WO2013071790A1 - Method for preventing circuit board solder mask ink from blocking holes - Google Patents

Method for preventing circuit board solder mask ink from blocking holes Download PDF

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Publication number
WO2013071790A1
WO2013071790A1 PCT/CN2012/081542 CN2012081542W WO2013071790A1 WO 2013071790 A1 WO2013071790 A1 WO 2013071790A1 CN 2012081542 W CN2012081542 W CN 2012081542W WO 2013071790 A1 WO2013071790 A1 WO 2013071790A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
ink
screen
screen printing
silk
Prior art date
Application number
PCT/CN2012/081542
Other languages
French (fr)
Chinese (zh)
Inventor
彭卫红
宋建远
朱拓
魏秀云
鲁惠
Original Assignee
深圳崇达多层线路板有限公司
大连崇达电路有限公司
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Publication date
Application filed by 深圳崇达多层线路板有限公司, 大连崇达电路有限公司 filed Critical 深圳崇达多层线路板有限公司
Publication of WO2013071790A1 publication Critical patent/WO2013071790A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/075—Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Definitions

  • the invention belongs to the technical field of circuit board manufacturing, and particularly relates to a method for preventing a solder mask ink plug hole of a circuit board. Background technique:
  • a special screen printing screen is required, and the screen printing screen is provided with a stop point corresponding to the position of the circuit board through the hole. These stops block the vias on the board so that the ink does not enter the vias to block the vias during subsequent screen printing of the ink.
  • the screen on the screen printing screen is prone to the phenomenon of mesh leakage, and it is impossible to ensure that the ink does not enter the through hole;
  • an object of the present invention is to provide a method for preventing a solder mask ink plug hole of a circuit board, so as to solve the problem of high ink leakage at the stop point of the screen printing screen.
  • the present invention mainly adopts the following technical solutions:
  • a method for preventing a solder mask ink plug hole of a circuit board comprising:
  • the white screen is used to screen one side of the circuit board, and then sprayed on the other side of the circuit board to wash away the ink in the via hole of the circuit board.
  • the white network is a screenless screen.
  • the surface of the circuit board is screen printed by the white net
  • the surface is roughened.
  • the silk screen is used to screen one side of the circuit board
  • the surface is pre-baked, exposed, and developed.
  • the screen printing side of the circuit board is turned downward, and the spraying pressure on the other side of the circuit board is adjusted to make the circuit board spray three times as much as the screen printing surface.
  • the invention utilizes a screenless screen to screen the ink on the surface of the circuit board, and pre-bakes, exposes and develops the surface, and increases the spray pressure on the other side of the circuit board during development.
  • the ink that has entered the screen into the via hole is punched out, and then the above steps are repeated on the other side of the board to complete the entire screen printing process.
  • the present invention The screen printing ink on the entire circuit board is relatively comprehensive, there is no ink on the outside of the via hole, and the via hole is not blocked, and the invention does not need to make a screenless screen, and has the advantage of low cost.
  • the invention provides a method for preventing the soldering hole of the soldering pad of the circuit board, which is mainly used for solving the problem that the ink leakage and the manufacturing cost of the current position of the screen printing screen are used.
  • the core of the method is: using a white net to screen one side of the circuit board, and then spraying on the other side of the circuit board to wash away the ink in the via hole of the circuit board.
  • the circuit board which has been formed and formed is subjected to a grinding plate treatment to roughen the board surface, and then the screen board is screen-printed using a screenless screen, and the ink leaks from the screen to the screen.
  • the screen board is screen-printed using a screenless screen, and the ink leaks from the screen to the screen.
  • the screen printed surface is pre-baked and exposed to dry the ink, and then the surface is developed, and developed.
  • the side with the ink printed down, the side without the ink printed upward adjust the spray pressure to normal, the upper spray pressure is increased to about three times the lower spray pressure, and the development spray is increased by the ink-free side.
  • the immersion pressure washes off the ink in the vias, allowing the inked side to develop normally.
  • the circuit board is inspected. If there is no plug hole in the via hole of the circuit board, post-baking is performed to dry the ink on the side of the printed circuit board.
  • the other side of the circuit board is ground, the side that has been printed with ink is turned down, the side without ink is turned upward, the lower brush is closed, the upper brush is adjusted to normal, and the ink-free side is ground.
  • the screen is screen-printed using the unscreened screen printing, and the same steps as the above-mentioned process of the ink are repeated to complete the silk screen processing on the other side of the circuit board.
  • the circuit board After the silk screen is processed on each surface of the circuit board, the circuit board needs to be inspected. If there is still an ink plug hole, the side on which the ink is printed is directed downward, and the side not printed with the ink is upward, and the spray pressure is turned off. The spray pressure is increased to about 2 times the lower spray pressure, and it is displayed again.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Disclosed is a method for preventing circuit board solder mask ink from blocking holes, comprising: performing silk-screen printing on one surface of a circuit board by using a white net, and then spraying the other surface of the circuit board to flush out ink in via holes of the circuit board. In the present invention, ink is printed on the board surface of the circuit board by silk-screen printing using a screen without blocking points, pre-baking, exposure and developing are performed on the board surface, and spraying pressure is applied to the other surface of the circuit board during developing to flush out the ink entering the via holes due to the silk-screen printing, and then the above steps are repeated on the other surface of the circuit board, thus completing the whole silk-screen printing process. Compared with the prior art, in the present invention, the silk-screen printing of ink on the surfaces of the whole circuit board is comprehensive, the phenomenon that no ink exists on the outer side of the via hole does not occur, and the situation that the via hole is blocked does not occur either. In addition, the present invention does not require manufacturing the screen without blocking points, and therefore has an advantage of low cost.

