CN107230539A - Flat electrode arrangement resistor and its manufacture craft - Google Patents
Flat electrode arrangement resistor and its manufacture craft Download PDFInfo
- Publication number
- CN107230539A CN107230539A CN201610176870.3A CN201610176870A CN107230539A CN 107230539 A CN107230539 A CN 107230539A CN 201610176870 A CN201610176870 A CN 201610176870A CN 107230539 A CN107230539 A CN 107230539A
- Authority
- CN
- China
- Prior art keywords
- electrode
- insulated substrate
- layer
- printed
- nickel coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 108
- 238000012545 processing Methods 0.000 claims abstract description 25
- 238000013461 design Methods 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 144
- 239000010410 layer Substances 0.000 claims description 94
- 238000000576 coating method Methods 0.000 claims description 78
- 239000011248 coating agent Substances 0.000 claims description 76
- 229910052759 nickel Inorganic materials 0.000 claims description 72
- 239000011241 protective layer Substances 0.000 claims description 53
- 239000011265 semifinished product Substances 0.000 claims description 34
- 239000007772 electrode material Substances 0.000 claims description 19
- 238000007639 printing Methods 0.000 claims description 17
- 238000007747 plating Methods 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 12
- 230000005611 electricity Effects 0.000 claims description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 10
- 238000011161 development Methods 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 238000007650 screen-printing Methods 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- 239000002002 slurry Substances 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 claims description 5
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 238000004064 recycling Methods 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 239000000047 product Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000012769 bulk production Methods 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 1
- YTAHJIFKAKIKAV-XNMGPUDCSA-N [(1R)-3-morpholin-4-yl-1-phenylpropyl] N-[(3S)-2-oxo-5-phenyl-1,3-dihydro-1,4-benzodiazepin-3-yl]carbamate Chemical compound O=C1[C@H](N=C(C2=C(N1)C=CC=C2)C1=CC=CC=C1)NC(O[C@H](CCN1CCOCC1)C1=CC=CC=C1)=O YTAHJIFKAKIKAV-XNMGPUDCSA-N 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
The invention discloses a kind of flat electrode arrangement resistor and its manufacture craft, by being symmetrically printed with multiple spaced backplates on two folding bar lines of each square grid at the insulated substrate back side, and symmetrically it is printed with multiple spaced front electrodes on two folding bar lines of the positive each square grid of insulated substrate, and backplate is also corresponded and is arranged symmetrically with front electrode, this structure design can make the electrode at the side of insulated substrate two full, the integrality of resistance is ensure that, is conducive to being lifted the power of resistor；In addition, the side electrode in resistor is formed using gold-tinted processing procedure, the precision of side electrode is both ensure that well, side electrode and front electrode and backplate strong bonded are enable again, the overall integrity of resistance is improved；Multiple resistance flats and it is arranged in parallel in the resistor, has both reduced the volume of resistor, installing space can be saved, client is beneficial to again and is welded.
Description
Technical field
The present invention relates to resistor technologies field, a kind of flat electrode arrangement is specifically provided
Resistor and its manufacture craft.
Background technology
Paster arrange resistor because its small product size is small, big power, dense arrangement,
It is easy to attachment, each electric appliances, personal data storage, mobile phone etc. can be widely used in and led to
Product is interrogated, and promotes the further miniaturization of this electronic product.
But because being limited by current manufacture craft, existing paster arrangement resistor there are
Following deficiency：1) resistor rolls on silver when making side electrode using sponge wheel
After cream, silver paste is brushed on the strip semi-finished product being arranged on tool, because brush silver is
Rolled again after first pushing, therefore inevitably produce broken strip, and because silver paste has
Certain viscosity, broken strip is often stained with sponge wheel, then strip substrate is rolled
During brush, surface after the end face brush silver of strip semi-finished product can be caused to apply silver-colored uneven, and then
The conjugation between side electrode and front and back electrode can be caused more unstable, so that
Cause the less stable of the integrally-built integrality of resistor and properties of product；
Another sponge wheel must be changed using during certain time limit, cause the increasing of manufacturing cost
Plus；2) because using silver paste to carry out side for raw material brushes silver, it burns till rear thickness
Typically thicker than vacuum coating is more, so can also increase the volume of resistor, is discontented with
The development trend of sufficient electronic product miniaturization.
The content of the invention
In order to overcome drawbacks described above, the invention provides a kind of flat electrode arrangement resistance
The integrality of resistance is good in device and its manufacture craft, the resistor, precision is high, also
Installing space can be saved, is welded beneficial to client.
The technical scheme that is used to solve its technical problem of the present invention is：One kind is flat
Formula electrode arrangement resistor, including a square block insulated substrate, the insulation base
Plate has what is extended on front and back, the insulated substrate back side and along X-direction
Multiple backplates being distributed in distance, the insulated substrate are symmetrically printed with both sides
Also symmetrically it is printed with the both sides extended on front and along X-direction multiple in interval
The front electrode of arrangement, positioned at the insulated substrate front on multiple front electrodes with
Multiple backplates on the insulated substrate back side are corresponded and symmetrical cloth
Put, and a resistance is also printed between two front electrodes being arranged symmetrically
Layer；
Be printed with insulated substrate front one layer extend along X-direction the
One protective layer, first protective layer can be covered positioned at insulated substrate front
On whole resistive layers, and one layer is also printed with the first protective layer outer surface
Two protective layers；
It is in each difference on two side elevations positioned opposite also on the insulated substrate
Sputtering has the side electrode of multiple vertical strips, and each side electrode correspondence is located at
Between the front electrode and backplate that are arranged symmetrically, and each side electrode
The front electrode that is also matched therewith respectively of vertical two ends be mutually connected with backplate；
In addition in each backplate, front electrode and the side of the insulated substrate
One layer of nickel coating is also electroplate with the electrode of face respectively, and on each nickel coating also
One layer of tin coating is electroplate with respectively.
As a further improvement on the present invention, the insulated substrate is rectangular block shape；
Length direction extension of first protective layer along the insulated substrate, and it is described
The two ends of first protective layer length direction also extend respectively to the insulated substrate length
The both sides of the edge in direction.
As a further improvement on the present invention, in each side of the insulated substrate
One layer is respectively electroplate with the electrode of face can cover all the first of the side electrode
Nickel coating, one layer is respectively electroplate with each backplate of the insulated substrate
The second nickel coating of the backplate can be covered all, in the insulated substrate
Each front electrode on be electroplate with one layer and can cover the front electrode
Towards the 3rd nickel coating of side electrode side, and first nickel plating being engaged
Layer, the second nickel coating and the 3rd nickel coating are also connected smoothly；
In addition, positioned at first nickel coating, the second nickel coating and the 3rd that are engaged
Tin coating on nickel coating is also connected smoothly.
As a further improvement on the present invention, first protective layer and the second protective layer
It is the paste resin bed of material.
Present invention also offers a kind of making work of the flat electrode arrangement resistor
Skill, is carried out as follows：
A, cut out a bulk of insulated substrate by design, the insulated substrate has just
Face and the back side, respectively respectively by radium-shine in the insulated substrate on the front and back
Cutting mode cuts out some folding bar lines extended along X-direction and some
The folding grain line extended along Y direction, the folding bar line is mutually handed over the folding grain line
Fork is vertical, so that many in being respectively respectively formed with the front and back for the insulated substrate
Individual square grid；
B, on two folding bar lines of each square grid at the insulated substrate back side
Multiple spaced first electrode material layers are symmetrically printed with, is dried and sinters
After form backplate, and center line of each backplate along X-direction
Also each folding bar line corresponding with its respectively coincides；
C, on two folding bar lines of the positive each square grid of the insulated substrate
Multiple spaced second electrode material layers are symmetrically printed with, is dried and sinters
After form front electrode, and center line of each front electrode along X-direction is also
Respectively the folding bar line respectively corresponding thereto coincides；
And positioned at the insulated substrate front on multiple front electrodes also with position
Corresponded and symmetrical in multiple backplates on the insulated substrate back side
Arrangement；
D, in the positive each square grid of the insulated substrate and in being oppositely arranged
Two front electrodes between be also printed with resistive layer, each resistive layer is also distinguished
Two front electrodes linking corresponding thereto；
E, on insulated substrate front and between per between adjacent two folding bar lines
Position at be also respectively printed with one layer of first protective layer extended along X-direction respectively,
First protective layer can cover complete between adjacent two folding bar lines
Portion's resistive layer, and the front electrode on adjacent two folding bar lines all exposes
In outside first protective layer；
F, resistance amendment all carried out to each resistive layer by radium-shine technology, with
Realize the precision of resistance；
G, through step f handle after each first protective layer outer surface on also
Respectively it is printed with one layer of second protective layer extended along X-direction, and each described second
The two ends of protective layer length direction also extend respectively to the insulated substrate along X-axis side
To two ora terminalis at；
H, will be exhausted after step a~g processing along the folding bar line of the insulated substrate
Edge substrate fractures into multiple strip semi-finished product successively；And by above-mentioned multiple strip semi-finished product
Stacked gradually, to constitute a stackable unit；
I, photoresistance dry film is sticked on the side formed in the stackable unit through folding bar,
And the exposure area of multiple vertical strips, Yi Jiduo are marked off on the photoresistance dry film
The electrode zone of individual vertical strip, the plurality of exposure area and multiple electrodes region be according to
It is secondary to be alternately arranged, and each electrode zone also correspond to be located at be arranged symmetrically just
Between face electrode and backplate；
The photoresistance dry film being pointed to first in the plurality of exposure area is exposed processing,
Make the photoresistance dry film solidification being located in exposure area；The plurality of electrode zone is pointed to again
In photoresistance dry film carry out development treatment, with remove be located at the plurality of electrode zone in
Photoresistance dry film；Then vacuum sputtering machines are recycled to the plurality of electrode after development treatment
Region is sputtered, and forms multiple side electrodes；Require to be located at each bar simultaneously
The front that the vertical two ends of side electrode on shape semi-finished product are also matched therewith respectively
Electrode and backplate linking；
J, by above-mentioned steps i be located at the plurality of exposure area in photoresistance dry film go
Remove, clean；
K, along the folding grain line of the strip semi-finished product by after step a~j processing
Strip semi-finished product fracture into multiple block semi-finished product successively；
L, using barrel plating mode on the side electrode of each block semi-finished product it is electric
The first nickel coating of the side electrode can be covered all by being coated with one layer, using rolling
Plating mode is electroplate with one layer in the backplate of each block semi-finished product can
The second nickel coating of the backplate is covered all, also using barrel plating mode every
One layer is electroplate with the front electrode of block semi-finished product described in one can cover described
Front electrode towards side electrode side the 3rd nickel coating, and in corresponding first
Nickel coating, the second nickel coating and the 3rd nickel coating are also connected smoothly；
M, first in each block semi-finished product after above-mentioned steps l processing
On nickel coating, the second nickel coating and the 3rd nickel coating also it is each be electroplate with respectively one layer it is tin plating
Layer, and positioned at corresponding first nickel coating, the second nickel coating and the 3rd nickel plating
Tin coating on layer is also connected smoothly；The now flat electrode arrangement resistor
Complete.
As a further improvement on the present invention, first electrode material is printed in above-mentioned steps b
The printing side of second electrode material layer is printed in the mode of printing of the bed of material, above-mentioned steps c
Printed in formula, above-mentioned steps d in the mode of printing of printed resistor layer, above-mentioned steps e
The second protective layer is printed in the mode of printing and above-mentioned steps g of first protective layer
Mode of printing all uses silk-screen printing.
As a further improvement on the present invention, the first electrode described in above-mentioned steps b
Second electrode material layer described in material layer and above-mentioned steps c is silver-colored palladium slurry
The bed of material；
Described in the first protective layer and above-mentioned steps g described in above-mentioned steps e
The second protective layer be the paste resin bed of material.
The beneficial effects of the invention are as follows：With arrayed chip resistor phase of the prior art
Than the flat electrode arrangement resistor made by the present invention has the following advantages that：1. lead to
Cross and symmetrically printed on two folding bar lines of each square grid at the insulated substrate back side
There are multiple spaced backplates, and in the positive each square grid of insulated substrate
Multiple spaced front electrodes, and position are symmetrically printed with two folding bar lines of son
In the backplate on the insulated substrate back side also with positioned at insulated substrate front on just
Face electrode is corresponded and is arranged symmetrically, and this structure design can make insulated substrate two
Electrode at side is full, it is ensured that the integrality of resistance, is conducive to lifting resistor
Power；2. resistance amendment is carried out to resistive layer using radium-shine mode, it can be ensured that electricity
The precision of resistance；3. the side electrode in resistor is formed using gold-tinted processing procedure, both very
The good precision that ensure that side electrode, enables side electrode and front electrode again
With backplate strong bonded, the overall integrity of resistance is improved；4. the resistor
In multiple resistance flats and be arranged in parallel, both reduced the volume of resistor, Neng Goujie
About installing space, is beneficial to client and welds again；5. the resistor quality parameter it is stable and
Manufacturing cost is relatively low, is applicable to bulk production.
Brief description of the drawings
The structural representation of insulated substrates of the Fig. 1 for the present invention after step a processing；
The structural representation at the insulated substrate back sides of the Fig. 2 for the present invention after step b processing
Figure；
Insulated substrate positive structural representations of the Fig. 3 for the present invention after step c processing
Figure；
Insulated substrate positive structural representations of the Fig. 4 for the present invention after step d processing
Figure；
Insulated substrate positive structural representations of the Fig. 5 for the present invention after step e processing
Figure；
Insulated substrate positive structural representations of the Fig. 6 for the present invention after step f processing
Figure；
Insulated substrate positive structural representations of the Fig. 7 for the present invention after step g processing
Figure；
Fig. 8 is the present invention through obtaining the strip semi-finished product after folding bar processing in step h
Structural representation；
The structure of stackable units of the Fig. 9 for the present invention after stacking processing in step h is shown
It is intended to；
Figure 10 is to be sticked on the side that stackable unit of the present invention is formed through folding bar
Structural representation after photoresistance dry film；
Figure 11 is that the structure being exposed to the photoresistance dry film shown in Figure 10 after processing is shown
It is intended to；
Figure 12 is that the structure that the photoresistance dry film shown in Figure 11 is carried out after development treatment is shown
It is intended to；
Figure 13 is to being sputtered on the stackable unit side shown in Figure 12 after side electrode
Structural representation；
The structure of the stackable units of the Figure 14 for the present invention after step j processing is shown
It is intended to；
Figure 15 obtains the knot of the block semi-finished product after being handled for the present invention through step k
Structure schematic diagram；
Figure 16 obtains the flat electrode arrangement electricity after being handled for the present invention through step m
Hinder the dimensional structure diagram of device；
Figure 17 illustrates for the cross-section structure of flat electrode arrangement resistor of the present invention
Figure.
With reference to accompanying drawing, make the following instructions：
1 --- insulated substrate 2 --- backplate
3 --- front electrode 4 --- resistive layers
5 --- the first protective layer 6 --- second protective layers
7 --- photoresistance dry film 70 --- exposure areas
71 --- electrode zone 8 --- side electrodes
91 --- the first nickel coating 92 --- second nickel coatings
93 --- the 3rd nickel coating 10 --- tin coatings
11 --- folding bar lines 12 --- roll over grain line
Embodiment
Referring to figure to a preferred embodiment of the present invention will be described in detail.
