CN115214247A - Segmented curing method for solder mask plug hole of 5G high-frequency product - Google Patents
Segmented curing method for solder mask plug hole of 5G high-frequency product Download PDFInfo
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- CN115214247A CN115214247A CN202110408332.3A CN202110408332A CN115214247A CN 115214247 A CN115214247 A CN 115214247A CN 202110408332 A CN202110408332 A CN 202110408332A CN 115214247 A CN115214247 A CN 115214247A
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- workpiece
- curing
- ink
- conveying
- solder mask
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 26
- 238000001723 curing Methods 0.000 title claims description 45
- 238000000034 method Methods 0.000 claims abstract description 22
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000003860 storage Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 abstract description 4
- 230000011218 segmentation Effects 0.000 abstract 1
- 238000011417 postcuring Methods 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/009—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using thermal means, e.g. infrared radiation, heat
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention relates to the technical field of 5G high-frequency product preparation, in particular to a method for solidifying solder resist plug holes of a 5G high-frequency product in a segmented mode, which comprises the following steps: the method comprises the following steps: conveying the workpiece into a printing station through a conveying device so as to print a first layer of ink on the workpiece; step two: conveying the workpiece to a pre-curing station through conveying equipment so as to pre-dry the workpiece until the printing ink does not stick to the workpiece; step three: feeding the workpiece into the printing station again through the conveying equipment so as to print a second layer of ink on the other side of the workpiece; step four: conveying the workpiece into a pre-curing station again through conveying equipment so as to pre-dry the workpiece until the printing ink does not stick to the workpiece; step five: feeding the workpiece into the printing station again through the conveying equipment, and continuously conveying for a certain distance, wherein the dropped ink flows back to the printing station; step six: the workpiece is fed into a curing oven by a conveying device so that graphite forms a cured layer on the workpiece. The curing time of the solder resist ink after segmentation is saved, and the product yield is improved.
Description
Technical Field
The invention relates to the technical field of 5G high-frequency product preparation, in particular to a segmented curing method for a solder mask plug hole of a 5G high-frequency product.
Background
Before that, after the 5G high-frequency product is subjected to solder mask welding by using the preparation and processing conditions which are traditionally used in the industry, the problems of long curing time, more curing conditions, power resource waste, processing aging loss, poor operation and processing controllability and the like exist, so that the problems of poor product yield, power waste, processing aging increase and wrong parameter conditions also exist in the curing batch production process after the 5G high-frequency product is subjected to the solder mask ink hole plugging process.
Disclosure of Invention
The invention aims to provide a preparation method for shortening the post-curing time of a 5G high-frequency product solder mask plug hole section.
In order to solve the technical problem, the invention provides a method for solidifying a solder mask plug hole section of a 5G high-frequency product, which comprises the following steps: the method comprises the following steps: conveying the workpiece into a printing station through conveying equipment so as to print a first layer of ink on the workpiece; step two: conveying the workpiece to a pre-curing station through conveying equipment so as to pre-dry the workpiece until the printing ink does not stick to the workpiece; step three: feeding the workpiece into the printing station again through the conveying equipment so as to print a second layer of ink on the other side of the workpiece; step four: conveying the workpiece into a pre-curing station again through conveying equipment so as to pre-dry the workpiece until the printing ink does not stick to the workpiece; step five: feeding the workpiece into the printing station again through the conveying equipment, and continuously conveying for a certain distance, wherein the dropped ink flows back to the printing station; step six: the workpiece is conveyed into a curing furnace by a conveying device, so that the graphite forms a cured layer on the workpiece.
Specifically, before the first step, the workpiece is erected on a bearing vehicle, the bearing vehicle is placed on a conveying device, and the bearing vehicle is conveyed through the conveying device to convey the workpiece.
Specifically, the interior of the carrier vehicle is provided with a hollow collecting cavity; collecting ink falling off when the workpiece is printed in the first step and the third step in a collecting cavity; and collecting the ink dropped during the pre-curing of the workpiece in the second step and the fourth step in a collecting cavity.
