CN112867278A - Solder mask manufacturing method for printed circuit sheet - Google Patents
Solder mask manufacturing method for printed circuit sheet Download PDFInfo
- Publication number
- CN112867278A CN112867278A CN202110125930.XA CN202110125930A CN112867278A CN 112867278 A CN112867278 A CN 112867278A CN 202110125930 A CN202110125930 A CN 202110125930A CN 112867278 A CN112867278 A CN 112867278A
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- China
- Prior art keywords
- printed circuit
- hole
- solder mask
- circuit board
- manufacturing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention provides a solder mask manufacturing method of a printed circuit sheet, which comprises the following steps: sand blasting, point blocking film manufacturing, point blocking screen plate manufacturing, air guide plate manufacturing, screen printing of a first surface, prebaking of the first surface, printing of a second surface, prebaking of the second surface, exposure and development; the invention can solve the problems that the screen printing of the printed circuit board sheet is leaked to the back surface and the plug hole is transparent, finally realizes the yield improvement of the printed circuit board, reduces the waste of the board, reduces the production cost and improves the manufacturing capability of the printed circuit board sheet.
Description
Technical Field
The invention relates to the field of printed circuit boards, in particular to a method for manufacturing a printed circuit board sheet through resistance welding.
Background
Generally, a thin printed circuit board is difficult to manufacture in a solder mask process, particularly a printed circuit board with a thin board thickness and needing a solder mask plug hole is easy to cause oil leakage to the back surface and light transmission of the plug hole in a silk-screen printing mode by using a traditional silk-screen printing mode.
Accordingly, the prior art is deficient and needs improvement.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the solder mask manufacturing method for the printed circuit sheet, which can solve the problems that the printed circuit sheet is subjected to oil leakage to the back surface by silk screen printing and the hole is plugged for light transmission, and improves the yield and the manufacturing capacity of the printed circuit sheet
The method for manufacturing the printed circuit sheet through the solder mask comprises the following steps of:
s1, sand blasting: and (3) sand blasting the printed circuit sheet to be processed with the solder resist, cleaning the oxidation and oil stains on the sheet surface, and roughening the copper surface.
S2, manufacturing a stop point film: and (3) performing light transmission design on the film at the position corresponding to the hole needing to be windowed, wherein the light transmission point is 4-8mil larger than the whole hole diameter of the drilled hole, and performing light blocking design on all other positions of the through hole containing the plate needing to be plugged.
S3, manufacturing a stop point screen plate: coating a layer of photosensitive paste on a 36T screen and drying, pasting a point blocking film on the screen coated with the photosensitive paste, transferring the pattern on the point blocking film to the screen by exposure and flushing development, and transferring the light-transmitting position of the point blocking film to the screen to obtain the light-blocking design, or vice versa.
S4, manufacturing an air guide plate: and etching the copper by using a copper-clad plate with the thickness of 1.0-1.6mm, drilling a plate edge positioning hole with the diameter of 3.2mm by using a drilling machine, and simultaneously drilling a hole at the position corresponding to the via hole of the plug hole to be soldered, wherein the diameter of the drilled hole is 0.6-1mm larger than the diameter of the via hole of the plug hole to be soldered integrally.
S5, silk-screen printing of the first surface: installing and fixing a stop screen plate on a screen printer, installing and fixing an air guide plate on the table top of the screen printer, positioning a printed circuit sheet subjected to sand blasting on the air guide plate by using a positioning sheet, aligning the stop screen, the air guide plate and the printed circuit sheet subjected to sand blasting, and printing ink on the surface of the printed circuit sheet subjected to sand blasting by using the screen printer at a certain pressure and speed, wherein through holes needing to be plugged on the printed circuit sheet are drilled through air holes on the air guide plate, the through holes needing to be plugged on the printed circuit sheet are plugged by the printing ink, other holes needing to be windowed are designed by the stop screen, the printing ink cannot seep oil to the back of the sheet, and the printed circuit sheet subjected to single-side screen printing is inserted and fixed by using a special sheet frame.
