CN102378499A - Method for manufacturing window plug holes at two sides during PCB (Printed Circuit Board) resistance welding - Google Patents
Method for manufacturing window plug holes at two sides during PCB (Printed Circuit Board) resistance welding Download PDFInfo
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- CN102378499A CN102378499A CN2011103159919A CN201110315991A CN102378499A CN 102378499 A CN102378499 A CN 102378499A CN 2011103159919 A CN2011103159919 A CN 2011103159919A CN 201110315991 A CN201110315991 A CN 201110315991A CN 102378499 A CN102378499 A CN 102378499A
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Abstract
The invention relates to a method for manufacturing window plug holes at two sides during PCB (Printed Circuit Board) resistance welding, comprising the following steps of: firstly, providing a PCB board, wherein the PCB board is provided with a first through hole to be provided with the window plug holes at the two sides and a second through hole not to be provided with the window plug holes at the two sides; secondly, carrying out primary resistance welding on the PCB board, wherein a manufacturing process comprises the following steps of: manufacturing the window plug holes at the two sides, carrying out primary prebaking, carrying out primary exposing, carrying out primary developing and carrying out primary after baking, and directly carrying out the primary prebaking without carrying out silk screen printing on the panel of the PCB board after the window plug holes are manufactured at the two sides; and thirdly, carrying out secondary resistance welding on the PCB board, wherein the manufacturing process comprises the following steps of: manufacturing no window plug hole at the two sides, carrying out the silk screen printing, carrying out secondary prebaking, carrying out secondary exposing, carrying out secondary developing and carrying out secondary after baking. In the method for manufacturing the window plug holes at the two sides during PCB resistance welding, an independent plug hole process is adopted for manufacturing the window plug holes at the two sides, and the defects that the plug hole is punched through and oil is spewed can be effectively overcome.
Description
Technical field
(Printed Circuit Board, PCB) making field relate in particular to the window manufacture method of consent of a kind of pcb board resistance weldering two sides to the present invention relates to printed circuit board (PCB).
Background technology
At present, have the pcb board of windowing on the two sides and add man-hour carrying out welding resistance, adopt following welding resistance flow process usually: consent → ink for screen printing → bake roasting → exposure → development → inspection plate → back in advance.When employing should hinder the production of weldering work flow, occur the consent position easily, need improve towards wearing or the wet goods quality defect of vomitting.
Summary of the invention
Therefore, the object of the present invention is to provide the window manufacture method of consent of a kind of pcb board resistance weldering two sides, it adopts independent consent flow process to the two sides consent of windowing, and effectively improves consent and dashes and wear and the wet goods defective of vomitting.
For realizing above-mentioned purpose, the manufacture method that the present invention provides a kind of pcb board resistance weldering two sides to window consent comprises the steps:
Step 1: pcb board is provided, said pcb board be provided with treat the two sides window consent first through hole and treat second through hole of the windowless consent in two sides;
Step 2: said pcb board is made welding resistance for the first time; The making flow process is: window and bake in advance consent → first time → bake after the development → first time exposure → first time for the first time in the two sides; Carrying out the two sides windows when filling in processing; Adopting solder resist that said first through hole is carried out consent handles; Then not carrying out consent for said second through hole handles; Window behind the consent in the completion two sides; The plate face of pcb board is not carried out ink for screen printing and directly carry out the first time roasting in advance, after subsequent treatment, form the two sides consent of windowing at said first lead to the hole site;
Step 3: said pcb board is made resistance weldering for the second time; The making flow process is: bake in advance the windowless consent → ink for screen printing in two sides → second time → roasting after exposure → second development → second time for the second time; During ink for screen printing; Plate face to pcb board carries out silk-screen, and the half tone that the is adopted consent position of windowing on the two sides is provided with the retaining oil drop to prevent that printing ink from getting into the two sides and windowing in the consent.
In the said step 2, use the aluminium flake consent when consent is windowed on the two sides, when roasting in advance for the first time, baked 60 minutes at 70 ℃, when developing for the first time, developing time is 75-90 second, and development pressure is controlled at 1.2-1.4Kg/cm
2, adopt segmented when baking after the first time, baked 30 minutes at 75 ℃, baked 30 minutes at 90 ℃, baked 120 minutes at 120 ℃.
In the said step 3, during ink for screen printing, the T number of the half tone that adopts is 43T or 48T, and wherein the transformational relation between T number and the order number is 1T=2.54
2Order.
The diameter of said retaining oil drop is than the big 10mil in the aperture of first through hole.
