CN105246272B - A kind of outer layer rigidity plate thickness is more than the rigid-flex combined board preparation method of 0.4mm internal layers lettering symbol - Google Patents
A kind of outer layer rigidity plate thickness is more than the rigid-flex combined board preparation method of 0.4mm internal layers lettering symbol Download PDFInfo
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- CN105246272B CN105246272B CN201510701309.8A CN201510701309A CN105246272B CN 105246272 B CN105246272 B CN 105246272B CN 201510701309 A CN201510701309 A CN 201510701309A CN 105246272 B CN105246272 B CN 105246272B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to the rigid-flex combined board preparation method that a kind of outer layer rigidity plate thickness is more than 0.4mm internal layers lettering symbol, it comprises the following steps：S1：Lamination, S2:X RAY practice shooting, S3：Milling edges of boards, S4：Copper, S5 is thinned:Outer layer drills, S6：Deburring, S7：De-smear, S8：Heavy copper, S9：Copper facing, S10：Outer-layer circuit pre-treatment, S11：Outer laminated film, S12：Outer-layer circuit exposes, S13：Development, S14:Outer-layer circuit etches DES, S15：Outer layer AOI is detected, S16：Welding resistance pre-treatment, S17：Welding resistance is printed, S18：It is pre-baked, S19：Welding resistance exposes, S20：Welding resistance is developed, S21：After bake, S22：Change gold, S23：First time silk-screen, S24：Toast for the first time, S25：Second of silk-screen, S26：Second of baking, S27：Flying probe, S28：Milling plate, S29：Product inspection FQC, S30：Packaging, S31：Storage.The present invention does protective layer with prepreg and outer layer hardboard FR4, serves the effect for avoiding character from being come off between de-smear by the way that character is first imprinted on internal layer flex plate.
Description
Technical field
The present invention relates to circuit board manufacture field, particularly outer layer rigidity plate thickness to be more than the firm of 0.4mm internal layers lettering symbol
Flex combined board preparation method.
Background technology
As electronic product is towards frivolous, short and small, multifunction development, rigid-flex combined board rigid plate region area is increasingly
It is small, it is necessary to the character space known of marking is less and less, so many characters can only be imprinted in flex plate region, but because outer layer is firm
The difference of height of the thicker formation of plate thickness is larger, directly can not print to character on flex plate in outer layer.If first character is imprinted on
On flex plate, character is caused to come off during being easy to due to character unprotect after de-smear, so designing a kind of outer layer
The rigid-flex combined board preparation method that rigid plate thickness is more than 0.4mm internal layers lettering symbol is just particularly important.
The content of the invention
The technical purpose of the present invention is by the way that character is first imprinted on internal layer flex plate, with prepreg and outer layer hardboard
FR4 does protective layer, serves the effect for avoiding character from being come off between de-smear；A kind of outer layer rigidity plate thickness is provided to be more than
The rigid-flex combined board preparation method of 0.4mm internal layers lettering symbol.
To solve above-mentioned technical problem, a kind of outer layer rigidity plate thickness of offer of the invention is more than 0.4mm internal layer letterings
The rigid-flex combined board preparation method of symbol, it comprises the following steps：S1：Lamination, S2:X-RAY practices shooting, S3：Milling edges of boards, S4：It is thinned
Copper, S5:Outer layer drills, S6：Deburring, S7：De-smear, S8：Heavy copper, S9：Copper facing, S10：Outer-layer circuit pre-treatment, S11：Outside
Laminated film, S12：Outer-layer circuit exposes, S13：Development, S14:Outer-layer circuit etching-DES, S15：Outer layer AOI is detected, S16：Resistance
Pre-welding treatment, S17：Welding resistance is printed, S18：It is pre-baked, S19：Welding resistance exposes, S20：Welding resistance is developed, S21：After bake, S22：Change gold,
S23：First time silk-screen (prints the character in positive rigid plate), S24：Toast for the first time, S25：Second of silk-screen (back up rigidity
Character on plate), S26：Second of baking, S27：Flying probe, S28：Milling plate, S29：Product inspection-FQC, S30：Packaging,
S31：Storage.