Description

一种防止线路板阻焊油墨塞孔的方法 技术领域：  Method for preventing solder mask ink plug hole of circuit board
本发明属于线路板制作技术领域，具体涉及的是一种防止线路板阻焊油墨塞孔的 方法。 背景技术：  The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a method for preventing a solder mask ink plug hole of a circuit board. Background technique:
线路板在制作完成后，需要对板面进行丝印油墨，以防止线路氧化，但是由于线路 板上存在过孔，在对板面进行丝印油墨时，会有部分油墨进入到过孔中导致塞孔，从而影响 线路板的焊接和电气性能，尤其是这些过孔直径较小，约为 0. 25mm、0. 3mm，一旦塞孔，去除 将十分麻烦。  After the circuit board is completed, it is necessary to screen the ink on the board surface to prevent oxidation of the line. However, since there are via holes on the circuit board, when the screen printing ink is applied to the board surface, some ink enters the via hole and causes the plug hole. , which affects the soldering and electrical properties of the circuit board, especially the diameter of the via holes is small, about 0. 25mm, 0.3mm, once the plug hole is removed, it will be very troublesome.
为此，目前为防止油墨塞孔，在对线路板的板面进行丝印油墨之前，需要制作一个 特制的丝印网版，该丝印网版上设置有与线路板过孔位置对应的挡点，通过这些挡点将线 路板上的过孔挡住，从而实现在后续丝印油墨时，油墨不能进入到过孔中 堵塞过孔。  For this reason, in order to prevent the ink plug hole, before the screen printing ink is applied to the board surface of the circuit board, a special screen printing screen is required, and the screen printing screen is provided with a stop point corresponding to the position of the circuit board through the hole. These stops block the vias on the board so that the ink does not enter the vias to block the vias during subsequent screen printing of the ink.
但是这种方式存在以下缺陷：  But this approach has the following drawbacks:
1、丝印时，需要调整丝印网版的高度和角度以控制下油墨的量，使刮刀刮过网版 让油墨从网孔中漏下，但是油墨很容易从挡点的边缘被刮进过孔中，造成过孔堵塞；  1. When silk screen printing, it is necessary to adjust the height and angle of the screen printing screen to control the amount of ink, so that the scraper scrapes through the screen to let the ink leak from the mesh, but the ink is easily scraped into the through hole from the edge of the stop. In the middle, causing blockage of the via hole;
2、这种丝印网版上的挡点容易出现漏网现象，无法保证油墨不进入过孔； 2. The screen on the screen printing screen is prone to the phenomenon of mesh leakage, and it is impossible to ensure that the ink does not enter the through hole;
¾ ^¾黑 4#人讨；^ — 制 「 吋鬥 —雲恧！ J^l¾ 占¾(^÷] ¾？十— Β ^ έέ 印油墨时，挡点过大容易造成过孔外侧无油墨的问题； 3⁄4 ^3⁄4黑4#人讨;^ — system “吋斗—云恧! J^l3⁄4 占3⁄4(^÷] 3⁄4?十— Β ^ έέ When printing ink, too large a stop point will cause no ink on the outside of the via hole The problem;
4、不同的线路板需要有与之对应的丝印网版，丝印网版不具有通用性，制作成本 高，增加了制作流程。 发明内容：  4. Different circuit boards need to have a corresponding screen printing screen. The screen printing screen does not have versatility, and the production cost is high, which increases the production process. Summary of the invention:
鉴于以上问题，本发明的目的在于提供一种防止线路板阻焊油墨塞孔的方法，以 解决采用挡点丝印网版所存在的挡点漏油墨和制作成本高的问题。  In view of the above problems, an object of the present invention is to provide a method for preventing a solder mask ink plug hole of a circuit board, so as to solve the problem of high ink leakage at the stop point of the screen printing screen.
