CN114916151B - Manufacturing method of wet film type solder mask process of ultrathin IC packaging support plate - Google Patents
Manufacturing method of wet film type solder mask process of ultrathin IC packaging support plate Download PDFInfo
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- CN114916151B CN114916151B CN202210840305.8A CN202210840305A CN114916151B CN 114916151 B CN114916151 B CN 114916151B CN 202210840305 A CN202210840305 A CN 202210840305A CN 114916151 B CN114916151 B CN 114916151B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a manufacturing method of a wet film type solder mask process of an ultrathin IC carrier plate, which comprises the steps of cleaning and coarsening the copper surface of the IC carrier plate, sequentially screen-printing solder mask ink on the TOP surface and the BOT surface of the IC carrier plate according to design requirements, loading the screen-printed IC carrier plate by using a thin plate jig and then placing the IC carrier plate into an oven for pre-baking when screen-printing the solder mask ink on the TOP surface and the BOT surface, and sequentially exposing, developing, baking and curing after pre-baking to finish the manufacture of the solder mask process; the manufacturing method of the ultra-thin IC carrier wet film type solder mask process can greatly reduce the production cost of a board factory, optimize the manufacturing process and improve the production efficiency.
Description
Technical Field
The invention belongs to the technical field of printed circuits, and particularly relates to a manufacturing method of a wet film type solder mask process of an ultrathin (thickness less than or equal to 0.2 mm) IC carrier plate.
Background
With the development of electronic products towards refinement and miniaturization, many manufacturers tend to be thinner and lighter in the design of IC package carriers, so the difficulty of the IC package carriers in solder mask manufacturing is greatly increased; in the prior art, ultra-thin (the thickness is less than or equal to 0.2 mm) IC packaging carrier plates are usually manufactured by using dry film type solder resist ink; however, the dry film type solder resist ink is expensive in cost, can be produced only by using a special vacuum film pressing machine, is low in production efficiency, greatly increases the cost for a plate factory, cannot realize large-batch production, and restricts the profitability of the plate factory; therefore, the invention provides a new technical scheme to solve the problem of solder mask manufacturing of ultrathin (thickness less than or equal to 0.2 mm) IC carrier plates.
Disclosure of Invention
The invention aims to provide a manufacturing method of a wet film type solder mask process of an ultrathin IC carrier plate, which can greatly reduce the production cost of a plate factory, optimize the manufacturing process and improve the production efficiency.
In order to solve the technical problem, the invention provides a manufacturing method of a wet film type solder mask process of an ultrathin IC carrier plate, which comprises the following steps:
step 4, after the thin plate jig is removed, printing solder resist ink on the BOT surface of the IC carrier plate in a silk-screen mode according to design requirements, wherein the silk-screen mode and the method are consistent with those of the TOP surface;
step 5, loading the IC carrier plate with the silk-screen BOT surface by using a thin plate jig again, inserting the IC carrier plate into a frame, and placing the frame into an oven for secondary pre-baking;
step 6, exposing the pre-baked IC carrier plate to realize image transfer of the printing ink;
step 7, developing the exposed IC carrier plate;
and 8, baking and curing to finish the manufacture of the solder resist process.
As a preferred embodiment of the present invention, further:
in the method for manufacturing the ultra-thin IC carrier wet film type solder mask process, in step 1, an alkaline cleaning agent and a super-roughening liquid medicine are used for cleaning and roughening the copper surface of the IC carrier.
In the step 2, a layer of solder resist ink is uniformly screen-printed on the TOP surface of the board surface by adopting a screen printing mode, wherein the screen printing screen is selected according to the required ink thickness, and the screen printing ink thickness is 15-30 μm.
In the manufacturing method of the ultra-thin IC carrier wet film type solder mask process, in the step 3, because the ultra-thin plate is not hard enough to support, a thin plate jig is needed to fix the IC carrier first, and then the IC carrier is inserted into a pig cage frame and sent into an oven for pre-baking.
In the manufacturing method of the ultra-thin IC carrier wet film type solder mask process, the baking conditions in the step 3 are as follows: the prebaking temperature is 70-75 ℃, and the prebaking time is 20-30min, aiming at curing the wet film of TOP surface silk screen printing.
