CN113163604B - Manufacturing method of circuit board solder mask plug hole - Google Patents
Manufacturing method of circuit board solder mask plug hole Download PDFInfo
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- CN113163604B CN113163604B CN202110428598.4A CN202110428598A CN113163604B CN 113163604 B CN113163604 B CN 113163604B CN 202110428598 A CN202110428598 A CN 202110428598A CN 113163604 B CN113163604 B CN 113163604B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to a manufacturing method of a circuit board solder mask plug hole, which comprises the following steps: scanning the circuit board to obtain the distribution condition of the through holes of the circuit board, and forming drilling pattern data; selecting an aluminum sheet, and drilling the aluminum sheet according to drilling pattern data to enable the aluminum sheet to be provided with diversion holes which are distributed uniformly with the through holes; pasting an aluminum sheet on a screen printing screen plate to form a hole plugging tool; covering the hole plugging tool on the circuit board, and aligning with the circuit board; pouring the hole plugging ink on the aluminum sheet, pressing the hole plugging ink into the through hole through the guide hole by utilizing a scraper to form a hole plugging; screen printing a solder mask layer on the surface of the circuit board; pre-baking the circuit board; carrying out local exposure on the circuit board according to design requirements; developing the circuit board, wherein a window opening area is formed at the position of a bonding pad of the circuit board, and the window opening area covers a through hole adjacent to the bonding pad; and (5) performing post baking and curing on the circuit board in a sectional baking mode. The invention can effectively prevent the problem of oil leakage of the plug hole of the circuit board.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a solder mask plug hole of a circuit board.
Background
A printed circuit board (english name: printed Circuit Board, PCB), also called a printed circuit board, a circuit board, is an important electronic component, and is a basic support for electronic components, and is also a carrier for electrically interconnecting electronic components.
In a circuit board, the design of an ink plug hole is adopted at the position of a through hole of the circuit board, so that the impedance characteristic of the circuit board is improved, the quality in the aspect of appearance is improved, after the ink plug hole, the plug hole ink is solidified in a mode of exposure, development and baking to form a solder resist plug hole, in the process of manufacturing the solder resist plug hole, the ink in the hole is possibly heated and expanded to generate the phenomenon that the ink is out of the hole when the development, the thermal baking and the post baking are carried out, and aiming at the pattern design of a precise circuit board with the plug hole position being close to a bonding pad (less than or equal to 75 mu m), the ink is extremely easy to be blew out and attached to the bonding pad (commonly called plug hole blew oil), so that the bonding pad is polluted by the ink, and the problems of poor welding and the like are generated.
At present, the ink attached to the bonding pad is generally ablated by laser, the bonding pad is cleaned, and the weldability of the bonding pad is ensured, but the laser ablation method is adopted, laser ablation data are required to be manufactured, accurate laser energy is adopted for ablation, and operations such as alignment, testing, energy adjustment, whole plate and the like are required to be performed in the ablation process, so that the labor cost, material cost and time cost of processing are higher; and laser ablation is a repair performed on the pads after the pads have been inked, and does not solve the problem of jack bleeding from the source.
Based on the background and the problems, a manufacturing method capable of effectively improving the problem of oil leakage of the plug hole of the precise circuit board needs to be explored.
Disclosure of Invention
The invention aims to provide a manufacturing method of a circuit board solder resist plug hole, which can effectively prevent the problem of oil leakage of the circuit board plug hole.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a manufacturing method of a circuit board solder resist plug hole, wherein the circuit board is a printed circuit board with a through hole, comprises the following steps:
step S1: scanning a circuit board, obtaining distribution conditions of through holes of the circuit board, forming scanning pattern data, comparing the scanning pattern data with design pattern data in a drilling machine, and correcting an area with deviation larger than 5 mu m according to the scanning pattern data to form drilling pattern data;
step S2: selecting an aluminum sheet, and drilling the aluminum sheet according to the drilling pattern data to ensure that the aluminum sheet is provided with diversion holes which are distributed uniformly with the through holes;
step S3: pasting the aluminum sheet on a screen printing screen plate to form a hole plugging tool;
step S4: covering the hole plugging tool on a circuit board, and aligning the hole plugging tool with the circuit board;
step S5: placing a layer of paper between the circuit board and the screen printer table, pouring hole plugging ink on the aluminum sheet, pressing the hole plugging ink into the through hole through the diversion hole on the aluminum sheet by using a scraper, and forming a hole plugging, wherein the viscosity of the hole plugging ink is 180-250dpa.s;
step S6: after plugging holes, standing for a period of time, and screen printing a solder mask layer on the surface of the circuit board;
step S7: after the silk-screen solder mask layer is finished, pre-baking the circuit board;
step S8: carrying out local exposure on the circuit board according to design requirements;
step S9: after exposure is completed, developing the circuit board, wherein a window opening area is formed at the bonding pad position of the circuit board, and the window opening area covers the through hole with the bonding pad distance of less than or equal to 75 mu m;
step S10: the upper surface and the lower surface of the circuit board are respectively provided with a silica gel pad to form a buffer structure, the upper surface and the lower surface of the buffer structure are provided with release gaskets to form a laminated structure, the upper surface and the lower surface of the laminated structure are provided with steel plates to form a baking structure, the upper surface of the baking structure is provided with a high-temperature resistant weight, and the circuit board is subjected to post baking and solidification in a sectional baking mode.
