CN105208791B - A kind of production method of printed circuit board character - Google Patents
A kind of production method of printed circuit board character Download PDFInfo
- Publication number
- CN105208791B CN105208791B CN201510648158.4A CN201510648158A CN105208791B CN 105208791 B CN105208791 B CN 105208791B CN 201510648158 A CN201510648158 A CN 201510648158A CN 105208791 B CN105208791 B CN 105208791B
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- character
- circuit board
- solder mask
- production method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0531—Decalcomania, i.e. transfer of a pattern detached from its carrier before affixing the pattern to the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
Abstract
The invention discloses a kind of production method of printed circuit board character, include the following steps：S1, preceding process, make the solder mask of printed circuit board；S2, choose the solder mask identical with required character color, and adjusts the solder mask viscosity to Appropriate；S3, prepare halftone, carries out whole plate silk-screen；S4, prebake conditions；S5, exposure, development, obtain printed circuit board character；S6, rear baking.The present invention prepares character using the technological process of welding resistance instead of traditional character preparation flow, the aligning accuracy of welding resistance exposure machine can reach ± 20 μm of margins of tolerance, much larger than ± 100 μm of the margin of tolerance of human eye contraposition, so the aligning accuracy of character is greatly improved, character off normal is effectively reduced, pad and easily fuzzy etc. bad problem of character on character.
Description
Technical field
The invention belongs to printed circuit board technology field, relates in particular to a kind of making side of printed circuit board character
Method.
Background technology
Printed circuit board, also known as printed circuit board (PCB) (Printed Circuit Board, referred to as PCB), are a kind of important
Electronic unit, be electronic component supporter, and electronic component electrical connection carrier.Printed circuit board usually wraps
Include more than one layer of line layer and be used for realization the substrate layer that insulate between line layer, printed circuit board is on the line layer of outer layer
Solder mask (Solder Mask) is also covered with, solder mask is the protective layer of outer layer insulation, plays protection circuit and prevents welding zero
During part on circuit tin effect, identify the position of each to-be-welded elements on printed circuit board for convenience, can also print outside solder mask
One layer of character layer is made, the color of character layer is generally white, the title of signable component, position, production cycle, company business
The information such as mark, product type, easy to indicate and welding component, it can also be used to check whether component welding is correct.
In the prior art, printed circuit board character is made generally after welding resistance making, uses mesh number (often to be put down for 120T
Have 120 holes in square centimetre) halftone, to its front one layer of photosensitive paste of brush, then by the film, character graphics is transferred to halftone
Upper (this process is commonly called as shining net), then halftone is installed on screen printer, legend ink is printed onto plate using method for printing screen
Face, by overbaking, by ink solidification.But above-mentioned manufacture craft aligns soon by people, aligning accuracy is limited, only up to
Reach ± 100 μm, misoperation, easily produces character off normal, pad etc. is bad on character；And due to wiring board character process
Halftone maximum mesh number is 120T, ink by the hole silk-screen of halftone to plate face when, certain diffusion is had, if required character
Width is no more than 75 μm, then is difficult to ensure that；Wiring board for surface copper thickness >=2OZ, it is necessary to when doing character, due to circuit surface and
Plate face drop is too big, and the depression between line is deeper, and character is not easy silk-screen, and in gap, can also produce, character obscures, dropping character etc. is asked
Topic.
The content of the invention
For this reason, the technical problems to be solved by the invention are in the prior art, the making contraposition of printed circuit board character
Precision deficiency, the easy off normal of character, unmanageable character duration, are also also easy to produce the problem of character is fuzzy, so as to propose a kind of print
The production method of circuit board character processed.
In order to solve the above technical problems, the technical scheme is that：
The present invention provides a kind of production method of printed circuit board character, it includes the following steps：
S1, preceding process, make the solder mask of printed circuit board；
S2, choose the solder mask identical with required character color, and adjusts the solder mask viscosity to Appropriate；
S3, prepare halftone, to halftone front one layer of photoresists of brush, and character graphics is transferred to net by the film
Version, is then placed in the printed circuit plate surface by halftone, carries out whole plate silk-screen；
S4, prebake conditions, remove the solvent in the solder mask；
S5, exposure, development, obtain printed circuit board character；
S6, rear baking.