Further：Described step S1：Lamination is by four pieces of mould release membrances, two pieces of filling films, two by upper and lower two blocks of steel plates
Block rigid plate (thickness 0.4mm), two pieces of prepregs and inner plating progress are hot-forming, above and below every piece of described filling film
Both sides are respectively connected with one piece of mould release membrance, and the both sides up and down of the inner plating are respectively connected with one piece of prepreg, described semi-solid preparation
The side that high temperature carrying tablet is posted on piece is connected with rigid plate (thickness 0.4mm), and the outside of two pieces of rigid plates respectively connects
There is one piece of mould release membrance.
Further：The Making programme of described inner plating is as follows：Step 1：Internal layer sawing sheet, step 2：Drilling (is bored
Lamination positioning hole and exposure positioning hole), step 3：Circuit pre-treatment, step 4：Interior laminated film, step 5：Internal layer circuit exposes, step
Rapid 6：Internal layer circuit etching-DES, step 7：Internal layer AOI is detected, step 8：Roughening, step 9：Lamination cover layer, step 10：It is folded
Layer, step 11：It is laminated, step 12：First time lettering accords with (being imprinted on the flex plate of upper strata), step 13:Toast for the first time, step
14：Second of lettering accords with (being imprinted on lower floor's flex plate), step 15：Second of baking.
Further：The Making programme of described prepreg is as follows：Step 1：Sawing sheet, step 2：Processing (will be resistance to
The carrier film of high temperature is attached on prepreg), step 3：Drilling (bores lamination positioning hole and mould punching positioning hole), step 4：Punching
Type (is punched with mould and removes the carrier film under firm position, retain the carrier film for scratching plate region).
Further：The hot-forming method and step is a successively：First it is carried out using 1KG power tight for the first time
Pressure, it is 4min to press the time for the first time, carries out the temperature of first time heating, for the first time heating during pressing for the first time to it
Control is at 30 DEG C, duration of heat 3min, b：Then it is pressed for the second time using 4KG power, pressed for the second time
Time is 9min, and second of heating is carried out to it during pressing for the second time, the temperature control of second heating at 130 DEG C,
The duration of heat is 8min, c:Then third time is carried out to it using 4KG power to press, it is 59min to press the time for the third time,
Third time carries out third time heating to it during pressing, and the temperature control of third time heating is at 130 DEG C, the duration of heat
For 18min, d：Then the 4th time is carried out to it press using 4KG power, it is 89min to press the time for the 4th time, is pressed for the 4th time
During the 4th heating is carried out to it, the temperature control of the 4th heating is at 185 DEG C, duration of heat 5min, e：
Then the 5th time is carried out to it press using 4KG power, it is 50min to press the time for the 5th time, right during pressing for the 5th time
It carries out the 5th heating, and the temperature control of the 5th heating is at 185 DEG C, duration of heat 60min, f：Then it is entered
The 6th heating of row, 185 DEG C of the temperature control of the 6th heating, duration of heat 62min, g：The 7th finally is carried out to it
Secondary heating, 20 DEG C of the temperature control of the 7th heating, duration of heat 55min.
Further：Described step S1:Need to use a kind of stamping machine, the stamping machine during being laminated to operation
Structure include upper bracket, support column, base, workbench, electric cylinder, hoistable platform and staking punch, described upper bracket leads to
Cross support column to be fixedly connected on base, described workbench is fixedly mounted on base, and described hoistable platform passes through electricity
Dynamic cylinder is connected to the bottom of upper bracket, and described staking punch is arranged on the bottom of hoistable platform, and described workbench is in pros
Shape, four locating dowels is provided with described workbench, described four locating dowels are flexibly connected by apparatus for adjusting position
On workbench, diel is fixedly connected with the workbench between described four locating dowels.
Further：Be provided with pin post in described diel, the bottom of the staking punch relative to pin post position
Offer jack.
