CN111385979A - Method for improving solder mask oil leakage of PCB - Google Patents
Method for improving solder mask oil leakage of PCB Download PDFInfo
- Publication number
- CN111385979A CN111385979A CN201811630018.4A CN201811630018A CN111385979A CN 111385979 A CN111385979 A CN 111385979A CN 201811630018 A CN201811630018 A CN 201811630018A CN 111385979 A CN111385979 A CN 111385979A
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- China
- Prior art keywords
- oil
- pcb
- exposure
- plugging
- solder mask
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 23
- 230000000740 bleeding effect Effects 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 6
- 230000001680 brushing effect Effects 0.000 claims description 9
- 239000003085 diluting agent Substances 0.000 claims description 6
- 235000013312 flour Nutrition 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000001029 thermal curing Methods 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- 208000032843 Hemorrhage Diseases 0.000 description 10
- 230000018109 developmental process Effects 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 3
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 2
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 208000002085 hemarthrosis Diseases 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to a method for improving solder mask bleeding of a PCB (printed circuit board), which comprises the steps of preparing ink, processing the PCB, plugging holes, printing oil, pre-baking, manufacturing a film, aligning, exposing and thermosetting.
Description
Technical Field
The invention relates to the field of PCB production, in particular to a method for improving solder mask oil bleeding of a PCB.
Background
In the existing production process of the circuit board, aiming at the PCB which needs to perform solder mask protection and hole plugging treatment on a via hole, a plurality of special structures such as the condition that a copper surface of a solder mask layer has a single-sided window are manufactured according to a normal process flow, and after contraposition development, the abnormal phenomenon of solder mask oil bleeding easily occurs, so that the appearance is influenced.
At present, the requirement of the PCB industry on the appearance of a circuit board is more and more strict, a control method is needed to reduce bad scrap and customer complaints under the bad condition that oil bleeding is easily generated due to the particularity of single-sided windowing, and the control method for welding-proof single-sided windowing oil bleeding in the industry at present is generally divided into two types: one is to reduce the fluidity of the ink by purchasing a special plug oil to avoid oil overflow; secondly, the following steps: the pre-baking parameters are improved, the post-baking segmentation time is adjusted to reduce oil leakage, the control of raw materials for process control by adopting the two methods improves the oil leakage after the in-situ development, but the control is still not ideal, the oil leakage is easy to occur, even the oil leakage is repeated, the preparation of the special hole plugging oil is slow, and manpower and material resources are wasted.
Disclosure of Invention
The technical problem to be solved by the embodiment of the invention is as follows: the method for improving the solder mask oil leakage of the PCB can ensure that the finished PCB keeps good weldability, does not generate oil leakage and improves the smoothness of the appearance of the PCB.
The technical problem to be further solved by the embodiments of the present invention is to provide a method for improving solder bleeding resistance of a PCB, which can keep good solderability of a PCB finished product and reduce abnormal phenomena of solder bleeding resistance.
In order to achieve the purpose, the invention adopts the following technical scheme: a method for improving solder mask oil bleeding of a PCB comprises the following steps:
preparing ink, namely adding 5-8ml of hole plugging diluent into 1kg of hole plugging oil and uniformly stirring; adding 20-45ml of flour oil diluent into 1kg of flour oil, and stirring uniformly.
Processing a PCB, and passing the PCB through a grinding and brushing machine before printing solder resist;
plugging holes and printing oil, wherein the plugging oil is subjected to plugging operation from the corresponding surface of the single-sided windowing, the plugging and printing oil processes are carried out simultaneously, and the interval cannot exceed 10 minutes.
And pre-baking, namely pre-baking the PCB.
And (3) manufacturing a film, namely, in the CAM manufacturing process, digging a hole on the single-sided windowing surface of the solder mask film, wherein the hole is larger than the single-sided edge of the via hole, and adding an oil ring.
And (4) alignment exposure, wherein a CCT automatic exposure machine is used for alignment, the front and back exposure scales of the single-sided windowing are the same, and the ultraviolet irradiation plate surface is used for exposure.
Developing the plate, namely washing the plate surface to remove the surface oil provided with the shading area during exposure;
the thermosetting is baked by oven heating at three temperature and time settings.
Furthermore, parameters of the grinding and brushing machine used for processing the PCB are that the current of the upper line brushing plate is 2.2A, the speed is 2.5m/min, the current of the lower line brushing plate is 3.4A, and the speed is 2.5 m/min.
Further, the baking temperature of the prebaking is 73 ℃, and the time is 55 min.
Furthermore, the green oil ring added in the manufacture of the film is 2 mil.
Furthermore, the para-position exposure and the face oil exposure energy are set to be 500mj/C square meter, the hole plugging oil exposure energy is 1000 mj/C square meter, and the exposure square is 13 grids.