S6, pre-baking the first surface: pre-baking the printed circuit sheet fixed by the inserted frame at the temperature of 72-75 ℃ for 20-25 minutes, and drying the ink.
S7, printing on the second side: and silk-screening the second surface in the same manner as the silk-screening of the first surface.
S8, pre-baking the second surface: pre-baking the printed circuit sheet fixed by the inserted frame at the temperature of 72-75 ℃ for 25-35 minutes, and drying the ink.
S9, exposure, development: the photosensitive ink generates polymerization reaction after being irradiated by ultraviolet rays in the film light-transmitting area, the photosensitive ink in the area can be reserved in a later developing step, the photosensitive ink which is not irradiated by the ultraviolet rays in the film light-blocking area can be developed in the developing step, and the bonding pad and the plug-in hole which need to be used for welding electric performance of the connector are exposed.
Preferably, the printed circuit thin plate is a printed circuit board having a plate thickness of less than 0.5 mm.
Preferably, the film at the position corresponding to the hole to be windowed is designed to be light-transmitting, and the light-transmitting point is 4-8mil, preferably 6mil larger than the whole hole diameter of the drilled hole.
Preferably, the position of the light-transmitting film on the screen is shifted to the screen to form a light-blocking design, and vice versa.
Preferably, the thickness of the air guide plate is 1.0-1.6mm, preferably 1.4mm, the plate edge positioning hole is drilled by a drilling machine, the diameter of the positioning hole is 3.2mm, meanwhile, the hole is drilled at the position corresponding to the via hole of the hole to be solder-welded, and the drilling diameter is 0.6-1mm, preferably 0.8mm larger than the whole diameter of the via hole of the hole to be solder-welded.
Preferably, the three parts of the stop point net, the air guide plate and the printed circuit sheet subjected to sand blasting are aligned, printing ink is printed on the surface of the printed circuit sheet subjected to sand blasting at a certain pressure and speed by a screen printing machine, a through hole is drilled on the through hole air guide plate needing hole plugging on the printed circuit sheet, the printing ink can plug the through hole needing hole plugging on the printed circuit sheet, the rest holes needing window opening are designed by the stop point net, the printing ink cannot seep oil to the back of the sheet, and the printed circuit sheet subjected to single-side screen printing is inserted and fixed by using a special sheet frame.
Preferably, the first face is pre-baked at a temperature of 72-75 ℃ for 15-25 minutes, preferably 20 minutes.
Preferably, the pre-baking temperature of the second face is 72-75 ℃, and the pre-baking time is 25-35 minutes, preferably 30 minutes.
Has the advantages that:
compared with the prior art, the invention has the beneficial effects that: the invention can solve the problems that the screen printing of the printed circuit board sheet is leaked to the back surface and the plug hole is transparent, finally realizes the yield improvement of the printed circuit board, reduces the waste of the board, reduces the production cost and improves the manufacturing capability of the printed circuit board sheet.
Detailed Description
In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to specific examples. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "fixed," "integrally formed," "left," "right," and the like as used herein are for descriptive purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
One embodiment of the invention is: the method for manufacturing the printed circuit sheet through the solder mask comprises the following steps of:
s1, sand blasting: sand blasting is carried out on a printed circuit thin plate needing to be processed with solder resist, oxidation and oil stain on the plate surface are cleaned, and a copper surface is roughened; the coarsening copper surface enhances the adhesive force.
S2, manufacturing a stop point film: performing light transmission design on a film at a position corresponding to a hole needing to be windowed, wherein a light transmission point is 4-8mil larger than the whole hole diameter of a drilled hole, and performing light blocking design on all other positions of via holes needing to be plugged on a printed circuit board; the design sets corresponding parameters according to the manufacturing range of the production process of a factory, and sets corresponding parameter changes according to specific conditions for special positions, so that the production requirements are met.