Beneficial effect of the present invention: the manufacture method that consent is windowed on pcb board resistance weldering of the present invention two sides, through employing resistance weldering at twice, adopt independent consent flow process with the consent of windowing to the two sides, effectively improve consent towards wearing and the wet goods defective of vomitting.
For further setting forth technological means and the effect that the present invention takes for the predetermined purpose of realization; See also following about detailed description of the present invention and accompanying drawing; Believe the object of the invention, characteristic and characteristics; Should obtain thus going deep into and concrete understanding, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing, describe in detail through specific embodiments of the invention, will make technical scheme of the present invention and other beneficial effects obvious.
In the accompanying drawing,
Fig. 1 is the window schematic flow sheet of manufacture method of consent of pcb board of the present invention resistance weldering two sides;
Fig. 2 for pcb board of the present invention resistance weldering two sides window consent each production phase of manufacture method the cross-sectional view of corresponding pcb board.
Embodiment
Like Fig. 1 and shown in Figure 2, the window manufacture method of consent of pcb board of the present invention resistance weldering two sides comprises the steps:
Step 1: pcb board is provided, said pcb board be provided with treat the two sides window consent first through hole 11 and treat second through hole 12 of the windowless consent in two sides;
Step 2: said pcb board is made welding resistance for the first time; The making flow process is: window and bake in advance consent → first time → bake after the development → first time exposure → first time for the first time in the two sides; Carrying out the two sides windows when filling in processing; Adopting solder resist that said first through hole 11 is carried out consent handles; Then not carrying out consent for said second through hole 12 handles; Window behind the consent in the completion two sides; The plate face of pcb board is not carried out ink for screen printing and directly carry out the first time roasting in advance, after subsequent treatment, form the two sides consent of windowing in said first through hole 11 positions;
Step 3: said pcb board is made resistance weldering for the second time; The making flow process is: bake in advance the windowless consent → ink for screen printing in two sides → second time → roasting after exposure → second development → second time for the second time; During ink for screen printing; Plate face to pcb board carries out silk-screen, and the half tone that the is adopted consent position of windowing on the two sides is provided with retaining oil drop 13 to prevent that printing ink from getting into the two sides and windowing in the consent.
In the said step 2, when windowing consent, the two sides uses the aluminium flake consent, when roasting in advance for the first time; Baked 60 minutes at 70 ℃, when developing for the first time, developing time is 75-90 second; Development pressure is controlled at 1.2-1.4Kg/cm2, adopts segmented when the back is roasting for the first time, bakes 30 minutes at 75 ℃; Baked 30 minutes at 90 ℃, baked 120 minutes at 120 ℃.
In the said step 3, during ink for screen printing, the T number of the half tone that adopts is 43T or 48T.
The diameter of said retaining oil drop 13 is than the big 10mil in the aperture of first through hole 11.
The manufacture method that consent is windowed on above-mentioned pcb board resistance weldering two sides through employing resistance weldering at twice, adopts independent consent flow process with the consent of windowing to the two sides, effectively improves consent towards wearing and the wet goods defective of vomitting.
The above; For the person of ordinary skill of the art; Can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of accompanying Claim of the present invention.
Claims (4)
1. the pcb board resistance weldering two sides manufacture method of consent of windowing is characterized in that, comprises the steps:
Step 1: pcb board is provided, said pcb board be provided with treat the two sides window consent first through hole and treat second through hole of the windowless consent in two sides;
Step 2: said pcb board is made welding resistance for the first time; The making flow process is: window and bake in advance consent → first time → bake after the development → first time exposure → first time for the first time in the two sides; Carrying out the two sides windows when filling in processing; Adopting solder resist that said first through hole is carried out consent handles; Then not carrying out consent for said second through hole handles; Window behind the consent in the completion two sides; The plate face of pcb board is not carried out ink for screen printing and directly carry out the first time roasting in advance, after subsequent treatment, form the two sides consent of windowing at said first lead to the hole site;
Step 3: said pcb board is made resistance weldering for the second time; The making flow process is: bake in advance the windowless consent → ink for screen printing in two sides → second time → roasting after exposure → second development → second time for the second time; During ink for screen printing; Plate face to pcb board carries out silk-screen, and the half tone that the is adopted consent position of windowing on the two sides is provided with the retaining oil drop to prevent that printing ink from getting into the two sides and windowing in the consent.
2. the window manufacture method of consent of pcb board as claimed in claim 1 resistance weldering two sides is characterized in that, in the said step 2, uses the aluminium flake consent when consent is windowed on the two sides; When roasting in advance for the first time, baked 60 minutes at 70 ℃, when developing for the first time; Developing time is 75-90 second, and development pressure is controlled at 1.2-1.4Kg/cm2, adopts segmented when the back is roasting for the first time; Baked 30 minutes at 75 ℃, baked 30 minutes, baked 120 minutes at 120 ℃ at 90 ℃.