Further：Described apparatus for adjusting position includes four tilting guide grooves and cunning being opened on workbench
Block, the bottom of the guide groove offer three jacks successively, and described locating dowel is movably connected in guide groove by sliding block,
Through hole is offered relative to the position of jack on described sliding block, described locating dowel is connected to the jack of guide groove through through hole
It is interior.
After said structure, the present invention is hard with prepreg and outer layer by the way that character is first imprinted on internal layer flex plate
Plate FR4 does protective layer, serves the effect for avoiding character from being come off between de-smear；And the position for overregulating four locating dowels is come
The punching press of the rigid-flexible joint plate of different size is tackled, improves the practical performance of stamping machine.
Brief description of the drawings
The present invention is further detailed explanation with reference to the accompanying drawings and detailed description.
Fig. 1 is step S1：Structural representation in lamination process.
Fig. 2 is the structural representation of stamping machine.
Fig. 3 is the structural representation of workbench in stamping machine.
Embodiment
The invention provides the rigid-flex combined board making side that a kind of outer layer rigidity plate thickness is more than 0.4mm internal layers lettering symbol
Method, it comprises the following steps：S1：Lamination, S2:X-RAY practices shooting, S3：Milling edges of boards, S4：Copper, S5 is thinned:Outer layer drills, S6：Go
Burr, S7：De-smear, S8：Heavy copper, S9：Copper facing, S10：Outer-layer circuit pre-treatment, S11：Outer laminated film, S12：Outer-layer circuit exposes
Light, S13：Development, S14:Outer-layer circuit etching-DES, S15：Outer layer AOI is detected, S16：Welding resistance pre-treatment, S17：Welding resistance is printed,
S18：It is pre-baked, S19：Welding resistance exposes, S20：Welding resistance is developed, S21：After bake, S22：Change gold, S23：(print front is just for first time silk-screen
Character on property plate), S24：Toast for the first time, S25：Second of silk-screen (character in back up rigid plate), S26：Second
Baking, S27：Flying probe, S28：Milling plate, S29：Product inspection-FQC, S30：Packaging, S31：Storage.
As shown in figure 1, step S1：Lamination be by upper and lower two blocks of steel plates by four pieces of mould release membrances, 14, two pieces of filling films 15,
Two pieces of rigid plates 16 (thickness 0.4mm), two pieces of prepregs 17 and inner plating 18 carry out every piece of hot-forming, described filling
The both sides up and down of film 15 are respectively connected with one piece of mould release membrance 14, and the both sides up and down of the inner plating 18 are respectively connected with one piece of prepreg
17, the side that high temperature carrying tablet is posted on described prepreg 17 is connected with rigid plate 16 (thickness 0.4mm), described two pieces
The outside of rigid plate 16 is respectively connected with one piece of mould release membrance 14.
The Making programme of above-mentioned inner plating is as follows：Step 1：Internal layer sawing sheet, step 2：Drilling (bores lamination positioning hole
With exposure positioning hole), step 3：Circuit pre-treatment, step 4：Interior laminated film, step 5：Internal layer circuit exposes, step 6：Interior layer line
Road etching-DES, step 7：Internal layer AOI is detected, step 8：Roughening, step 9：Lamination cover layer, step 10：Lamination, step 11：
It is laminated, step 12：First time lettering accords with (being imprinted on the flex plate of upper strata), step 13:Toast for the first time, step 14：Second of print
Character (is imprinted on lower floor's flex plate), step 15：Second of baking.
The Making programme of above-mentioned prepreg is as follows：Step 1：Sawing sheet, step 2：Processing is (by resistant to elevated temperatures carrying
Film is attached on prepreg), step 3：Drilling (bores lamination positioning hole and mould punching positioning hole), step 4：Stamp (uses mould
The carrier film under firm position is removed in punching, retains the carrier film for scratching plate region).