S3, manufacturing a stop point screen plate: coating a layer of photosensitive paste on a 36T screen and drying, pasting a point blocking film on the screen coated with the photosensitive paste, transferring the pattern on the point blocking film to the screen by exposure and flushing development, and transferring the light-transmitting position of the point blocking film to the screen to obtain the light-blocking design, or vice versa.
S4, manufacturing an air guide plate: etching copper by using a copper-clad plate with the thickness of 1.0-1.6mm, preferably selecting a core plate with the thickness of 1.4mm, drilling a plate edge positioning hole by using a drilling machine, wherein the diameter of the positioning hole is 3.2mm, and simultaneously drilling a hole at the position corresponding to the via hole of the hole to be plugged with the solder resist, and the diameter of the drilled hole is 0.6-1mm larger than the diameter of the via hole to be plugged with the solder resist; preferably 0.8 mm.
S5, silk-screen printing of the first surface: installing and fixing a stop screen plate on a screen printer, installing and fixing an air guide plate on the table top of the screen printer, positioning a printed circuit sheet subjected to sand blasting on the air guide plate by using a positioning sheet, aligning the stop screen, the air guide plate and the printed circuit sheet subjected to sand blasting, and printing ink on the surface of the printed circuit sheet subjected to sand blasting by using the screen printer at a certain pressure and speed, wherein through holes needing to be plugged on the printed circuit sheet are drilled through air holes on the air guide plate, the through holes needing to be plugged on the printed circuit sheet are plugged by the printing ink, other holes needing to be windowed are designed by the stop screen, the printing ink cannot seep oil to the back of the sheet, and the printed circuit sheet subjected to single-side screen printing is inserted and fixed by using a special sheet frame.
S6, pre-baking the first surface: pre-baking the printed circuit sheet fixed by the inserted frame at the temperature of 72-75 ℃ for 20-25 minutes, and drying the ink.
S7, printing on the second side: and silk-screening the second surface in the same manner as the silk-screening of the first surface.
S8, pre-baking the second surface: pre-baking the printed circuit sheet fixed by the inserted frame at the temperature of 72-75 ℃ for 25-35 minutes, and drying the ink.
S9, exposure, development: the photosensitive ink generates polymerization reaction after being irradiated by ultraviolet rays in the film light-transmitting area, the photosensitive ink in the area can be reserved in a later developing step, the photosensitive ink which is not irradiated by the ultraviolet rays in the film light-blocking area can be developed in the developing step, and the bonding pad and the plug-in hole which need to be used for welding electric performance of the connector are exposed.
In some embodiments of the invention, the printed circuit thin plate is a printed circuit board with a plate thickness of 0.3 mm; performing light transmission design on the film at the position corresponding to the hole to be windowed, wherein the light transmission point is 6 mils larger than the whole hole diameter of the drilled hole; the thickness of the air guide plate is 1.4mm, a plate edge positioning hole is drilled through a drilling machine, the diameter of the positioning hole is 3.2mm, meanwhile, a hole is drilled at the position corresponding to the via hole of the hole to be plugged in the solder mask mode, and the diameter of the drilled hole is 0.8mm larger than the diameter of the via hole to be plugged in the solder mask mode;
the method comprises the following steps of aligning a dot blocking net, an air guide plate and a printed circuit sheet subjected to sand blasting, silk-screening printing ink on the surface of the printed circuit sheet subjected to sand blasting at a certain pressure and speed by using a silk-screen printing machine, wherein drilled air holes are formed in the air guide plate corresponding to through holes to be plugged in the printed circuit sheet, the through holes to be plugged in the printed circuit sheet are plugged by the printing ink, the other holes to be windowed are designed by the dot blocking net, the printing ink cannot seep oil to the back of the sheet, and the printed circuit sheet subjected to single-sided silk-screening is inserted and fixed by using a special sheet frame;
the first surface is pre-baked at the temperature of 75 ℃ for 20 minutes; the pre-baking temperature of the second surface is 75 ℃, and the pre-baking time is 30 minutes;
the technical features mentioned above are combined with each other to form various embodiments which are not listed above, and all of them are regarded as the scope of the present invention described in the specification; also, modifications and variations may be suggested to those skilled in the art in light of the above teachings, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. A printed circuit sheet solder mask manufacturing method is characterized by comprising the following steps:
s1, sand blasting;
s2, manufacturing a stop point film;
s3, manufacturing a stop point screen plate;
s4, manufacturing an air guide plate;
s5, silk-screen printing the first surface;
s6, pre-baking the first surface;
s7, printing a second side;
s8, pre-baking the second face;
and S9, exposing and developing.
