CN103079362A - Method for preventing oil from bleeding from solder resist ink plug hole - Google Patents
Method for preventing oil from bleeding from solder resist ink plug hole Download PDFInfo
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- CN103079362A CN103079362A CN201210569923XA CN201210569923A CN103079362A CN 103079362 A CN103079362 A CN 103079362A CN 201210569923X A CN201210569923X A CN 201210569923XA CN 201210569923 A CN201210569923 A CN 201210569923A CN 103079362 A CN103079362 A CN 103079362A
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Abstract
The invention discloses a method for preventing oil from bleeding from a solder resist ink plug hole. The method comprises the following steps of: manufacturing single-surface and double-side windowing via hole plugging aluminum sheets and non-windowing plug hole aluminum sheets; plugging single-surface and double-side windowing via holes of a PCB (Printed Circuit Board); when the single-surface windowing via hole is plugged, displaying exposed point films on one surface where the windowing via holes are not windowed; and then plugging non-windowing via holes. According to the method disclosed by the invention, solder resist ink is printed after the plugging is carried out in graded times, so that the problem of oil bleeding in the plugging process of single-side windowing, double-side windowing and non-windowing PCB is effectively solved; and the quality and service performance of products are improved.
Description
Technical field
The invention belongs to the printed wiring board manufacture technology field, what be specifically related to is a kind of method that prevents welding resistance ink plugging bleed.
Background technology
Continuous renewal along with the electronic product technology, the structure of electronic chip and mounting means are also constantly improving and are changing, its development is to have developed into from the parts with plug-in unit pin to adopt the arrange highly dense integrated circuit modules of solder joint of ball-type matrix basically, the height of electronic product is integrated, and making and the quality of pcb board are had higher requirement.
At present need consent in the pcb board manufacturing process, reaching anti-welding purpose, consent refers to the technique of the pcb board through hole being filled with green oil (or welding resistance printing ink).And have single face window pad, double window pad and without the situation of windowing for consent positions different on the same pcb board, adopt conventional production method, have following problem: one, rabbet ink is not roasting dead, at silk-screen welding resistance printing ink, the rear expansion bleed that easily occurs when roasting; Two, there is air to exist in the through hole, when baking behind the silk-screen welding resistance printing ink for the second time, the problem that gas expansion causes bleed easily occurs; The existence of the problems referred to above can make solder mask (green oil) face plain, affects product appearance, causes the quality of product and serviceability relatively poor.
Summary of the invention
For this reason, the object of the present invention is to provide a kind of method that prevents welding resistance ink plugging bleed, with the problem that solves the pad of windowing at present, double window pad and easily occur the consent bleed without the pcb board of windowing.
The objective of the invention is to be achieved through the following technical solutions.
A kind of method that prevents welding resistance ink plugging bleed comprises step:
S1, make the windowed plug hole aluminium flake: hole at the aluminium flake identical with the pcb board size, and single face is windowed on described boring and the pcb board, and to cross the hole site corresponding one by one for via hole position and double window;
S2, make not windowed plug hole aluminium flake: hole at the aluminium flake identical with the pcb board size, and the hole site of not windowing on described boring and the pcb board is corresponding one by one;
S3, make the exposure point alignment film: make the exposure point alignment film identical with the pcb board size, and make on exposure point and the pcb board on this film the single face via hole position of not windowing of windowing corresponding one by one;
S4, adopt the consent that the windowed plug hole aluminium flake is not windowed at the via hole that requires single face to window among the step S1, and make to enter the oily degree of depth in the hole and be positioned at hole depth 70～80%, then keep 75 ℃ pre-baked 50～55 minutes;
S5, adopt among the step S3 exposure point alignment film single face on pcb board via hole position of not windowing of windowing to expose;
2.5～4.0 m/mins of S6, control developing powders develop to the exposure point alignment film after the exposure;
S7, carry out after the segmentation roasting to above-mentioned pcb board;
S8, adopt among the step S2 not the windowed plug hole aluminium flake that consent is carried out in the pcb board one side hole site of not windowing, and behind consent, print welding resistance printing ink at the plate face, and make printing welding resistance printing ink enter into single face window via hole, double window via hole and the via hole of not windowing, then carry out pre-baked;
S9, the pcb board face is carried out welding resistance film aligning, exposure, development, detection and rear roasting.