In the step 5, the thin plate jig is used again to fix the IC carrier plate, and then the IC carrier plate is inserted into a pig cage frame and sent into an oven for pre-baking, wherein the pre-baking temperature is 70-75 ℃, and the pre-baking time is 25-35min, so that the wet film silk-printed on the BOT surface is cured.
In the method for manufacturing the ultra-thin IC carrier wet film type solder mask process, in step 6, a DI exposure machine or a semi-automatic exposure machine is used to transfer an image to the surface of the IC carrier.
In the manufacturing method of the ultra-thin IC carrier wet film type solder mask process, the developing process in step 7 is specifically as follows: and developing the exposed image by adopting a sodium carbonate or potassium carbonate solution with the concentration of 0.8-1.2% at the temperature of 30 +/-2 ℃ to expose the required copper surface without using ink to protect the exposed copper surface.
In the step 8, the baking and curing are carried out, the developed IC carrier plate is placed into an oven to be baked, the baking condition can be set according to different ink characteristics, the high-temperature section at 155 ℃ is kept for not less than 60min, and the aim is to finally cure the ink on the plate surface.
The manufacturing method designed by the invention replaces the dry film type solder resist ink process flow, and has the following beneficial effects compared with the prior art:
(1) According to the manufacturing method of the ultra-thin (thickness is less than or equal to 0.2 mm) IC carrier plate wet film type solder mask process, wet film type assembly welding ink is adopted to replace dry film type solder mask ink, and the ink cost is saved by 500%;
(2) The manufacturing method of the ultra-thin (thickness is less than or equal to 0.2 mm) IC carrier wet film type solder mask process provided by the invention can finish the solder mask process manufacturing by using a screen printing machine without using an expensive vacuum film pressing machine, and the equipment cost is saved by 1000%;
(3) According to the manufacturing method of the ultra-thin (the thickness is less than or equal to 0.2 mm) IC carrier wet film type solder mask process, the silk-screen printing efficiency can reach 2panel/min, the vacuum film pressing efficiency is only 1panel/min, and the efficiency can be improved by 100%.
Drawings
FIG. 1 is a flow chart of a wet film type solder mask process designed by the present invention;
FIG. 2 is a schematic view of the assembly of the thin plate jig during pre-baking;
1-thin plate jig, 2-ultrathin IC packaging carrier plate, and 3-fastener.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and intended to explain the present invention and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "TOP", "bottom", "inner", "outer", "TOP face", "BOT face", and the like, are used in the orientations and positional relationships indicated in the accompanying drawings, which are merely for convenience of description and simplicity of description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Example 1
As shown in fig. 1-2, the present embodiment provides a manufacturing method of a wet film type solder mask process for an ultra-thin IC carrier, comprising the following steps:
step 4, after the thin plate jig is removed, performing screen printing on the BOT surface of the IC carrier plate according to design requirements, wherein the screen printing mode and the method are consistent with those of the TOP surface; fixing the IC carrier plate by using the thin plate jig again, then inserting the IC carrier plate into a pig cage frame, and feeding the pig cage frame into an oven for pre-baking, wherein the pre-baking temperature is 70-75 ℃, and the pre-baking time is 25-35min;
step 5, loading the IC carrier plate with the silk-screen BOT surface by using a thin plate jig again, inserting the IC carrier plate into the frame, and placing the frame into an oven for secondary pre-baking;
step 6, exposing the pre-baked IC carrier plate to realize image transfer of the printing ink; transferring the image to the surface of the IC carrier plate by using a DI (direct ion) exposure machine or a semi-automatic exposure machine;
step 7, developing the exposed IC carrier plate; developing the exposed image by adopting a sodium carbonate or potassium carbonate solution with the concentration of 0.8-1.2% at the temperature of 30 +/-2 ℃ to expose the required copper surface, wherein the exposed copper surface is not required to be protected by ink;
step 8, baking and curing, wherein baking conditions can be set according to different ink characteristics, and the baking conditions are kept for not less than 60min at the high temperature of 155 ℃, so that the solder mask process is manufactured;
the client: kangjia core cloud, product thickness 0.23mm
Capacity: 2000 square meters per month
Efficiency: the original flow is 30 pieces/hour, and 60 pieces/hour after optimization can be improved by 100 percent
The cost is saved: the original solder resist flow is 18 yuan per square meter, and the optimized solder resist flow is 12 yuan per square meter, thereby saving 33.3 percent.