Optionally, in the step S10, the stage baking includes a first stage, a second stage, a third stage, a fourth stage, a fifth stage and a sixth stage,
the baking parameters of the first stage are 60 ℃ multiplied by 60min;
the baking parameters of the second stage are 80 ℃ multiplied by 30min;
the baking parameter of the third stage is 100 ℃ multiplied by 30min;
the baking parameters in the fourth stage are 120 ℃ multiplied by 30min;
the baking parameter of the fifth stage is 150 ℃ multiplied by 70min;
and the baking parameters in the sixth stage are that the baking is closed, the baking oven is not opened, and the baking is kept stand for 60min.
Optionally, in step S9, the developing further includes washing, where the washing time is 100S-150S.
Optionally, in step S9, the developing further includes heat drying, where the heat drying is to dry the board surface by adopting a drying mode of 40-50 ℃ x 3 min.
According to the technical scheme, through scanning the distribution condition of the through holes of the circuit board, drilling hole pattern data is formed, the aluminum sheet is drilled according to the drilling hole pattern data, so that the aluminum sheet is provided with guide holes consistent with the distribution of the through holes, more accurate hole plugging aluminum sheet patterns are obtained, hole plugging operation can be rapidly and accurately carried out, and the problem of hole explosion and oil bleeding caused by solidification of the surface of hole plugging ink and non-solidification of the interior is prevented by reducing the viscosity of the hole plugging ink; on the other hand, when the circuit board is subjected to solder resist windowing, the circuit board is subjected to local exposure according to design requirements, after the exposure is finished, the circuit board is developed, a windowing area is formed at the position of a bonding pad of the circuit board, the windowing area covers a through hole adjacent to the bonding pad, and the problem that oil is generated on the bonding pad due to the fact that the hole plugging position is too close to the bonding pad is prevented; in addition, through stacking the back curing of toasting, can make the circuit board be heated more even, abundant, increase the stewing after toasting again, further ensure the post-curing effect of circuit board, so, whole manufacturing method can effectively prevent the problem that the circuit board jack oil is spilled.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a schematic plan view of a prior art circuit board plug hole oil drain problem;
FIG. 2 is a flowchart of a method for fabricating a solder mask plug hole of a circuit board according to an embodiment of the invention;
FIG. 3 is a schematic diagram of an aluminum board and a circuit board according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a circuit board according to an embodiment of the present invention after plugging;
FIG. 5 is a schematic diagram of a solder mask layer of a circuit board according to an embodiment of the invention;
FIG. 6 is a schematic diagram of a structure of a window area formed by windowing a solder mask layer according to an embodiment of the present invention;
FIG. 7 is a schematic plan view of FIG. 6;
fig. 8 is a schematic structural diagram of a circuit board stack according to an embodiment of the present invention after post bake curing.
Reference numerals illustrate:
Detailed Description
The following describes the embodiments of the present invention further with reference to the drawings. The description of these embodiments is provided to assist understanding of the present invention, but is not intended to limit the present invention. In addition, the technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
As shown in fig. 1, in one type of circuit board, the design of the hole plugging ink 200 is adopted at the position of the through hole 101 of the circuit board 100, so as to improve the impedance characteristic of the circuit board 100 and the quality of the appearance. When the manufacturing method in the prior art is used for performing solder resist hole plugging, the hole plugging ink 200 in the through hole 101 is possibly heated and expanded during development, heat drying or post baking, the phenomenon that the hole plugging ink 200 is out of the hole is generated, and aiming at the pattern design of a circuit board with the hole plugging position being close to a bonding pad (less than or equal to 75 mu m), the hole plugging ink 200 is extremely easy to be out and attached to the bonding pad 103 (commonly called hole plugging oil bleeding), so that the bonding pad 103 is polluted by the ink, and the problems of poor welding and the like are generated.