Further, the punching plate is used for developing, wherein the upper pressure of the developing is 2.6Kg/C square meter, and the lower pressure of the developing is 1.1 Kg/C square meter.
Further, the three temperature and time periods of the thermal curing are respectively as follows: a first stage: 75 ℃ for 55 minutes; and (2) second stage: 110 ℃ for 50 minutes; and (3) three stages: at 150 deg.C for 40 min, the surface oil and the pore-plugging oil were completely hardened.
The invention has the beneficial effects that: in the improvement method, the ink preparation step is to mix the proper ink according to the proportion, so that special ink is not purchased, and the cost is reduced; 2mil green oil rings are additionally arranged in the film manufacturing step, so that oil leakage during welding can be better prevented, and the cleanliness of the PCB is improved; the exposure energy of the alignment exposure control surface oil, the hole filling oil exposure energy and the exposure ruler are matched with the manufactured printing ink, so that the exposure effect is better achieved; the thermosetting is baked by setting three sections of temperature and time, so that the surface oil and the plug hole oil can be completely hardened, and the phenomenon of oil bleeding is reduced.
Drawings
The figures further illustrate the invention, but the examples in the figures do not constitute any limitation of the invention.
FIG. 1 is a flow chart of the method for improving solder mask and oil bleeding of PCB board according to the present invention.
Detailed Description
It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict, and the present invention is further described in detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, an embodiment of the present invention provides a method for improving solder joint bleeding of a PCB, including the following steps:
preparing ink, namely adding 5-8ml of hole plugging diluent into 1kg of hole plugging oil and uniformly stirring; adding 20-45ml of flour oil diluent into 1kg of flour oil, and stirring uniformly.
Processing the PCB 1, passing the PCB 1 through a grinding and brushing machine before printing solder resist, and controlling the current of the upper line brush plate to be 2.2A and the speed to be 2.5m/min, the current of the lower line brush plate to be 3.4A and the speed to be 2.5 m/min.
And plugging holes and printing oil, wherein the plugging oil is subjected to plugging operation from the corresponding surface of the single-sided windowing, and during specific implementation, the plugging and printing oil processes are carried out simultaneously, and the interval cannot exceed 10 minutes.
Pre-baking, namely pre-baking the PCB at 73 ℃ for the following time: and (5) 55 min.
And (3) manufacturing a film, wherein in the CAM manufacturing process, a 2mil green oil ring 3 is additionally arranged on the single-side windowing surface of the solder mask film, which is larger than the single-side edge of the via hole, and the amount and the range of the green oil ring can be increased in the specific implementation.
And (3) contraposition exposure, namely contraposition is carried out by using a CCT automatic exposure machine, the single-side windowing front side and the back side exposure ruler are the same, exposure is carried out on the ultraviolet irradiation plate surface, the surface oil exposure energy is set to be 500mj/C square meter, the hole plugging oil exposure energy is 1000 mj/C square meter, and the exposure ruler is 13 grids.
And (3) plate punching development, namely, plate punching development is carried out on the plate, the face oil provided with a shading area during exposure is washed away, and the upper pressure of development is 2.6Kg/C square meter, and the lower pressure is 1.1 Kg/C square meter.
The thermosetting is baked by setting the temperature and time in three sections by heating in an oven, one section is: 75 ℃ for 55 minutes; and (2) second stage: 110 ℃ for 50 minutes; and (3) three stages: at 150 deg.C for 40 min, the surface oil and the pore-plugging oil were completely hardened.
In the improvement method, the ink preparation step is to mix the proper ink according to the proportion, so that special ink is not purchased, and the cost is reduced; the green oil ring is added in the film manufacturing step, so that oil leakage during welding can be better prevented, and the cleanliness of the PCB is increased; the exposure energy of the alignment exposure control surface oil, the hole filling oil exposure energy and the exposure ruler are matched with the manufactured printing ink, so that the exposure effect is better achieved; the thermosetting is baked by setting three sections of temperature and time, so that the surface oil and the plug hole oil can be completely hardened, and the phenomenon of oil bleeding is reduced.
While the foregoing is directed to embodiments of the present invention, it will be appreciated by those skilled in the art that various changes may be made in the embodiments without departing from the principles of the invention, and that such changes and modifications are intended to be included within the scope of the invention.
Claims (7)
1. A method for improving solder mask oil bleeding of a PCB is characterized by comprising the following steps:
preparing ink, namely adding 5-8ml of hole plugging diluent into 1kg of hole plugging oil and uniformly stirring; adding 20-45ml of flour oil diluent into 1kg of flour oil, and uniformly stirring;
processing a PCB, and passing the PCB through a grinding and brushing machine before printing solder resist;
plugging and printing oil, namely performing plugging operation on the plugging oil from the corresponding surface of the single-sided windowing, wherein the plugging and printing oil processes are performed simultaneously, and the interval cannot exceed 10 minutes;
pre-baking, namely pre-baking the PCB;
during CAM manufacturing, a green oil ring is additionally arranged on the single-side windowing surface of the solder mask film, which is larger than the single-side edge of the via hole;
aligning exposure, aligning by using a CCT automatic exposure machine, wherein a single-side window is opened, the front and back exposure scales are the same, and ultraviolet rays irradiate the plate surface for exposure;
developing the plate, namely washing the plate surface to remove the surface oil provided with the shading area during exposure;
the thermosetting is baked by oven heating at three temperature and time settings.
2. The method for improving solder mask oil bleeding of the PCB as claimed in claim 1, wherein: the parameters of the grinding and brushing machine for processing the PCB are that the current of the upper line brushing plate is 2.2A, the speed is 2.5m/min, the current of the lower line brushing plate is 3.4A, and the speed is 2.5 m/min.
3. The method for improving solder mask oil bleeding of the PCB as claimed in claim 1, wherein: the baking temperature of the pre-baking is 73 ℃, and the time is 55 min.
4. The method for improving solder mask oil bleeding of the PCB as claimed in claim 1, wherein: the added green oil ring is 2mil in the manufacturing of the film.
5. The method of claim 1, further comprising: the alignment exposure is carried out, the exposure energy of the face oil is set to be 500mj/C square meter, the exposure energy of the hole plugging oil is 1000 mj/C square meter, and the exposure square is 13 grids.
6. The method of claim 1, further comprising: the punching plate is used for developing, wherein the developing upper pressure is 2.6Kg/C square meter, and the developing lower pressure is 1.1 Kg/C square meter.
7. The method of claim 1, further comprising: the three stages of temperature and time of the thermal curing are respectively as follows: a first stage: 75 ℃ for 55 minutes; and (2) second stage: 110 ℃ for 50 minutes; and (3) three stages: at 150 deg.C for 40 min, the surface oil and the pore-plugging oil were completely hardened.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811630018.4A CN111385979A (en) | 2018-12-28 | 2018-12-28 | Method for improving solder mask oil leakage of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811630018.4A CN111385979A (en) | 2018-12-28 | 2018-12-28 | Method for improving solder mask oil leakage of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111385979A true CN111385979A (en) | 2020-07-07 |
Family
ID=71218170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811630018.4A Pending CN111385979A (en) | 2018-12-28 | 2018-12-28 | Method for improving solder mask oil leakage of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111385979A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770525A (en) * | 2020-12-18 | 2021-05-07 | 珠海杰赛科技有限公司 | Manufacturing method of printed circuit board |
| CN113597098A (en) * | 2021-06-02 | 2021-11-02 | 深圳市辉煌线路板有限公司 | Method for improving solder resist bleeding of back drilling hole of printed circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102802357A (en) * | 2012-08-10 | 2012-11-28 | 东莞市五株电子科技有限公司 | Method for preventing solder mask of singleside-windowed PCB (Printed Circuit Board) from oil leakage |
| CN103079362A (en) * | 2012-12-25 | 2013-05-01 | 深圳市星河电路有限公司 | Method for preventing oil from bleeding from solder resist ink plug hole |
| CN107046774A (en) * | 2017-03-07 | 2017-08-15 | 惠州中京电子科技有限公司 | A kind of method of the anti-welding bleeds of improvement PCB |
| CN107683023A (en) * | 2017-09-19 | 2018-02-09 | 珠海精毅电路有限公司 | The method of aperture bleed when preventing high-temperature baking after printed substrate via hole consent |
-
2018
- 2018-12-28 CN CN201811630018.4A patent/CN111385979A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102802357A (en) * | 2012-08-10 | 2012-11-28 | 东莞市五株电子科技有限公司 | Method for preventing solder mask of singleside-windowed PCB (Printed Circuit Board) from oil leakage |
| CN103079362A (en) * | 2012-12-25 | 2013-05-01 | 深圳市星河电路有限公司 | Method for preventing oil from bleeding from solder resist ink plug hole |
| CN107046774A (en) * | 2017-03-07 | 2017-08-15 | 惠州中京电子科技有限公司 | A kind of method of the anti-welding bleeds of improvement PCB |
| CN107683023A (en) * | 2017-09-19 | 2018-02-09 | 珠海精毅电路有限公司 | The method of aperture bleed when preventing high-temperature baking after printed substrate via hole consent |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770525A (en) * | 2020-12-18 | 2021-05-07 | 珠海杰赛科技有限公司 | Manufacturing method of printed circuit board |
| CN113597098A (en) * | 2021-06-02 | 2021-11-02 | 深圳市辉煌线路板有限公司 | Method for improving solder resist bleeding of back drilling hole of printed circuit board |
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Application publication date: 20200707 |