CN110660551B - Method for manufacturing alloy plate metal resistor for electronic product - Google Patents
Method for manufacturing alloy plate metal resistor for electronic product Download PDFInfo
- Publication number
- CN110660551B CN110660551B CN201910892848.2A CN201910892848A CN110660551B CN 110660551 B CN110660551 B CN 110660551B CN 201910892848 A CN201910892848 A CN 201910892848A CN 110660551 B CN110660551 B CN 110660551B
- Authority
- CN
- China
- Prior art keywords
- manufacturing
- resistor
- alloy
- electrode
- alloy plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/003—Apparatus or processes specially adapted for manufacturing resistors using lithography, e.g. photolithography
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/2416—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
Abstract
The invention discloses a method for manufacturing an alloy plate metal resistor for an electronic product, which comprises the following steps: (1) manufacturing an array area containing a plurality of images matched with the shape of the resistor on an alloy plate with a set size by adopting a lithography yellow light process; (2) etching the image array area until the thickness of the alloy plate is matched with the target resistance value to obtain an alloy resistor circuit; (3) sequentially manufacturing a positive electrode and a back electrode on the front surface and the back surface of the alloy resistor by combining a micro-lithography yellow light process and an electroplating method; (4) manufacturing an insulating protective film in a non-electrode area, and manufacturing a laser code on the insulating protective film; (5) cutting off the resistors in the array area; (6) and sequentially depositing a plurality of metal films on the surface of the resistor corresponding to the electrode area. The manufacturing method of the invention obtains the precise alloy resistor circuit by the micro-lithography yellow light process technology, and the manufactured product has the characteristics of high precision and high power while being small in size, and the method is simple and efficient.
Description
Technical Field
The invention belongs to the field of resistors of electronic components, and particularly relates to a method for manufacturing an alloy plate metal resistor for an electronic product.
Background
With the progress of science and technology, the development of the era and the requirements of people on various electronic products are continuously improved, the resistor which is reliable in performance and stable in process and can be suitable for various environments also has a diversified development trend according to the special requirements of the electronic products, wherein the requirement of the market on a high-precision high-power resistor is continuously developed, particularly the requirement of the market on a miniaturized high-power high-precision resistor is promoted, so that resistor manufacturers can develop the miniaturized high-power resistor, and the miniaturized high-power high-precision resistor can be widely applied to the miniaturized high-power high-precision resistor in products such as automobiles, batteries, chargers, switching power supplies and the like.
In the face of the development trend that the size of terminal application equipment is increasingly miniaturized, the common alloy chip resistor cannot get rid of the constraint of a ceramic substrate framework in structural design, so that the resistor product has larger size, low precision and far lower heat dissipation capability than that of a metal, and is very easy to generate a cracking mode of shell-shaped cracking caused by internal stress, a ceramic substrate which is fragile and hard in texture (usually, the bending property is less than 3 mm) is adopted as a carrier, the shock resistance is poor, the bending and the cracking are easy to cause the failure of the whole circuit system, and the electrical property of the product of the alloy chip resistor is greatly influenced by temperature, and even the product has low failure power and is easy to burn when the temperature. The alloy chip resistor usually needs to adjust the thickness of an alloy foil to improve power, but the existing process cannot be etched completely, so that the product precision distribution is unstable, the yield is reduced, the reliability is low, the electrical property is unstable, the requirements on the product quality and the assembly process are high due to the fact that repeated correction is needed to finish multiple coating forming, and the overall production cost is high due to the fact that precious metals such as silver and the like are needed to be used as electrodes.
Disclosure of Invention
In view of the above problems, the present invention provides a method for manufacturing a metal resistor of an alloy plate for an electronic product.