Referring to fig. 2, the embodiment of the invention provides a method for manufacturing a solder mask plug hole of a circuit board, which is capable of effectively avoiding the problem that a bonding pad is polluted by ink due to oil leakage of the circuit board plug hole by plugging the ink into a through hole 101 at a circuit pattern area 105, and comprises the following steps:
step S1: scanning a circuit board, obtaining distribution conditions of through holes of the circuit board, forming scanning pattern data, comparing the scanning pattern data with design pattern data in a drilling machine, and correcting an area with deviation larger than 5 mu m according to the scanning pattern data to form drilling pattern data;
step S2: selecting an aluminum sheet, and drilling the aluminum sheet according to the drilling pattern data to ensure that the aluminum sheet is provided with diversion holes which are distributed uniformly with the through holes;
step S3: pasting the aluminum sheet on a screen printing screen plate to form a hole plugging tool;
step S4: covering the hole plugging tool on a circuit board, and aligning the hole plugging tool with the circuit board;
step S5: placing a layer of paper between the circuit board and the screen printer table, pouring hole plugging ink on the aluminum sheet, pressing the hole plugging ink into the through hole through the diversion hole on the aluminum sheet by using a scraper, and forming a hole plugging, wherein the viscosity of the hole plugging ink is 180-250dpa.s;
step S6: after plugging holes, standing for a period of time, and screen printing a solder mask layer on the surface of the circuit board;
step S7: after the silk-screen solder mask layer is finished, pre-baking the circuit board;
step S8: carrying out local exposure on the circuit board according to design requirements;
step S9: after exposure is completed, the circuit board is developed, and a window opening area is formed at the bonding pad position of the circuit board, wherein the window opening area covers the through hole with the bonding pad distance smaller than or equal to 75 mu m.
Step S10: the upper surface and the lower surface of the circuit board are respectively provided with a silica gel pad to form a buffer structure, the upper surface and the lower surface of the buffer structure are provided with release gaskets to form a laminated structure, the upper surface and the lower surface of the laminated structure are provided with steel plates to form a baking structure, the upper surface of the baking structure is provided with a high-temperature resistant weight, and the circuit board is subjected to post baking and solidification in a sectional baking mode.
The present embodiment will be described in further detail below with reference to the accompanying drawings.
Before the hole plugging of the circuit board 100 is carried out, the circuit board 100 is scanned, the distribution condition of the through holes 101 of the circuit board 100 is obtained, and drilling pattern data is formed; and selecting an aluminum sheet 300, and drilling the aluminum sheet 300 according to the drilling pattern data, so that the aluminum sheet 300 is provided with diversion holes 301 distributed in accordance with the through holes 101. Alternatively, the thickness of the aluminum sheet 300 is 0.2mm.
In the actual processing of the circuit board 100, due to the influence of factors such as complex processing flow and material expansion and contraction, the distribution situation of the through holes 101 of the circuit board 100 may deviate from the position of the design graphic data, and at this time, if the design graphic data is directly used as drilling graphic data, deviation occurs between the diversion holes 301 on the aluminum plate 300 and the actual through holes 101 of the circuit board 100 when the aluminum plate 300 is manufactured, so that the hole plugging ink 200 plugs outside the through holes, and oil leakage hidden trouble is generated for subsequent processing.
Therefore, before the circuit board 100 is plugged, the circuit board 100 is scanned to obtain the distribution condition of the through holes 101 of the circuit board 100, scanning pattern data is formed, then the scanning pattern data is compared with design pattern data in a drilling machine, and for the area with deviation, for example, the area with deviation larger than 5 mu m, the drilling pattern data is formed by correcting according to the scanning pattern data, so that the alignment precision of the diversion holes 301 of the aluminum sheet 300 and the through holes 101 can be effectively improved, and the problem of inconsistent two holes is prevented.
The aluminum sheet 300 is pasted on the screen to form a hole plugging tool, please refer to fig. 3 and 4, and the hole plugging tool is covered on the circuit board 100 to align with the circuit board 100.
Pouring the hole plugging ink 200 on the aluminum sheet 300, pressing the hole plugging ink 200 into the through hole 101 through the diversion holes 301 on the aluminum sheet 300 by using a scraper to form a hole plugging. It should be noted that in the prior art, the viscosity of the hole plugging ink used is generally 200-300dpa.s, the viscosity of the hole plugging ink 200 used in the present embodiment is 180-250dpa.s, the hole plugging ink with lower viscosity is used to more easily plug the through hole 101, and in the subsequent heat drying and baking processes, the volatile components in the hole plugging ink 200 volatilize faster, so that the problem of ink popping due to the fact that the surface of the hole plugging ink 200 is dried, the inside is not dried, the inside temperature is too high, and the volatilization of the volatile components is blocked is avoided. Optionally, a layer of paper 400 may be placed between the circuit board 100 and the screen printer stage 500 during this hole plugging step, and the paper 400 may serve to absorb excess ink and vent.