3. according to claim 1 or claim 2 the pcb board resistance weldering two sides manufacture method of consent of windowing is characterized in that in the said step 3, during ink for screen printing, the T number of the half tone that adopts is 43T or 48T.
4. the window manufacture method of consent of pcb board as claimed in claim 1 resistance weldering two sides, the diameter of said retaining oil drop is than the big 10mil in the aperture of first through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110315991 CN102378499B (en) | 2011-10-18 | 2011-10-18 | Method for manufacturing window plug holes at two sides during PCB (Printed Circuit Board) resistance welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110315991 CN102378499B (en) | 2011-10-18 | 2011-10-18 | Method for manufacturing window plug holes at two sides during PCB (Printed Circuit Board) resistance welding |
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| Publication Number | Publication Date |
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| CN102378499A true CN102378499A (en) | 2012-03-14 |
| CN102378499B CN102378499B (en) | 2013-03-20 |
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| CN 201110315991 Active CN102378499B (en) | 2011-10-18 | 2011-10-18 | Method for manufacturing window plug holes at two sides during PCB (Printed Circuit Board) resistance welding |
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Cited By (18)
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| CN102686031A (en) * | 2012-05-25 | 2012-09-19 | 东莞山本电子科技有限公司 | Pre-windowing process of high-density interconnected PCB (printed circuit board) with buried blind hole |
| CN102795006A (en) * | 2012-08-09 | 2012-11-28 | 皆利士多层线路版(中山)有限公司 | Green oil silk-printing method for printed circuit board |
| CN103079362A (en) * | 2012-12-25 | 2013-05-01 | 深圳市星河电路有限公司 | Method for preventing oil from bleeding from solder resist ink plug hole |
| CN103220888A (en) * | 2013-04-18 | 2013-07-24 | 梅州市志浩电子科技有限公司 | Printed circuit board silk screen hole plugging method |
| CN103794516A (en) * | 2014-01-24 | 2014-05-14 | 广州兴森快捷电路科技有限公司 | Stepped weld resist manufacturing method for packaged product |
| CN104411119A (en) * | 2014-10-30 | 2015-03-11 | 胜宏科技（惠州）股份有限公司 | Method for processing reddening of circuit board solder mask conducting holes |
| CN104640376A (en) * | 2013-11-13 | 2015-05-20 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board plug hole forming method |
| CN105338744A (en) * | 2015-10-22 | 2016-02-17 | 江门崇达电路技术有限公司 | Manufacturing method for PCB with double-sided oil-coating via hole and tin spraying surface treatment |
| CN106132111A (en) * | 2016-07-26 | 2016-11-16 | 江门崇达电路技术有限公司 | A kind of manufacture method of the wiring board with different solder mask colors |
| CN107333397A (en) * | 2017-08-07 | 2017-11-07 | 胜宏科技（惠州）股份有限公司 | A kind of wiring board control deeply etching method |
| CN108513451A (en) * | 2017-02-28 | 2018-09-07 | 胜宏科技（惠州）股份有限公司 | A kind of production method of the wiring board through-hole solder mask consent depth more than 80% |
| CN110662364A (en) * | 2019-11-06 | 2020-01-07 | 深南电路股份有限公司 | Manufacturing method of circuit board solder mask and circuit board |
| CN110831336A (en) * | 2019-11-11 | 2020-02-21 | 珠海崇达电路技术有限公司 | Resin hole plugging method for large-aperture back drilling hole |
| CN111182743A (en) * | 2020-01-06 | 2020-05-19 | 江门崇达电路技术有限公司 | Manufacturing method of ceramic-based circuit board |
| CN112492764A (en) * | 2021-01-27 | 2021-03-12 | 四川英创力电子科技股份有限公司 | Method for eliminating solder resist ink in through hole of printed circuit board |
| CN112930043A (en) * | 2021-01-29 | 2021-06-08 | 生益电子股份有限公司 | PCB ink hole plugging method and PCB |
| CN113747674A (en) * | 2021-08-31 | 2021-12-03 | 智恩电子(大亚湾)有限公司 | Thick copper plate printing method and ink |
