CN106132111A - A kind of manufacture method of the wiring board with different solder mask colors - Google Patents
A kind of manufacture method of the wiring board with different solder mask colors Download PDFInfo
- Publication number
- CN106132111A CN106132111A CN201610594882.8A CN201610594882A CN106132111A CN 106132111 A CN106132111 A CN 106132111A CN 201610594882 A CN201610594882 A CN 201610594882A CN 106132111 A CN106132111 A CN 106132111A
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- China
- Prior art keywords
- manufacture method
- treatment
- welding resistance
- development
- wiring board
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Methods (AREA)
Abstract
The invention belongs to wiring board manufacture field, being specifically related to the manufacture method of a kind of wiring board with different solder mask colors, the sequence of steps of described method is as follows: standing process after consent process before welding resistance pre-treatment, welding resistance, double-surface screen printing process, silk-screen, pre-baked process, exposure-processed, development treatment, rear roasting process.Described method shortens the production cycle of the wiring board of multiple solder mask colors, reduce twice welding resistance production cost, it is to avoid second time pre-treatment nog plate produces plate face green oil and wipes flower, improves production quality, has great market prospect and economic worth.
Description
Technical field
The invention belongs to wiring board manufacture field, be specifically related to the making side of a kind of wiring board with different solder mask colors
Method.
Background technology
In prior art, the solder mask on the surface of wiring board generally is a kind of color.Along with market demands
Improve constantly, from outward appearance and process requirements, need to develop new product, make and there are two kinds of solder mask colors.Because of circuit two sides welding resistance
Ink is inconsistent and the characteristic of ink itself, and existing procedure is always to there will be welding resistance development excessively or development carrying out welding resistance silk-screen
The quality problem such as the cleanest.
Existing procedure mostly is: one green oil of a dirty oil, and welding resistance produces the side using twice welding resistance flow process, i.e. one side to make
Formula produces.But the method production cycle is long, production procedure is: welding resistance pre-treatment → silk-screen first (green oil) → evacuation → pre-
Before roasting → exposure imaging → rear roasting → welding resistance pre-treatment (mill one side) → welding resistance after second (dirty oil) → silk-screen of consent → silk-screen
Stand → pre-baked → exposure → development → rear roasting → lower operation.But because pcb board is through the most pre-baked and first time exposure imaging
After, plate face copper face can turn to be yellow, and therefore when carrying out second time silk-screen dirty oil, needs through a welding resistance pre-treatment, production cycle
Long；Twice pre-treatment, pre-baked, expose, develop and after bake, production cost is high；The nog plate process that welding resistance processes for the second time is easily produced
Flower wiped by raw plate face green oil, and impact produces quality.
Summary of the invention
To this end, the technical problem to be solved is to overcome the technical bottleneck of prior art, thus one is proposed
Improve the production efficiency of welding resistance, the method reducing cost.
For solving above-mentioned technical problem, the invention discloses the making side of a kind of wiring board with different solder mask colors
Method, the sequence of steps of described method is as follows:
After consent process before welding resistance pre-treatment, welding resistance, double-surface screen printing process, silk-screen at standing process, pre-baked process, exposure
Reason, development treatment, rear roasting process.
Preferably, the nog plate speed of described welding resistance pre-treatment is 3.4m/min.
Preferably, during described double-surface screen printing processes, silk-screen mesh number is 36T or 39T.
Preferably, during described double-surface screen printing processes, the viscosity of used ink is 100-120dpa.s, the thickness of wet film
For 40-45 μm.
Preferably, needing to carry out standing process after described silk-screen, time of repose is 1-2h.
Preferably, in described pre-baked process, 48min need to be toasted with vertical oven, or toast 50min by tunnel oven.
Preferably, in described exposure-processed, the energy progression of used green oil exposure is 9-11 lattice, dirty oil exposure energy
Range number is 11-12 lattice.
Preferably, in described development treatment, development cylinder two-way pressure is 0.8-1.2kg/cm2, speed is 5.0m/min.
Preferably, in described development treatment, green oil faces up, the ventricumbent mode of dirty oil is developed in employing, closes last
The downforce of one section of development cylinder, developing time is 46s.
Being more highly preferred to, in described development treatment, used development cylinder is 4, each development cylinder body length 1 meter.
The technique scheme of the present invention has the advantage that described method shortens multiple welding resistance face compared to existing technology
The production cycle of the wiring board of color；Reduce by twice welding resistance production cost；Avoid second time pre-treatment nog plate to produce plate face green oil to wipe
Flower, promotes and produces quality；There is great market prospect and economic worth.
Detailed description of the invention
Embodiment 1 present embodiment discloses the manufacture method of a kind of wiring board with different solder mask colors, described method
Step as follows:
S1: welding resistance pre-treatment: during Gai, need to carry out nog plate to wiring board, and the speed of nog plate is 3.4m/min；
S2: before wiring board carries out welding resistance, consent processes；
S3: silk-screen two sides processes: wherein silk-screen mesh number 36T or 39T, ink viscosity 100-120dpa.s, wet-film thickness
For 40-45 μm；
S4: after silk-screen, standing processes: the time of standing is 1-2h；
S5: pre-baked process: use vertical oven bakes the temperature that 48min or use tunnel oven are at 75 DEG C at a temperature of 75 DEG C
The lower roasting 50min of degree；
S6: exposure-processed: in described exposure-processed, green oil exposure energy progression is 9-11 lattice, dirty oil exposure energy progression
For 11-12 lattice (in exposure-processed, making to confirm exposure energy with light copper coin)；
S7: development treatment: development cylinder two-way pressure is 1.0+/-0.2kg/cm2(by 1.0kg/cm2Control), the speed of development
For 5.0m/min, (developing line has 4 sections of development cylinders, each development cylinder body length 1 meter to degree, and the total length that development cylinder+new liquid washes length is
4.8m), development that green oil faces up, dirty oil faces down, (being simply turned off downforce, upper positive pressure is normally opened to close final stage development cylinder
Open), developing time is 46s；
S8: rear roasting process.
Effect: described method uses needle-bar technology two sides welding resistance silk-screen simultaneously, aobvious by closing one section of dirty oil face during development
Shadow pressure, reduces dirty oil developing time, and green oil face photographic parameter is constant, thus solves two kinds of ink when developing simultaneously, dirty oil
Development is excessively or the clean problem of green oil development.
Obviously, above-described embodiment is only for clearly demonstrating example, and not restriction to embodiment.Right
For those of ordinary skill in the field, can also make on the basis of the above description other multi-form change or
Variation.Here without also cannot all of embodiment be given exhaustive.And the obvious change thus extended out or
Change among still in the protection domain of the invention.
Claims (10)
1. the manufacture method of a wiring board with different solder mask colors, it is characterised in that the sequence of steps of described method is such as
Under:
Before welding resistance pre-treatment, welding resistance, consent processes, double-surface screen printing processes, standing process after silk-screen, pre-baked process, exposure-processed,
Development treatment, rear roasting process.
2. manufacture method as claimed in claim 1, it is characterised in that the nog plate speed of described welding resistance pre-treatment is 3.4m/
min。
3. manufacture method as claimed in claim 2, it is characterised in that during described double-surface screen printing processes, silk-screen mesh number is 36T
Or 39T.
4. manufacture method as claimed in claim 3, it is characterised in that during described double-surface screen printing processes, used ink
Viscosity is 100-120dpa.s, and the thickness of wet film is 40-45 μm.
5. manufacture method as claimed in claim 4, it is characterised in that need to carry out standing process after described silk-screen, stand
Time is 1-2h.
6. manufacture method as claimed in claim 5, it is characterised in that in described pre-baked process, need to toast with vertical oven
48min, or toast 50min by tunnel oven.
7. manufacture method as claimed in claim 6, it is characterised in that in described exposure-processed, used green oil exposure
Energy progression be 9-11 lattice, dirty oil exposure energy progression is 11-12 lattice.
8. manufacture method as claimed in claim 7, it is characterised in that in described development treatment, development cylinder two-way pressure is
0.8-1.2kg/cm2, speed is 5.0m/min.
9. manufacture method as claimed in claim 8, it is characterised in that in described development treatment, uses green oil to face up, black
The ventricumbent mode of oil is developed, and closes the downforce of final stage development cylinder, and developing time is 46s.
10. manufacture method as claimed in claim 9, it is characterised in that in described development treatment, used development cylinder is 4
Individual, each development cylinder body length 1 meter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610594882.8A CN106132111A (en) | 2016-07-26 | 2016-07-26 | A kind of manufacture method of the wiring board with different solder mask colors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610594882.8A CN106132111A (en) | 2016-07-26 | 2016-07-26 | A kind of manufacture method of the wiring board with different solder mask colors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106132111A true CN106132111A (en) | 2016-11-16 |
Family
ID=57289604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610594882.8A Pending CN106132111A (en) | 2016-07-26 | 2016-07-26 | A kind of manufacture method of the wiring board with different solder mask colors |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106132111A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111601460A (en) * | 2020-05-30 | 2020-08-28 | 涟水县苏杭科技有限公司 | Multi-spelling two-color solder mask, character plug hole adding and tin melting surface treatment processing method |
| CN112118678A (en) * | 2020-08-31 | 2020-12-22 | 珠海智锐科技有限公司 | Manufacturing method of packaging substrate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102378499A (en) * | 2011-10-18 | 2012-03-14 | 东莞生益电子有限公司 | Method for manufacturing window plug holes at two sides during PCB (Printed Circuit Board) resistance welding |
| CN104320928A (en) * | 2014-10-13 | 2015-01-28 | 广东依顿电子科技股份有限公司 | Hole plugging method of different resistance welding colors of circuit board |
| CN104869758A (en) * | 2015-05-15 | 2015-08-26 | 深圳崇达多层线路板有限公司 | Method for making solder-resisting layer on PCB sheet |
| CN104902695A (en) * | 2015-06-08 | 2015-09-09 | 深圳崇达多层线路板有限公司 | Solder resist manufacturing method of windowing taphole design |
-
2016
- 2016-07-26 CN CN201610594882.8A patent/CN106132111A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102378499A (en) * | 2011-10-18 | 2012-03-14 | 东莞生益电子有限公司 | Method for manufacturing window plug holes at two sides during PCB (Printed Circuit Board) resistance welding |
| CN104320928A (en) * | 2014-10-13 | 2015-01-28 | 广东依顿电子科技股份有限公司 | Hole plugging method of different resistance welding colors of circuit board |
| CN104869758A (en) * | 2015-05-15 | 2015-08-26 | 深圳崇达多层线路板有限公司 | Method for making solder-resisting layer on PCB sheet |
| CN104902695A (en) * | 2015-06-08 | 2015-09-09 | 深圳崇达多层线路板有限公司 | Solder resist manufacturing method of windowing taphole design |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111601460A (en) * | 2020-05-30 | 2020-08-28 | 涟水县苏杭科技有限公司 | Multi-spelling two-color solder mask, character plug hole adding and tin melting surface treatment processing method |
| CN112118678A (en) * | 2020-08-31 | 2020-12-22 | 珠海智锐科技有限公司 | Manufacturing method of packaging substrate |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161116 |