Preferably, single face described in the step S1 window via hole be on the pcb board behind the via hole consent one side pad, the via hole of another side landless arranged; Described double window via hole be on the pcb board behind the via hole consent two sides via hole of pad is arranged.
Preferably, the via hole of not windowing among the step S2 is the via hole that the two sides does not all have pad behind the via hole consent.
Preferably, step S5 comprises: use the exposure point alignment film that the via hole of windowing of single face on the pcb board is simultaneously carried out the contraposition exposure in the position of not windowing, single face the window one side of position of via hole of windowing adopts film to block, and does not expose.
Preferably, do not window before the position simultaneously carries out contraposition exposure at via hole that single face is windowed, pre-baked to remove window bubble in the via hole of single face.
Preferably, among the S3 on the exposure point diameter on the alignment film and the pcb board the window aperture of via hole of single face identical.
The present invention compared with prior art, beneficial effect is: the method that prevents welding resistance ink plugging bleed provided by the invention, by making single face, double window via hole consent aluminium flake and windowed plug hole aluminium flake not, to the pcb board single face, double window via hole consent, and when single face windowed the via hole consent, go out the exposure point film in the single face one side that via hole do not window of windowing, afterwards the via hole of not windowing is carried out consent, the present invention prints welding resistance printing ink after the gradation consent, effectively avoided single face to window, double window and without the bleed problem of windowing and occurring in the pcb board consent process has improved quality and the serviceability of product.
Description of drawings
Fig. 1 is the method flow diagram that the present invention prevents welding resistance ink plugging bleed.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
See also shown in Figure 1ly, Fig. 1 is the method flow diagram that the present invention prevents welding resistance ink plugging bleed.The present invention is to provide a kind of method that prevents welding resistance ink plugging bleed, it is mainly used in solving the problem of windowing at present pad, double window pad and easily occurring the consent bleed without the pcb board of windowing.
Wherein the present invention prevents that the method for welding resistance ink plugging bleed from specifically comprising the steps:
S1, make the windowed plug hole aluminium flake: hole at the aluminium flake identical with the pcb board size, and single face is windowed on described boring and the pcb board, and to cross the hole site corresponding one by one for via hole position and double window;
Hole at the aluminium flake identical with the pcb board size, and the single face via hole position of windowing is corresponding one by one on described boring and the pcb board, and it is corresponding one by one to make on described boring and the pcb board double window cross the hole site; Namely include on this windowed plug hole aluminium flake with window via hole and double window of single face and cross through hole corresponding to hole site.
The wherein said single face via hole of windowing refers on the pcb board that one side has pad, the via hole of another side landless behind the via hole consent; Described double window via hole refers on the pcb board that there is the via hole of pad on two sides behind the via hole consent.
S2, make not windowed plug hole aluminium flake: hole at the aluminium flake identical with the pcb board size, and the hole site of not windowing on described boring and the pcb board is corresponding one by one;
The wherein said via hole of not windowing refers on the pcb board that two sides behind the via hole consent does not all have the via hole of pad, and described not windowed plug hole aluminium flake refers to only have on this aluminium flake the through hole corresponding with windowed plug hole position not, and other single faces are windowed via hole and double window via hole then not at this not on the windowed plug hole aluminium flake.
S3, make the exposure point alignment film: make the exposure point alignment film identical with the pcb board size, and make on exposure point and the pcb board on this film the single face via hole position of not windowing of windowing corresponding one by one;
The via hole that single face is windowed the exposure point film in the one side of not windowing; And the diameter that makes exposure point is identical with the via hole aperture that the plate single face is windowed, and the via hole of windowing without the single face only via hole of double window need not go out by this film to expose.
S4, adopt the consent that the windowed plug hole aluminium flake is not windowed at the via hole that requires single face to window among the step S1, and make to enter the oily degree of depth in the hole and be positioned at hole depth 70～80%, then keep 75 ℃ pre-baked 50～55 minutes;
Pcb board is carried out consent, adopt the mode of screen painting that the windowed plug hole aluminium flake is placed on the half tone, correspondence ink for screen printing on this aluminium flake, make printing ink enter into via hole on the pcb board by the hole on the aluminium flake, the via hole that is filled with printing ink herein is single face window via hole and double window via hole, and printing ink enters in the via hole unsuitable too many, is positioned at hole depth 70～80% as good take the oily degree of depth.
