CN111988920A - Solder-resisting hole plugging method for BMU printed circuit board - Google Patents
Solder-resisting hole plugging method for BMU printed circuit board Download PDFInfo
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- CN111988920A CN111988920A CN202011159206.0A CN202011159206A CN111988920A CN 111988920 A CN111988920 A CN 111988920A CN 202011159206 A CN202011159206 A CN 202011159206A CN 111988920 A CN111988920 A CN 111988920A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
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- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a solder mask hole plugging method for a BMU printed circuit board, which comprises the following steps: s1, shooting; s2, milling edge round corners; s3, acid etching to reduce copper; s4, grinding a plate; s5, selecting plating to enable the area near the hole position needing the solder resist plug hole to have an annular slope; s6, sequentially carrying out the following steps on the BMU printed circuit board: drilling, copper deposition, plate electroplating, line pretreatment, film pressing, exposure, development, detection, pattern electroplating, alkaline etching and AOI; s7, sequentially carrying out the following steps on the BMU printed circuit board: solder mask hole plugging, printing surface oil, pre-baking, exposure and development. The steps of the invention are reasonable in design, and the hole plugging plumpness is improved, the ink is prevented from rising high, and the yellowing of the via hole is prevented by adding the steps of S3, S4 and S5 and enabling the area near the hole position needing the solder-resisting hole plugging to have an annular slope.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a solder mask hole plugging method for a BMU printed circuit board.
Background
The BMU is an automobile battery board, a plurality of through holes are formed in a BMU printed circuit board, and the through holes are usually required to be subjected to solder mask and plug holes. However, in the production process of the via hole solder resist, the following problems exist:
(1) the aperture of the via hole needing to be subjected to solder mask plug hole is relatively small and is only 0.5mm, but the thickness of the face copper on the BMU printed circuit board is as high as 4OZ (wherein the thickness of 1OZ copper foil is =35 um), the thickness of the BMU printed circuit board is as high as 6.2mm, and the ink has certain tension, so that the plug hole is not full when the via hole is subjected to solder mask plug hole.
(2) When the via hole passing through the solder resist plug hole is pre-baked and exposed, the ink in the via hole can expand due to heating, so that the ink is abnormal in height rising.
(3) Because the number of holes in a partial area is dense, the influence of the specific surface area is large, so that the attack of the developing liquid medicine on the ink in the through holes is large during development, and the developed BMU printed circuit board has yellowing of the through holes.
(4) Because the number of holes in a part of the area is dense, the frequency of hole plugging by solder resist in the area is high, and further serious abnormity of hole plugging marks in the area can be caused.
(5) During post-curing, the ink in the holes of the via holes can expand due to heating, so that the abnormal high ink leakage occurs.
Disclosure of Invention
The invention aims to provide a solder mask plug hole method for a BMU printed circuit board, which aims to solve the technical problem that plug holes are not full when the BMU printed circuit board is subjected to solder mask plug hole in the prior art.
In order to achieve the aim, the technical scheme of the invention provides a solder mask plug hole method for a BMU printed circuit board, which comprises the following steps:
s1, targeting: shooting target holes on the BMU printed circuit board;
s2, milling edge and round corner: milling edges and round corners of the BMU printed circuit board;
s3, acid etching to reduce copper: reducing the thickness of the surface copper on the BMU printed circuit board through acid etching;
s4, grinding a plate: reducing the thickness of the surface copper through abrasion;
s5, selective plating: thickening the surface copper through selective electroplating to enable an annular slope to be formed in a region near a hole position needing a solder resist plug hole;
s6, sequentially carrying out the following steps on the BMU printed circuit board: drilling, copper deposition, plate electroplating, line pretreatment, film pressing, exposure, development, detection, pattern electroplating, alkaline etching and AOI;
s7, sequentially carrying out the following steps on the BMU printed circuit board: solder mask hole plugging, printing surface oil, pre-baking, exposure, development, green inspection, post-baking and inspection;
s8, sequentially carrying out the following steps on the BMU printed circuit board: solder resist printing, prebaking, exposure, development, green inspection and post curing.
