信华印电路科技有限公司 | A kind of different big rigid-flex combined board manufacture craft of two sides rigidity plate suqare |
| CN107278064B (en) * | 2017-08-09 | 2019-07-09 | 常熟东南相互电子有限公司 | The production method of flexible-rigid compound circuit board |
| CN107995800B (en) * | 2017-12-28 | 2020-01-03 | 信利光电股份有限公司 | Soft board and hard board combination method of soft and hard combination board |
| CN112188744B (en) * | 2020-10-29 | 2022-05-17 | 惠州市特创电子科技股份有限公司 | Circuit board and processing method thereof |
Citations (3)
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| CN102271469A (en) * | 2011-07-08 | 2011-12-07 | 深圳市精诚达电路有限公司 | Method for processing rigid-flexible printed circuit board (PCB) |
| CN203181405U (en) * | 2013-02-02 | 2013-09-04 | 宁波华远电子科技有限公司 | Flexible printed circuit manufactured by continuous die cutting |
| CN103384444A (en) * | 2013-07-30 | 2013-11-06 | 博敏电子股份有限公司 | Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2547183A1 (en) * | 2011-07-15 | 2013-01-16 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof as well as rigid-flex printed circuit board or a sub-assembly thereof |
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2014
- 2014-11-25 CN CN201410693447.1A patent/CN104470214B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102271469A (en) * | 2011-07-08 | 2011-12-07 | 深圳市精诚达电路有限公司 | Method for processing rigid-flexible printed circuit board (PCB) |
| CN203181405U (en) * | 2013-02-02 | 2013-09-04 | 宁波华远电子科技有限公司 | Flexible printed circuit manufactured by continuous die cutting |
| CN103384444A (en) * | 2013-07-30 | 2013-11-06 | 博敏电子股份有限公司 | Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof |
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| CN104470214A (en) | 2015-03-25 |
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