S5, adopt among the step S3 exposure point alignment film single face on pcb board via hole position of not windowing of windowing to expose;
Do not window before the position simultaneously carries out contraposition exposure at via hole that single face is windowed, need pre-bakedly to remove window bubble in the via hole of single face, avoid occurring the bleed problem.
Use the exposure point alignment film that the via hole of windowing of single face on the pcb board is simultaneously carried out the contraposition exposure in the position of not windowing, the another side of the position of windowing (opening one side window position) adopts film to block, and does not expose; Avoid because of the long-pending too large problem of the ill-exposed Kong Bianji pasta that causes; And the via hole of windowing without single face only the via hole of double window do not need contraposition.
2.5～4.0 m/mins of S6, control developing powders develop to the exposure point alignment film after the exposure;
Move back film behind the exposure imaging, film is moved back with exterior domain in the single face via hole position of not windowing of windowing.
S7, carry out after the segmentation roasting to above-mentioned pcb board;
Adopt after the low-temperature end roastingly herein, do not need behind 150 ℃ the high temperature roasting.
S8, adopt not that the windowed plug hole aluminium flake carries out consent to the hole site of not windowing on pcb board two sides, and behind the consent at plate face printing welding resistance printing ink, then carry out pre-baked;
The mode of employing screen painting not windowed plug hole aluminium flake is placed on the half tone, correspondence ink for screen printing on this aluminium flake, make printing ink enter into the via hole of not windowing on the pcb board by the hole on the aluminium flake, and printing ink enters in the via hole unsuitable too many, be positioned at hole depth 70～80% as good take the oily degree of depth, then keep 75 ℃ pre-baked 50～55 minutes.
Print welding resistance printing ink at the pcb board face afterwards, welding resistance printing ink herein is identical with the ink composition in the consent, in printing welding resistance printing ink process, can make welding resistance printing ink correspondence enter into consent on the pcb board, fill the consent that only is filled with 70～80% printing ink originally complete.
S9, the pcb board face is carried out welding resistance film aligning, exposure, development, detection and rear roasting.
Adopt at last the normal welding resistance film to carry out contraposition, exposure, development, detection and rear roasting, make pcb board.
The present invention is directed to the different via holes of windowing, utilize different consent aluminium flakes, adopt different ink plugging modes, and the amount of control rabbet ink, solve the bleed problem that occurs in the pcb board consent process, thereby improved quality and the serviceability of product.
The above only is preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. method that prevents welding resistance ink plugging bleed is characterized in that comprising step:
S1, make the windowed plug hole aluminium flake: hole at the aluminium flake identical with the pcb board size, and single face is windowed on described boring and the pcb board, and to cross the hole site corresponding one by one for via hole position and double window;
S2, make not windowed plug hole aluminium flake: hole at the aluminium flake identical with the pcb board size, and the hole site of not windowing on described boring and the pcb board is corresponding one by one;
S3, make the exposure point alignment film: make the exposure point alignment film identical with the pcb board size, and make on exposure point and the pcb board on this film the single face via hole position of not windowing of windowing corresponding one by one;
S4, adopt the consent that the windowed plug hole aluminium flake is not windowed at the via hole that requires single face to window among the step S1, and make to enter the oily degree of depth in the hole and be positioned at hole depth 70～80%, then keep 75 ℃ pre-baked 50～55 minutes;
S5, adopt among the step S3 exposure point alignment film single face on pcb board via hole position of not windowing of windowing to expose;
2.5～4.0 m/mins of S6, control developing powders develop to the exposure point alignment film after the exposure;
S7, carry out after the segmentation roasting to above-mentioned pcb board;
S8, adopt among the step S2 not the windowed plug hole aluminium flake that consent is carried out in the pcb board one side hole site of not windowing, and behind consent, print welding resistance printing ink at the plate face, and make printing welding resistance printing ink enter into single face window via hole, double window via hole and the via hole of not windowing, then carry out pre-baked;
S9, the pcb board face is carried out welding resistance film aligning, exposure, development, detection and rear roasting.
