CN214226652U - Sheet type thin film resistor - Google Patents
Sheet type thin film resistor Download PDFInfo
- Publication number
- CN214226652U CN214226652U CN202120021820.4U CN202120021820U CN214226652U CN 214226652 U CN214226652 U CN 214226652U CN 202120021820 U CN202120021820 U CN 202120021820U CN 214226652 U CN214226652 U CN 214226652U
- Authority
- CN
- China
- Prior art keywords
- thin film
- electrode
- film resistor
- connecting section
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a chip type thin film resistor, which comprises an insulating substrate, a thin film resistor and a surface electrode; the surface electrode and the thin film resistor are both arranged on the insulating substrate, and the thin film resistor is formed in the middle of the surface electrode; the thin film resistor separates the face electrode into a first electrode and a second electrode; the thin film resistor comprises a first connecting part, a second connecting part and a third connecting part; one end of the first connecting portion is arranged on the same side edge of the first electrode and the second electrode, one end of the third connecting portion is arranged on the same other side edge of the first electrode and the second electrode, and the second connecting portion is respectively connected with the other end of the first connecting portion and the other end of the third connecting portion. The utility model discloses can increase the length of resistance, reduce the resistance of resistance.
Description
Technical Field
The utility model belongs to the technical field of the electron production technique and specifically relates to a sheet film resistor is related to.
Background
With the miniaturization development of computer technology and microelectronic technology, thin film resistors with small volume and low resistance loss become one of important components of electronic equipment.
In the prior art, the shape of the resistor body in the thin film resistor is rectangular, and different resistance values are obtained by changing the area of the rectangle, however, the length of the resistor body in the existing thin film resistor depends on the length of the surface electrode, so that the existing thin film resistor can only increase the width of the resistor body to increase the area of the rectangle, so as to reduce the resistance value of the resistor, and therefore the existing thin film resistor cannot obtain a lower resistance value under the condition that the width of the resistor is not changed.
SUMMERY OF THE UTILITY MODEL
The utility model provides a chip film resistor and preparation method thereof to solve the technical problem that current chip film resistor can't obtain lower resistance under the unchangeable condition of resistance width, face electrode layer length, the utility model discloses can increase the length of resistance, reduce the resistance of resistance.
In order to solve the above technical problem, an embodiment of the present invention provides a sheet type thin film resistor, including: an insulating substrate, a thin film resistor, and a surface electrode;
the surface electrode and the thin film resistor are both arranged on the insulating substrate, and the thin film resistor is formed in the middle of the surface electrode; the thin film resistor separates the face electrode into a first electrode and a second electrode;
the thin film resistor comprises a first connecting part, a second connecting part and a third connecting part;
one end of the first connecting portion is arranged on the same side edge of the first electrode and the second electrode, one end of the third connecting portion is arranged on the same other side edge of the first electrode and the second electrode, and the second connecting portion is respectively connected with the other end of the first connecting portion and the other end of the third connecting portion.
Preferably, the length of the second connection portion is greater than a line interval between the first connection portion and the third connection portion.
Preferably, the second connection portion includes a first connection section;
one end of the first connecting section is connected with the other end of the first connecting part; the other end of the first connecting section is connected with the other end of the third connecting part;
the included angle formed by the first connecting section and the first connecting part is less than 180 degrees; the included angle formed by the first connecting section and the third connecting part is less than 180 degrees.
Preferably, the first connecting portion is parallel to the third connecting portion.
Preferably, the second connection portion includes a first connection section, a second connection section, and a third connection section;
one end of the first connecting section is connected with the other end of the first connecting part; the other end of the first connecting section is connected with one end of the second connecting section;
the other end of the second connecting section is connected with one end of the third connecting section, and the other end of the third connecting section is connected with the other end of the third connecting part;
the included angle formed by the first connecting section and the first connecting part is less than or equal to 90 degrees; the included angle formed by the first connecting section and the second connecting section is less than or equal to 90 degrees;
the included angle formed by the second connecting section and the third connecting section is less than or equal to 90 degrees; the included angle formed by the third connecting section and the third connecting part is less than or equal to 90 degrees.
As a preferred scheme, the first connecting part and the third connecting part are arranged on the same straight line; the first connecting portion and the third connecting portion are parallel to the second connecting section respectively.