为实现上述目的，本发明主要采用以下技术方案：  In order to achieve the above object, the present invention mainly adopts the following technical solutions:
一种防止线路板阻焊油墨塞孔的方法，包括：  A method for preventing a solder mask ink plug hole of a circuit board, comprising:
利用白网对线路板的一面进行丝印，之后在线路板的另一面喷淋，冲掉线路板过 孔中的油墨。  The white screen is used to screen one side of the circuit board, and then sprayed on the other side of the circuit board to wash away the ink in the via hole of the circuit board.
其中所述白网为无挡点的网版。  The white network is a screenless screen.
其中在利用白网对线路板的一面进行丝印之前，对该面进行磨板粗化。 其中在利用白网对线路板的一面进行丝印之后，对该面进行预烘烤、曝光、显影。 其中对线路板进行显影时，使线路板丝印的一面朝下，调整线路板另一面的喷淋 压力，使其为丝印面喷淋压力的三倍，对线路板进行喷淋。  Where the surface of the circuit board is screen printed by the white net, the surface is roughened. After the silk screen is used to screen one side of the circuit board, the surface is pre-baked, exposed, and developed. When developing the circuit board, the screen printing side of the circuit board is turned downward, and the spraying pressure on the other side of the circuit board is adjusted to make the circuit board spray three times as much as the screen printing surface.
本发明利用无挡点的网版对线路板的板面进行丝印油墨，并对该面进行预烘烤、 曝光、显影，并在显影时，在线路板的另一面增加喷淋压力，将因丝印进入到过孔中的油墨 冲出，之后对线路板的另一面重复上述步骤，完成整个丝印过程。 与现有技术相比，本发明 整个线路板面丝印油墨比较全面，不会出现过孔外侧无油墨的现象，也不会出现过孔被堵 塞的情况，而且本发明无需制作无挡点网版，具有成本低的优点。 具体实施方式： The invention utilizes a screenless screen to screen the ink on the surface of the circuit board, and pre-bakes, exposes and develops the surface, and increases the spray pressure on the other side of the circuit board during development. The ink that has entered the screen into the via hole is punched out, and then the above steps are repeated on the other side of the board to complete the entire screen printing process. Compared with the prior art, the present invention The screen printing ink on the entire circuit board is relatively comprehensive, there is no ink on the outside of the via hole, and the via hole is not blocked, and the invention does not need to make a screenless screen, and has the advantage of low cost. detailed description:
为阐述本发明的思想及目的，下面将结合具体实施例对本发明做进一步的说明。 本发明提供的是一种防止线路板阻焊油墨塞孔的方法，其主要用于解决目前采用 挡点丝印网版所存在的挡点漏油墨和制作成本髙的问题。  In order to explain the idea and object of the present invention, the present invention will be further described below in conjunction with the specific embodiments. The invention provides a method for preventing the soldering hole of the soldering pad of the circuit board, which is mainly used for solving the problem that the ink leakage and the manufacturing cost of the current position of the screen printing screen are used.
其中该方法的核心是：利用白网对线路板的一面进行丝印，之后在线路板的另一 面喷淋，冲掉线路板过孔中的油墨。  The core of the method is: using a white net to screen one side of the circuit board, and then spraying on the other side of the circuit board to wash away the ink in the via hole of the circuit board.