2. the method that prevents welding resistance ink plugging bleed according to claim 1, it is characterized in that single face described in the step S1 window via hole be on the pcb board behind the via hole consent one side pad, the via hole of another side landless are arranged; Described double window via hole be on the pcb board behind the via hole consent two sides via hole of pad is arranged.
3. the method that prevents welding resistance ink plugging bleed according to claim 1, the via hole that it is characterized in that not windowing among the step S2 is the via hole that the two sides does not all have pad behind the via hole consent.
4. the method that prevents welding resistance ink plugging bleed according to claim 1, it is characterized in that step S5 comprises: use the exposure point alignment film that the via hole of windowing of single face on the pcb board is simultaneously carried out the contraposition exposure in the position of not windowing, single face the window one side of position of via hole of windowing adopts film to block, and does not expose.
5. the method that prevents welding resistance ink plugging bleed according to claim 4 is characterized in that: do not window before the position simultaneously carries out the contraposition exposure at via hole that single face is windowed, and pre-baked to remove window bubble in the via hole of single face.
6. the method that prevents welding resistance ink plugging bleed according to claim 1 is characterized in that among the S3 that the window aperture of via hole of single face on the exposure point diameter on the alignment film and pcb board is identical.
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| CN201210569923.XA CN103079362B (en) | 2012-12-25 | 2012-12-25 | Method for preventing oil from bleeding from solder resist ink plug hole |
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| CN201210569923.XA CN103079362B (en) | 2012-12-25 | 2012-12-25 | Method for preventing oil from bleeding from solder resist ink plug hole |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687334A (en) * | 2013-12-02 | 2014-03-26 | 深圳市景旺电子股份有限公司 | Method for solving problem of oil bleeding of anti-welding plug hole in single-side windowed PCB (printed circuit board) |
| CN104902695A (en) * | 2015-06-08 | 2015-09-09 | 深圳崇达多层线路板有限公司 | Solder resist manufacturing method of windowing taphole design |
| CN105101661A (en) * | 2014-05-21 | 2015-11-25 | 深圳崇达多层线路板有限公司 | Manufacturing method of printed circuit board ink plug hole |
| CN105764240A (en) * | 2016-01-12 | 2016-07-13 | 大连崇达电路有限公司 | Printed circuit board with double-side windowing and oil filling in holes in resistance welding ring disc and production process |
| CN106550550A (en) * | 2016-10-26 | 2017-03-29 | 广东骏亚电子科技股份有限公司 | A kind of anti-welding one side windowing via manufacture method |
| CN109068487A (en) * | 2018-09-14 | 2018-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of method of two-sided patch welding |
| CN110324983A (en) * | 2019-07-29 | 2019-10-11 | 广州兴森快捷电路科技有限公司 | The production method of wiring board |
| CN111385979A (en) * | 2018-12-28 | 2020-07-07 | 惠东县建祥电子科技有限公司 | Method for improving solder mask oil leakage of PCB |
| CN112672512A (en) * | 2020-12-16 | 2021-04-16 | 广州添利电子科技有限公司 | Three-in-one green oil hole plugging process |
| CN113543483A (en) * | 2021-06-22 | 2021-10-22 | 深圳市景旺电子股份有限公司 | Solder resist hole plugging method for printed circuit board |
| CN115209633A (en) * | 2022-09-14 | 2022-10-18 | 深圳万和兴电子有限公司 | Manufacturing method of single-sided windowing hole plugging of PCB lead-free tin-sprayed plate |
| CN115214247A (en) * | 2021-04-16 | 2022-10-21 | 江苏协和电子股份有限公司 | Segmented curing method for solder mask plug hole of 5G high-frequency product |
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| CN102387671A (en) * | 2011-10-18 | 2012-03-21 | 东莞生益电子有限公司 | Manufacturing method for single face windowing hole plugging of tin spayed plate |