Above-mentioned hot-forming method and step is a successively：First it is carried out for the first time to press using 1KG power, for the first time
It is 4min to press the time, carries out first time heating during pressing for the first time to it, the temperature control of heating is 30 for the first time
DEG C, duration of heat 3min, b：Then it is pressed for the second time using 4KG power, pressing the time for the second time is
9min, second of heating is carried out to it during pressing for the second time, the temperature control of second of heating at 130 DEG C, hold by heating
The continuous time is 8min, c:Then carry out third time to it using 4KG power to press, it is 59min to press the time for the third time, third time
Third time heating is carried out during pressing to it, the temperature control that third time heats is in 130 DEG C, the duration of heat
18min, d：Then the 4th time is carried out to it press using 4KG power, it is 89min to press the time for the 4th time, is pressed for the 4th time
During the 4th heating is carried out to it, the temperature control of the 4th heating is at 185 DEG C, duration of heat 5min, e：So
The 5th time is carried out to it press using 4KG power afterwards, it is 50min to press the time for the 5th time, to it during pressing for the 5th time
The 5th heating is carried out, the temperature control of the 5th heating is at 185 DEG C, duration of heat 60min, f：Then it is carried out
6th heating, 185 DEG C of the temperature control of the 6th heating, duration of heat 62min, g：Finally it is carried out the 7th time
Heating, 20 DEG C of the temperature control of the 7th heating, duration of heat 55min.
The present invention does protective layer by the way that character is first imprinted on internal layer flex plate with prepreg and outer layer hardboard FR4, rises
To the effect for avoiding character from being come off between de-smear.
Above-mentioned step S1:Need to use a kind of stamping machine, the structure of described stamping machine during being laminated to operation
As shown in Figures 2 and 3, it includes upper bracket 3, support column 2, base 1, workbench 7, electric cylinder 4, hoistable platform 5 and punching press
First 6, described upper bracket 3 is fixedly connected on base 1 by support column 2, and described workbench 7 is fixedly mounted on base 1
On, described hoistable platform 5 is connected to the bottom of upper bracket 3 by electric cylinder 4, and described staking punch 6 is arranged on hoistable platform 5
Bottom, described workbench 7 is square, is provided with four locating dowels 8 on described workbench 7, described four
Locating dowel 8 is movably connected on workbench 7 by apparatus for adjusting position, the workbench 7 between described four locating dowels 8
On be fixedly connected with diel 9, pin post 10 is provided with described diel 9, the bottom of the staking punch 6 is relative to pin
The position of post 10 offers jack.First the specification of the rigid-flexible joint plate of punching press is adjusted by apparatus for adjusting position as needed during work
The position of four locating dowels 8 is saved, then needing the rigid-flexible joint plate of punching press to be placed on workbench 7, starts the profit of electric cylinder 4
Moved downward with hoistable platform 5 with staking punch 6, first to rigid-flexible joint plate is completed by staking punch 6 and four locating dowels 8
Secondary punching press, then pulling up four locating dowels 8 and being again started up electric cylinder 4 makes it be moved downward again with staking punch 6, passes through punching
Pressure head 6 and pin post 10 complete second of punching press to rigid-flexible joint plate, after punching press terminates reverse starting electric cylinder make its with
Staking punch is returned to original position.The design tackles rushing for the rigid-flexible joint plate of different size by adjusting the position of four locating dowels
Pressure, improves its practical performance；And the design also has the advantages of simple in construction, easily fabricated and practicality and high efficiency.
Apparatus for adjusting position as shown in Figures 2 and 3 includes four tilting guide grooves 11 being opened on workbench 7
With sliding block 12, the bottom of the guide groove 11 offers three jacks 13 successively, and described locating dowel 8 is connected by the activity of sliding block 12
It is connected in guide groove 11, through hole is offered relative to the position of jack 13 on described sliding block 12, described locating dowel 8 passes through logical
Hole is connected in the jack 13 of guide groove 11.When needing the rigid-flexible joint plate to different size to carry out punching press, locating dowel 8 is pulled up
Mobile sliding block 12, make on sliding block 12 by being aligned with specified jack 13, be then inserted into locating dowel 8, make locating dowel 8
Lower end is stretched in jack 13, the position of locating dowel 8 is not being changed, and the design can be according to the difference of rigid-flexible joint plate
Specification adjust locating dowel 8 position, so as to complete the punching press to the rigid-flexible joint plate of different size, its have it is simple in construction, be easy to
The advantages of manufacture and practicality and high efficiency.