Further, in step S3, the surface copper on the BMU pcb is reduced by 10um through acid etching; in step S4, the surface copper is reduced by 2um by abrasion; in step S5, the surface copper is thickened by 12um by selective plating, so that the area near the hole position where the hole is to be plugged has an annular slope.
Further, in step S5, the selective plating includes sequentially performing, on the surface copper:
(1) line pretreatment: removing the oxide layer of the surface copper and roughening the surface copper;
(2) pressing a plating-resistant dry film: pressing a layer of plating-resistant dry film on the surface copper;
(3) exposure: selecting hole sites needing to be plugged with solder resist, and then enlarging the hole sites according to the caliber of a required slope and the corresponding size of the whole hole to obtain negative film plating selection data;
(4) and (3) developing: carrying out development treatment on the surface copper through sodium carbonate solution;
(5) electroplating: electroplating the developed surface copper to increase the thickness according to the thickness of the required selective copper plating layer.
Further, in step S5, the exposure in the selective plating is to enlarge the hole-site-specific hole by 4 mils to obtain negative film selective plating data.
Further, in step S7, the solder resist plug hole includes: carrying out solder mask hole plugging by using hole plugging ink special for the sun; and (3) fully and uniformly stirring the main agent and the curing agent when the oil is mixed with the solder-resisting hole-plugging ink, prohibiting the addition of a diluent, controlling the viscosity of the ink by 180-200 PS, and standing for at least 20 minutes before use.
Further, in step S7, the solder resist plug hole includes: plugging holes by using a hole plugging machine, wherein the glue scraping of the hole plugging machine is 30mm/80 degrees, and the screen tension of a special screen for aluminum sheet hole plugging of the hole plugging machine is controlled within 16N +/-3N; at least scraping 5 blades to back the ink for 4 times for plugging holes; scraping the screen bottom of the special screen printing plate for the aluminum sheet plug hole once after manufacturing 5 BMU printed circuit boards; when plugging the holes, carrying out one-by-one inspection on the BMU printed circuit board; printing surface oil on the BMU printed circuit board after the hole plugging within 30 minutes; and the printing surface oil is used for printing the BMU printed circuit board once by adopting a 75T inclined screen plate.
Further, in step S7, the pre-baking includes: the pre-baking temperature is controlled at 75 ℃, and the pre-baking time is controlled at 30 minutes.
Further, in step S7, the exposing includes: exposing only the hole position needing the solder resist plug hole through the first film; the manufacturing steps of the first film comprise: according to the requirement, the hole diameter of the drilling hole of the solder mask plug hole is increased by a certain size on one side to obtain film data on the front side and the back side, and the holes of the film data on the front side and the back side on the bonding pad are deleted.
Further, in step S7, the step of making the first film in the exposure includes: 3mil is enlarged on one side of the drilling hole diameter of the solder mask plug hole as required to be used as the front and back film data.
Further, in step S8, before solder mask printing is performed on the BMU printed circuit board, solder mask processing is performed.
In summary, the technical scheme of the invention has the following beneficial effects: firstly, the steps of the invention are reasonable in design, and by adding the steps S3, S4 and S5, an annular slope is formed in the area in the vicinity of the hole position needing the solder resist hole, and the slope has the following functions:
(1) the guide hinders the inflow of welding ink, when carrying out the resistance welding consent of step S7, because the existence of slope, the slope can make to hinder the welding ink production direction for the drive power of slant decurrent to reduce and hinder the conflict effect that the tension of welding ink itself produced to the flow-in punishment, thereby will be favorable to hindering the welding ink flow-in punishment, thereby effectively improve the consent saturation.
(2) Avoid printing ink to emit high, because the existence on slope for the relative grow in top space of via hole has, thereby when carrying out the via hole of hindering the welding consent to roast in advance, expose to the sun, the interior printing ink of crossing can upwards extend toward the space on slope after the inflation of being heated, because the space of the relative via hole in space at slope place is great, can hold this part volume that forms after the inflation of being heated of printing ink, thereby can avoid the interior printing ink of crossing to emit high toward the space beyond the outer slope.
(3) Avoid the via hole yellowing, because the existence on slope for there is a buffering angle developing solution impact force direction and pore wall vertical direction, thereby when the hole number ratio is dense region facing partial via hole, even this region developing solution impact force when developing is bigger, because the cushioning effect on slope, thereby make printing ink in the via hole be difficult to be washed by the developing solution to brush, and then prevent the via hole yellowing.
Secondly, aiming at the problem of hole plugging caused by the fact that solder mask hole plugging is frequent in a region with dense hole numbers of partial through holes, the invention scrapes the screen bottom of the special screen printing plate for aluminum sheet hole plugging once after 5 BMU printed circuit boards are manufactured in the process of solder mask hole plugging, thereby preventing the screen bottom of the special screen printing plate for aluminum sheet hole plugging from gathering ink, and preventing the BMU printed circuit boards from generating hole plugging marks after the screen bottom gathers ink.
Thirdly, when the solder resist hole plugging ink is subjected to oil mixing, the main agent and the curing agent are fully and uniformly stirred, the diluent is forbidden to be added, the viscosity of the ink is controlled to be 180-200 PS, and the ink is kept still for at least 20 minutes before use, so that the phenomena of poor hole plugging and high ink overflowing caused by volatilization of the heated diluent when the solder resist ink is subjected to prebaking exposure are avoided.
Fourthly, the pre-baking temperature of S7 is controlled at 75 ℃ and the pre-baking time is controlled at 30 minutes, so that the phenomenon that the ink is too high due to too long pre-baking time is prevented.
Fifthly, in step S8, before solder resist printing is performed on the BMU printed circuit board, solder resist pretreatment is performed, so that the ink rising abnormality after the ink in the via hole expands due to heating can be effectively reduced.
In summary, in terms of quality: the plug hole plumpness is improved, and the abnormity such as plug hole printing and ink overflow is avoided, so that the core competitiveness of the product is improved, and the efficiency is improved: no need of rework, and improved process capability.
Drawings
FIG. 1 is a schematic structural diagram of a BMU printed circuit board with a slope according to the solder resist plug hole method of the invention;
1-BMU printed circuit board, 2-via, 3-selective copper plating, 4-ramp, 5-force vector of developer impact.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, but the technical solutions in the embodiments of the present invention are not limited to the scope of the present invention.
Referring to fig. 1, the present embodiment provides a solder mask via hole method for a BMU printed circuit board 1, including the following steps:
s1, targeting: shooting target holes on the BMU printed circuit board 1; in practical operation, the BMU pcb 1 can be targeted by a targeting machine, and the significance of the targeting is: the BMU printed circuit board 1 is generally laminated by a plurality of laminated plates together, and a target position hole is needed for alignment, so that the alignment precision can meet the production requirement, otherwise, the layers are staggered, so that the open circuit condition is caused, and the reliability is influenced.
S2, milling edge and round corner: milling edges and round corners of the BMU printed circuit board 1; in practical operation, the BMU printed circuit board 1 may be subjected to edge milling and corner milling by an edge milling device such as an edge milling machine.
S3, acid etching to reduce copper: reducing the thickness of surface copper on the BMU printed circuit board 1 through acid etching; in actual operation, the liquid medicine adopted in acid etching can be a mixed liquid of hydrogen peroxide and hydrochloric acid in a ratio of 2:1, and can also be other acid etching liquid medicines, the time of acid etching can be 5 minutes, and certainly can be other times, and the selection can be performed automatically according to the thickness of the face copper to be reduced by actual needs of a user.
S4, grinding a plate: reducing the thickness of the facing copper through abrasion; in actual operation, the plate grinding operation can be performed on the surface copper through the plate grinding machine, certain abrasion and thickness reduction can be generated on the surface copper in the plate grinding operation process, and specifically the thickness reduction amount can be selected according to needs.
S5, selective plating: thickening the surface copper through selective electroplating to enable an annular slope 4 to be arranged in a region near a hole position needing a solder resist plug hole; in practical operation, the specific implementation mode of selective plating comprises the following steps of sequentially carrying out the following steps on facing copper:
(1) line pretreatment: removing the oxide layer of the surface copper and roughening the surface copper;
(2) pressing a plating-resistant dry film: pressing a layer of plating-resistant dry film on the surface copper;
(3) exposure: selecting hole sites needing to be plugged with solder resist, and then enlarging the hole sites according to the caliber of the needed slope 4 and the corresponding size of the whole hole to obtain negative film plating selection data;
(4) developing; immersing the BMU printed circuit board 1 processed in the step (3) into a sodium carbonate solution, and further carrying out development treatment on the surface copper; the concentration of the sodium carbonate solution can be 4%. Of course, this is only one embodiment, and other embodiments are also possible.
(5) Electroplating: and electroplating the developed surface copper to increase the thickness according to the thickness of the required selective copper plating layer 3. It should be noted that, because the anti-plating dry film is covered, when the surface copper is thickened and the selective copper plating layer 3 is plated upwards, the selective copper plating layer 3 plated first at the bottom tends to gather towards the hole position due to the pressure transmitted from the selective copper plating layer 3 at the top, so that an annular slope is formed after the plating is finished.
S6, sequentially carrying out the following steps on the BMU printed circuit board 1: drilling, copper deposition, plate electroplating, line pretreatment, film pressing, exposure, development, detection, pattern electroplating, alkaline etching and AOI; the lamination in step S6 is preferably a resist dry film. The drilling, copper deposition, board electroplating, line pretreatment, film pressing, exposure, development, inspection, pattern electroplating, alkaline etching and AOI of step S6 are common processes in the art and are not described herein.
S7, sequentially carrying out the following steps on the BMU printed circuit board 1: solder mask hole plugging, printing surface oil, pre-baking, exposure, development, green inspection, post-baking and inspection; preferably, at the time of development in step S7, the development point is regulated to 60%, and parameters such as the developer solution concentration, PH, linear speed, and the like are checked before development. Green check in step S7: the appearance abnormality such as whether the plug holes are full and the plug hole marks are serious is mainly seen. Post-baking in step S7: and continuously baking the BMU printed circuit board 1 by adopting five sections of parameters aiming at the plug holes. From the low temperature section to the high temperature section, specifically, the curing temperature of 50 ℃ can be maintained for 90 minutes in the first section, the curing temperature of 70 ℃ can be maintained for 60 minutes in the second section, the curing temperature of 90 ℃ can be maintained for 30 minutes in the third section, the curing temperature of 120 ℃ can be maintained for 30 minutes in the fourth section, and the curing temperature of 150 ℃ can be maintained for 50 minutes in the fifth section. Of course, other temperatures or times are also possible and may be selected. Checking in step S7: the post-baked board needs to be inspected completely, and the quality is guaranteed to be qualified.
S8, sequentially carrying out the following steps on the BMU printed circuit board 1: solder resist printing, prebaking, exposure, development, green inspection and post curing. Preferably, in step S8, before solder mask printing, the BMU printed circuit board 1 is subjected to a solder mask pre-treatment, where the solder mask pre-treatment refers to: and removing the oxide layer of the surface copper and roughening the surface copper. Therefore, the abnormal phenomenon that the ink in the hole of the through hole 2 rises after being heated and expanded is effectively reduced during post-curing. After completion of S8, the next process may be performed.
Preferably, in step S3, the surface copper on the BMU printed circuit board 1 is reduced by 10um by acid etching; in step S4, the facing copper is reduced in thickness by 2um by abrasion; in step S5, the surface copper is thickened by 12um by selective plating so that the area near the hole site where the solder resist hole is to be plugged has a ring-shaped slope 4. And the reason why selective plating reduces copper by 2um more than acid etching is 2um to compensate for wear. Theoretically, the hole opening after selective plating is 12um lower than the copper surface.
Specifically, in step S5, the exposure during the selective plating is to enlarge the hole positions by 4 mils to obtain the negative film selective plating film data. The target position captured by the alignment exposure can be a T hole which is formed by target shooting and used for PIN on a machine drill.