Referring to fig. 5, after the hole is plugged, the hole plugging ink 200 in the through hole 101 is allowed to stand for a period of time, and then the solder mask 102 is screen printed on the surface of the circuit board 101, and the solder mask 102 covers the whole circuit pattern area 105. The standing time can be adjusted according to actual conditions, and the standing time is optionally 15-20min. After the screen printing solder mask 102 is completed, the circuit board 100 is pre-baked, and the baking parameter of the pre-baking is 75 ℃ x 45min.
Referring to fig. 6 and 7, the circuit board 100 is partially exposed according to design requirements; after exposure, the circuit board 100 is developed, and a window area 103 is formed at the pad position of the circuit board 100, wherein the window area 103 covers the through hole 101 adjacent to the pad, and specifically, the window area 103 covers the through hole 101 with a distance from the pad of less than or equal to 75 μm.
The developing device specifically operates as: the circuit board 100 is sequentially subjected to alkaline washing, weak alkaline washing, air drying, water washing and thermal drying, and when in development, generally, the water washing time after development is 50s-100s, and in this embodiment, optionally, the water washing time after development is prolonged to 100s-150s, so that the excessive plug hole ink 200 can be fully flushed, and the problem of oil bleeding caused by excessive heating generated by the excessive plug hole ink 200 is prevented; in the thermal drying stage of development, the board surface of the circuit board 100 is dried in a thermal drying mode, the parameters adopted in thermal drying are 40-50 ℃ multiplied by 3min, the thermal drying time is properly prolonged, the blowing operation is canceled, and the ink in the through hole 101 caused by hot air blowing is further prevented from oiling.
Post-baking and curing the circuit board 100 by adopting a sectional baking mode, wherein the sectional baking comprises a first stage, a second stage, a third stage, a fourth stage, a fifth stage and a sixth stage, and the baking parameters of the first stage are 60 ℃ multiplied by 60min; the baking parameters of the second stage are 80 ℃ multiplied by 30min; the baking parameter of the third stage is 100 ℃ multiplied by 30min; the baking parameters in the fourth stage are 120 ℃ multiplied by 30min; the baking parameter of the fifth stage is 150 ℃ multiplied by 70min; and the baking parameters in the sixth stage are that the baking is closed, the baking oven is not opened, and the baking is kept stand for 60min. Through the sectional baking of the previous five stages, the last sixth stage uses the residual temperature of the oven to rest for 60min, so that the temperature of the circuit board 100 can be heated more uniformly and fully, and the problem of hole plugging and oil bleeding caused by thermal expansion and cold contraction of the circuit board 100 can be prevented.
Referring to fig. 8, in this embodiment, a multi-layer stack manner is adopted to perform post baking and curing, the circuit board 100 to be post baked is stacked, silica gel pads 600 are respectively disposed on the upper surface and the lower surface of the circuit board 100 to form a buffer structure, release gaskets 700 are disposed on the upper surface and the lower surface of the buffer structure to form a stack structure, steel plates 800 are disposed on the upper surface and the lower surface of the stack structure to form a baking structure, a high-temperature resistant weight 900 is disposed on the upper surface of the baking structure, and the circuit board is post baked and cured in a sectional baking manner. The release gasket 700 may be made of a material with high temperature resistance and strong chemical inertia, such as PTFE or ETFE, and the weight of the weight 900 is 15-25kg, the silica gel pad 600 can form a slow heat conduction effect, and the silica gel pad 600 is soft, so that the hole sites of the hole can be compacted, and the oil leakage problem is prevented. The number of the circuit boards 100 to be stacked is not limited herein, and a plurality of the circuit boards 100 may be stacked and baked according to the production requirement.
According to the invention, the aluminum sheet is used for fast and accurately carrying out hole plugging operation, when the solder mask windowing is carried out on the circuit board, the window windowing area covers the through hole adjacent to the bonding pad, so that the problem that the hole plugging position is too close to the bonding pad to cause oil leakage of the hole plugging position and the bonding pad is solved, and the problem of oil leakage of the hole plugging of the circuit board can be effectively prevented.
The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, and yet fall within the scope of the invention.
In the description of the present patent, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", "row", "column", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present patent and simplifying the description, and do not indicate or imply that the apparatus or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the patent.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present patent, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.