Embodiment 1：Refering to shown in accompanying drawing 16 and 17, a kind of flat electrode arrangement is electric
Device, including a square block insulated substrate 1 are hindered, the insulated substrate 1 has just
(it is length side on face and the back side, the back side of insulated substrate 1 and along X-direction
To) extension both sides on using screen printing mode be symmetrically printed with it is multiple in interval row
The backplate 2 of row, the electrode material of backplate is silver-colored palladium slurry, the insulation
Also screen printing mode is used on the both sides extended on the front of substrate 1 and along X-direction
Symmetrically it is printed with multiple front electrodes 3 being distributed in distance, the electrode material of front electrode
Expect for silver-colored palladium slurry, multiple front electrodes 3 on the front of insulated substrate 1
Corresponded and right with multiple backplates 2 on the insulated substrate back side
Claim arrangement, and also using silk between two front electrodes 3 being arranged symmetrically
Net mode of printing is printed with a resistive layer 4；
On the front of insulated substrate 1 one layer is printed with using screen printing mode
The first protective layer 5 extended along X-direction, first protective layer 5 can be covered
Firmly it is located at whole resistive layers 4 on the front of insulated substrate 1, and described first protects
One layer of second protective layer is also printed with using screen printing mode on the outer surface of sheath 5
6；
It it is in each point on two side elevations positioned opposite also on the insulated substrate 1
Jian She there are not the side electrode 8 of multiple vertical strips, each 8 pairs of side electrode
It should be located between the front electrode 3 being arranged symmetrically and backplate 2, and each institute
State front electrode 3 and the back of the body that the vertical two ends of side electrode 8 are also matched therewith respectively
Face electrode 2 is mutually connected；In addition in each backplate of the insulated substrate 1
2nd, one layer of nickel coating is also electroplate with respectively on front electrode 3 and side electrode 8,
And also it is electroplate with one layer of tin coating 10 respectively on each nickel coating.
In the present embodiment, it is preferred that the insulated substrate 1 is rectangular block shape；Institute
State length direction extension of first protective layer 5 along the insulated substrate 1, and described the
The two ends of the length direction of one protective layer 5 also extend respectively to the length of insulated substrate 1
The both sides of the edge in direction.
It is preferred that, each electricity on each side electrode 8 of the insulated substrate 1
The first nickel coating 91 of the side electrode can be covered all by being coated with one layer,
Respectively being electroplate with one layer in each backplate 2 of the insulated substrate 1 can be complete
The second nickel coating 92 of backplate is stated in all standing residence, in the insulated substrate 1
Each front electrode 3 on be electroplate with one layer can cover it is described front electricity
Pole is towards the 3rd nickel coating 93 of side electrode side, and described first be engaged
Nickel coating 91, the second nickel coating 92 and the 3rd nickel coating 93 are also connected smoothly；
In addition, positioned at first nickel coating 91, the second nickel coating 92 that are engaged
Also it is connected smoothly with the tin coating 10 on the 3rd nickel coating 93.
It is preferred that, the protective layer 6 of the first protective layer 5 and second is resin slurry
Layer.
In the present invention, additionally provide one kind and prepare the flat electrode arrangement resistor
Preferred fabrication technique, carry out as follows：
A, refering to shown in accompanying drawing 1, cut out a bulk of insulated substrate 1 by design,
The insulated substrate 1 have front and back, the insulated substrate 1 front and
On the back side, some respectively are cut out along X-direction by radium-shine cutting mode respectively
The folding bar line 11 of extension and some folding grain lines 12 extended along Y direction,
The folding bar line 11 intersected with the folding grain line 12 it is vertical so that described exhausted
Edge substrate 1 is respectively respectively formed with multiple square grid on the front and back；
B, refering to shown in accompanying drawing 2, in each square of the back side of insulated substrate 1
Symmetrically it is printed with two folding bar lines 11 of grid multiple along the folding bar line extension side
Back side electricity is formed to spaced first electrode material layer, after being dried and sintering
Pole 2, and center line of each backplate 2 along X-direction also respectively distinguish
Corresponding folding bar line coincides with its；
C, refering to shown in accompanying drawing 3, it is positive each square in the insulated substrate 1
Symmetrically it is printed with two folding bar lines 11 of grid multiple along the folding bar line extension side
Front electricity is formed to spaced second electrode material layer, after being dried and sintering
Pole 3, and center line of each front electrode 3 along X-direction also it is each respectively with
Its corresponding described folding bar line coincides；
And multiple front electrodes 3 on the front of insulated substrate 1 also with
Multiple backplates 2 on the back side of insulated substrate 1 correspond and
It is arranged symmetrically；
D, refering to shown in accompanying drawing 4, it is positive each square in the insulated substrate 1
Resistive layer is also printed with grid and between two front electrodes 3 being oppositely arranged
4, two front electrodes 3 of each resistive layer 4 also respectively corresponding thereto are held in the mouth
Connect, preferably each resistive layer 4 also extends respectively to two corresponding thereto
On front electrode 3；
E, refering to shown in accompanying drawing 5, on the front of insulated substrate 1 and between every
One layer is respectively also printed with respectively along X-axis at position between adjacent two folding bar lines 11
First protective layer 5 (insulation material layer) of direction extension, first protective layer 5
The whole resistive layers 4 that can be covered between adjacent two folding bar lines, and position
Described first is all exposed in the front electrode 3 on adjacent two folding bar lines
Outside protective layer 5；