The technical purpose is achieved, the technical effect is achieved, and the invention is realized through the following technical scheme:
a method for manufacturing an alloy plate metal resistor for an electronic product comprises (1) manufacturing an array region containing a plurality of images matched with the shape of the resistor on the alloy plate by a lithography yellow light process; (2) etching the image array area until the thickness of the alloy plate is matched with the target resistance value to obtain an alloy resistor circuit; (3) sequentially manufacturing a positive electrode and a back electrode on the front surface and the back surface of the alloy resistor by combining a micro-lithography yellow light process and an electroplating method; (4) manufacturing an insulating protective film in a non-electrode area, and manufacturing a laser code on the insulating protective film; (5) cutting off the resistors in the array area; (6) and sequentially depositing a plurality of metal films on the surface of the resistor corresponding to the electrode area.
As a further improvement of the invention, photosensitive films are sequentially covered on two surfaces of the alloy plate, then the alloy plate is exposed under the shielding of a light shielding template, after development, an array of dumbbell-shaped patterns which are matched with the shape of the metal resistor is formed on the surface of the alloy plate, and other areas are shielded by the photosensitive films.
Preferably, the image created in step (1) includes an image matching the overall shape of the resistor and an image of the resistor circuit disposed inside the resistor.
Preferably, the photosensitive film used in step (1) is a positive-working resin photosensitive film.
Preferably, in the step (2), the alloy plate is etched by a chemical etching method to obtain a resistance layer with a set thickness.
Preferably, the method comprises the step of manufacturing solder mask protective layers, wherein the solder mask protective layers are positioned on the upper surface and the lower surface of the alloy plate so as to protect a precise circuit formed by etching from being damaged and influencing the resistor precision.
Preferably, the step (3) specifically comprises the following steps:
covering a photosensitive film on the whole front surface or the whole back surface of the alloy plate, exposing and developing the electrode manufacturing area, and then exposing a precise alloy resistor circuit; then, depositing a front electrode layer and a back electrode layer by adopting a micro-lithography yellow light process and an electroplating method; and removing the photosensitive film in other areas by using an etching solution after the electrode is manufactured.
Preferably, before the manufacturing step (4), a laser or mechanical polishing method is adopted to manufacture a cut resistance-adjusting line on the surface of the manufactured resistor, the resistance and the precision of the alloy resistor are corrected, and the cut resistance-adjusting line is positioned at the middle edge part of a finished product, so that the influence on the electrical property can be reduced to the minimum.
Preferably, the step (5) includes cutting the resistors in the array on the alloy plate into particles by mechanical cutting or laser engraving.
Preferably, the step (6) includes depositing metal films of different materials on the surface of the electrode region by electroplating.
The invention has the beneficial effects that:
1. by adopting the micro-lithography yellow-light process, the manufactured alloy resistor has more miniaturized size, precise circuit, high precision and stable distribution (the allowable deviation range is +/-0.5% - +/-1%), and simultaneously, the problem of reduction of the yield of unclean products caused by increase of the metal thickness is effectively solved;
2. the alloy material is used as a carrier and a resistor, so that the alloy material has good flexibility and impact resistance, has ultralow resistance, high power, high reliability, stable ultralow resistance temperature coefficient, better load life capability, no product failure in a high-temperature environment and strong heat dissipation capability, and can greatly reduce the temperature resistance effect brought by electrodes;
3. compared with the traditional chip resistor, the packaging method is simpler and more efficient due to the fact that the chip resistor needs to be repeatedly corrected and printed in an alignment mode and the forming mode is complex;
4. noble metals such as silver and the like are not used as electrodes, so that the manufacturing cost is reduced, and the application requirement of a client application end on a miniaturized high-precision high-power resistor is met.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of the present invention after step A is completed;
FIG. 2 is a schematic structural diagram after step B is completed in the embodiment of the present invention;
FIG. 3 is a schematic structural diagram of the embodiment of the present invention after step D is completed;
FIG. 4 is a schematic structural diagram of the embodiment of the present invention after step E is completed;
FIG. 5 is a schematic structural diagram of the embodiment of the present invention after step F is completed;
FIG. 6 is a schematic structural diagram of the embodiment of the present invention after step G is completed;
FIG. 7 is a schematic structural diagram of the embodiment of the present invention after step H is completed;
FIG. 8 is a schematic structural diagram of an embodiment of the present invention after step I is completed;
FIG. 9 is a schematic structural diagram of the embodiment of the present invention after step K is completed;
FIG. 10 is a schematic structural diagram of the embodiment of the present invention after step M is completed;
FIG. 11 is a schematic structural diagram of the embodiment of the present invention after step N is completed;
FIG. 12 is a schematic structural diagram of the embodiment of the present invention after step O is completed;
FIG. 13 is a schematic structural diagram of the embodiment of the present invention after completion of step Q;
FIG. 14 is a schematic structural diagram of an embodiment of the present invention after step R is completed;
FIG. 15 is a schematic structural diagram of the embodiment of the present invention after step S is completed;
FIG. 16 is a schematic diagram of a cut single resistor made in accordance with the present invention;
wherein: 01-alloy plate, 02-first metal resistor, 03-insulating protective layer, 04-second metal resistor, 05-laser code, 06-copper layer, 07-nickel layer, 08-tin layer, 09-photosensitive film, 10-resin protective layer, 11-front electrode, 12-back electrode and 13-cut resistance-adjusting line.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following detailed description of the principles of the invention is provided in connection with the accompanying drawings.