In the patent of the invention, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," "fixedly connected," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present patent will be understood by those skilled in the art according to the specific circumstances.
In the present patent, unless expressly stated or limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
Claims (4)
1. The manufacturing method of the solder resist plug hole of the circuit board is characterized by comprising the following steps of:
step S1: scanning a circuit board, obtaining distribution conditions of through holes of the circuit board, forming scanning pattern data, comparing the scanning pattern data with design pattern data in a drilling machine, and correcting an area with deviation larger than 5 mu m according to the scanning pattern data to form drilling pattern data;
step S2: selecting an aluminum sheet, and drilling the aluminum sheet according to the drilling pattern data to ensure that the aluminum sheet is provided with diversion holes which are distributed uniformly with the through holes;
step S3: pasting the aluminum sheet on a screen printing screen plate to form a hole plugging tool;
step S4: covering the hole plugging tool on a circuit board, and aligning the hole plugging tool with the circuit board;
step S5: placing a layer of paper between the circuit board and the screen printer table, pouring hole plugging ink on the aluminum sheet, pressing the hole plugging ink into the through hole through the diversion hole on the aluminum sheet by using a scraper, and forming a hole plugging, wherein the viscosity of the hole plugging ink is 180-250dpa.s;
step S6: after plugging holes, standing for a period of time, and screen printing a solder mask layer on the surface of the circuit board;
step S7: after the silk-screen solder mask layer is finished, pre-baking the circuit board;
step S8: carrying out local exposure on the circuit board according to design requirements;
step S9: after exposure is completed, developing the circuit board, wherein a window opening area is formed at the bonding pad position of the circuit board, and the window opening area covers the through hole with the bonding pad distance of less than or equal to 75 mu m;
step S10: the upper surface and the lower surface of the circuit board are respectively provided with a silica gel pad to form a buffer structure, the upper surface and the lower surface of the buffer structure are provided with release gaskets to form a laminated structure, the upper surface and the lower surface of the laminated structure are provided with steel plates to form a baking structure, the upper surface of the baking structure is provided with a high-temperature resistant weight, and the circuit board is subjected to post baking and solidification in a sectional baking mode.
2. The method of claim 1, wherein in the step S10, the stage baking includes a first stage, a second stage, a third stage, a fourth stage, a fifth stage and a sixth stage,
the baking parameters of the first stage are 60 ℃ multiplied by 60min;
the baking parameters of the second stage are 80 ℃ multiplied by 30min;
the baking parameter of the third stage is 100 ℃ multiplied by 30min;
the baking parameters in the fourth stage are 120 ℃ multiplied by 30min;
the baking parameter of the fifth stage is 150 ℃ multiplied by 70min;
and the baking parameters in the sixth stage are that the baking is closed, the baking oven is not opened, and the baking is kept stand for 60min.
3. The method of fabricating a solder mask plug hole for a circuit board according to claim 1, wherein in the step S9, the developing further includes washing, and the washing time is 100S-150S.
4. The method for fabricating a solder mask plug hole for a circuit board according to claim 1, wherein in the step S9, the developing further comprises a thermal drying step, and the thermal drying step is a step of drying the board surface by adopting a drying mode of 40 ℃ -50 ℃ x 3 min.
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| CN113677095B (en) * | 2021-08-17 | 2022-05-31 | 东莞市若美电子科技有限公司 | Manufacturing method of circuit board with air guide plate special for hole plugging printing replacing white paper hole plugging |
| CN113490341A (en) * | 2021-09-08 | 2021-10-08 | 成都航天通信设备有限责任公司 | Processing method and processing die for resin plug hole of printed board with thickness less than 0.5mm |
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| TW552832B (en) * | 2001-06-07 | 2003-09-11 | Lg Electronics Inc | Hole plugging method for printed circuit boards, and hole plugging device |
| CN105101661B (en) * | 2014-05-21 | 2018-11-09 | 深圳崇达多层线路板有限公司 | The production method of printed wiring board ink plugging |
| CN107124826B (en) * | 2017-06-20 | 2019-08-23 | 广州兴森快捷电路科技有限公司 | Improve the method for wiring board welding resistance consent bleed |
| CN109302802B (en) * | 2018-12-03 | 2019-12-03 | 深圳市博敏电子有限公司 | A kind of manufacturing method exempted from V-cut and stamp hole and spell stepped groove wiring board more |
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| CN106041325A (en) * | 2016-07-05 | 2016-10-26 | 潍坊路加精工有限公司 | Laser drilling method |
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| CN113163604A (en) | 2021-07-23 |
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