Claims (3)
1. a kind of outer layer rigidity plate thickness is more than the rigid-flex combined board preparation method of 0.4mm internal layers lettering symbol, it is characterised in that：Bag
Include following steps：S1：Lamination, S2:X-RAY practices shooting, S3：Milling edges of boards, S4：Copper, S5 is thinned:Outer layer drills, S6：Deburring, S7：
De-smear, S8：Heavy copper, S9：Copper facing, S10：Outer-layer circuit pre-treatment, S11：Outer laminated film, S12：Outer-layer circuit exposes, S13：
Development, S14:DES, S15：Outer layer AOI is detected, S16：Welding resistance pre-treatment, S17：Welding resistance is printed, S18：It is pre-baked, S19：Welding resistance exposes
Light, S20：Welding resistance is developed, S21：After bake, S22：Change gold, S23：First time silk-screen, print the character in positive rigid plate, S24：The
Once toast, S25：Second of silk-screen, the character in back up rigid plate, S26：Second of baking, S27：Flying probe, S28：
Milling plate, S29：FQC, S30：Packaging, S31：Storage；
Described step S1：Lamination is to be by four pieces of mould release membrances (14), two pieces of filling films (15), thickness by upper and lower two blocks of steel plates
0.4mm two pieces of rigid plates (16), two pieces of prepregs (17) and inner plating (18) carries out every piece of hot-forming, described filling
The both sides up and down of film (15) are respectively connected with one piece of mould release membrance (14), and the both sides up and down of the inner plating (18) are respectively connected with one and half
Cured sheets (17), the side of high temperature carrying tablet is posted on described prepreg (17) and rigid plate (16) that thickness is 0.4mm
It is connected, the outside of two pieces of rigid plates (16) is respectively connected with one piece of mould release membrance (14)；
The Making programme of described inner plating is as follows：Step 1：Internal layer sawing sheet, step 2：Drilling, bore lamination positioning hole and exposure
Light-seeking hole, step 3：Circuit pre-treatment, step 4：Interior laminated film, step 5：Internal layer circuit exposes, step 6：DES, step 7：
Internal layer AOI is detected, step 8：Roughening, step 9：Lamination cover layer, step 10：Lamination, step 11：Lamination, step 12：For the first time
Lettering accords with, and is imprinted on the flex plate of upper strata, step 13:Toast for the first time, step 14：Second of lettering symbol, is imprinted on lower floor's flex plate
On, step 15：Second of baking；
The Making programme of described prepreg is as follows：Step 1：Sawing sheet, step 2：Processing, resistant to elevated temperatures carrier film is pasted
Onto prepreg, step 3：Drilling, bore lamination positioning hole and mould punching positioning hole, step 4：Stamp, being punched with mould will
Carrier film under firm position removes, and retains the carrier film for scratching plate region；
The hot-forming method and step is a successively：First it is carried out for the first time to press using 1KG power, pressed for the first time
Time is 4min, carries out first time heating during pressing for the first time to it, and the temperature control of heating adds at 30 DEG C for the first time
Thermal endurance is 3min, b：Then it is pressed for the second time using 4KG power, it is 9min to press the time for the second time, the
Second of heating is carried out to it during secondary compaction, second of temperature control heated is in 130 DEG C, the duration of heat
8min,c:Then carry out third time to it using 4KG power to press, it is 59min to press the time for the third time, the mistake pressed for the third time
Carry out third time heating in journey to it, the temperature control of third time heating is at 130 DEG C, duration of heat 18min, d：Then
It is carried out to press for the 4th time using 4KG power, it is 89min to press the time for the 4th time, enters it during pressing for the 4th time
The heating of row the 4th time, the temperature control of the 4th heating is at 185 DEG C, duration of heat 5min, e：Then 4KG power is used
The 5th time is carried out to it to press, it is 50min to press the time for the 5th time, it is carried out the 5th time during pressing for the 5th time plus
Heat, the temperature control of the 5th heating is at 185 DEG C, duration of heat 60min, f：Then the 6th heating is carried out to it,