The alloy plate metal resistor with the dumbbell-shaped structure manufactured by the invention as shown in fig. 16 comprises first metal resistors 02 which are symmetrically arranged at two sides up and down, first metal resistors 02 which are arranged in the middle and at two sides, and second metal resistors 04 which are vertically connected, wherein the first metal resistors 02 or the second metal resistors 04 comprise an alloy plate 01 and a resistor circuit arranged in the alloy plate 01, a front electrode 11 and a back electrode 12 are respectively arranged on the upper surface and the lower surface of the first metal resistor 02, and a welding-proof protective body attached to the surface of the electrode layer, at the same time, the outer layer of the first metal resistor 02 is sequentially wrapped by at least one metal film layer, and the outer layer of the second metal resistor 04 is wrapped by an insulating protective layer 03.
The resistance value and the precision of the alloy resistor are corrected by a cut resistance adjusting line 13 arranged on the surface of the second metal resistor 04 or the surface of the welding-proof protective body, and the cut resistance adjusting line is positioned at the middle edge part of a finished product, so that the influence on the electrical property can be reduced to the minimum.
The material for manufacturing the metal film layer comprises any one or more of copper, nickel or tin.
The resistor protection device further comprises a laser code 05 arranged on the surface of the insulation protection layer and used for marking the type and/or the resistance value of the resistor.
The thickness of the first metal resistor 02 is equal to that of the second metal resistor 04.
The invention provides a method for manufacturing an alloy plate metal resistor for an electronic product, which is realized by the following steps:
A. as shown in fig. 1, alloy material is mechanically cut into alloy plates 01 with set size according to product design;
B. as shown in fig. 2, a positive photosensitive film 09 with a size corresponding to the back surface of the alloy plate is covered on the back surface of the alloy plate 01;
C. covering a layer of photosensitive film 09 with the size equivalent to that of the front surface of the alloy plate on the front surface of the alloy plate;
D. as shown in fig. 3, transferring the designed resistor graphic array to the front surface of the alloy plate 01 covering the photosensitive film by a lithography yellow light process, and performing exposure treatment on the transparent region of the resistor to crosslink and cure the photosensitive film needing to retain the graphic;
E. as shown in fig. 4, the alloy plate subjected to the exposure treatment is subjected to a development treatment so that the photosensitive film in the unexposed area is dissolved and removed;
F. as shown in fig. 5, etching reaction is performed on the developed areas of the alloy plate by an acid process to obtain a plurality of resistor patterns with set dimensions;
G. as shown in fig. 6, covering a resin protective layer 10 with a size corresponding to the back surface of the alloy plate on the back surface of the alloy plate after etching treatment;
H. as shown in fig. 7, covering a layer of negative photosensitive film completely covering the front surface of the alloy plate on the front surface of the etched alloy plate again;
firstly, respectively setting an exposure area on a single pattern etched on the front surface of the alloy plate to carry out ultraviolet exposure treatment with certain energy; then developing the remaining area to remove the photosensitive film in the area; as shown in fig. 8, electroplating is adopted to deposit on both ends of the single pattern exposure area, and the thickened copper circuit is the plated front electrode 11;
I. spraying a layer of welding-proof protective body on the front surface of the alloy plate treated in the steps A-H;
J. removing the resin protective layer 10 covering the back of the alloy plate;
K. covering a layer of negative photosensitive film which completely covers the back surface of the alloy plate on the back surface of the alloy plate with the protective layer removed;
firstly, respectively setting an exposure area on a single pattern etched on the back surface of the alloy plate to carry out ultraviolet exposure treatment with certain energy; then developing the remaining area to remove the photosensitive film in the area; as shown in fig. 9, the electroplating method is adopted to deposit on both ends of the single pattern exposure area, i.e. the back electrode 12 is plated;