| CN102523698A (en) * | 2011-12-14 | 2012-06-27 | 景旺电子（深圳）有限公司 | Method for filling through-holes of printed circuit board (PCB) with solder mask ink for double-sided opening |
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| CN102378499A (en) * | 2011-10-18 | 2012-03-14 | 东莞生益电子有限公司 | Method for manufacturing window plug holes at two sides during PCB (Printed Circuit Board) resistance welding |
| CN102387671A (en) * | 2011-10-18 | 2012-03-21 | 东莞生益电子有限公司 | Manufacturing method for single face windowing hole plugging of tin spayed plate |
| CN102523698A (en) * | 2011-12-14 | 2012-06-27 | 景旺电子（深圳）有限公司 | Method for filling through-holes of printed circuit board (PCB) with solder mask ink for double-sided opening |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687334A (en) * | 2013-12-02 | 2014-03-26 | 深圳市景旺电子股份有限公司 | Method for solving problem of oil bleeding of anti-welding plug hole in single-side windowed PCB (printed circuit board) |
| CN105101661A (en) * | 2014-05-21 | 2015-11-25 | 深圳崇达多层线路板有限公司 | Manufacturing method of printed circuit board ink plug hole |
| CN105101661B (en) * | 2014-05-21 | 2018-11-09 | 深圳崇达多层线路板有限公司 | The production method of printed wiring board ink plugging |
| CN104902695A (en) * | 2015-06-08 | 2015-09-09 | 深圳崇达多层线路板有限公司 | Solder resist manufacturing method of windowing taphole design |
| CN105764240A (en) * | 2016-01-12 | 2016-07-13 | 大连崇达电路有限公司 | Printed circuit board with double-side windowing and oil filling in holes in resistance welding ring disc and production process |
| CN106550550A (en) * | 2016-10-26 | 2017-03-29 | 广东骏亚电子科技股份有限公司 | A kind of anti-welding one side windowing via manufacture method |
| CN109068487A (en) * | 2018-09-14 | 2018-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of method of two-sided patch welding |
| CN111385979A (en) * | 2018-12-28 | 2020-07-07 | 惠东县建祥电子科技有限公司 | Method for improving solder mask oil leakage of PCB |
| CN110324983A (en) * | 2019-07-29 | 2019-10-11 | 广州兴森快捷电路科技有限公司 | The production method of wiring board |
| CN112672512A (en) * | 2020-12-16 | 2021-04-16 | 广州添利电子科技有限公司 | Three-in-one green oil hole plugging process |
| CN115214247A (en) * | 2021-04-16 | 2022-10-21 | 江苏协和电子股份有限公司 | Segmented curing method for solder mask plug hole of 5G high-frequency product |
| CN113543483A (en) * | 2021-06-22 | 2021-10-22 | 深圳市景旺电子股份有限公司 | Solder resist hole plugging method for printed circuit board |
| CN115209633A (en) * | 2022-09-14 | 2022-10-18 | 深圳万和兴电子有限公司 | Manufacturing method of single-sided windowing hole plugging of PCB lead-free tin-sprayed plate |
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Address after: Baoan District manhole Street Ho 518000 Shenzhen city Guangdong Province four West Industrial Park second building Patentee after: Shenzhen Xinghe circuit Limited by Share Ltd Address before: Baoan District manhole Street Ho 518000 Shenzhen city Guangdong Province four West Industrial Park second building Patentee before: Galaxy Circuit Co., Ltd. |
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Effective date of registration: 20180608 Address after: 518000 Shenzhen, Baoan District, Guangdong, four wells in the West China Industrial Park, second wells. Co-patentee after: Xinghe circuit (Fujian) Co., Ltd. Patentee after: Shenzhen Xinghe circuit Limited by Share Ltd Address before: 518000 Shenzhen, Baoan District, Guangdong, four wells in the West China Industrial Park, second wells. Patentee before: Shenzhen Xinghe circuit Limited by Share Ltd |
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Address after: 364302 D01 block, Yan Qian industrial concentrated area, Longyan, Fujian. Co-patentee after: Shenzhen Xinghe circuit Limited by Share Ltd Patentee after: Xinghe circuit (Fujian) Co., Ltd. Address before: 518000 Shenzhen, Baoan District, Guangdong, four wells in the West China Industrial Park, second wells. Co-patentee before: Xinghe circuit (Fujian) Co., Ltd. Patentee before: Shenzhen Xinghe circuit Limited by Share Ltd |
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