The part has the beneficial effects that: (1) the guide hinders the inflow of welding ink, when carrying out the resistance welding consent of step S7, because the existence of slope 4, slope 4 can make to hinder the welding ink production direction for the drive power of slant decurrent to reduce and hinder the conflict effect that the tension of welding ink itself produced in to flowing into via hole 2, thereby will be favorable to hindering in welding ink flows into via hole 2, thereby effectively improve the consent saturation. The saturation reaches 85% when the copper plating layer 3 is selected to be 12 um. And the acid etching copper reduction process and the plate grinding process are carried out after the edge and the fillet are milled, so that the integral thickening of the surface copper by selective plating in the subsequent process is prevented. (2) Avoid printing ink to emit high, because the existence of slope 4, make the relative grow in the top space of via hole 2, thereby in the via hole 2 to having carried out hindering the welding consent and toasting in advance, when exposing to the sun, printing ink in the via hole 2 can upwards extend toward the space of slope 4 after the inflation of being heated, because the space of the relative via hole 2 at the space at slope 4 place is great, can hold this part volume that forms after the inflation of being heated of printing ink, thereby can avoid printing ink in the via hole 2 to emit high toward the space beyond the slope 4. (3) Avoid the via hole to yellow, because the existence of slope 4 for there is a buffering angle developer solution impact force direction and pore wall vertical direction, thereby when the hole number ratio is dense region facing partial via hole 2, even this region developer solution impact force ratio when developing is bigger, because the cushioning effect of slope 4, thereby make the printing ink in the via hole 2 be difficult to be washed by the developer solution to brush, and then prevent that the via hole from yellow. Namely as shown in fig. 1: an angle formed between a force vector 5 of the solder resist developing solution impact and the orifice slope 4 is a buffering angle, so that the force acting on the hole wall is F (1-COS) consumed by the hole wall slope 4, and the ink in the hole is solidified in the hole wall and is not easy to be washed away. Therefore, in terms of quality: the filling degree of the plug holes is as high as 85%, and the defects of high ink emission, yellowing of through holes and the like are avoided, so that the core competitiveness of the product is improved. In terms of efficiency: no need of rework, and improved process capability.
Specifically, in step S7, the solder resist plug hole includes: carrying out solder mask hole plugging by using hole plugging ink special for the sun; and (3) fully and uniformly stirring the main agent and the curing agent when the oil is mixed with the solder-resisting hole-plugging ink, prohibiting the addition of a diluent, controlling the viscosity of the ink by 180-200 PS, and standing for at least 20 minutes before use.
The part has the beneficial effects that: according to the invention, when the oil is mixed in the solder-resisting hole plugging ink, the main agent and the curing agent are fully and uniformly stirred, the diluent is forbidden to be added, the viscosity of the ink is controlled to be 180-200 PS, and the ink is kept still for at least 20 minutes before use, so that the phenomena of poor hole plugging and ink rising caused by volatilization of the heated diluent in the process of pre-baking exposure of the solder-resisting ink are prevented.
Specifically, in step S7, the solder resist plug hole includes: plugging holes by using a hole plugging machine, wherein the glue scraping of the hole plugging machine is 30mm/80 degrees, and the screen tension of a special screen for aluminum sheet hole plugging of the hole plugging machine is controlled within 16N +/-3N; at least scraping 5 blades to back the ink for 4 times for plugging holes; scraping the screen bottom of a screen plate special for aluminum sheet hole plugging once after manufacturing 5 BMU printed circuit boards 1; when plugging holes, the BMU printed circuit board 1 is inspected one by one to ensure that the fullness of the plugged holes reaches 85 percent; printing surface oil on the BMU printed circuit board 1 after the hole plugging within 30 minutes; the printing surface oil is used for printing the BMU printed circuit board 1 once by adopting a 75T inclined screen printing plate. In practice, a plughole backing plate is also used.
The part has the beneficial effects that: aiming at the problem of hole plugging caused by the fact that solder mask hole plugging is frequent in a region with dense hole numbers of partial through holes 2, the invention scrapes the screen bottom of the special screen printing plate for aluminum sheet hole plugging once after 5 BMU printed circuit boards 1 are manufactured in the process of solder mask hole plugging, thereby preventing the screen bottom of the special screen printing plate for aluminum sheet hole plugging from gathering ink, and preventing the BMU printed circuit boards 1 from generating hole plugging marks after the screen bottom gathers ink.