l, spraying a layer of solder mask protective body on the back of the alloy plate processed in the step K, and protecting a precise circuit of the resistor body;
m, as shown in fig. 10, performing laser resistance correction on the first metal resistor 02 with the preliminary resistance value, which is obtained on the alloy plate processed in the steps A to H and has an up-down symmetrical double-sided structure, so as to achieve the set resistance value and the set precision;
n, as shown in fig. 11, coating an insulating protective layer on the outer surface of the second metal resistor 04 among the multiple alloy resistors in a spraying manner;
o, as shown in figure 12, laser marking a layer of laser code 05 on the upper surface of the insulating protective layer;
p, cutting the multiple alloy resistors on the alloy plate into particles in a mechanical cutting mode;
q, as shown in figure 13, covering a layer of metal copper 06 on the front electrode and the back electrode at the two ends of the outer surface of the alloy resistor by barrel plating;
r, as shown in FIG. 14, forming a layer of metallic nickel 07 on the surface of the copper layer by barrel plating;
and S, as shown in FIG. 15, forming a layer of metal tin 08 on the surface of the nickel layer by adopting a barrel plating mode.
In summary, the invention provides a method for manufacturing an alloy plate metal resistor for an electronic product, which adopts a lithography yellow light process, the manufactured alloy resistor has small size, precise circuit, high precision and stable distribution (the allowable deviation range is +/-0.5% to +/-1%), an alloy material with certain flexibility is reasonably selected, the manufactured product has ultralow resistance, high power, high reliability, stable ultralow resistance temperature coefficient, better load life capability, no product failure in a high-temperature environment, strong heat dissipation capability, greatly reduced temperature resistance effect brought by electrodes, and is simpler and more efficient than the traditional packaging method of the resistor, which has the defects of repeatedly correcting contraposition printing and complicated forming mode, and simultaneously effectively solves the problem of poor etching quality rate reduction caused by increased metal thickness without using noble metals such as silver and the like as electrodes, the manufacturing cost is reduced, and the application requirement of a client application end on a miniaturized high-precision high-power resistor is met.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. A method of making an alloy sheet metal resistor for an electronic product, comprising the steps of:
(1) manufacturing an array area containing a plurality of images matched with the shape of the resistor on the alloy plate by adopting a lithography yellow light process, wherein the manufactured images comprise the images matched with the overall shape of the manufactured resistor and the images of the resistor circuit arranged in the resistor;
(2) etching the image array area until the thickness of the alloy plate is matched with the target resistance value to obtain an alloy resistor circuit;
(3) sequentially manufacturing a front electrode and a back electrode with an electrode circuit structure on the front surface and the back surface of the alloy resistor by combining a lithography yellow light process and an electroplating method; wherein, the negative resin photosensitive film is adopted in the process of the micro-lithography yellow light technique;
(4) manufacturing an insulating protective film in a non-electrode area, and manufacturing a laser code on the insulating protective film;
(5) cutting off the resistors in the array area;
(6) and sequentially depositing a plurality of metal films on the surface of the resistor corresponding to the electrode area.
2. A method of manufacturing an alloy sheet metal resistance for electronic products according to claim 1, characterized in that: the step (1) comprises covering photosensitive films on two surfaces of an alloy plate in sequence, then exposing under the shielding of a light-shielding template, forming an array of dumbbell-shaped patterns which are matched with the shape of the metal resistor on the surface of the alloy plate after developing, and shielding other areas by the photosensitive films.