185 DEG C of the temperature control of 6th heating, duration of heat 62min, g：Finally carry out the 7th time to it to heat, the 7th time
20 DEG C of the temperature control of heating, duration of heat 55min；
Described step S1:Need to use a kind of stamping machine during being laminated to operation, the structure of the stamping machine is including upper
Support (3), support column (2), base (1), workbench (7), electric cylinder (4), hoistable platform (5) and staking punch (6), it is described
Upper bracket (3) is fixedly connected on base (1) by support column (2), and described workbench (7) is fixedly mounted on base (1)
On, described hoistable platform (5) is connected to the bottom of upper bracket (3) by electric cylinder (4), and described staking punch (6) is arranged on
The bottom of hoistable platform (5), described workbench (7) is square, and four positioning are provided with described workbench (7)
Post (8), described four locating dowels (8) are movably connected on workbench (7) by apparatus for adjusting position, and described four fixed
Diel (9) is fixedly connected with workbench (7) between position post (8).
2. outer layer rigidity plate thickness is more than the rigid-flex combined board preparation method of 0.4mm internal layers lettering symbol according to claim 1,
It is characterized in that：Pin post (10) is provided with described diel (9), the bottom of the staking punch (6) is relative to pin post
(10) position offers jack.
3. outer layer rigidity plate thickness according to claim 1 is more than the rigid-flex combined board making side of 0.4mm internal layers lettering symbol
Method, it is characterised in that：Described apparatus for adjusting position includes four tilting guide grooves (11) being opened on workbench (7)
With sliding block (12), the bottom of the guide groove (11) offers three jacks (13) successively, and described locating dowel (8) passes through sliding block
(12) it is movably connected in guide groove (11), offers through hole relative to the position of jack (13) on described sliding block (12), institute
The locating dowel (8) stated is connected to through through hole in the jack (13) of guide groove (11).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510701309.8A CN105246272B (en) | 2015-10-26 | 2015-10-26 | A kind of outer layer rigidity plate thickness is more than the rigid-flex combined board preparation method of 0.4mm internal layers lettering symbol |
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| CN201510701309.8A CN105246272B (en) | 2015-10-26 | 2015-10-26 | A kind of outer layer rigidity plate thickness is more than the rigid-flex combined board preparation method of 0.4mm internal layers lettering symbol |
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| CN105246272B true CN105246272B (en) | 2018-04-06 |
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| CN108260294A (en) * | 2016-12-29 | 2018-07-06 | 天津梦祥原科技有限公司 | A kind of welding circuit board support device |
| CN108359117A (en) * | 2018-02-06 | 2018-08-03 | 浙江欣麟新材料技术有限公司 | A kind of cover board processing technology |
| CN111587024B (en) * | 2019-02-18 | 2022-02-01 | 纬联电子科技(中山)有限公司 | Fixing device and electronic device fixing seat with same |
| CN110248501A (en) * | 2019-07-01 | 2019-09-17 | 高德（无锡）电子有限公司 | The manufacturing process of the Rigid Flex of text is printed on soft board |
| CN111217151B (en) * | 2020-01-08 | 2021-09-17 | 上海向隆电子科技有限公司 | Stacking processing method and stacking processing equipment for wedge-shaped light guide plate |
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| CN101990370A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Making method of ceramic matrix flex-rigid multilayer circuit board |
| CN104470214A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Shape machining method for flexible printed circuit board of rigid-flexible combined circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590756A (en) * | 1991-09-28 | 1993-04-09 | Ibiden Co Ltd | Production of rigid/flexible board |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101990370A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Making method of ceramic matrix flex-rigid multilayer circuit board |
| CN104470214A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Shape machining method for flexible printed circuit board of rigid-flexible combined circuit board |
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