Specifically, in step S7, the pre-baking includes: the pre-baking temperature is controlled to be 75 ℃, and the pre-baking time is controlled to be 30 minutes, so that the phenomenon that the ink is too high due to overlong pre-baking time is avoided.
Specifically, in step S7, the exposure includes: exposing only the hole position needing the solder resist plug hole through the first film; the first film manufacturing step comprises: according to the requirement, the hole diameter of the drilling hole of the solder mask plug hole is increased by a certain size to obtain the front and back film data, and the holes on the bonding pad, in which the front and back film data are located, are deleted. Wherein the energy of the exposure is selected according to the requirement.
Specifically, in step S7, the step of producing the first film in exposure includes: 3mil is enlarged on one side of the drilling hole diameter of the solder mask plug hole as required to be used as the front and back film data.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.
Claims (10)
1. A solder mask hole plugging method for a BMU printed circuit board is characterized by comprising the following steps: the method comprises the following steps:
s1, targeting: shooting target holes on the BMU printed circuit board;
s2, milling edge and round corner: milling edges and round corners of the BMU printed circuit board;
s3, acid etching to reduce copper: reducing the thickness of the surface copper on the BMU printed circuit board through acid etching;
s4, grinding a plate: reducing the thickness of the surface copper through abrasion;
s5, selective plating: thickening the surface copper through selective electroplating to enable an annular slope to be formed in a region near a hole position needing a solder resist plug hole;
s6, sequentially carrying out the following steps on the BMU printed circuit board: drilling, copper deposition, plate electroplating, line pretreatment, film pressing, exposure, development, detection, pattern electroplating, alkaline etching and AOI;
s7, sequentially carrying out the following steps on the BMU printed circuit board: solder mask hole plugging, printing surface oil, pre-baking, exposure, development, green inspection, post-baking and inspection;
s8, sequentially carrying out the following steps on the BMU printed circuit board: solder resist printing, prebaking, exposure, development, green inspection and post curing.
2. The solder mask via hole method of the BMU printed circuit board as claimed in claim 1, wherein: in step S3, the surface copper on the BMU printed circuit board is reduced by 10um by acid etching; in step S4, the surface copper is reduced by 2um by abrasion; in step S5, the surface copper is thickened by 12um by selective plating, so that the area near the hole position where the hole is to be plugged has an annular slope.
3. The BMU printed circuit board solder mask hole plugging method according to claim 1 or 2, wherein: in step S5, the selective plating includes sequentially performing, on the surface copper:
(1) line pretreatment: removing the oxide layer of the surface copper and roughening the surface copper;
(2) pressing a plating-resistant dry film: pressing a layer of plating-resistant dry film on the surface copper;
(3) exposure: selecting hole sites needing to be plugged with solder resist, and then enlarging the hole sites according to the caliber of a required slope and the corresponding size of the whole hole to obtain negative film plating selection data;
(4) and (3) developing: carrying out development treatment on the surface copper through sodium carbonate solution;
(5) electroplating: electroplating the developed surface copper to increase the thickness according to the thickness of the required selective copper plating layer.
4. The solder mask via hole method of the BMU printed circuit board as claimed in claim 3, wherein: in step S5, the exposure in the selective plating is to enlarge the hole position by 4 mils to obtain the negative film selective plating film data.
5. The BMU printed circuit board solder mask hole plugging method according to any one of claims 1, 2 and 4, wherein: in step S7, the solder resist plug hole includes: carrying out solder mask hole plugging by using hole plugging ink special for the sun; and (3) fully and uniformly stirring the main agent and the curing agent when the oil is mixed with the solder-resisting hole-plugging ink, prohibiting the addition of a diluent, controlling the viscosity of the ink by 180-200 PS, and standing for at least 20 minutes before use.