3. A method of manufacturing an alloy sheet metal resistance for electronic products according to claim 1, characterized in that: the photosensitive film used in step (1) is a positive resin photosensitive film.
4. A method of manufacturing an alloy sheet metal resistance for electronic products according to claim 1, characterized in that: and (3) etching the alloy plate by adopting a chemical etching method in the step (2) to obtain a resistance layer with a set thickness.
5. The method of claim 4, wherein the metal resistor is formed by a method comprising the steps of: and (3) manufacturing a welding-proof protective layer covering the surface of the electrode after the front electrode or the back electrode is manufactured.
6. A method of manufacturing an alloy sheet metal resistance for electronic products according to claim 1, characterized in that: the step (3) specifically comprises the following steps:
covering a photosensitive film on the whole front surface or the whole back surface of the alloy plate, exposing the alloy resistor circuit after exposing and developing the electrode manufacturing area; then, depositing a front electrode layer and a back electrode layer by adopting a micro-lithography yellow light process and an electroplating method; and removing the photosensitive film in other areas by using an etching solution after the electrode is manufactured.
7. A method of manufacturing an alloy sheet metal resistance for electronic products according to claim 1, characterized in that: and (4) before the manufacturing step (4), manufacturing a cut and trimming resistance line on the surface of the manufactured resistor by adopting a laser or mechanical grinding method to correct the resistance value and the precision.
8. A method of manufacturing an alloy sheet metal resistance for electronic products according to claim 1, characterized in that: and the step (5) comprises the step of cutting the resistors in the array on the alloy plate into granules respectively by adopting a mechanical cutting or laser engraving mode.
9. A method of manufacturing an alloy sheet metal resistance for electronic products according to claim 1, characterized in that: and (6) depositing metal films of different materials on the surface of the electrode area in an electroplating mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910892848.2A CN110660551B (en) | 2019-09-20 | 2019-09-20 | Method for manufacturing alloy plate metal resistor for electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910892848.2A CN110660551B (en) | 2019-09-20 | 2019-09-20 | Method for manufacturing alloy plate metal resistor for electronic product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110660551A CN110660551A (en) | 2020-01-07 |
| CN110660551B true CN110660551B (en) | 2021-03-02 |
Family
ID=69038241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910892848.2A Active CN110660551B (en) | 2019-09-20 | 2019-09-20 | Method for manufacturing alloy plate metal resistor for electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110660551B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6712987B2 (en) * | 1998-09-14 | 2004-03-30 | Heraeus Electro-Nite International N.V. | Process for manufacturing an electrical resistor with at least two connection contact pads on a substrate with at least one recess |
| CN101354934A (en) * | 2008-09-19 | 2009-01-28 | 北京七一八友晟电子有限公司 | Alloy foil resistance chip and preparation method thereof |
| CN101998770A (en) * | 2009-08-17 | 2011-03-30 | 健鼎（无锡）电子有限公司 | Method for manufacturing etched film resistance circuit board manufacturing method |
| CN105453192A (en) * | 2013-08-07 | 2016-03-30 | 松下知识产权经营株式会社 | Resistor and method for manufacturing same |
| CN205508541U (en) * | 2016-03-25 | 2016-08-24 | 昆山厚声电子工业有限公司 | Flat electrode array resistor |
| CN107230539A (en) * | 2016-03-25 | 2017-10-03 | 昆山厚声电子工业有限公司 | Flat electrode arrangement resistor and its manufacture craft |
| CN108666057A (en) * | 2018-04-03 | 2018-10-16 | 广东风华高新科技股份有限公司 | A kind of chip resistor and preparation method thereof |