Specifically, the bottom of the inner side wall of the collecting cavity is connected with a liquid outlet pipe, and the outlet of the liquid outlet pipe is hinged with a cover body; a storage tank suitable for storing ink is arranged at the bottom of the printing station, and a push rod is arranged on the left side of the printing station and positioned above the storage tank; in the first step and the third step, the printing ink printed on the workpiece comes from a storage tank; and in the fifth step, the bearing vehicle is conveyed to the printing station and then is conveyed to the push rod, and the cover body is opened through the push rod, so that the ink in the collecting cavity flows out to the storage tank.
Specifically, in the second step and the fourth step, the light source irradiation device is installed at the pre-curing station, and the workpiece is pre-cured by the light source irradiation device.
Specifically, in the second step and the fourth step, the baking temperature of the light source irradiation device is 70 ℃ to 80 ℃.
Specifically, in the second step and the fourth step, the baking time of the light source irradiation device is 10 minutes to 15 minutes.
Specifically, in the sixth step, the baking time of the curing oven is 1 hour to 2 hours.
Specifically, when a double-sided workpiece is printed, after the fifth step is completed on one side of the workpiece, the first to fifth steps are repeated on the other side of the workpiece, and finally the sixth step is completed.
Specifically, the workpiece is turned over by the carrier.
The method has the beneficial effects that the step of solidifying the 5G high-frequency product solder mask hole plugging section is realized by pre-solidifying the workpiece, so that the solidifying time of the 5G high-frequency product solder mask ink hole plugging process after section is shortened, and the solidifying condition of the product after solidification is fixed; therefore, the curing time of the segmented solder resist ink of the 5G high-frequency product is saved, and the yield of the product is improved;
the dropped printing ink is returned to the position of printing ink before thermal curing is carried out, so that the condition that the printing ink is cured below the workpiece is avoided, meanwhile, the dropped printing ink can be recycled, and the printing ink is saved.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a flow chart of a preferred embodiment of a 5G high frequency product solder mask via hole step curing method of the present invention;
FIG. 2 is a schematic production line of a preferred embodiment of the 5G high frequency product solder mask via hole step cure of the present invention;
fig. 3 is a perspective block diagram of a preferred embodiment of the vehicle of the present invention.
In the figure:
the device comprises a conveying device 1, a workpiece 2, a printing station 3, a storage tank 31, a push rod 32, a pre-curing station 4, a bearing vehicle 5, a collection cavity 51, a liquid outlet pipe 52, a cover body 53, a slide rail 54, a slide block 55, a sliding cylinder 56, a lifting block 57, a first chuck 58, a second chuck 59 and a curing furnace 6.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams each illustrating the basic structure of the present invention only in a schematic manner, and thus show only the constitution related to the present invention.
As shown in FIG. 1, the method for curing the solder mask plug hole section of the 5G high-frequency product comprises the following steps: the method comprises the following steps: conveying the workpiece into a printing station through conveying equipment so as to print a first layer of ink on the workpiece; step two: conveying the workpiece to a pre-curing station through conveying equipment so as to pre-dry the workpiece until the printing ink does not stick to the workpiece; step three: feeding the workpiece into the printing station again through the conveying equipment so as to print a second layer of ink on the other side of the workpiece; step four: conveying the workpiece into a pre-curing station again through conveying equipment so as to pre-dry the workpiece until the printing ink does not stick to the workpiece; step five: the workpiece is conveyed into the printing station again through the conveying equipment, the workpiece is conveyed for a certain distance, and the dropped ink flows back to the printing station; step six: the workpiece is fed into a curing oven by a conveying device so that graphite forms a cured layer on the workpiece. By pre-curing the workpiece, the segmented post-curing time of the 5G high-frequency product solder-resist ink hole plugging process is shortened, and post-curing conditions of the fixed product are reduced; therefore, the curing time of the segmented solder resist ink of the 5G high-frequency product is saved, and the yield of the product is improved; the printing ink that will drop flows back to the position of printing ink before carrying out the thermocuring, avoids the condition of printing ink solidification in work piece below, and the printing ink that drops simultaneously can be recycled, has practiced thrift printing ink.