F, resistance amendment all carried out to each resistive layer 4 by radium-shine technology,
To realize the precision of resistance, as shown in Figure 6；
G, refering to shown in accompanying drawing 7, each described first after being handled through step f
One layer of second protection extended along X-direction is also respectively printed with the outer surface of protective layer 5
6 (insulation material layer) of layer, and the two of each length direction of second protective layer 6
End also extends respectively to the insulated substrate 1 along at two ora terminalis of X-direction；
H, will be after step a~g processing along the folding bar line 11 of the insulated substrate
Insulated substrate fracture into multiple strip semi-finished product successively, as shown in Figure 8；And will
Above-mentioned multiple strip semi-finished product are stacked gradually, to constitute a stackable unit, such as attached
Shown in Fig. 9；
I, refering to shown in accompanying drawing 10, photoresistance dry film 7 is sticked in the stackable unit
On the side formed through folding bar, and mark off on the photoresistance dry film 7 multiple vertical
The exposure area 70 of strip and the electrode zone 71 of multiple vertical strips, this is more
Individual exposure area 70 and multiple electrodes region 71 is are alternately arranged successively, and each institute
State electrode zone and also correspond to and be located at the front electrode 3 being arranged symmetrically and backplate 2
Between；
The photoresistance dry film being pointed to first in the plurality of exposure area 70 is exposed place
Reason, makes the photoresistance dry film solidification being located in exposure area, as shown in Figure 11；Again
The photoresistance dry film being pointed in the plurality of electrode zone 71 carries out development treatment, to go
Except the photoresistance dry film in the plurality of electrode zone, as shown in Figure 12；Then
Vacuum sputtering machines are recycled to splash the plurality of electrode zone 71 after development treatment
Penetrate, multiple side electrodes 8 (this is gold-tinted making technology) are formed, such as the institute of accompanying drawing 13
Show；Vertical the two of side electrode being located on each strip semi-finished product are required simultaneously
The front electrode 3 being also matched therewith respectively and backplate 2 is held to be connected；
J, by above-mentioned steps i be located at the plurality of exposure area in photoresistance dry film go
Remove, clean, as shown in Figure 14；
K, along the strip semi-finished product folding grain line 12 will pass through step a~j processing
Strip semi-finished product afterwards fracture into multiple block semi-finished product successively, as shown in Figure 15；
L, using barrel plating mode on the side electrode of each block semi-finished product it is electric
The first nickel coating 91 of the side electrode can be covered all by being coated with one layer, be adopted
With barrel plating mode one layer is electroplate with the backplate of each block semi-finished product
The second nickel coating 92 of the backplate can be covered all, also using barrel plating
Mode is electroplate with one layer on the front electrode of each block semi-finished product to be covered
Threeth nickel coating 93 of the front electrode towards side electrode side is covered, and is in
Corresponding the first nickel coating 91, the second nickel coating 92 and the 3rd nickel coating 93 is also
It is connected smoothly；
M, first in each block semi-finished product after above-mentioned steps l processing
It is also each on nickel coating 91, the second nickel coating 92 and the 3rd nickel coating 93 to electroplate respectively
There is one layer of tin coating 10, and positioned at corresponding first nickel coating 91, second
Tin coating 10 on the nickel coating 93 of nickel coating 92 and the 3rd is also connected smoothly；
Now the flat electrode arrangement resistor completes, the flat electrode arrangement electricity
Hinder dimensional structure diagram and the cross-sectional view such as institute of accompanying drawing 16 and 17 of device
Show.
In the manufacture craft of above-mentioned flat electrode arrangement resistor, it is preferred that above-mentioned
Printed in step b in the mode of printing of printing first electrode material layer, above-mentioned steps c
The printing of printed resistor layer in the mode of printing of second electrode material layer, above-mentioned steps d
The mode of printing and above-mentioned step of the first protective layer are printed in mode, above-mentioned steps e
The mode of printing that the second protective layer is printed in rapid g all uses silk-screen printing.
It is preferred that, first electrode material layer described in above-mentioned steps b and above-mentioned
Second electrode material layer described in step c is silver-colored palladium pulp layer；Above-mentioned steps e
Described in the first protective layer and the second protective layer described in above-mentioned steps g it is equal
For the paste resin bed of material.
In summary, the flat electrode arrangement resistor made by the present invention has as follows
Advantage：1. by two folding bar lines of each square grid at the insulated substrate back side
Multiple spaced backplates are symmetrically printed with, and it is positive every in insulated substrate
Multiple spaced fronts are symmetrically printed with two folding bar lines of one square grid
Electrode, and backplate on the insulated substrate back side also with positioned at insulated substrate just
Front electrode on face is corresponded and is arranged symmetrically, and this structure design can make absolutely
Electrode at the side of edge substrate two is full, it is ensured that the integrality of resistance, is conducive to carrying
Rise the power of resistor；2. resistance amendment, energy are carried out to resistive layer using radium-shine mode
Enough ensure the precision of resistance value；3. the side electrode in resistor uses gold-tinted processing procedure shape
Into, the precision of side electrode is both ensure that well, enable again side electrode with
Front electrode and backplate strong bonded, improve the overall integrity of resistance；④
Multiple resistance flats and it is arranged in parallel in the resistor, has both reduced the body of resistor
Product, can save installing space, and client is beneficial to again and is welded；5. the resistor quality
Energy is stable and manufacturing cost is relatively low, is applicable to bulk production.