Preferably, the second connection portion includes a first connection section, a second connection section, and a third connection section;
one end of the first connecting section is connected with the other end of the first connecting part; the other end of the first connecting section is connected with one end of the second connecting section;
the other end of the second connecting section is connected with one end of the third connecting section, and the other end of the third connecting section is connected with the other end of the third connecting part;
the included angle formed by the first connecting section and the first connecting part is more than 90 degrees; the included angle formed by the first connecting section and the second connecting section is larger than 90 degrees;
the included angle formed by the second connecting section and the third connecting section is larger than 90 degrees; the third connecting section and the third connecting part form an included angle larger than 90 degrees.
As a preferred scheme, the first connecting part and the third connecting part are arranged on the same straight line; the first connecting portion and the third connecting portion are parallel to the second connecting section respectively.
Preferably, the first connecting portion is vertically provided on the same side edge of the first electrode and the second electrode.
Preferably, the third connecting portion is vertically provided on the same other side edge of the first electrode and the second electrode.
Compared with the prior art, the embodiment of the utility model provides a have following beneficial effect:
the embodiment of the utility model provides a chip type film resistor, including insulating substrate, film resistor, face electrode; the surface electrode and the thin film resistor are both arranged on the insulating substrate, and the thin film resistor is formed in the middle of the surface electrode; the thin film resistor separates the face electrode into a first electrode and a second electrode; the thin film resistor comprises a first connecting part, a second connecting part and a third connecting part; one end of the first connecting portion is arranged on the same side edge of the first electrode and the second electrode, one end of the third connecting portion is arranged on the same other side edge of the first electrode and the second electrode, and the second connecting portion is respectively connected with the other end of the first connecting portion and the other end of the third connecting portion. The second connecting part is arranged between the first connecting part and the third connecting part, so that the length of the thin film resistor is increased, the cross section area of the resistor body is increased, the square resistance of the resistor is reduced, and the resistance value of the resistor is reduced. And with simple shortening resistance length for the resistance area concentrates on the resistor middle part and compares, with resistance distribution in bigger area, effectively improves the radiating efficiency, is showing and is promoting the power characteristic.
Drawings
Fig. 1 is a schematic structural diagram of a chip thin film resistor according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a thin film resistor according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a conventional thin film resistor;
fig. 4 is a schematic flow chart of a manufacturing process of a chip thin film resistor according to an embodiment of the present invention;
wherein the reference numbers in the drawings of the specification are as follows:
1. an insulating substrate; 2. a first mask; 3. a thin film resistor; 4. a second mask; 5. a face electrode; 6. repairing a resistance line by laser; 7. a resin protective layer; 8. a back electrode layer; 9. a nickel-chromium layer; 10. a nickel layer; 11. and a tin layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
First embodiment
Referring to fig. 1, an embodiment of the present invention provides a chip type thin film resistor, including: an insulating substrate 1, a thin film resistor 3, and a surface electrode 5;
a thin film resistor 3 is provided on an insulating substrate 1, and a pair of face electrodes 5 are provided to cover both ends of the thin film resistor 3.
Referring to fig. 2, fig. 2 is a schematic structural diagram of an electrode and a resistor portion in an embodiment of the present invention, which includes three different electrode patterns, and in an actual processing process, a rectangular thin film resistor layer is formed first, then a mask is disposed to shield a portion corresponding to the thin film resistor 3 in fig. 2, a surface electrode 5 is disposed on the thin film resistor 3 that is not shielded, and the surface electrodes 5 respectively covering two ends of the resistor and the thin film resistor 3 exposed in the middle are obtained after the mask is removed. The pattern of the surface electrode 5 formed differs depending on the mask pattern to be provided, and thus the thin film resistor 3 not covered with the surface electrode 5 is formed in a different pattern.
The thin film resistor 3 comprises a first connecting part, a second connecting part and a third connecting part;
one end of the first connecting portion is arranged on the same side edge of the first electrode and the second electrode, one end of the third connecting portion is arranged on the same other side edge of the first electrode and the second electrode, and the second connecting portion is respectively connected with the other end of the first connecting portion and the other end of the third connecting portion.
In a preferred embodiment, the chip thin film resistor further comprises a resin protection layer 7, a back electrode layer 8, a nickel-chromium layer 9, a nickel layer 10, a tin layer 11; face electrode 5 and thin resistive layer 3 are gone up and are covered resin protective layer 7, and face electrode 5 and thin resistive layer 3 all establish on the first surface of insulating substrate 1, and back electrode layer 8 is established on the second surface of insulating substrate 1, is connected first surface and face electrode layer 5 through nickel chromium layer 9, is connected second surface and back electrode layer 8, is equipped with nickel layer 10 and is used for with external component welded tin layer 11 on nickel chromium layer 9's the surface based on electroplating technique.
In a preferred embodiment, as shown in fig. 2, the length of the second connection portion is greater than the line spacing between the first connection portion and the third connection portion; the first connecting part is vertically arranged on the same side edge of the first electrode and the second electrode; the third connecting portion is vertically provided on the same other side edge of the first electrode and the second electrode.
Preferably, the second connecting portion includes a first connecting section; one end of the first connecting section is connected with the other end of the first connecting part; the other end of the first connecting section is connected with the other end of the third connecting part; the included angle formed by the first connecting section and the first connecting part is less than 180 degrees; the included angle formed by the first connecting section and the third connecting part is less than 180 degrees; the first connecting part is parallel to the third connecting part, and specific details can be seen in fig. 2 (a).
Preferably, the second connecting portion includes a first connecting section, a second connecting section, and a third connecting section; one end of the first connecting section is connected with the other end of the first connecting part; the other end of the first connecting section is connected with one end of the second connecting section; the other end of the second connecting section is connected with one end of a third connecting section, and the other end of the third connecting section is connected with the other end of a third connecting part; the included angle formed by the first connecting section and the first connecting part is less than or equal to 90 degrees; the included angle formed by the first connecting section and the second connecting section is less than or equal to 90 degrees; the included angle formed by the second connecting section and the third connecting section is less than or equal to 90 degrees; the included angle formed by the third connecting section and the third connecting part is less than or equal to 90 degrees; the first connecting part and the third connecting part are arranged on the same straight line; the first connecting part and the third connecting part are respectively parallel to the second connecting section, and specific details can be seen in fig. 2 (b).
Preferably, the second connecting portion includes a first connecting section, a second connecting section, and a third connecting section; one end of the first connecting section is connected with the other end of the first connecting part; the other end of the first connecting section is connected with one end of the second connecting section; the other end of the second connecting section is connected with one end of a third connecting section, and the other end of the third connecting section is connected with the other end of a third connecting part; the included angle formed by the first connecting section and the first connecting part is more than 90 degrees; the included angle formed by the first connecting section and the second connecting section is larger than 90 degrees; the included angle formed by the second connecting section and the third connecting section is larger than 90 degrees; the included angle formed by the third connecting section and the third connecting part is more than 90 degrees, and the first connecting part and the third connecting part are arranged on the same straight line; the first connecting part and the third connecting part are respectively parallel to the second connecting section, and specific details can be seen in fig. 2 (c).
In this embodiment, the second connection portion is disposed between the first connection portion and the third connection portion to increase the length of the thin film resistor, thereby increasing the cross-sectional area of the resistor, reducing the sheet resistance of the resistor, and further reducing the resistance of the resistor.
In the present embodiment, as can be seen from the resistance calculation formula R ═ p × L/(S × h), when the resistivity and the resistance length are constant, only the area of the resistance and the thickness of the resistance layer affect the magnitude of the resistance, and therefore, in the case where the resistance values are the same, the thickness of the resistance layer is reduced by increasing the area of the resistance, thereby saving the material and reducing the deposition time.
Referring to fig. 4, an embodiment of the present invention further provides a manufacturing process of a chip type thin film resistor, including the following steps:
s1: providing an insulating substrate 1, wherein the insulating substrate 1 comprises a first surface and a second surface, and the first surface and the second surface are oppositely arranged;
s2: a first mask 2 is arranged on the first surface, and the first mask 2 is removed after a resistance film layer is laminated by a deposition technology to obtain a thin film resistance layer 3;
s3: a second mask 4 is arranged on the surface of the thin film resistance layer 3, and the second mask 4 is removed after a layer of electrode film is laminated by a chemical deposition technology to obtain a surface electrode layer 5;
s4: and forming a back electrode layer 8 on the second surface to obtain the chip thin film resistor.
In a preferred embodiment, the deposition technique in step S2 is a physical deposition technique or a chemical deposition technique; the physical deposition technology mainly comprises the steps of bombarding a target material by charged ions (inert gas) in a vacuum environment, bombarding metal ions out, and depositing the metal ions on an insulating substrate 1 by using a potential difference; the chemical deposition technology is mainly to carry out chemical reaction on a gas-phase compound or a simple substance containing film elements on the surface of a substrate to form a film.
In a preferred embodiment, the insulating substrate 1 is an alumina ceramic substrate, the thin film resistor 3 is made of a nichrome material, and the surface electrode 5 is made of a copper material.
In a preferred embodiment, the chemical deposition in step S3 is performed by electrochemical deposition, wherein the object to be plated is used as a cathode, copper is used as an anode, and the object is placed in an electroplating solution, and after the electroplating solution is electrified, a redox reaction is performed to deposit a layer of copper on the plated object.
In a preferred embodiment, after step S3, a laser cutting method is used to cut the thin-film resistive layer 3 into trimming lines 6, and the effective width of the thin-film resistive layer 3 is changed by the trimming lines 6, so as to obtain the target resistance value.
In a preferred embodiment, the thin film resistance layer 3 and the surface electrode layer 5 are covered with a resin protective layer 7 on the surface.
In a preferred embodiment, the first surface is connected to the face electrode layer 5 and the second surface is connected to the back electrode layer 8 by a nickel-chromium layer 9.
In a preferred embodiment, a nickel layer 10 and a tin layer 11 for soldering with external elements are provided on the surface of the nickel-chromium layer 9 on the basis of electroplating techniques.
From the above, the embodiment of the present invention provides a chip thin film resistor, which includes an insulating substrate, a thin film resistor, and a surface electrode; the surface electrode and the thin film resistor are both arranged on the insulating substrate, and the thin film resistor is formed in the middle of the surface electrode; the thin film resistor separates the face electrode into a first electrode and a second electrode; the thin film resistor comprises a first connecting part, a second connecting part and a third connecting part; one end of the first connecting portion is arranged on the same side edge of the first electrode and the second electrode, one end of the third connecting portion is arranged on the same other side edge of the first electrode and the second electrode, and the second connecting portion is respectively connected with the other end of the first connecting portion and the other end of the third connecting portion. By providing the second connection portion between the first connection portion and the third connection portion, the length (which may also be referred to as a width, and in the calculation of the resistance, a direction perpendicular to the length is generally referred to as a "width") of the thin film resistor is increased, so that the cross-sectional area of the resistor body is increased, the sheet resistance of the resistor body is decreased, and the resistance value of the resistor body is decreased.
The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations are also considered as the protection scope of the present invention.
Claims (10)
1. A chip type thin film resistor, comprising: an insulating substrate, a thin film resistor, and a surface electrode;
the surface electrode and the thin film resistor are both arranged on the insulating substrate, and the thin film resistor is formed in the middle of the surface electrode; the thin film resistor separates the face electrode into a first electrode and a second electrode;
the thin film resistor comprises a first connecting part, a second connecting part and a third connecting part;
one end of the first connecting portion is arranged on the same side edge of the first electrode and the second electrode, one end of the third connecting portion is arranged on the same other side edge of the first electrode and the second electrode, and the second connecting portion is respectively connected with the other end of the first connecting portion and the other end of the third connecting portion.
2. The chip thin film resistor as claimed in claim 1, wherein a length of the second connection part is greater than a line interval between the first connection part and the third connection part.
3. The chip thin film resistor as claimed in claim 2, wherein the second connection part comprises a first connection segment;
one end of the first connecting section is connected with the other end of the first connecting part; the other end of the first connecting section is connected with the other end of the third connecting part;
the included angle formed by the first connecting section and the first connecting part is less than 180 degrees; the included angle formed by the first connecting section and the third connecting part is less than 180 degrees.
4. The chip thin film resistor as claimed in claim 3, wherein the first connection part is parallel to the third connection part.
5. The chip thin film resistor as claimed in claim 2, wherein the second connection part includes a first connection section, a second connection section, a third connection section;
one end of the first connecting section is connected with the other end of the first connecting part; the other end of the first connecting section is connected with one end of the second connecting section;
the other end of the second connecting section is connected with one end of the third connecting section, and the other end of the third connecting section is connected with the other end of the third connecting part;
the included angle formed by the first connecting section and the first connecting part is less than or equal to 90 degrees; the included angle formed by the first connecting section and the second connecting section is less than or equal to 90 degrees;
the included angle formed by the second connecting section and the third connecting section is less than or equal to 90 degrees; the included angle formed by the third connecting section and the third connecting part is less than or equal to 90 degrees.
6. The chip thin film resistor as claimed in claim 5, wherein the first connection portion and the third connection portion are disposed on a same straight line; the first connecting portion and the third connecting portion are parallel to the second connecting section respectively.
7. The chip thin film resistor as claimed in claim 2, wherein the second connection part includes a first connection section, a second connection section, a third connection section;
one end of the first connecting section is connected with the other end of the first connecting part; the other end of the first connecting section is connected with one end of the second connecting section;
the other end of the second connecting section is connected with one end of the third connecting section, and the other end of the third connecting section is connected with the other end of the third connecting part;
the included angle formed by the first connecting section and the first connecting part is more than 90 degrees; the included angle formed by the first connecting section and the second connecting section is larger than 90 degrees;
the included angle formed by the second connecting section and the third connecting section is larger than 90 degrees; the third connecting section and the third connecting part form an included angle larger than 90 degrees.
8. The chip thin film resistor as claimed in claim 7, wherein the first connection portion and the third connection portion are disposed on a same straight line; the first connecting portion and the third connecting portion are parallel to the second connecting section respectively.
9. The chip thin film resistor as claimed in any one of claims 1 to 8, wherein the first connection part is vertically provided on the same side edge of the first electrode and the second electrode.
10. The chip thin film resistor as claimed in any one of claims 1 to 8, wherein the third connection part is vertically provided on the same other side edge of the first electrode and the second electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120021820.4U CN214226652U (en) | 2021-01-05 | 2021-01-05 | Sheet type thin film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120021820.4U CN214226652U (en) | 2021-01-05 | 2021-01-05 | Sheet type thin film resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214226652U true CN214226652U (en) | 2021-09-17 |
Family
ID=77708935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120021820.4U Active CN214226652U (en) | 2021-01-05 | 2021-01-05 | Sheet type thin film resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214226652U (en) |
-
2021
- 2021-01-05 CN CN202120021820.4U patent/CN214226652U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20140210587A1 (en) | Resistor and method for making same | |
| CN1326158C (en) | Electrically conductive glass and photoelectric conversion element using the same | |
| EP2048707A1 (en) | Patterns of conductive objects on a substrate and method of producing thereof | |
| CN101743639A (en) | Contact structure for a semiconductor component and a method for production thereof | |
| CN110265214A (en) | A kind of manufacture craft and thin film inductor of thin film inductor | |
| EP0710177A1 (en) | Circuit board material with barrier layer | |
| CN100524547C (en) | Making method for current induction wafer resistor | |
| US7453702B2 (en) | Printed wiring board | |
| CN214226652U (en) | Sheet type thin film resistor | |
| CN109346255A (en) | A kind of low resistivity value resistor and its manufacture craft | |
| CN107230537B (en) | Metal foil type current detection resistor and manufacturing process thereof | |
| CN112837872A (en) | Chip type thin film resistor and preparation method thereof | |
| CN107359035A (en) | The manufacture method of chip fixed resister and chip fixed resister | |
| CN110854066A (en) | Semiconductor electroplating method | |
| CN109348642A (en) | A kind of golden method of wiring board whole plate electricity | |
| CN208922799U (en) | A kind of low resistivity value resistor | |
| CN208315303U (en) | Thin film chip resistance | |
| RU2206187C1 (en) | Method for producing microstrip boards for hybrid integrated circuits | |
| CN205508539U (en) | Metal foil formula current detection resistor | |
| CN110911067A (en) | Current sensing resistor and manufacturing method thereof | |
| CN110797439A (en) | Coating method of copper electrode of silicon heterojunction solar cell | |
| CN113394303B (en) | Solar cell electrode manufacturing method | |
| CN213638358U (en) | Lead structure of PCB metal finger position | |
| CN211980310U (en) | Current sensing resistor | |
| CN115003058B (en) | Golden finger lead design method, golden finger lead structure and circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |