JPH0592544A - Cream solder printer and cream solder printing method - Google Patents

Abstract

PURPOSE:To maintain and control the contact degree of a printing mask and a circuit board even if the flatness of printing mask is insufficient when printing is performed on a cream solder circuit board and provide a cream solder printer and cream solder printing method in which accurate transfer of cream solder can be carried out. CONSTITUTION:A cream solder printer can be moved in the direction crossing the plate face of a circuit board 17 independently from a clamping means 11, and a suction means 14 holding a printing mask 21 by air-suction and retaining the same on the plate face of circuit board is installed. In the printing method of cream solder, the suction means 14 is moved close to the printing mask 21 while being retained to be on the same level as the circuit board 17 retained by the clamping means 11, and the printing mask is held by the suction means, and then cream solder on the upper face of printing mask is squeezed and transferred onto the circuit board, and the circuit board only is separated from the printing mask, and then the holding of printing mask by the suction means is released.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cream solder printing machine and a cream solder printing method, and more particularly, to printing cream solder on a circuit board on which a circuit pattern is formed, at a desired position for mounting an electronic component or the like. The present invention relates to a printing machine and a method for printing cream solder.

[0002]

2. Description of the Related Art In a printing machine for printing cream solder at a required position on a circuit board on which a circuit pattern is formed,
As shown in FIG. 6, the print mask 1 such as a stainless plate having a predetermined print pattern and the circuit board 3 held by the board clamp 2 are offset by a predetermined distance L (about 0.2 to 0.5 mm). In this state, the mask 1 and the circuit board 3 are brought into close contact with each other while pressing the squeegee (spatula) 4 on the mask 1, and the cream solder 5 on the mask 1 is squeezed by the squeegee 4 in the arrow direction. As a result, a contact printing method is generally used in which the cream solder 4 is pushed out onto the circuit board 2 through the opening of the mask 1 and the print pattern is transferred to the circuit board 2.

[0003]

By the way, in the cream solder printing machine, the contact printing method of contacting the print mask and the circuit board is a simple and excellent printing method. It is important to maintain and maintain the degree of adhesion at all times during printing.

That is, as shown in FIG. 7, when the flatness of the print mask 1 is insufficient and the surface of the mask 1 is inclined with respect to the plate surface of the circuit board 3, the print mask 1 is squeezed during squeezing.
However, there is a problem in that it is not possible to secure sufficient adhesiveness with the circuit board 3 and the cream solder cannot be accurately transferred. The present invention has been made in view of the above points, and when transferring cream solder onto a circuit board, even if the flatness of the print mask is insufficient, the adhesion between the print mask and the circuit board is always constant. It is an object of the present invention to provide a cream solder printing machine and a printing method thereof, which can be maintained and managed as described above and can accurately transfer cream solder.

[0005]

In order to achieve the above object, according to the cream solder printing machine of the present invention, the above-mentioned printing is performed by squeezing the cream solder with the spatula on the upper surface of the printing mask in which the printing pattern is perforated. In a cream solder printing machine for printing cream solder on a required portion of a circuit board held by a clamp means that can be attached to and detached from a mask, the cream solder printer is movable in a direction orthogonal to a plate surface of the circuit board independently of the clamp means. Adsorption means for adsorbing the print mask and holding it on the plate surface of the circuit board is provided.

Further, according to the method for printing cream solder of the present invention, the circuit board held by the clamp means which can be raised and lowered by squeezing the cream solder with the spatula on the upper surface of the printing mask having the printed pattern. In a method of printing cream solder at a required portion of the circuit board, the circuit board is provided so as to be movable in a direction orthogonal to a plate surface of the circuit board independently of the clamp means, and sucks the print mask. Adsorption means to hold on the plate surface of
While holding the circuit board held by the clamp means so as to be flush with the circuit board, the print mask is brought close to the print board, and the print mask is sucked by the suction means, and then cream solder is applied to the upper surface of the print mask with a spatula. By squeezing, the print pattern is transferred onto the circuit board, and only the circuit board held by the clamp means is separated from the print mask, and then the suction of the print mask by the suction means is released. It is composed of steps.

[0007]

The suction means moves independently of the clamp means in a direction orthogonal to the board surface of the circuit board, and when printing the cream solder on the circuit board, the printing mask is sucked to the board surface of the circuit board. Hold. When the cream solder is printed on the circuit board, the suction means is held so as to be flush with the circuit board held by the clamp means and brought close to the print mask. Print on the substrate.

After the cream solder is printed on the circuit board, only the circuit board is separated from the printing mask, and then the suction of the printing mask by the suction means is released. The printing of the cream solder can be performed accurately without being affected by the deformation caused by the return of the solder paste to the original state.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to FIGS. The cream solder printing machine 10
As shown in FIG. 1, the substrate clamp 11 and the printing table 1
2, table lifting device 13, suction devices 14, 14 arranged on both sides of the table lifting device 13, respectively suction device 1
4, a driving device 15 for driving up and down 4, a position correcting device 16,
A mask frame 20, a print mask 21 attached to the mask frame 20, and a squeegee 22 squeezed by a driving device (not shown) are provided.

The board clamp 11 is mounted on the printing table 12 and detachably holds a work (circuit board) 17 on which cream solder is to be printed.
The table elevating device 13 lifts and lowers the printing mask 21 so that the printing mask 21 can be moved in and out of contact with the printing mask 21. The adsorption device 14 is the drive device 1
It is driven in the up-down direction orthogonal to the plate surface of the work 17 independently of the substrate clamp 11 by 5 to adsorb the print mask 21 and hold it on the plate surface of the work 17. Each adsorption device 14
As shown in the figure, the other end of the vacuum pipe 14a, one end of which is connected to a vacuum generator (not shown), is open to the upper surface, and the print mask 21 is sucked by this. Here, the table lifting device 13 and each drive device 15 are arranged on the position correction device 16 as shown in the figure.

The position correction device 16 is a table lifting device 1.
3 is controlled to correct the position of the workpiece 17 held by the substrate clamp 11 with respect to the mask frame 20, that is, the workpiece 17 with respect to the printing mask 21, to an appropriate position suitable for cream solder printing. The mask frame 20 is attached to a mask fixing device (not shown). As the printing mask 21 attached to the mask frame 20, a stainless plate having a thickness of about 150 to 200 μm, which is punched with a predetermined printing pattern according to the thickness of cream solder to be printed, is used.

The squeegee 22 is driven by a squeegee device (not shown) to squeeze the cream solder on the print mask 21 in the manner shown by the arrow in the figure. The printing machine 10 of the present invention is configured as described above, and prints cream solder on the work 17 by the method of the present invention described below. First, the work 17 is mounted on the substrate clamp 11 in advance, and a required amount of cream solder is supplied onto the print mask 21, and the print table 12 is moved by the table elevating device 13 and each suction device 14 is driven by the driving device 15. To drive.

The substrate clamp 11 and each suction device 1
4 while keeping the same level, and as shown in FIG. 2, the print mask 21 and the surface of the work 17 are almost in close contact with each other or a slight offset amount (0.2 to 0.5 m
Stop at a nearby position (about m). In parallel with this operation, the position correcting device 16 corrects the position of the work 17 with respect to the print mask 21.

Next, the vacuum generator is driven to adsorb the print masks 21 located in the vicinity of the upper surfaces of the respective suction devices 14 as shown in FIG. Squeegee the squeegee 22 in the direction of the arrow in the figure. As a result, the cream solder having the print pattern punched in the print mask 21 is transferred onto the work 17.

At this time, the print mask 2 is used by each suction device 14.
Since 1 is absorbed, even if the flatness of the print mask 21 is insufficient and the surface of the mask 21 is inclined with respect to the plate surface of the work 17, sufficient adhesion between the work 17 and the print mask 21 is secured. Then, the solder paste is accurately transferred onto the work 17. Next, as shown in FIG. 4, only the printing table 12, that is, the work 17 is lowered by the table elevating / lowering device 13 to be separated from the printing mask 21 by the plate. At this time, the printing mask 2 by the suction device 14 is released before the plate separation.
When the suction of No. 1 is released, the print mask 21 is suddenly deformed in an attempt to return to the original state shown in FIG. 2 attached to the mask frame 20, which is not preferable for accurately transferring the cream solder to the work 17.

Thereafter, as shown in FIG. 5, the adsorption device 1
4, the suction of the print mask 21 is released, and the print mask 2
1 is returned to the original state shown in FIG. As a result, even if the print mask is deformed due to the release of the suction, the work 17
Has already been separated from the printing mask 21 and has no effect. Next, each drive device 15 is driven to drive the suction device 14
After returning to the state at the start of printing shown in FIG. 1, the work 17 on which the cream solder is printed is removed from the substrate clamp 11, and the cream solder is replaced with a new work to be printed. Thereafter, the printing of the cream solder on the work is performed in the same manner as described above.

[0017]

As is apparent from the above description, according to the cream solder printing machine and the cream solder printing method of the present invention, it is possible to move independently of the clamping means in the direction orthogonal to the plate surface of the circuit board. Adsorbing means for adsorbing the print mask and holding it on the board surface of the circuit board, adsorbing the print mask by bringing the adsorbing means close to the print mask, and then squeezing the cream solder on the upper surface of the print mask with a spatula. Then, after transferring the printing pattern onto the circuit board and separating only the circuit board held by the clamping means from the printing mask, the suction of the printing mask by the suction means is released, so that the cream solder is applied on the circuit board. Since printing is performed, even if the flatness of the print mask is insufficient, the degree of adhesion between the print mask and the circuit board can be increased, and constant maintenance can be maintained at all times. It can be transferred to.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing a cream solder printing machine of the present invention.

FIG. 2 is a view for explaining a cream solder printing method of the present invention using the cream solder printing machine of FIG. 1, and is an explanatory view when a suction unit and a circuit board are offset from a printing mask by a predetermined distance and arranged in proximity. is there.

FIG. 3 is an explanatory view showing a state in which a print mask is sucked by a suction means and cream solder is squeezed.

FIG. 4 is an explanatory view showing a state in which only the circuit board is separated from the printing mask.

FIG. 5 is an explanatory diagram showing a state in which suction of a print mask by suction means is released.

FIG. 6 is an explanatory diagram illustrating a method of printing cream solder in a conventional cream solder printing machine.

FIG. 7 is an explanatory diagram illustrating a problem in printing cream solder when a print mask is inclined with respect to a circuit board.

[Explanation of symbols]

 10 Cream Solder Printing Machine 11 Board Clamp 14 Adsorption Device 17 Workpiece (Circuit Board) 21 Printing Mask 22 Squeegee

Claims (2)

[Claims] 1. A squeegee of cream solder with a spatula on the upper surface of a print mask having a printed pattern formed therein, so that the cream solder is applied to a predetermined portion of a circuit board held by a clamp means that can be freely attached to and detached from the print mask. In a cream solder printing machine for printing, provided is a suction means that is movable in a direction orthogonal to the plate surface of the circuit board independently of the clamp means and that sucks the print mask and holds it on the board surface of the circuit board. A cream solder printing machine characterized by that. 2. A cream solder for printing cream solder on a predetermined portion of a circuit board held by a vertically movable clamp means by squeezing cream solder with a spatula on the upper surface of a print mask having a printed pattern. In the printing method, the suction means, which is provided independently of the clamp means and is movable in a direction orthogonal to the plate surface of the circuit board, holds the print mask and holds the print mask on the board surface of the circuit board. While holding the circuit board held by the means so as to be flush with the circuit board, the print mask is approached, and the print mask is sucked by the suction means, and then the cream solder on the upper surface of the print mask is squeezed with a spatula. Thus, the print pattern is transferred onto the circuit board, and only the circuit board held by the clamp means is separated from the print mask. A method for printing cream solder, characterized in that the suction of the print mask by the suction means is released after the operation.