| CN108987010A (en) * | 2018-07-10 | 2018-12-11 | 广东风华高新科技股份有限公司 | A kind of oil level resistor disc and its manufacturing method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050046543A1 (en) * | 2003-08-28 | 2005-03-03 | Hetzler Ullrich U. | Low-impedance electrical resistor and process for the manufacture of such resistor |
| US8242878B2 (en) * | 2008-09-05 | 2012-08-14 | Vishay Dale Electronics, Inc. | Resistor and method for making same |
| CN103400674B (en) * | 2013-07-31 | 2016-06-29 | 南京萨特科技发展有限公司 | The manufacture method of ultrathin alloy plate sensitive resistor |
| CN104376938B (en) * | 2013-08-13 | 2018-03-13 | 乾坤科技股份有限公司 | Resistance device |
-
2019
- 2019-09-20 CN CN201910892848.2A patent/CN110660551B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6712987B2 (en) * | 1998-09-14 | 2004-03-30 | Heraeus Electro-Nite International N.V. | Process for manufacturing an electrical resistor with at least two connection contact pads on a substrate with at least one recess |
| CN101354934A (en) * | 2008-09-19 | 2009-01-28 | 北京七一八友晟电子有限公司 | Alloy foil resistance chip and preparation method thereof |
| CN101998770A (en) * | 2009-08-17 | 2011-03-30 | 健鼎（无锡）电子有限公司 | Method for manufacturing etched film resistance circuit board manufacturing method |
| CN105453192A (en) * | 2013-08-07 | 2016-03-30 | 松下知识产权经营株式会社 | Resistor and method for manufacturing same |
| CN205508541U (en) * | 2016-03-25 | 2016-08-24 | 昆山厚声电子工业有限公司 | Flat electrode array resistor |
| CN107230539A (en) * | 2016-03-25 | 2017-10-03 | 昆山厚声电子工业有限公司 | Flat electrode arrangement resistor and its manufacture craft |
| CN108666057A (en) * | 2018-04-03 | 2018-10-16 | 广东风华高新科技股份有限公司 | A kind of chip resistor and preparation method thereof |
| CN108987010A (en) * | 2018-07-10 | 2018-12-11 | 广东风华高新科技股份有限公司 | A kind of oil level resistor disc and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110660551A (en) | 2020-01-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10340072B2 (en) | Electronic component and method of manufacturing the same | |
| CN1671270A (en) | Method of manufacturing tape wiring substrate | |
| KR20030029480A (en) | Electronic component and method of manufacturing the same | |
| KR20120085042A (en) | Method for manufacturing shadow mask for forming a thin layer | |
| CN112672529A (en) | Method suitable for forming precise flexible circuit | |
| TW201025529A (en) | Substrate structure and manufacturing method thereof | |
| CN110660551B (en) | Method for manufacturing alloy plate metal resistor for electronic product | |
| JP2005026525A (en) | Wiring board and method of manufacturing the same | |
| CN101990058A (en) | Method of coating wafer-level camera module and wafer-level camera module | |
| JPH0783196B2 (en) | Electromagnetic wave shielding metal grid, electromagnetic wave shielding transparent article, and method for manufacturing electromagnetic wave shielding metal grid | |
| JP2007194595A (en) | Method of manufacturing thin-film chip resistor, thin-film chip capacitor, and thin-film chip inductor | |
| CN109496080B (en) | Circuit board electroplating process method | |
| CN210722604U (en) | Alloy plate metal resistor for electronic product | |
| JP3129170B2 (en) | Method of manufacturing rectangular thin film chip resistor | |
| CN108231371A (en) | Two-side film membrane inductor and preparation method thereof | |
| JPS619592A (en) | Electrocast mandrel, manufacture and electrocast process thereby | |
| CN210052625U (en) | Thin film inductor | |
| JP3567144B2 (en) | Chip type resistor and method of manufacturing the same | |
| JP3982655B2 (en) | Manufacturing method of electronic parts | |
| CN110996514A (en) | Method for manufacturing cavity structure | |
| JPH0878217A (en) | Manufacture of rectangular-shaped thin film chip resistor | |
| CN109346558A (en) | Light transmission film solar chip and production method | |
| JP2006066830A (en) | Method of manufacturing high aspect semiconductor device | |
| TWI779973B (en) | Chip resistor and method of making the same | |
| CN214226652U (en) | Sheet type thin film resistor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |