CN113784526B - Printed circuit board screen printing solder mask method - Google Patents
Printed circuit board screen printing solder mask method Download PDFInfo
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- CN113784526B CN113784526B CN202111330657.0A CN202111330657A CN113784526B CN 113784526 B CN113784526 B CN 113784526B CN 202111330657 A CN202111330657 A CN 202111330657A CN 113784526 B CN113784526 B CN 113784526B
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- circuit board
- printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a printed circuit board silk-screen solder mask method, which comprises the following steps: coating a layer of photosensitive glue on the blank silk screen, and baking the photosensitive glue; transferring the solder resist pattern onto a screen printing plate by laser imaging, and flushing the unexposed pattern by using a high-pressure water gun; installing the prepared silk screen on a silk screen printing machine, fixing a printed board on a silk screen printing machine table by using process holes on the printed board, and then adjusting the alignment of the silk screen printing plate and the patterns of the printed board to ensure that the patterns are coincided; printing a layer of uniform UV solder resist ink on the position of the printed circuit board, which needs to be covered with solder resist; after printing one surface, turning over the printed circuit board, and printing a second surface; after the printing on the two sides of the printed circuit board is finished, directly carrying out high-temperature curing; printing characters on the surface of the printed circuit board; the steps of pre-baking, exposure and development are reduced, the process flow is shortened, no film is needed, and the cost is saved; the automatic turnover device is used for turning over the circuit board for printing, so that the labor is reduced, and the efficiency is improved.
Description
Technical Field
The invention relates to the technical field of printed circuit board production, in particular to a method for assembling and welding a printed circuit board by silk screen printing.
Background
The circuit board is usually required to be subjected to solder mask after the circuit is completed, except for the circuit board without the circuit and the silk screen printing, the circuit board with circuit patterns basically needs to be subjected to solder mask printing as long as the circuit board is provided with circuit patterns, and the solder mask printing method has the functions of preventing short circuit of circuit pad bridging during welding, effectively protecting the pad, providing a good electrical environment and a chemical protection layer for the circuit board, and thus protecting the board surface from oxidation and damage; in the existing production process, a layer of liquid photosensitive solder resist is uniformly printed on two surfaces of a circuit board, and a permanent protective layer with high reliability on the surface of the substrate is formed after the procedures of exposure, development and the like.
Disclosure of Invention
Aiming at the defects of the related prior art, the application provides a printed circuit board screen printing assembly welding method, wherein the solder resist pattern is directly made on the screen, and then the solder resist pattern to be covered is directly printed on the printed board surface through the screen pattern, so that the steps of pre-baking, exposure and development are reduced, the process flow is shortened, a film is not needed, the cost is saved, and the method has strong practicability.
In order to achieve the above object, the present invention employs the following techniques:
a printed circuit board silk-screen solder mask method comprises the following steps:
step one, coating a layer of photosensitive glue on a blank silk screen, and baking the photosensitive glue;
transferring the solder resist pattern onto a screen printing plate by laser imaging, and flushing the unexposed pattern by using a high-pressure water gun;
step three, mounting the prepared silk screen on a silk screen printing machine, fixing the printed board on a silk screen printing machine table by using process holes on the printed board, and then adjusting the alignment of the silk screen printing plate and the patterns of the printed board to ensure that the patterns are coincided;
printing a layer of uniform UV solder resist ink on the position of the printed circuit board, which needs to be covered with the solder resist;
step five, after one surface is printed, turning over the printed circuit board, and printing a second surface by the same method as the step S03 and the step S04;
step six, directly carrying out high-temperature curing after the two sides of the printed circuit board are printed;
seventhly, characters are printed on the surface of the printed circuit board;
and step five, turning over by adopting a circuit board turning device.
Further, in the pattern of the silk-screen printing plate in the second step, the position where light is transmitted is the position where oil needs to be fed, and solder resist ink is printed on the printed circuit board; the position of lightproof is the position that does not need to get off the oil, does not need to print the resistance welding.
Further, the temperature of the high-temperature curing in the sixth step is 150 +/-10 ℃, and the curing time is 60-90 minutes.
Further, the drying temperature in the first step is 60-80 ℃, and the drying time is 10-30 minutes.
The invention has the beneficial effects that:
1. the solder resist pattern is directly made on the silk screen, and then the solder resist to be covered is directly printed on the printed board surface through the silk screen pattern, so that the steps of pre-baking, exposure and development are reduced, and the process flow is shortened; because the steps of exposure and development are reduced, a film is not needed in the production process, and the cost is greatly saved;
2. after one surface of the circuit board is printed, the circuit board is turned over by the automatic turning device, and then the second surface is printed, so that the labor is reduced, the working efficiency is improved, and meanwhile, errors are not easy to occur; a connecting rod is added between the connecting plate and the clamping block, so that the connecting plate and the objective table are prevented from interfering in the process of clamping the circuit board; at least one part of one end of the second concave part and one end of the third concave part are located in the groove area, so that the circuit board can be conveniently clamped by the turnover mechanism.
Drawings
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Fig. 1 is a schematic flow chart of a solder mask silk-screen method according to an embodiment of the present application.
Fig. 2 is a perspective view of the overall structure of the embodiment of the present application.
Fig. 3 is a schematic perspective view of a turnover mechanism according to an embodiment of the present application.
The attached drawings indicate the following: the device comprises an object stage 1, an object stage 2, a linear mechanism 3, a turnover mechanism 11, a groove 12, a first concave part 13, a boss 14, a second concave part 15, a third concave part 31, a first telescopic part 32, a base 33, a second telescopic part 34, a support 35, a rotating shaft 36, a motor 37, a connecting plate 38, a connecting rod 39, a clamping block 391 and a strip-shaped groove.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
One of the conveniences of the embodiments of the present application, this example provides a circuit board turning device applied to a printed circuit board screen printing assembly welding method, where the turning device is disposed on one side of a screen printing solder mask device, as shown in fig. 2 to 3, and includes: the device comprises an object stage 1, a linear mechanism 2 and a turnover mechanism 3.
The turnover mechanism 3 comprises two turnover assemblies which are symmetrically arranged and are arranged on one side of the linear mechanism 2 and used for turning the printed circuit board 180 degrees; the turning assembly comprises a first telescopic part 31 and a rotating shaft 35, the first telescopic part 31 is vertically arranged on a base 32, the base 32 is fixed on the side surface of the linear mechanism 2, the upper end of the first telescopic part 31 is connected with a second telescopic part 33 which is horizontally arranged, one end of the second telescopic part 33 is provided with a bracket 34, one end of the rotating shaft 35 is arranged on the bracket 34 in a penetrating way, one end of the rotating shaft 35 is connected with a motor 36, the motor 36 is fixed on the bracket 34, the other end of the rotating shaft 35 is provided with a connecting plate 37, the length of the connecting plate 37 can be adjusted, the lower end surface of the connecting plate 37 is higher than the lower end surface of the bracket 34, connecting rods 38 are arranged at two ends of the connecting plate 37, one end of each connecting rod 38 is connected with a clamping block 39, the connecting rod 38 is added between the clamping block 39 and the connecting plate 37 to prevent the connecting plate 37 from interfering with the objective table 1, and the side surface of the clamping block 39 is provided with a strip-shaped groove 391 for passing through the circuit board to prevent the circuit board from falling off in the overturning process.
Specifically, two object stages 1 are arranged on the linear mechanism 2, wherein one object stage 1 is positioned above the other object stage 1 and used for placing a printed circuit board; the center of the object stage 1 is provided with a groove 11, the groove 11 is used for bearing a circuit board, two sides of the end surface of the object stage 1 are provided with first concave parts 12, the first concave parts 12 are used for penetrating through a connecting plate 37, a preset distance is reserved between the first concave parts 12 and the groove 11, a boss 13 is formed, the center of the first concave part 12 is provided with second concave parts 14 along the width direction, the second concave parts 14 are used for penetrating through a bracket 34, two sides of the first concave part 12 in the width direction are provided with third concave parts 15, and the third concave parts 15 are used for penetrating through a clamping block 39; one end of the second concave part 14 and one end of the third concave part 15 are at least partially positioned in the area of the groove 11, and the length of the connecting rod 38 is not less than the width of the boss 13.
Another aspect of the embodiments of the present application provides a method for printing solder masks on a printed circuit board, which includes the following steps:
step one, coating a layer of photosensitive glue on a blank silk screen, and baking the photosensitive glue;
transferring the solder resist pattern onto a screen printing plate by laser imaging, and flushing the unexposed pattern by using a high-pressure water gun;
step three, mounting the prepared silk screen on a silk screen printing machine, fixing the printed board on a silk screen printing machine table by using process holes on the printed board, and then adjusting the alignment of the silk screen printing plate and the patterns of the printed board to ensure that the patterns are coincided;
printing a layer of uniform UV solder resist ink on the position of the printed circuit board, which needs to be covered with the solder resist;
step five, after one surface is printed, turning over the printed circuit board, and printing a second surface by the same method as the step S03 and the step S04;
step six, directly carrying out high-temperature curing after the two sides of the printed circuit board are printed;
seventhly, characters are printed on the surface of the printed circuit board;
preferably, in this example, step five employs the circuit board turnover device as in the above embodiment.
Specifically, in the pattern of the silk-screen printing plate in the second step, the position where light is transmitted is the position where oil needs to be fed, and solder resist ink is printed on the printed circuit board; the position of lightproof is the position that does not need to get off the oil, does not need to print the resistance welding.
Specifically, the temperature of the high-temperature curing in the sixth step is 150 +/-10 ℃, and the curing time is 60-90 minutes.
Specifically, the drying temperature in the first step is 60-80 ℃, and the drying time is 10-30 minutes.
Specific embodiments are described below:
firstly, coating a layer of photosensitive glue on a blank silk screen, and baking the blank silk screen at the temperature of about 75 ℃; then transferring the solder resist pattern to a screen printing plate by laser imaging, and flushing the unexposed pattern by using a high-pressure water gun; in the pattern of the silk-screen printing plate, the light-transmitting position is the position needing oil feeding, solder resist ink is printed on the printed circuit board, the light-transmitting position is the position needing no oil feeding, and solder resist printing is not needed; then, installing the prepared silk screen on a silk screen printing machine, fixing the printed board on a silk screen printing machine table by using the process holes on the printed board, and then adjusting the alignment of the silk screen printing plate and the patterns of the printed board to ensure that the patterns are coincided; then starting a screen printer, and printing a layer of uniform UV solder resist ink on the position of the printed circuit board needing to be covered with solder resist; after one surface is printed, the printed circuit board is turned over by a circuit board turning device, the first telescopic part 31 is started, the second telescopic part 33 moves downwards, when the connecting plate 37 abuts the first recess 12, the clamping block 39 is now in the third recess 15, the second telescopic member 33 is activated, causing the carriage 35 to slide in the second recess 14, and the clamping block 39 to move towards the centre of the groove 11, when the end of the clamp block 39 abuts against one end of the third recess 15, the four corners of the circuit board enter the strip-shaped groove 391, clamping the circuit board, then, the first telescopic member 31 is started again to lift the second telescopic member 33 upwards by a predetermined height, so as to drive the circuit board to lift the circuit board upwards by the predetermined height, at this time, the motor 36 is started to drive the rotating shaft 35 to rotate, so as to turn the circuit board 180 degrees, then, the first telescopic member 31 is started again, so that the second telescopic member moves downwards, and the circuit board is placed in the groove 11; then starting the second surface of the printed circuit board of the screen printing machine, directly carrying out high-temperature curing after the two surfaces of the printed circuit board are printed, and baking for 60-90 minutes at 150 ℃; finally, characters are printed on the surface of the printed circuit board.
In the embodiment, the solder resist pattern is directly made on the silk screen, and then the solder resist to be covered is directly printed on the printed board surface through the silk screen pattern, so that the steps of pre-baking, exposure and development are reduced, and the process flow is shortened; because the steps of exposure and development are reduced, a film is not needed in the production process, and the cost is greatly saved; after one surface of the circuit board is printed, the circuit board is turned over by the automatic turning device, and then the second surface is printed, so that the labor is reduced, the working efficiency is improved, and meanwhile, errors are not easy to occur; a connecting rod is added between the connecting plate and the clamping block, so that the connecting plate and the objective table are prevented from interfering in the process of clamping the circuit board; at least one part of one end of the second concave part and one end of the third concave part are located in the groove area, so that the circuit board can be conveniently clamped by the turnover mechanism.
The above is only a preferred embodiment of the present invention and is not intended to limit the present invention, and it is apparent that those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (8)
1. A printed circuit board silk-screen solder mask method is characterized by comprising the following steps:
s01, coating a layer of photosensitive glue on the blank silk screen, and baking the photosensitive glue;
s02, transferring the solder resist pattern to a screen printing plate by laser imaging, and flushing the unexposed pattern by a high-pressure water gun;
s03, installing the prepared silk screen on a silk screen printing machine, fixing the printed board on a silk screen printing machine table by using the process holes on the printed board, and then adjusting the silk screen printing plate to be aligned with the patterns of the printed board to ensure that the patterns are coincided;
s04, printing a layer of uniform UV solder resist ink on the position of the printed circuit board needing to be covered with the solder resist;
s05, after one surface is printed, turning over the printed circuit board, and printing a second surface by the same method as the step S03 and the step S04;
s06, directly carrying out high-temperature curing after the two sides of the printed circuit board are printed;
s07, printing characters on the surface of the printed circuit board;
wherein step S05 adopts circuit board turning device, and circuit board turning device includes:
a linear mechanism (2);
two object stages (1) are arranged on the linear mechanism (2) and used for placing a printed circuit board, wherein one object stage (1) is positioned above the other object stage (1);
the turnover mechanism (3) comprises two turnover assemblies, the turnover assemblies are symmetrically arranged and are arranged on one side of the linear mechanism (2) and used for turning the printed circuit board 180 degrees;
the turnover component comprises a first telescopic piece (31) and a rotating shaft (35), wherein the first telescopic piece (31) is vertically arranged on a base (32), the base (32) is fixed to the side of the linear mechanism (2), the upper end of the first telescopic piece (31) is connected with a second telescopic piece (33) horizontally arranged, one end of the second telescopic piece (33) is provided with a support (34), one end of the rotating shaft (35) penetrates through the support (34), one end of the rotating shaft (35) is connected with a motor (36), the motor (36) is fixed to the support (34), the other end of the rotating shaft (35) is provided with a connecting plate (37), two ends of the connecting plate (37) are provided with connecting rods (38), one end of each connecting rod (38) is connected with a clamping block (39), and the side of each clamping block (39) is provided with a strip-shaped groove (391) for passing through a circuit board.
2. The printed circuit board screen printing solder mask method according to claim 1, wherein in the pattern of the screen printing plate of step S02, the position where light is transmitted is the position where oil needs to be dropped, and solder mask ink is printed on the printed circuit board; the position of lightproof is the position that does not need to get off the oil, does not need to print the resistance welding.
3. The printed circuit board screen printing solder resist method according to claim 1, wherein the temperature of the high temperature curing in step S06 is 150 ± 10 ℃, and the curing time is 60-90 minutes.
4. The printed circuit board screen printing solder resist method as claimed in claim 1, wherein the baking temperature of step S01 is 60-80 ℃ and the baking time is 10-30 minutes.
5. The printed circuit board screen printing solder resist method according to claim 1, wherein the object stage (1) is provided with a groove (11) at the center, the groove (11) is used for carrying a circuit board, the object stage (1) is provided with a first concave portion (12) at two sides of the end surface, the first concave portion (12) is used for penetrating through the connecting plate (37), a predetermined distance is reserved between the first concave portion (12) and the groove (11) and forms a boss (13), the first concave portion (12) is provided with a second concave portion (14) at the center along the width direction thereof, the second concave portion (14) is used for penetrating through the bracket (34), the first concave portion (12) is provided with a third concave portion (15) at two sides in the width direction, and the third concave portion (15) is used for penetrating through the clamping block (39).
6. The printed circuit board screen printing solder resist method of claim 5, characterized in that one end of the second recess (14) and the third recess (15) is at least partially located in the area of the groove (11).
7. The printed circuit board screen printing solder resist method of claim 5, wherein the length of the connecting rod (38) is not less than the width of the boss (13).
8. The printed circuit board screen printing solder resist method according to claim 1, wherein the lower end surface of the connecting plate (37) is higher than the lower end surface of the bracket (34).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111330657.0A CN113784526B (en) | 2021-11-11 | 2021-11-11 | Printed circuit board screen printing solder mask method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111330657.0A CN113784526B (en) | 2021-11-11 | 2021-11-11 | Printed circuit board screen printing solder mask method |
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| Publication Number | Publication Date |
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| CN113784526A CN113784526A (en) | 2021-12-10 |
| CN113784526B true CN113784526B (en) | 2022-03-01 |
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| CN202111330657.0A Active CN113784526B (en) | 2021-11-11 | 2021-11-11 | Printed circuit board screen printing solder mask method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117082746B (en) * | 2023-10-12 | 2024-01-23 | 四川英创力电子科技股份有限公司 | Processing method of half-etched copper characters |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104883825B (en) * | 2015-05-15 | 2018-04-06 | 江门崇达电路技术有限公司 | A kind of method for making solder mask in the circuit board |
| CN105208791B (en) * | 2015-10-09 | 2018-04-24 | 深圳崇达多层线路板有限公司 | A kind of production method of printed circuit board character |
| CN109890141B (en) * | 2019-03-22 | 2020-08-14 | 广州江美印刷有限公司 | Manufacturing process of antioxidant PCB (printed Circuit Board) |
| CN109936927A (en) * | 2019-04-10 | 2019-06-25 | 奥蒂玛光学科技（深圳）有限公司 | Circuit board renovation method and system |
| CN211518806U (en) * | 2019-09-20 | 2020-09-18 | 余道祥 | Automatic upset silk screen printing machine |
| CN112996250B (en) * | 2019-12-13 | 2022-06-10 | 安徽天兵电子科技股份有限公司 | Operation method of turnover device for PCB |
| CN211679206U (en) * | 2020-01-15 | 2020-10-16 | 深圳市迈越智能设备有限公司 | Automatic turning and cleaning device for materials |
| CN212786071U (en) * | 2020-08-26 | 2021-03-23 | 福清鑫铭电子科技有限公司 | Automatic turning device of PCB |
| CN112626590A (en) * | 2020-12-10 | 2021-04-09 | 王文俊 | A gilding equipment for production of PCB board |
| CN112867278A (en) * | 2021-01-29 | 2021-05-28 | 深圳市强达电路有限公司 | Solder mask manufacturing method for printed circuit sheet |
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