6. The BMU printed circuit board solder mask hole plugging method according to any one of claims 1, 2 and 4, wherein: in step S7, the solder resist plug hole includes: plugging holes by using a hole plugging machine, wherein the glue scraping of the hole plugging machine is 30mm/80 degrees, and the screen tension of a special screen for aluminum sheet hole plugging of the hole plugging machine is controlled within 16N +/-3N; at least scraping 5 blades to back the ink for 4 times for plugging holes; scraping the screen bottom of the special screen printing plate for the aluminum sheet plug hole once after manufacturing 5 BMU printed circuit boards; when plugging the holes, carrying out one-by-one inspection on the BMU printed circuit board; printing surface oil on the BMU printed circuit board after the hole plugging within 30 minutes; and the printing surface oil is used for printing the BMU printed circuit board once by adopting a 75T inclined screen plate.
7. The BMU printed circuit board solder mask hole plugging method according to any one of claims 1, 2 and 4, wherein: in step S7, the pre-baking includes: the pre-baking temperature is controlled at 75 ℃, and the pre-baking time is controlled at 30 minutes.
8. The BMU printed circuit board solder mask hole plugging method according to any one of claims 1, 2 and 4, wherein: in step S7, the exposing includes: exposing only the hole position needing the solder resist plug hole through the first film; the manufacturing steps of the first film comprise: according to the requirement, the hole diameter of the drilling hole of the solder mask plug hole is increased by a certain size on one side to obtain film data on the front side and the back side, and the holes of the film data on the front side and the back side on the bonding pad are deleted.
9. The solder mask via hole method of the BMU printed circuit board as claimed in claim 8, wherein: in step S7, the step of producing the first film in the exposure includes: 3mil is enlarged on one side of the drilling hole diameter of the solder mask plug hole as required to be used as the front and back film data.
10. The BMU printed circuit board solder mask hole plugging method according to any one of claims 1, 2, 4 and 9, wherein: in step S8, a solder mask pre-process is performed before solder mask printing is performed on the BMU printed circuit board.
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| CN202011159206.0A CN111988920B (en) | 2020-10-27 | 2020-10-27 | Solder-resisting hole plugging method for BMU printed circuit board |
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| CN202011159206.0A CN111988920B (en) | 2020-10-27 | 2020-10-27 | Solder-resisting hole plugging method for BMU printed circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113597098A (en) * | 2021-06-02 | 2021-11-02 | 深圳市辉煌线路板有限公司 | Method for improving solder resist bleeding of back drilling hole of printed circuit board |
| CN115214247A (en) * | 2021-04-16 | 2022-10-21 | 江苏协和电子股份有限公司 | Segmented curing method for solder mask plug hole of 5G high-frequency product |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2003046226A (en) * | 2001-07-30 | 2003-02-14 | Kyocera Corp | Wiring board and its manufacturing method |
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| CN110769609A (en) * | 2019-11-27 | 2020-02-07 | 珠海元盛电子科技股份有限公司 | Photosensitive film hole plugging plate and PCB resin hole plugging method |
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| JP2003046226A (en) * | 2001-07-30 | 2003-02-14 | Kyocera Corp | Wiring board and its manufacturing method |
| CN103429008A (en) * | 2012-05-25 | 2013-12-04 | 镇江华扬信息科技有限公司 | Manufacture method of printed circuit board with via on pad |
| CN106341950A (en) * | 2016-09-29 | 2017-01-18 | 深圳市迅捷兴科技股份有限公司 | Circuit board manufacturing method adopting resin plugging |
| CN110769609A (en) * | 2019-11-27 | 2020-02-07 | 珠海元盛电子科技股份有限公司 | Photosensitive film hole plugging plate and PCB resin hole plugging method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115214247A (en) * | 2021-04-16 | 2022-10-21 | 江苏协和电子股份有限公司 | Segmented curing method for solder mask plug hole of 5G high-frequency product |
| CN113597098A (en) * | 2021-06-02 | 2021-11-02 | 深圳市辉煌线路板有限公司 | Method for improving solder resist bleeding of back drilling hole of printed circuit board |
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| CN111988920B (en) | 2021-01-01 |
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