2. The printed circuit board solder mask manufacturing method according to claim 1, wherein: the thickness of the printed circuit thin plate is less than 0.5 mm.
3. The printed circuit board solder mask manufacturing method according to claim 1, wherein: the point-blocking film is manufactured by carrying out light transmission design on the film at the position corresponding to the hole needing to be windowed, and the light transmission point is 4-8mil larger than the whole hole diameter of the drilled hole.
4. The printed circuit board solder mask manufacturing method according to claim 1, wherein: the light-blocking design is realized when the light-transmitting position on the point blocking film is transferred to the screen printing plate, and vice versa.
5. The printed circuit board solder mask manufacturing method according to claim 1, wherein: the thickness of the air guide plate is 1.0-1.6mm, the plate edge positioning hole is drilled through a drilling machine, meanwhile, a hole is drilled at the position corresponding to the via hole of the plug hole to be welded, and the diameter of the drilled hole is 0.6-1mm larger than the diameter of the via hole of the plug hole to be welded.
6. The printed circuit board solder mask manufacturing method according to claim 1, wherein: the printing of the first surface and the second surface of the silk screen also comprises alignment, and the dot blocking net, the air guide plate and the printed circuit sheet subjected to sand blasting are aligned.
7. The printed circuit board solder mask manufacturing method according to claim 1, wherein: the pre-baking temperature of the first surface is 72-75 ℃, and the pre-baking time is 15-25 minutes.
8. The printed circuit board solder mask manufacturing method according to claim 1, wherein: the pre-baking temperature of the second surface is 72-75 ℃, and the pre-baking time is 25-35 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110125930.XA CN112867278A (en) | 2021-01-29 | 2021-01-29 | Solder mask manufacturing method for printed circuit sheet |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110125930.XA CN112867278A (en) | 2021-01-29 | 2021-01-29 | Solder mask manufacturing method for printed circuit sheet |
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| CN112867278A true CN112867278A (en) | 2021-05-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110125930.XA Pending CN112867278A (en) | 2021-01-29 | 2021-01-29 | Solder mask manufacturing method for printed circuit sheet |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113784526A (en) * | 2021-11-11 | 2021-12-10 | 四川英创力电子科技股份有限公司 | Printed circuit board screen printing solder mask method |
| CN114916151A (en) * | 2022-07-18 | 2022-08-16 | 江苏博敏电子有限公司 | Manufacturing method of wet film type solder mask process of ultrathin IC packaging support plate |
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| CN113784526A (en) * | 2021-11-11 | 2021-12-10 | 四川英创力电子科技股份有限公司 | Printed circuit board screen printing solder mask method |
| CN114916151A (en) * | 2022-07-18 | 2022-08-16 | 江苏博敏电子有限公司 | Manufacturing method of wet film type solder mask process of ultrathin IC packaging support plate |
| CN114916151B (en) * | 2022-07-18 | 2022-12-30 | 江苏博敏电子有限公司 | Manufacturing method of wet film type solder mask process of ultrathin IC packaging support plate |
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Address after: 518000 101-401, building A-1, Fufa Industrial Park, No.3, Fuyuan 1st Road, Heping community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Qiangda circuit Co.,Ltd. Address before: 518000 101-401, building A-1, Fufa Industrial Park, No.3, Fuyuan 1st Road, Heping community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Applicant before: Q&D CIRCUITS Co.,Ltd. |
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Application publication date: 20210528 |
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