其具体实现步骤如下：首先对己经制作成型的线路板进行磨板处理，使板面粗化， 然后使用无挡点的网版对线路板一面进行丝印，油墨从网版上漏下，到线路板的板面上，其 中会有部分油墨进入到该板面的过孔中，然后再对经过丝印的该面进行预烘烤、曝光，使油 墨干燥，接着对该面进行显影，显影时，将印刷有油墨的一面向下，没有印油墨的一面向上， 调整下喷淋压力正常，上喷淋压力加大至下喷淋压力的三倍左右，通过向无油墨的一面加 大显影喷淋压力冲掉过孔内的油墨，使有油墨的一面正常显影。  The specific implementation steps are as follows: firstly, the circuit board which has been formed and formed is subjected to a grinding plate treatment to roughen the board surface, and then the screen board is screen-printed using a screenless screen, and the ink leaks from the screen to the screen. On the board surface of the circuit board, a part of the ink enters the through hole of the board surface, and then the screen printed surface is pre-baked and exposed to dry the ink, and then the surface is developed, and developed. , the side with the ink printed down, the side without the ink printed upward, adjust the spray pressure to normal, the upper spray pressure is increased to about three times the lower spray pressure, and the development spray is increased by the ink-free side. The immersion pressure washes off the ink in the vias, allowing the inked side to develop normally.
经过显影之后对线路板进行检査，如果该线路板过孔中无塞孔，则进行后烘烤，使 线路板巳经印刷有油墨的一面油墨干燥。  After the development, the circuit board is inspected. If there is no plug hole in the via hole of the circuit board, post-baking is performed to dry the ink on the side of the printed circuit board.
之后对线路板的另一面进行磨板，将已经印刷有油墨的一面向下，无油墨的一面 向上，关闭下磨刷，调整上磨刷至正常，对无油墨的一面的进行磨板，经过磨板后，再使用无 挡点的网版丝印对该面进行丝印，重复上述对有油墨的一面处理相同的步骤，完成对线路 板另一面的丝印处理。  Then, the other side of the circuit board is ground, the side that has been printed with ink is turned down, the side without ink is turned upward, the lower brush is closed, the upper brush is adjusted to normal, and the ink-free side is ground. After the plate is ground, the screen is screen-printed using the unscreened screen printing, and the same steps as the above-mentioned process of the ink are repeated to complete the silk screen processing on the other side of the circuit board.
其中在线路板每一板面丝印处理之后，需要对线路板检查，如果仍存在油墨塞孔， 则将印刷有油墨的一面向下，未印刷有油墨的一面向上，关 闭下喷淋压力，上喷淋压力加 大至下喷淋压力的 2倍左右，再显澎一次。  After the silk screen is processed on each surface of the circuit board, the circuit board needs to be inspected. If there is still an ink plug hole, the side on which the ink is printed is directed downward, and the side not printed with the ink is upward, and the spray pressure is turned off. The spray pressure is increased to about 2 times the lower spray pressure, and it is displayed again.
以上是对本发明所提供的一种防止线路板阻焊油墨塞孔的方法进行了详细的介 绍，本文中应用了具体个例对本发明的结构原理及实施方式进行了阐述，以上实施例只是 用于帮助理解本发明的方法及其核心思想；同时，对于本领域的一般技术人员，依据本发明 的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解 为对本发明的限制。  The above is a detailed introduction of a method for preventing the solder mask ink plug hole of the circuit board provided by the present invention. The structural principle and the implementation manner of the present invention are described in the following. The above embodiment is only used for the above embodiment. To help understand the method of the present invention and its core idea; at the same time, for those skilled in the art, according to the idea of the present invention, there will be changes in specific embodiments and application scopes. It should not be construed as limiting the invention.