Preferably, the solder mask viscosity is 50-100Pas.
Preferably, in the step S3 full page silk-screen printing process, the hardness of scraper is 65-75A.
Preferably, in the step S3, the silk-screen pressure of full page silk-screen is 3-5kg/cm2, silk-screen speed is 3.5-
4.5m/min。
Preferably, in the step S4, prebake conditions temperature is 70-75 DEG C, and the prebake conditions time is 40-45min.
Preferably, in the step S5, exposure energy 150-250mj/cm2；Developing powder is 3-4m/min, development
Liquid spray pressure is 0.7-1.3kg/cm2。
Preferably, the step of washing and drying printed circuit board are further included after the step S5, wherein, washing pressure is
0.7-1.3kg/cm2, drying temperature is 35-45 DEG C, drying time 10-20s.
Preferably, in the step S6, the temperature toasted afterwards is 150-155 DEG C, post-bake times 55-60min.
Preferably, in the step S3, the mesh number of the halftone is 77T.
Preferably, the step S1 specifically includes nog plate, the making of silk-screen halftone, whole plate ink for screen printing, prebake conditions, exposure
Light, development and the process toasted afterwards.
The above technical solution of the present invention has the following advantages over the prior art：
(1) production method of printed circuit board character of the present invention, includes the following steps：S1, preceding process, make print
The solder mask of circuit board processed；S2, choose the solder mask identical with required character color, and adjust the solder mask viscosity to
Appropriate；S3, prepare halftone, carries out whole plate silk-screen；S4, prebake conditions；S5, exposure, development, obtain printed circuit board character；S6、
After toast.Character is prepared instead of traditional character preparation flow using the technological process of welding resistance, due to welding resistance exposure machine
Aligning accuracy can reach ± 20 μm of margins of tolerance, much larger than ± 100 μm of the margin of tolerance of human eye contraposition, so pair of character
Position precision is greatly improved, and effectively reduces character off normal, pad and easily fuzzy etc. bad problem of character on character.
(2) production method of printed circuit board character of the present invention, is turned character graphics using the film in exposure
Move on in plate face, the minimum pattern precision (minimum widith of single line) of the film can reach 20 μm, and film exposure produces
Diffusion phenomena can control within ± 5 μm, its precision is far above 75 μm of silk-screen printing minimum widith, so, character is most
Small line width makes ability and is improved.
(3) production method of printed circuit board character of the present invention, makees character, oil certainly as a result of welding resistance flow
Ink can be engraved between line, recycled exposure, development to make figure, be instead of direct silk-screen character graphics, and oil between line has been effectively ensured
The making of black figure.
Embodiment
Embodiment
A kind of production method of printed circuit board character is present embodiments provided, it includes the following steps：
S1, preceding process, the oxide layer of printed circuit board copper surface is removed using chemical cleaning and the method for washing, increases copper face
Roughness, to improve the combination power of soldermask coatings and copper face and strengthen the color consistency of coating, using conventional welding resistance technique
Solder mask is made in printed circuit plate surface, is specially：Nog plate, is roughened copper face, makes silk-screen halftone as requested, and carry out whole
Plate ink for screen printing, printed circuit plate surface is evenly applied to by solder mask, then the prebake conditions 40- under low temperature at 70-75 DEG C
45min, then carries out uv-exposure and develops to wash away the solder mask of lightproof area, toasted after finally carrying out, by solder mask
Thoroughly cure；
S2, choose the solder mask identical with required character color, and adjusts the solder mask host agent and curing agent
Ratio makes viscosity to Appropriate：50-100Pas, in the present embodiment, the viscosity of solder mask is 80Pas；
S3, prepare halftone, and the halftone mesh number is 77T, to halftone front one layer of photoresists of brush, and will by the film
Character graphics is transferred to halftone, then halftone is placed in the welding resistance layer surface of the printed circuit board, carries out whole plate silk-screen, will
Solder mask is coated on printed circuit plate surface；In full page silk-screen printing process, the hardness of scraper is 65-75A (Shore hardness), this reality
It is 70A to apply in example, and silk-screen pressure is 3-5kg/cm2, it is preferably 4kg/cm in the present embodiment2, silk-screen speed is 3.5-4.5m/
Min, is preferably 4m/min in the present embodiment；
After S4, full page silk-screen, prebake conditions are carried out to printed circuit board, the evaporation of the solvent in solder mask is fallen to remove
The solvent in solder mask is stated, printed circuit board plate face ink is tentatively hardened preparation exposure, the temperature of prebake conditions is 70-75
DEG C, it is 72 DEG C in the present embodiment, the time of prebake conditions is 40-45min, is 42min in the present embodiment；
The film that making has required character, is attached to printed circuit plate surface progress uv-exposure by S5, and exposure energy is
150-250mj/cm2, it is 200mj/cm in the present embodiment2, after exposure, by the part solder mask hardening of illumination, it is attached to plate
Face；Development, the solder mask equipped with lightproof area during exposure is rinsed out, is met the printed circuit board character of requirement, is shown
During shadow, developing powder 3-4m/min, is 3.5m/min in the present embodiment, developer solution spray pressure is 0.7-1.3kg/
cm2, it is 1kg/cm in the present embodiment2；After development, printed circuit board is washed, washing pressure is 0.7-1.3kg/cm2, this
It is 1kg/cm in embodiment2, 10-20s is then dried at 35-45 DEG C, drying temperature is 40 DEG C in the present embodiment, drying time
For 15s.
S6, at 150-155 DEG C after baking, 55-60min, in the present embodiment after baking temperature be 150 DEG C, during rear baking
Between be 60min, make plate face legend ink fully hardened, form permanent character not easily to fall off.
The present embodiment prepares character using the technological process of welding resistance instead of traditional character preparation flow, due to welding resistance
The aligning accuracy of exposure machine can reach ± 20 μm of margins of tolerance, much larger than ± 100 μm of the margin of tolerance of human eye contraposition, so
The aligning accuracy of character is greatly improved, effectively reduce character off normal, on character pad and character easily it is fuzzy etc. no
Good problem.
Obviously, the above embodiments are merely examples for clarifying the description, and the restriction not to embodiment.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or
Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or
Among changing still in the protection domain of the invention.
Claims (7)
1. a kind of production method of printed circuit board character, it is characterised in that include the following steps：
S1, preceding process, make the solder mask of printed circuit board；
S2, choose the solder mask identical with required character color, and adjusts the solder mask viscosity to Appropriate；
S3, prepare halftone, to halftone front one layer of photoresists of brush, and character graphics is transferred to halftone by the film, so
Halftone is placed in the printed circuit board welding resistance layer surface afterwards, carries out whole plate silk-screen；
S4, prebake conditions, remove the solvent in the solder mask；
S5, exposure, development, obtain printed circuit board character；
S6, rear baking；
The solder mask viscosity is 50-100Pas；In the step S3 full page silk-screen printing process, the hardness of scraper is 65-
75A；In the step S3, the silk-screen pressure of full page silk-screen is 3-5kg/cm2, silk-screen speed is 3.5-4.5m/min.
2. the production method of printed circuit board character according to claim 1, it is characterised in that in the step S4, in advance
Baking temperature is 70-75 DEG C, and the prebake conditions time is 40-45min.
3. the production method of printed circuit board character according to claim 2, it is characterised in that in the step S5, expose
Light energy is 150-250mj/cm2；Developing powder is 3-4m/min, and developer solution spray pressure is 0.7-1.3kg/cm2。
4. the production method of printed circuit board character according to claim 3, it is characterised in that also wrapped after the step S5
The step of including washing and drying printed circuit board, wherein, washing pressure is 0.7-1.3kg/cm2, drying temperature is 35-45 DEG C,
Drying time is 10-20s.
5. the production method of printed circuit board character according to claim 4, it is characterised in that in the step S6, after
The temperature of baking is 150-155 DEG C, post-bake times 55-60min.
6. the production method of printed circuit board character according to claim 5, it is characterised in that in the step S3, institute
The mesh number for stating halftone is 77T.
7. the production method of printed circuit board character according to claim 6, it is characterised in that the step S1 is specifically wrapped
Include nog plate, the making of silk-screen halftone, whole plate ink for screen printing, prebake conditions, exposure, development and the process toasted afterwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510648158.4A CN105208791B (en) | 2015-10-09 | 2015-10-09 | A kind of production method of printed circuit board character |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510648158.4A CN105208791B (en) | 2015-10-09 | 2015-10-09 | A kind of production method of printed circuit board character |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105208791A CN105208791A (en) | 2015-12-30 |
| CN105208791B true CN105208791B (en) | 2018-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510648158.4A Expired - Fee Related CN105208791B (en) | 2015-10-09 | 2015-10-09 | A kind of production method of printed circuit board character |
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| Country | Link |
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| CN (1) | CN105208791B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106274027A (en) * | 2016-08-15 | 2017-01-04 | 梅州市志浩电子科技有限公司 | A kind of silk-screen manufacturing method of screen |
| CN108235578A (en) * | 2018-01-02 | 2018-06-29 | 京东方科技集团股份有限公司 | PCB silk-screens production method, PCB screen printing patterns and pcb board |
| CN109587965A (en) * | 2018-11-21 | 2019-04-05 | 奥士康精密电路（惠州）有限公司 | A kind of processing method controlling pcb board character white oil block thickness |
| CN109729651B (en) * | 2019-01-09 | 2020-07-28 | 深圳市江霖电子科技有限公司 | Solder resist process for reducing ghost of white core material circuit board |
| CN110602870A (en) * | 2019-08-29 | 2019-12-20 | 佛山市顺德区厚信电子配件有限公司 | Circuit board character manufacturing method |
| CN112223889B (en) * | 2020-12-10 | 2021-03-02 | 四川英创力电子科技股份有限公司 | Method for printing characters with multiple colors on same side of printed board and manufacturing method of printed board |
| CN113784526B (en) * | 2021-11-11 | 2022-03-01 | 四川英创力电子科技股份有限公司 | Printed circuit board screen printing solder mask method |
| CN115734503A (en) * | 2022-10-28 | 2023-03-03 | 清远市富盈电子有限公司 | PCB small character silk-screen printing method |
| CN116321781B (en) * | 2023-05-25 | 2023-08-04 | 深圳市龙腾电路科技有限公司 | Method for manufacturing thick copper plate character and application of thick copper plate character in preparation of circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4954421A (en) * | 1980-05-08 | 1990-09-04 | M&T Chemicals Inc. | Photoflashing a liquid polymer layer on a phototool surface exposed to air |
| CN103660652A (en) * | 2012-09-04 | 2014-03-26 | 深南电路有限公司 | Silk screen printing technology for printed circuit board |
| CN104244575A (en) * | 2014-09-24 | 2014-12-24 | 晏石英 | Circuit board provided with multi-color solder mask layers |
-
2015
- 2015-10-09 CN CN201510648158.4A patent/CN105208791B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4954421A (en) * | 1980-05-08 | 1990-09-04 | M&T Chemicals Inc. | Photoflashing a liquid polymer layer on a phototool surface exposed to air |
| CN103660652A (en) * | 2012-09-04 | 2014-03-26 | 深南电路有限公司 | Silk screen printing technology for printed circuit board |
| CN104244575A (en) * | 2014-09-24 | 2014-12-24 | 晏石英 | Circuit board provided with multi-color solder mask layers |
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| Publication number | Publication date |
|---|---|
| CN105208791A (en) | 2015-12-30 |
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Granted publication date: 20180424 Termination date: 20201009 |