Optionally, before the step one, the workpiece is erected on a carrying vehicle, the carrying vehicle is arranged on a conveying device, and the carrying vehicle is conveyed by the conveying device to convey the workpiece.
Optionally, a hollow collecting cavity is arranged in the bearing vehicle, and specifically, the workpiece is erected above the collecting cavity; collecting ink falling off when the workpiece is printed in the first step and the third step in a collecting cavity; and step two and step four, collecting the ink dropped during pre-curing the workpiece in the collecting cavity, specifically, directly dropping the ink printed on the workpiece in the collecting cavity.
Optionally, a liquid outlet pipe is connected to the bottom of the inner side wall of the collection cavity, and a cover body is hinged to the outlet of the liquid outlet pipe, specifically, the cover body is open at the side, and a torsion spring is arranged at the outlet of the cover body and the liquid outlet pipe; a storage tank suitable for storing ink is arranged at the bottom of the printing station, and a push rod is arranged on the left side of the printing station, namely the push rod is positioned in the direction from the pre-curing station to the printing station and is positioned above the storage tank; in the first step and the third step, the printing ink printed on the workpiece comes from a storage tank; in step five, after carrying the printing station to the printing station from the curing station in advance, continue to carry to the push rod, in this in-process, the push rod can contact with the lid, and open the lid through the push rod, so that collect the printing ink outflow in the intracavity to the holding vessel, and then the printing ink after the printing is accomplished can used repeatedly, printing ink has been practiced thrift, and simultaneously, because the printing ink of collecting the intracavity is more than the printing ink on the work piece, and the work piece is more close to the baking point of curing in advance, when this makes the printing ink on work piece surface solidify in advance, it still can be the fluid form to collect the printing ink in the intracavity, avoid printing ink to lead to the problem of washing difficulty collecting the intracavity solidification.
Optionally, in the second step and the fourth step, a light source irradiation device is installed at the pre-curing station, and the workpiece is pre-cured by the light source irradiation device, specifically, the workpiece is irradiated by strong light in the light source irradiation device.
Optionally, in the second step and the fourth step, the baking temperature of the light source irradiation device is 70 ℃.
Optionally, in the second step and the fourth step, the baking time of the light source irradiation device is 10 minutes.
Optionally, in the sixth step, the baking time of the curing oven is 1 hour.
Optionally, when a double-sided workpiece is printed, after the fifth step is finished on one side of the workpiece, the sixth step is finished on the other side of the workpiece by repeating the first step to the fifth step.
Optionally, turn over the work piece through bearing the car, it is concrete, top both sides at bearing the car are provided with the slide rail, sliding connection has the slider in the slide rail, and the movable end at a sliding cylinder is connected to the slider, it has a lifter to peg graft on the slider, it is connected with first chuck to rotate between two lifters, it is connected with the second chuck to rotate at the middle part of two slide rails, the work piece just presss from both sides between first chuck and second chuck, when turning over, promote the slider through sliding cylinder and slide in the slide rail, the lifter upwards jacks along the slider simultaneously, make first chuck pass the second chuck, treat that first chuck and second chuck are after on same horizontal plane, accomplish the turn-over of work piece.
Example two
The other parts are the same as the first embodiment, except that,
specifically, in the second step and the fourth step, the baking temperature of the light source irradiation device was 80 ℃.
Specifically, in the second step and the fourth step, the baking time of the light source irradiation device is 15 minutes.
Specifically, in the sixth step, the baking time of the curing oven is 2 hours.
EXAMPLE III
The other parts are the same as the first embodiment, except that,
specifically, in the second step and the fourth step, the baking temperature of the light source irradiation device was 75 ℃.
Specifically, in the second step and the fourth step, the baking time of the light source irradiation device is 12 minutes.
Specifically, in the sixth step, the baking time of the curing oven is 1.5 hours.
In light of the foregoing description of the preferred embodiment of the present invention, it is to be understood that various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. A method for solidifying a 5G high-frequency product solder mask plug hole section is characterized by comprising the following steps:
the method comprises the following steps: conveying the workpiece into a printing station through a conveying device so as to print a first layer of ink on the workpiece;
step two: conveying the workpiece to a pre-curing station through conveying equipment so as to pre-dry the workpiece until the printing ink does not stick to the workpiece;
step three: feeding the workpiece into the printing station again through the conveying equipment so as to print a second layer of ink on the other side of the workpiece;
step four: conveying the workpiece into a pre-curing station again through conveying equipment so as to pre-dry the workpiece until the printing ink does not stick to the workpiece;
step five: the workpiece is conveyed into the printing station again through the conveying equipment, the workpiece is conveyed for a certain distance, and the dropped ink flows back to the printing station;
step six: the workpiece is fed into a curing oven by a conveying device so that graphite forms a cured layer on the workpiece.
2. The method for curing the solder mask hole segment of the 5G high-frequency product according to claim 1,
before the first step, the workpiece is erected on a bearing vehicle, the bearing vehicle is arranged on a conveying device, and the bearing vehicle is conveyed through the conveying device to convey the workpiece.
3. The method for curing the solder mask hole segment of the 5G high-frequency product according to claim 2,
the interior of the bearing vehicle is provided with a hollow collecting cavity;
collecting ink falling off when the workpiece is printed in the first step and the third step in a collecting cavity;
and collecting the ink dropped during the pre-curing of the workpiece in the second step and the fourth step in a collecting cavity.
4. A5G high-frequency product solder mask via hole segment curing method as claimed in claim 3,
the bottom of the inner side wall of the collecting cavity is connected with a liquid outlet pipe, and the outlet of the liquid outlet pipe is hinged with a cover body;
a storage tank suitable for storing ink is arranged at the bottom of the printing station, and a push rod is arranged on the left side of the printing station and positioned above the storage tank;
in the first step and the third step, the printing ink printed on the workpiece comes from a storage tank;
and in the fifth step, the bearing vehicle is conveyed to the printing station and then is conveyed to the push rod, and the cover body is opened through the push rod, so that the ink in the collecting cavity flows out to the storage tank.
5. The method for curing the solder mask hole segment of the 5G high-frequency product according to claim 4,
in the second step and the fourth step, a light source irradiation device is installed on the pre-curing station, and the workpiece is pre-cured through the light source irradiation device.
6. The method for curing the solder mask hole segment of the 5G high-frequency product according to claim 5,
in the second step and the fourth step, the baking temperature of the light source irradiation device is 70-80 ℃.
7. The method for curing the solder mask hole segment of the 5G high-frequency product according to claim 6,
in the second step and the fourth step, the baking time of the light source irradiation device is 10 minutes to 15 minutes.
8. The method for curing the solder mask hole segment of the 5G high-frequency product according to claim 7,
in the sixth step, the baking time of the curing oven is 1 hour to 2 hours.
9. The method for curing the solder mask hole segment of the 5G high-frequency product according to claim 8,
when the double-sided workpiece is printed, after the step five is completed on one side of the workpiece, the steps one-five are repeated on the other side of the workpiece, and finally the step six is completed.
10. The method for curing the solder mask via hole segment of the 5G high-frequency product according to claim 9,
and turning over the workpiece through the bearing vehicle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110408332.3A CN115214247A (en) | 2021-04-16 | 2021-04-16 | Segmented curing method for solder mask plug hole of 5G high-frequency product |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110408332.3A CN115214247A (en) | 2021-04-16 | 2021-04-16 | Segmented curing method for solder mask plug hole of 5G high-frequency product |
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| CN115214247A true CN115214247A (en) | 2022-10-21 |
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| CN202110408332.3A Pending CN115214247A (en) | 2021-04-16 | 2021-04-16 | Segmented curing method for solder mask plug hole of 5G high-frequency product |
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