| CN113966101A (en) * | 2021-12-21 | 2022-01-21 | 广东科翔电子科技股份有限公司 | Small pad windowing manufacturing method of high-precision Mini-LED PCB |
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| CN102686031A (en) * | 2012-05-25 | 2012-09-19 | 东莞山本电子科技有限公司 | Pre-windowing process of high-density interconnected PCB (printed circuit board) with buried blind hole |
| CN102686031B (en) * | 2012-05-25 | 2015-06-24 | 湖南鸿瑞新材料股份有限公司 | Pre-windowing process of high-density interconnected PCB (printed circuit board) with buried blind hole |
| CN102795006A (en) * | 2012-08-09 | 2012-11-28 | 皆利士多层线路版(中山)有限公司 | Green oil silk-printing method for printed circuit board |
| CN102795006B (en) * | 2012-08-09 | 2015-07-08 | 皆利士多层线路版(中山)有限公司 | Green oil silk-printing method for printed circuit board |
| CN103079362A (en) * | 2012-12-25 | 2013-05-01 | 深圳市星河电路有限公司 | Method for preventing oil from bleeding from solder resist ink plug hole |
| CN103079362B (en) * | 2012-12-25 | 2015-02-18 | 深圳市星河电路有限公司 | Method for preventing oil from bleeding from solder resist ink plug hole |
| CN103220888B (en) * | 2013-04-18 | 2016-03-02 | 梅州市志浩电子科技有限公司 | Printed circuit board (PCB) mesh screen plughole method |
| CN103220888A (en) * | 2013-04-18 | 2013-07-24 | 梅州市志浩电子科技有限公司 | Printed circuit board silk screen hole plugging method |
| CN104640376A (en) * | 2013-11-13 | 2015-05-20 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board plug hole forming method |
| CN103794516A (en) * | 2014-01-24 | 2014-05-14 | 广州兴森快捷电路科技有限公司 | Stepped weld resist manufacturing method for packaged product |
| CN103794516B (en) * | 2014-01-24 | 2016-06-08 | 广州兴森快捷电路科技有限公司 | A kind of encapsulating products manufacture method of ladder welding resistance |
| CN104411119A (en) * | 2014-10-30 | 2015-03-11 | 胜宏科技（惠州）股份有限公司 | Method for processing reddening of circuit board solder mask conducting holes |
| CN105338744A (en) * | 2015-10-22 | 2016-02-17 | 江门崇达电路技术有限公司 | Manufacturing method for PCB with double-sided oil-coating via hole and tin spraying surface treatment |
| CN106132111A (en) * | 2016-07-26 | 2016-11-16 | 江门崇达电路技术有限公司 | A kind of manufacture method of the wiring board with different solder mask colors |
| CN108513451A (en) * | 2017-02-28 | 2018-09-07 | 胜宏科技（惠州）股份有限公司 | A kind of production method of the wiring board through-hole solder mask consent depth more than 80% |
| CN107333397A (en) * | 2017-08-07 | 2017-11-07 | 胜宏科技（惠州）股份有限公司 | A kind of wiring board control deeply etching method |
| CN110662364A (en) * | 2019-11-06 | 2020-01-07 | 深南电路股份有限公司 | Manufacturing method of circuit board solder mask and circuit board |
| CN110831336B (en) * | 2019-11-11 | 2020-10-27 | 珠海崇达电路技术有限公司 | Resin hole plugging method for large-aperture back drilling hole |
| CN110831336A (en) * | 2019-11-11 | 2020-02-21 | 珠海崇达电路技术有限公司 | Resin hole plugging method for large-aperture back drilling hole |
| CN111182743A (en) * | 2020-01-06 | 2020-05-19 | 江门崇达电路技术有限公司 | Manufacturing method of ceramic-based circuit board |
| CN111182743B (en) * | 2020-01-06 | 2021-06-04 | 江门崇达电路技术有限公司 | Manufacturing method of ceramic-based circuit board |
| CN112492764A (en) * | 2021-01-27 | 2021-03-12 | 四川英创力电子科技股份有限公司 | Method for eliminating solder resist ink in through hole of printed circuit board |
| CN112930043A (en) * | 2021-01-29 | 2021-06-08 | 生益电子股份有限公司 | PCB ink hole plugging method and PCB |
| CN113747674A (en) * | 2021-08-31 | 2021-12-03 | 智恩电子(大亚湾)有限公司 | Thick copper plate printing method and ink |
| CN113966101A (en) * | 2021-12-21 | 2022-01-21 | 广东科翔电子科技股份有限公司 | Small pad windowing manufacturing method of high-precision Mini-LED PCB |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523000 Dongcheng District (Dongguan) science and Technology Industrial Park, Guangdong, China Patentee before: Dongguan Shengyi Electronics Ltd. |