Claims

权 利 要 求 书 Claim
1. 一种防止线路板阻焊油墨塞孔的方法，其特征在于包括： A method for preventing a solder mask ink plug hole of a circuit board, comprising:
利用白网对线路板的一面进行丝印，之后在线路板的另一面喷淋，冲掉线路板过孔中 的油墨。  The white screen is used to screen one side of the circuit board, and then sprayed on the other side of the circuit board to wash away the ink in the via hole of the circuit board.
2.根据权利要求 1所述的防止线路板阻焊油墨塞孔的方法，其特征在于所述白网为无 挡点的网版。  2. A method of preventing solder mask ink plug holes in a circuit board according to claim 1, wherein said white net is a screenless screen.
3.根据权利要求 1所述的防止线路板阻焊油墨塞孔的方法，其特征在于在利用白网对 线路板的一面进行丝印之前，对该面进行磨板粗化。  A method of preventing solder mask ink plug holes according to claim 1, wherein the face is roughened before the one side of the circuit board is screen printed by the white net.
4.根据权利要求 1所述的防止线路板阻焊油墨塞孔的方法，其特征在于在利用白网对 线路板的一面进行丝印之后，对该面进行预烘烤、曝光、显影。  The method for preventing solder mask ink plug holes of a circuit board according to claim 1, wherein after the one side of the circuit board is screen printed by the white net, the surface is pre-baked, exposed, and developed.
5.根据权利要求 4所述的防止线路板阻焊油墨塞孔的方法，其特征在于对线路板进行 显影时，使线路板丝印的一面朝下，调整线路板另一面的喷淋压力，使其为丝印面喷淋压力 的三倍，对线路板进行喷淋。  5 . The method according to claim 4 , wherein when the circuit board is developed, the screen printing side of the circuit board is turned downward, and the spray pressure on the other side of the circuit board is adjusted. It is sprayed on the circuit board by making it three times the spray pressure of the silk screen.
PCT/CN2012/081542 2011-11-16 2012-09-18 Method for preventing circuit board solder mask ink from blocking holes WO2013071790A1 (en)

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CN201110363165.1A CN102548232B (en) 2011-11-16 2011-11-16 Method for preventing circuit board solder mask ink from blocking hole
CN201110363165.1 2011-11-16

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CN102548232B (en) * 2011-11-16 2014-05-21 大连崇达电路有限公司 Method for preventing circuit board solder mask ink from blocking hole
CN104582300A (en) * 2013-10-18 2015-04-29 重庆方正高密电子有限公司 Circuit board anti-welding baseplate and circuit board manufacturing method
CN111741603B (en) * 2020-07-04 2021-05-07 吉安满坤科技股份有限公司 Manufacturing method of new energy intelligent automobile printed circuit board
CN114114859A (en) * 2021-12-14 2022-03-01 上海展华电子(南通)有限公司 Developing method and developing device

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