Example 2
As shown in fig. 1-2, the present embodiment provides a method for manufacturing a wet film solder mask process of an ultra-thin IC carrier, which includes the following steps:
step 4, after the thin plate jig is removed, performing screen printing on the BOT surface of the IC carrier plate according to design requirements, wherein the screen printing mode and the method are consistent with those of the TOP surface; fixing the IC carrier plate by using the thin plate jig again, then inserting the IC carrier plate into a pig cage frame, and feeding the pig cage frame into the oven for pre-baking, wherein the pre-baking temperature is 70-75 ℃, and the pre-baking time is 25-35min;
step 5, loading the IC carrier plate with the silk-screen BOT surface by using a thin plate jig again, inserting the IC carrier plate into a frame, and placing the frame into an oven for secondary pre-baking;
step 6, exposing the pre-baked IC carrier plate to realize image transfer of the printing ink; transferring the image to the surface of the IC carrier plate by using a DI (direct ion) exposure machine or a semi-automatic exposure machine;
step 7, developing the exposed IC carrier plate; developing the exposed image by adopting a sodium carbonate or potassium carbonate solution with the concentration of 0.8-1.2% at the temperature of 30 +/-2 ℃ to expose the required copper surface without using ink for protection;
step 8, baking and curing, wherein baking conditions can be set according to different ink characteristics, and the baking conditions are kept for not less than 60min at the high temperature of 155 ℃, so that the solder mask process is manufactured;
customer: KCC with product thickness of 0.16mm
Capacity: 1000 square meters per month
Efficiency: the original flow is 20 pieces/hour, and the optimized flow is 40 pieces/hour, which can be improved by 100 percent
The cost is saved: the original solder resist flow is 18 yuan per square meter, and the optimized solder resist flow is 12 yuan per square meter, thereby saving 33.3 percent.
Example 3
As shown in fig. 1-2, the present embodiment provides a manufacturing method of a wet film type solder mask process for an ultra-thin IC carrier, comprising the following steps:
step 4, after the thin plate jig is removed, printing solder resist ink on the BOT surface of the IC carrier plate in a silk-screen mode according to design requirements, wherein the silk-screen mode and the method are consistent with those of the TOP surface; fixing the IC carrier plate by using the thin plate jig again, then inserting the IC carrier plate into a pig cage frame, and feeding the pig cage frame into an oven for pre-baking, wherein the pre-baking temperature is 70-75 ℃, and the pre-baking time is 25-35min;
step 5, loading the IC carrier plate with the silk-screen BOT surface by using a thin plate jig again, inserting the IC carrier plate into the frame, and placing the frame into an oven for secondary pre-baking;
step 6, exposing the pre-baked IC carrier plate to realize image transfer of the printing ink; transferring the image to the surface of the IC carrier plate by using a DI (direct immersion) exposure machine or a semi-automatic exposure machine;
step 7, developing the exposed IC carrier plate; developing the exposed image by adopting a sodium carbonate or potassium carbonate solution with the concentration of 0.8-1.2% at the temperature of 30 +/-2 ℃ to expose the required copper surface, wherein the exposed copper surface is not required to be protected by ink;
and 8, baking and curing, wherein baking conditions can be set according to different ink characteristics, and the high-temperature section at 155 ℃ is kept for not less than 60min, so that the solder resist process is manufactured.
Customer: goll shares, product thickness 0.32mm
Capacity: 500 square meters per month
Efficiency: the original flow is 30 pieces/hour, and 60 pieces/hour after optimization can be improved by 100 percent
The cost is saved: the original solder resist flow is 18 yuan per square meter, and the optimized solder resist flow is 12 yuan per square meter, thereby saving 33.3 percent.
In the present invention, unless otherwise specifically stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
It should be particularly noted that although the present specification describes embodiments, not every embodiment includes only a single technical solution, and such description of the specification is for clarity only, and those skilled in the art should take the specification as a whole, and the technical solutions in the embodiments may be appropriately combined to form other embodiments that may be understood by those skilled in the art, and the above embodiments only express the preferred embodiments of the technical solutions, and the description thereof is more specific and detailed, but cannot therefore be understood as the technical solutions.
Claims (1)
1. A manufacturing method of a wet film type solder mask process of an ultrathin IC carrier plate is characterized in that the thickness of the IC carrier plate is less than or equal to 0.2mm, and comprises the following steps:
step 1, cleaning and roughening the copper surface of the IC carrier plate by using an alkaline cleaning agent and super-roughening liquid medicine;
step 2, printing solder resist ink on the TOP surface of the IC carrier plate according to design requirements; uniformly screen-printing a layer of solder resist ink on the TOP surface of the board surface by adopting a screen printing method, wherein the screen printing screen is selected according to the required ink thickness, and the thickness of the screen printing ink is 15-30 mu m;
step 3, loading the IC carrier plate with the TOP surface printed by silk by using a thin plate jig, inserting the IC carrier plate into a frame, and placing the frame into an oven for prebaking; because the rigidity of the ultrathin plate is not enough to support, 2 thin plate jigs (1) are needed to be used, the IC carrier plate is firstly fixed through the buckles (3) and the buckle grooves, and then the IC carrier plate is inserted into the pig cage frame and sent into the oven for prebaking; pre-baking at 70-75 deg.C for 20-30min;
step 4, after the thin plate jig is removed, printing solder resist ink on the BOT surface of the IC carrier plate in a silk-screen mode according to design requirements, wherein the silk-screen mode and the method are consistent with those of the TOP surface; fixing the IC carrier plate by using the thin plate jig again, wherein 2 thin plate jigs (1) are needed, fixing the IC carrier plate by using a buckle (3) and a buckle groove, inserting the IC carrier plate into a pig cage frame, and feeding the pig cage frame into an oven for pre-baking at the pre-baking temperature of 70-75 ℃ for 25-35min;
step 5, loading the IC carrier plate with the silk-screen BOT surface by using a thin plate jig again, inserting the IC carrier plate into the frame, needing to use 2 thin plate jigs (1), fixing the IC carrier plate through a buckle (3) and a buckle groove, and then placing the IC carrier plate into an oven for secondary pre-baking;
step 6, exposing the pre-baked IC carrier plate to realize image transfer of the printing ink; transferring the image to the surface of the IC carrier plate by using a DI (direct ion) exposure machine or a semi-automatic exposure machine;
step 7, developing the exposed IC carrier plate; developing the exposed image by adopting a sodium carbonate or potassium carbonate solution at the temperature of 30 +/-2 ℃ to expose a required copper surface without using ink to protect the exposed copper surface;
and 8, baking and curing, wherein baking conditions can be set according to different ink characteristics, and the high-temperature section at 155 ℃ is kept for not less than 60min, so that the solder resist process is manufactured.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210840305.8A CN114916151B (en) | 2022-07-18 | 2022-07-18 | Manufacturing method of wet film type solder mask process of ultrathin IC packaging support plate |
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| CN202210840305.8A CN114916151B (en) | 2022-07-18 | 2022-07-18 | Manufacturing method of wet film type solder mask process of ultrathin IC packaging support plate |
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| CN114916151A CN114916151A (en) | 2022-08-16 |
| CN114916151B true CN114916151B (en) | 2022-12-30 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009260335A (en) * | 2008-03-28 | 2009-11-05 | Ngk Spark Plug Co Ltd | Multi-layer wiring board and manufacturing method thereof |
| CN110351958A (en) * | 2019-06-28 | 2019-10-18 | 奥士康精密电路（惠州）有限公司 | A kind of plate thickness is lower than the anti-welding making method of white oil plate of 0.4mm |
| CN112867278A (en) * | 2021-01-29 | 2021-05-28 | 深圳市强达电路有限公司 | Solder mask manufacturing method for printed circuit sheet |
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- 2022-07-18 CN CN202210840305.8A patent/CN114916151B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009260335A (en) * | 2008-03-28 | 2009-11-05 | Ngk Spark Plug Co Ltd | Multi-layer wiring board and manufacturing method thereof |
| CN110351958A (en) * | 2019-06-28 | 2019-10-18 | 奥士康精密电路（惠州）有限公司 | A kind of plate thickness is lower than the anti-welding making method of white oil plate of 0.4mm |
| CN112867278A (en) * | 2021-01-29 | 2021-05-28 | 深圳市强达电路有限公司 | Solder mask manufacturing method for printed circuit sheet |
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| CN114916151A (en) | 2022-08-16 |
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