Described above is only the preferred embodiment of the present invention, but is not limited to this
Invention, it is noted that for those skilled in the art, not
On the premise of departing from the technology of the present invention principle, some improvement and modification can also be made,
These improvement and modification also should be regarded as within the scope of the present invention.
Claims (7)
1. a kind of flat electrode arrangement resistor, it is characterised in that：It is square including one
Block insulated substrate (1), the insulated substrate (1) has front and back,
Symmetrically printed on the both sides extended on insulated substrate (1) back side and along X-direction
Multiple backplates (2) being distributed in distance are brushed with, the insulated substrate (1) is just
Also symmetrically it is printed with the both sides extended on face and along X-direction multiple in interval row
The front electrode (3) of row, on the insulated substrate (1) front it is multiple just
Face electrode (3) and multiple backplates (2) on the insulated substrate back side
Correspond and be arranged symmetrically, and in two front electrodes being arranged symmetrically
(3) resistive layer (4) is also printed between；
One layer is printed with the insulated substrate (1) front along X-direction to extend
The first protective layer (5), first protective layer (5) can be covered positioned at institute
State whole resistive layers (4) on insulated substrate (1) front, and first protection
Layer is also printed with one layer of second protective layer (6) on (5) outer surface；
In on two side elevations positioned opposite also on the insulated substrate (1),
Respectively sputtering has the side electrode (8) of multiple vertical strips, each side electricity respectively
Pole (8) correspondence is located at the front electrode (3) being arranged symmetrically and backplate (2)
Between, and the vertical two ends of each side electrode (8) also match with it respectively
The front electrode (3) of conjunction is mutually connected with backplate (2)；In addition in the insulation
Each backplate (2), front electrode (3) and the side of substrate (1)
One layer of nickel coating is also electroplate with face electrode (8) respectively, and in each nickel plating
One layer of tin coating (10) is also electroplate with layer respectively.
2. flat electrode arrangement resistor according to claim 1, its feature
It is：The insulated substrate (1) is rectangular block shape；
Length direction of first protective layer (5) along the insulated substrate (1) prolongs
Stretch, and the two ends of first protective layer (5) length direction also extend respectively to institute
State the both sides of the edge of insulated substrate (1) length direction.
3. flat electrode arrangement resistor according to claim 2, its feature
It is：Each electricity on each side electrode (8) of the insulated substrate (1)
The first nickel coating (91) of the side electrode can be covered all by being coated with one layer,
One is respectively electroplate with each backplate (2) of the insulated substrate (1)
Layer can cover all the second nickel coating (92) of the backplate, described
Being electroplate with one layer on each front electrode (3) of insulated substrate (1) can cover
Threeth nickel coating (93) of the front electrode towards side electrode side is covered, and
First nickel coating (91), the second nickel coating (92) and the 3rd plating being engaged
Nickel dam (93) is also connected smoothly；
In addition, positioned at first nickel coating (91), the second nickel coating that are engaged
(92) also it is connected smoothly with the tin coating (10) on the 3rd nickel coating (93).
4. flat electrode arrangement resistor according to claim 1, its feature
It is：First protective layer (5) and the second protective layer (6) are resin slurry
Layer.
5. a kind of flat electrode arrangement electricity as any one of claim 1-4
Hinder the manufacture craft of device, it is characterised in that：Carry out as follows：
A, a bulk of insulated substrate (1), the insulated substrate (1) are cut out by design
With front and back, in the insulated substrate (1) on the front and back, respectively
Some foldings extended along X-direction are cut out by radium-shine cutting mode respectively
Bar line (11) and some folding grain lines (12) extended along Y direction, it is described
Folding bar line (11) with it is described folding grain line (12) intersect it is vertical so that described
Insulated substrate (1) is respectively respectively formed with multiple square grid on the front and back；
B, the insulated substrate (1) back side each square grid two folding bars
Multiple spaced first electrode material layers are symmetrically printed with line (11), are carried out
Dry and backplate (2) is formed after sintering, and each backplate (2)
Along also each folding bar line phase corresponding with its respectively of the center line of X-direction
Overlap；
C, two folding bars in the positive each square grid of the insulated substrate (1)
Multiple spaced second electrode material layers are symmetrically printed with line (11), are carried out
Dry and front electrode (3) is formed after sintering, and each front electrode (3)
The folding bar line also respectively distinguished corresponding thereto along the center line of X-direction is mutually overlapping
Close；
And multiple front electrodes (3) on the insulated substrate (1) front
Also with multiple backplates (2) on the insulated substrate (1) back side
Correspond and be arranged symmetrically；
D, in the positive each square grid of the insulated substrate (1) and in relative
Resistive layer (4), Mei Yisuo are also printed between two front electrodes (3) set
State two front electrodes (3) linking of resistive layer (4) also respectively corresponding thereto；
E, on the insulated substrate (1) front and between per adjacent two folding bar lines
(11) at the position between also it is each be printed with respectively one layer extend along X-direction the
One protective layer (5), first protective layer (5) can cover adjacent positioned at this
Whole resistive layers (4) between two folding bar lines, and positioned at adjacent two folding bar lines
On the front electrode (3) be all exposed to first protective layer (5) outside；
F, resistance amendment all carried out to each resistive layer (4) by radium-shine technology,
To realize the precision of resistance；
G, each first protective layer (5) outer surface after being handled through step f
On be also respectively printed with one layer of second protective layer (6) extended along X-direction, it is and each
The two ends of second protective layer (6) length direction also extend respectively to the insulation
Substrate (1) is along at two ora terminalis of X-direction；
H, along the folding bar line (11) of the insulated substrate it will pass through step a~g processing
Insulated substrate afterwards fractures into multiple strip semi-finished product successively；And by above-mentioned multiple strips
Semi-finished product are stacked gradually, to constitute a stackable unit；
I, be sticked photoresistance dry film (7) side formed in the stackable unit through folding bar
On face, and mark off on the photoresistance dry film (7) exposure of multiple vertical strips
Region (70) and the electrode zone (71) of multiple vertical strips, the plurality of exposure
Region (70) and multiple electrodes region (71) is are alternately arranged successively, and each institute
State electrode zone and also correspond to and be located at the front electrode (3) being arranged symmetrically and back side electricity
Between pole (2)；
The photoresistance dry film being pointed to first in the plurality of exposure area (70) is exposed
Processing, makes the photoresistance dry film solidification being located in exposure area；The plurality of electricity is pointed to again
Photoresistance dry film in polar region domain (71) carries out development treatment, to remove positioned at the plurality of
Photoresistance dry film in electrode zone；Then after recycling vacuum sputtering machines to development treatment
The plurality of electrode zone (71) sputtered, form multiple side electrodes (8)；
The vertical two ends of side electrode being located on each strip semi-finished product are required simultaneously
Front electrode (3) and backplate (2) linking being also matched therewith respectively；
J, by above-mentioned steps i be located at the plurality of exposure area in photoresistance dry film go
Remove, clean；
K, along the strip semi-finished product folding grain line (12) step a~j will be passed through
Strip semi-finished product after processing fracture into multiple block semi-finished product successively；
L, using barrel plating mode on the side electrode of each block semi-finished product it is electric
The first nickel coating (91) of the side electrode can be covered all by being coated with one layer,
Using barrel plating mode one is electroplate with the backplate of each block semi-finished product
Layer can cover all the second nickel coating (92) of the backplate, also use
Barrel plating mode is electroplate with one layer of energy on the front electrode of each block semi-finished product
Threeth nickel coating (93) of the front electrode towards side electrode side is enough covered,
And in corresponding the first nickel coating (91), the second nickel coating (92) and the 3rd plating
Nickel dam (93) is also connected smoothly；
M, first in each block semi-finished product after above-mentioned steps l processing
It is also each on nickel coating (91), the second nickel coating (92) and the 3rd nickel coating (93)
One layer of tin coating (10) is electroplate with respectively, and positioned at corresponding first nickel plating
Tin coating on layer (91), the second nickel coating (92) and the 3rd nickel coating (93)
(10) also it is connected smoothly；Now the flat electrode arrangement resistor has made
Into.
6. the making work of flat electrode arrangement resistor according to claim 5
Skill, it is characterised in that：The printing side of first electrode material layer is printed in above-mentioned steps b
Mode of printing, the above-mentioned steps of second electrode material layer are printed in formula, above-mentioned steps c
In d the first protective layer is printed in the mode of printing of printed resistor layer, above-mentioned steps e
The mode of printing that the second protective layer is printed in mode of printing and above-mentioned steps g is all adopted
Use silk-screen printing.
7. the making work of flat electrode arrangement resistor according to claim 5
Skill, it is characterised in that：First electrode material layer described in above-mentioned steps b and
Second electrode material layer described in above-mentioned steps c is silver-colored palladium pulp layer；
Described in the first protective layer and above-mentioned steps g described in above-mentioned steps e
The second protective layer be the paste resin bed of material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610176870.3A CN107230539A (en) | 2016-03-25 | 2016-03-25 | Flat electrode arrangement resistor and its manufacture craft |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610176870.3A CN107230539A (en) | 2016-03-25 | 2016-03-25 | Flat electrode arrangement resistor and its manufacture craft |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107230539A true CN107230539A (en) | 2017-10-03 |
Family
ID=59932450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610176870.3A Pending CN107230539A (en) | 2016-03-25 | 2016-03-25 | Flat electrode arrangement resistor and its manufacture craft |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107230539A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110660551A (en) * | 2019-09-20 | 2020-01-07 | 丽智电子（南通）有限公司 | Method for manufacturing alloy plate metal resistor for electronic product |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007103849A (en) * | 2005-10-07 | 2007-04-19 | Taiyosha Electric Co Ltd | Manufacturing method for chip resistor |
| TW201216799A (en) * | 2010-10-14 | 2012-04-16 | Young Fast Optoelectronics Co | Manufacturing method of touch sensor pattern and signal conductor |
| CN203941772U (en) * | 2014-06-20 | 2014-11-12 | 昆山厚声电子工业有限公司 | Thick film high power low resistance patch resistor |
| CN104238782A (en) * | 2013-06-07 | 2014-12-24 | 福建省辉锐材料科技有限公司 | Touch screen electrode preparation method |
| CN104952792A (en) * | 2015-07-13 | 2015-09-30 | 深圳市华星光电技术有限公司 | Method for manufacturing TFT (thin film transistor) substrate structure |
| CN105161620A (en) * | 2015-07-10 | 2015-12-16 | 广州奥翼电子科技有限公司 | Organic semiconductor element structure and manufacturing method |
| CN105304241A (en) * | 2014-06-20 | 2016-02-03 | 昆山厚声电子工业有限公司 | Thick-film patch resistor with high power and low resistance value and manufacturing method of thick-film patch resistor |
| CN205508541U (en) * | 2016-03-25 | 2016-08-24 | 昆山厚声电子工业有限公司 | Flat electrode array resistor |
-
2016
- 2016-03-25 CN CN201610176870.3A patent/CN107230539A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007103849A (en) * | 2005-10-07 | 2007-04-19 | Taiyosha Electric Co Ltd | Manufacturing method for chip resistor |
| TW201216799A (en) * | 2010-10-14 | 2012-04-16 | Young Fast Optoelectronics Co | Manufacturing method of touch sensor pattern and signal conductor |
| CN104238782A (en) * | 2013-06-07 | 2014-12-24 | 福建省辉锐材料科技有限公司 | Touch screen electrode preparation method |
| CN203941772U (en) * | 2014-06-20 | 2014-11-12 | 昆山厚声电子工业有限公司 | Thick film high power low resistance patch resistor |
| CN105304241A (en) * | 2014-06-20 | 2016-02-03 | 昆山厚声电子工业有限公司 | Thick-film patch resistor with high power and low resistance value and manufacturing method of thick-film patch resistor |
| CN105161620A (en) * | 2015-07-10 | 2015-12-16 | 广州奥翼电子科技有限公司 | Organic semiconductor element structure and manufacturing method |
| CN104952792A (en) * | 2015-07-13 | 2015-09-30 | 深圳市华星光电技术有限公司 | Method for manufacturing TFT (thin film transistor) substrate structure |
| CN205508541U (en) * | 2016-03-25 | 2016-08-24 | 昆山厚声电子工业有限公司 | Flat electrode array resistor |
Non-Patent Citations (1)
| Title |
|---|
| 吴文明等: "《平板显示器的制造与测试》", 30 September 2013 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110660551A (en) * | 2019-09-20 | 2020-01-07 | 丽智电子（南通）有限公司 | Method for manufacturing alloy plate metal resistor for electronic product |
| CN110660551B (en) * | 2019-09-20 | 2021-03-02 | 丽智电子（南通）有限公司 | Method for manufacturing alloy plate metal resistor for electronic product |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110416320A (en) | A kind of no main grid photovoltaic module | |
| JP2011508946A (en) | Conductive glass for dye-sensitized solar cell and method for producing the same | |
| CN204857754U (en) | Solar cell assembly | |
| CN106098277A (en) | Flexible LED lamp bar dedicated resistor and manufacture method thereof | |
| CN108255347A (en) | Touch-control display panel and preparation method thereof, driving method | |
| CN104216594A (en) | Low-impedance capacitive touch screen and manufacturing method thereof | |
| JP2013541853A (en) | Use of a uniform layer of insulating material in back contact solar cells. | |
| CN102800763B (en) | The manufacture method of solaode and gate line electrode thereof | |
| CN104576779B (en) | Screen mesh array conducting film, solar cell and preparation method thereof | |
| CN205508541U (en) | Flat electrode array resistor | |
| CN108054222A (en) | A kind of method for making its electrode of HIT solar cells | |
| CN107230539A (en) | Flat electrode arrangement resistor and its manufacture craft | |
| CN109117017A (en) | Touch panel and display device | |
| CN107230537A (en) | Metal foil chip current sensing resistor and its manufacture craft | |
| CN102081486B (en) | Capacitive touch inductor | |
| CN109378111A (en) | A kind of latticed transparent conductive film and preparation method thereof | |
| CN103441156B (en) | A kind of solar module and solar battery sheet thereof | |
| CN206460963U (en) | IBC cell electrode structures | |
| CN106206787A (en) | Bendable solar module and manufacture method thereof | |
| JP2018160395A (en) | Transparent conductor and method for producing transparent conductor | |
| CN106340548B (en) | A kind of Weak light type amorphous silicon thin-film solar cells and its manufacturing process | |
| CN204215387U (en) | A kind of low-impedance capacitor touch-screen | |
| CN203930728U (en) | The electrical connection regional structure of touch control electrode layer | |
| CN203366779U (en) | Conductive film | |
| ITRM20110040A1 (en) | ELEMENTS OF VERTICAL ELECTRICAL CONNECTION OF PHOTOELECTROCHEMICAL CELLS. |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171003 |