CN110911067A - Current sensing resistor and manufacturing method thereof - Google Patents
Current sensing resistor and manufacturing method thereof Download PDFInfo
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- CN110911067A CN110911067A CN201911092155.1A CN201911092155A CN110911067A CN 110911067 A CN110911067 A CN 110911067A CN 201911092155 A CN201911092155 A CN 201911092155A CN 110911067 A CN110911067 A CN 110911067A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/245—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by mechanical means, e.g. sand blasting, cutting, ultrasonic treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
Abstract
The application discloses a current sensing resistor and a manufacturing method thereof, wherein the current sensing resistor comprises a substrate made of an alloy resistor strip; the left side of the lower surface of the base body is provided with a first copper conductive electrode layer, the right side of the lower surface is provided with a second copper conductive electrode layer, and the first copper conductive electrode layer and the second copper conductive electrode layer are mutually separated. Compared with the prior art, this application can effectively ensure current sensing resistor's low resistance temperature coefficient through the structure that separates each other between first copper conducting electrode layer and the second copper conducting electrode layer, and adopts alloy resistance strip as the base member, makes current sensing resistor can possess lower resistance value.
Description
Technical Field
The present disclosure relates to resistor technologies, and particularly to a current sensing resistor and a method for manufacturing the same.
Background
In order to ensure stable operation of various electronic products, current sensing resistors are not required, and such current sensing resistors generally have to have low resistance and low temperature coefficient of resistance. In the prior art, a current sensing resistor is formed by welding an alloy resistor strip and red copper electrode strips at two ends through an electron beam, and a protective layer is formed by adopting a plastic process. However, the alloy resistance strip and the red copper strip are formed by tailor-welding, that is, the welding spot is a composite of two materials, and the resistance temperature coefficient of the red copper strip is far larger than that of the alloy resistance strip, so that the resistance body is difficult to approach the low temperature coefficient of the original alloy resistance strip, and the current induction resistance is difficult to have the low resistance temperature coefficient.
Disclosure of Invention
An object of the embodiments of the present invention is to provide a current sensing resistor and a method for manufacturing the same, which can provide the current sensing resistor with a low temperature coefficient of resistance and a low resistance value.
In order to solve the above problem, embodiments of the present application provide a current sensing resistor, including a substrate made of an alloy resistor strip; the left side of the lower surface of the base body is provided with a first copper conductive electrode layer, the right side of the lower surface is provided with a second copper conductive electrode layer, and the first copper conductive electrode layer and the second copper conductive electrode layer are mutually separated.
Further, a notch is formed in the lower surface, and the notch is located between the first copper conducting electrode and the second copper conducting electrode.
Furthermore, the upper surface of the base body is provided with a first protective layer for shielding the upper surface, and the outer surface of the first protective layer is provided with a resistance code or a character code.
Further, a second protection layer is arranged between the first copper conductive electrode layer and the second copper conductive electrode layer, and the second protection layer shields the lower surface between the first copper conductive electrode layer and the second copper conductive electrode layer and shields the first surface of the first copper conductive electrode layer and the second surface of the second copper conductive electrode layer; wherein the first surface is opposite the second surface.
Further, a first metal layer is arranged on the outer surface of the first copper conducting electrode layer, and a second metal layer is arranged on the outer surface of the first metal layer;
and a third metal layer is arranged on the outer surface of the second copper electrode layer, and a fourth metal layer is arranged on the outer surface of the third metal layer.
Further, the first metal layer and the third metal layer are nickel layers, and the second metal layer and the fourth metal layer are tin layers.
Further, a method for manufacturing a current sensing resistor is provided, which includes:
providing a substrate made of an alloy resistance strip;
arranging a first protective layer for shielding the upper surface on the upper surface of the substrate;
forming a copper electrode tape layer on the lower surface of the substrate to shield the lower surface;
and removing the middle part of the copper electrode belt layer to form a first copper conductive electrode layer on the left side of the lower surface and a second copper conductive electrode layer on the right side of the lower surface, wherein the first copper conductive electrode layer and the second copper conductive electrode layer are mutually separated.
Further, the method also comprises the following steps:
and grinding the lower surface between the first copper conductive electrode layer and the second copper conductive electrode layer to form a notch.
Further, the method also comprises the following steps:
arranging a second protective layer between the first copper conductive electrode layer and the second copper conductive electrode layer and covering the lower surface between the first copper conductive electrode layer and the second copper conductive electrode layer and the first surface of the first copper conductive electrode layer and the second surface of the second copper conductive electrode layer; wherein the first surface is opposite the second surface.
Further, the method also comprises the following steps:
and arranging a first metal layer on the outer surface of the first copper conducting electrode layer, arranging a second metal layer on the outer surface of the first metal layer, arranging a third metal layer on the outer surface of the second copper conducting electrode layer, and arranging a fourth metal layer on the outer surface of the third metal layer.
The embodiment of the application has the following beneficial effects:
embodiments of the present application provide a current sensing resistor and a method of manufacturing the same, wherein the current sensing resistor includes a substrate made of an alloy resistive strip; the left side of the lower surface of the base body is provided with a first copper conductive electrode layer, the right side of the lower surface is provided with a second copper conductive electrode layer, and the first copper conductive electrode layer and the second copper conductive electrode layer are mutually separated. Compared with the prior art, the embodiment of the application can effectively ensure the low resistance temperature coefficient of the current sensing resistor through the structure that the first copper conductive electrode layer and the second copper conductive electrode layer are mutually separated, and the alloy resistance strip is used as the substrate, so that the current sensing resistor can have a lower resistance value.
Drawings
FIG. 1 is a schematic diagram of a current sense resistor according to the prior art;
FIG. 2 is a schematic diagram of a current sense resistor of the prior art;
fig. 3 is a schematic structural diagram of a current sensing resistor according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a current sensing resistor according to a second embodiment of the present application;
fig. 5 is a schematic flow chart of a method for manufacturing a current sensing resistor according to a third embodiment of the present application;
FIG. 6 is a schematic view of the structure of the substrate;
FIG. 7 is a schematic structural view corresponding to step S2 in the third embodiment;
FIG. 8 is a schematic structural view corresponding to step S3 in the third embodiment;
FIG. 9 is a schematic view of the overall and partial structure of a substrate with copper electrode tape layers separated by a predetermined dimension;
FIG. 10 is a schematic view of a portion of the substrate of FIG. 9 after polishing the lower surface of the substrate;
FIG. 11 is a schematic view of the substrate shown in FIG. 10 after a second passivation layer is formed thereon.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions of the present embodiment will be clearly and completely described below with reference to the drawings in the present embodiment, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
Fig. 1 shows a structure diagram of a current sensing resistor in the prior art, which can be referred to in chinese patent application No. 201610930752.7. The main forming method is that the alloy resistance strip and the red copper electrode strips at two ends are welded together by electron beams, and a protective layer is formed by adopting a plastic package process. The total lengths of small-size resistors 0402, 0603 and 0805 are only 1.0mm, 1.6mm and 2.0mm respectively, but the minimum width of an electron beam welding seam can only be 0.3mm-0.5mm, namely the total width of the welding seams at two sides reaches 0.6mm-1.0mm, so that the process cannot basically meet the production application of small-size products and is only suitable for large-size production above 1206 and 2512. Secondly, because the alloy resistance belt and the red copper electrode belt are formed by tailor welding, namely, the welding spot is a composite of two materials, and the resistance temperature coefficient of the red copper belt is far larger than that of the alloy resistance belt, the resistance body is difficult to be close to the low temperature coefficient of the original alloy resistance belt. Moreover, because the protective layer of the current sensing resistor is formed by adopting a traditional plastic package process such as semiconductor package, the actual utilization rate of the process material is only about 20% -30%, namely the loss cost is very high, the processing and maintenance cost of a plastic package mold is also very high, and the compatibility is not strong. In addition, the electron beam needs to be sent by a vacuum electron beam welding machine, and the vacuum electron beam welding machine needs 1 million yuan, so that the investment cost is high, and the welding efficiency is not high. In addition, the poor welding penetration and the like easily occur on the strip with the thickness less than 0.3 mm.
Fig. 2 shows a structure diagram of another current sensing resistor in the prior art, which can be referred to in chinese patent application No. 200810212796.1. The resistor body is formed by using a ceramic substrate as a carrier through processes of film sputtering, laminating and the like, and an adhesion layer, an oxidation layer, a copper electrode, a metal layer, a terminal electrode, an external electrode and the like are formed in the manufacturing process by using process technologies of wet etching, electroplating, laminating, photoetching and the like. Although the current sensing resistor has a superior heat conduction effect, the structure and the process are complex, the layers are multiple, the substrate is used as a carrier, the thickness is thick, the miniaturization and the thinning are not facilitated, and the oxide layer has a certain influence on the resistivity and the resistance temperature coefficient of the resistor body, namely the resistance value is not good for hitting and the low resistance temperature coefficient is difficult to achieve.
To solve the problems in the prior art, referring to fig. 3, a schematic structural diagram of a current sensing resistor provided by an embodiment of the present application is shown, and includes a substrate 1 made of an alloy resistor strip. The left side of the lower surface of the base body 1 is provided with a first copper conductive electrode layer 2, the right side of the lower surface is provided with a second copper conductive electrode layer 3, and the first copper conductive electrode layer 2 and the second copper conductive electrode layer 3 are mutually separated.
In this embodiment, the substrate 1 is a rectangular alloy resistive strip, the alloy in the alloy resistive strip includes manganin, manganin-tin, nickel-copper, iron-chromium-aluminum and alloys with the same kind of properties, the highest TCR level of some materials can be controlled within ± 10 ppm/deg.c, the thickness thereof is mainly 0.2mm-1.5mm, and the width thereof is determined according to the specific required dimension of each model. The shape and size of the first copper conductive electrode layer 2 and the second copper conductive electrode layer 3 are the same, and the thickness of the copper conductor is 20-200 um. The thickness of the copper electrode layer of the current sensing resistor with different types is different.
The structure that the first copper conductive electrode layer 2 and the second copper conductive electrode layer 3 are separated from each other can effectively ensure the low resistance temperature coefficient of a product, and compared with a product using a ceramic substrate as a base body, the alloy resistance strip is adopted as the base body, the alloy resistance strip has thicker thickness under the condition of the same resistivity, but the total thickness of the product is still smaller than that of the alloy resistance strip using the ceramic substrate as the base body so as to realize the design of lower resistance value, such as 0.2m omega-10 m omega, and simultaneously, the design of miniaturization and thinning is also facilitated, such as 0603, 0402 and the following models.
In this embodiment, the lower surface of the substrate 1 is provided with a recess, which is located between the first copper electrode 2 and the second copper electrode 3.
In this embodiment, different types of resistor products have different depths of the recess. By arranging the notch, the actual resistance value of the product can meet the requirement of target precision.
In this embodiment, the upper surface of the substrate 1 is provided with the first protection layer 4 of the substrate 1 shielding the upper surface, and the outer surface of the first protection layer 4 is provided with a resistance code or a character code.
In this embodiment, the first protective layer 4 is made of solder resist ink or epoxy resin having good high temperature resistance, and preferably green solder resist ink for PCB is used, which has good properties and is inexpensive. The thickness of the first protective layer 4 is 10um-30 um.
In this embodiment, a second passivation layer 5 is disposed between the first copper conductive electrode layer 2 and the second copper conductive electrode layer 3, and the second passivation layer 5 shields the lower surface of the space 3 between the first copper conductive electrode layer 2 and the second copper conductive electrode layer, and shields the first surface of the first copper conductive electrode layer 2 and the second surface of the second copper conductive electrode layer 3. Wherein the first surface is opposite to the second surface.
In this embodiment, the first copper conductive electrode layer 2 is provided with a first metal layer 11 on the outer surface thereof, and the second metal layer 12 is provided on the outer surface of the first metal layer 11. The outer surface of the second copper conductive electrode layer 3 is provided with a third metal layer 21, and the outer surface of the third metal layer is provided with a fourth metal layer 22.
The first metal layer 11 and the third metal layer 21 are nickel layers, and the second metal layer 12 and the fourth metal layer 22 are tin layers.
In the present embodiment, the first metal layer 11 shields the bottom surface and the left side surface of the first copper electrode layer 2 and the left side surface of the base 1, and the second metal layer 12 shields the bottom surface and the left side surface of the first metal layer 11. The third metal layer 21 shields the bottom and right side surfaces of the second copper electrode layer 3 and the right side surface of the base 1, and the fourth metal layer 22 shields the bottom and right side surfaces of the third metal layer 21.
Further, referring to fig. 4, a schematic structural diagram of a current sensing resistor provided in the second embodiment of the present application is shown.
The difference between this embodiment and the first embodiment is that the first metal layer 11, the second metal layer 12, the third metal layer 21 and the fourth metal layer 22 are all rectangular. The first metal layer 11 shields the bottom surface of the first copper electrode layer 2, and the second metal layer 12 shields the bottom surface of the first metal layer 11. The third metal layer 21 shields the bottom surface of the second copper electrode layer 3, and the fourth metal layer 22 shields the bottom surface of the third metal layer 21.
Compared with the existing current sensing resistor, the current sensing resistor of the embodiment has the characteristics of low resistance temperature coefficient and low resistance value, is more miniaturized and thinned, has more stable characteristics and is simpler in structure.
Further, referring to fig. 5, a schematic flow chart of a manufacturing method of a current sensing resistor according to a third embodiment of the present application is shown, including:
step S1, providing a substrate made of the alloy resistance strip.
In this embodiment, according to the preset requirements of model, resistance and temperature coefficient of resistance, a corresponding alloy resistance strip is selected, the thickness of the alloy resistance strip is mainly 0.2mm-1.5mm, and the width of the alloy resistance strip is determined according to the specific size of each model. 0805 alloy resistance strips with CuMn7Sn, 0.52mm thickness and 4mm width, resistivity of 29uΩ & cm, TCR of + -15 PPM/deg.C, each length of about 20mm, are selected. After the selection of the alloy resistance strip is completed, degreasing and pretreatment are carried out on the surface of the alloy resistance strip, so that the purposes of cleaning and micro-etching are achieved, and the adhesion strength with a copper electrode strip layer in a later process is improved. The resulting rectangular substrate is shown in fig. 6.
In step S2, a first protective layer for shielding the upper surface of the base is provided.
In this embodiment, the upper surface of the alloy resistance strip is completely shielded, a first protective layer with a film thickness of 10um-30um is formed, and drying and curing are performed at 60 ℃ -150 ℃. The resulting structure is shown in fig. 7.
In step S3, a copper electrode tape layer is formed on the lower surface of the substrate to shield the lower surface.
In this embodiment, a uniform and dense copper electrode strip layer is formed on the lower surface of the substrate by a rack plating process or a chemical deposition process, and forms a densely combined parallel structure with the substrate, as shown in fig. 8. The thickness of the copper electrode strip layer is controlled to be 20um-200um, and the specific thickness can be set according to different models and/or different resistance sections.
In this embodiment, after the copper electrode tape layer is formed, the substrate with the copper electrode tape layer is subjected to spaced pre-separation by a predetermined size by high precision stamping, wire cutting or the like, as shown in fig. 9. One side is completely separated and the other side still temporarily remains connected to the common electrode.
Step S4, removing the middle portion of the copper electrode tape layer to form a first copper conductive electrode layer on the left side of the bottom surface and a second copper conductive electrode layer on the right side of the bottom surface, wherein the first copper conductive electrode layer and the second copper conductive electrode layer are separated from each other.
In this embodiment, the step S4 further includes polishing the bottom surface between the first copper conductive electrode layer and the second copper conductive electrode layer to form a notch.
In this embodiment, according to the requirement of the preset resistance, the middle portion of the copper electrode tape layer is completely removed to form the shape of the first copper conductive electrode layer → the substrate → the second copper conductive electrode layer, i.e. the middle redundant portion of the copper electrode tape layer is cut off to form the first copper conductive electrode layer and the second copper conductive electrode layer completely separated by the middle substrate. Except that the redundant copper electrode layer is completely divided, the lower surface between the first copper conductive electrode layer and the second copper conductive electrode layer is ground to form a concave structure, as shown in fig. 10, so that the resistance value of the product can meet the target precision requirement. The grinding equipment is a high-precision numerically controlled lathe or equipment with the same function and capable of synchronously measuring the band stop value, and the grinding depth can be accurately controlled to be more than 0.2 um.
In this embodiment, after the polishing of the lower surface of the substrate located between the first copper conductive electrode layer and the second copper conductive electrode layer is completed, a second passivation layer covering the lower surface between the first copper conductive electrode layer and the second copper conductive electrode layer and the first surface of the first copper conductive electrode layer and the second surface of the second copper conductive electrode layer are disposed between the first copper conductive electrode layer and the second copper conductive electrode layer. Wherein the first surface is opposite to the second surface. Namely, the concave part of the concave character surface is covered at one time by printing or coating, and a second protective layer is formed, as shown in fig. 11.
In the embodiment, after the steps are carried out, the resistance code or the character code is formed on the surface of the first protective layer by printing or laser marking, if the product is an ultra-small type, the product is limited by the area of the graph, the resistance code or the character code can not be set, and the product is cured at the temperature of 150-250 ℃.
In this embodiment, after the curing is completed, a first metal layer is disposed on an outer surface of the first copper conductive electrode layer, a second metal layer is disposed on an outer surface of the first metal layer, a third metal layer is disposed on an outer surface of the second copper conductive electrode layer, and a fourth metal layer is disposed on an outer surface of the third metal layer. The first metal layer and the third metal layer are nickel layers, and the second metal layer and the fourth metal layer are tin layers.
The metal layer is provided with two modes, the first mode is that after solidification is completed, one side of the product, namely the connecting end of the common electrode, is cut to form a single grain shape, and then a nickel layer and a tin layer are respectively plated on the single grain-shaped product in a rolling mode. The second mode is that the solidified product is directly processed through the rack plating method to form a nickel layer and a tin layer, and then the nickel layer and the tin layer are cut into particles to form single particles.
By testing the current sense resistor obtained in the above-described step, for example, by testing a 0805 model current sense resistor obtained in the above-described step, a resistance value of 0.55m Ω can be obtained as R ═ ρ L/S ═ ρ L/Wt. Wherein the processed matrix L is 1mm, the matrix width is 1mm, and the length, the width and the thickness of the single-grain finished product are respectively 2.0mm, 1.2mm and 0.58 mm. The actual measurement result of the high-temperature TCR is 18-25 PPM/DEG C, which is very close to the TCR of the raw material: 15 PPM/DEG C. A visual comparison of this embodiment with the prior art can be seen in the following table.
As can be seen from the above table, compared with the prior art, the process difficulty used in the above embodiment is small, the copper conductive electrode forming process is more suitable for the design and batch production of miniaturized products, and the low temperature coefficient of resistance of the product is effectively ensured by separating the first copper conductive electrode layer and the second copper conductive electrode layer from each other. And the ultra-low resistance value smaller than 1m omega can be realized by adopting a thicker alloy resistance strip as a substrate.
The foregoing is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations are also regarded as the protection scope of the present application.
Claims (10)
1. A current sensing resistor is characterized by comprising a base body made of an alloy resistor strip; the left side of the lower surface of the base body is provided with a first copper conductive electrode layer, the right side of the lower surface is provided with a second copper conductive electrode layer, and the first copper conductive electrode layer and the second copper conductive electrode layer are mutually separated.
2. The current sensing resistor of claim 1, wherein said lower surface has a notch therein, said notch being located between said first copper conducting electrode and said second copper conducting electrode.
3. The current sensing resistor of claim 1, wherein the upper surface of the substrate is provided with a first protection layer covering the upper surface, and the outer surface of the first protection layer is provided with a resistance code or a word.
4. The current sensing resistor according to any one of claims 1 or 2, wherein a second passivation layer is disposed between the first copper conductive electrode layer and the second copper conductive electrode layer, and the second passivation layer shields the lower surface between the first copper conductive electrode layer and the second copper conductive electrode layer and shields the first surface of the first copper conductive electrode layer and the second surface of the second copper conductive electrode layer; wherein the first surface is opposite the second surface.
5. The current sensing resistor of claim 4, wherein the first copper conductive electrode layer has a first metal layer on an outer surface thereof, and a second metal layer on an outer surface thereof;
and a third metal layer is arranged on the outer surface of the second copper electrode layer, and a fourth metal layer is arranged on the outer surface of the third metal layer.
6. The current sensing resistor of claim 5, wherein the first and third metal layers are nickel layers and the second and fourth metal layers are tin layers.
7. A method of making a current sense resistor, comprising:
providing a substrate made of an alloy resistance strip;
arranging a first protective layer for shielding the upper surface on the upper surface of the substrate;
forming a copper electrode tape layer on the lower surface of the substrate to shield the lower surface;
and removing the middle part of the copper electrode belt layer to form a first copper conductive electrode layer on the left side of the lower surface and a second copper conductive electrode layer on the right side of the lower surface, wherein the first copper conductive electrode layer and the second copper conductive electrode layer are mutually separated.
8. The method of manufacturing a current sense resistor of claim 7, further comprising:
and grinding the lower surface between the first copper conductive electrode layer and the second copper conductive electrode layer to form a notch.
9. The method of manufacturing a current sensing resistor according to any one of claims 7 or 8, further comprising:
arranging a second protective layer between the first copper conductive electrode layer and the second copper conductive electrode layer and covering the lower surface between the first copper conductive electrode layer and the second copper conductive electrode layer and the first surface of the first copper conductive electrode layer and the second surface of the second copper conductive electrode layer; wherein the first surface is opposite the second surface.
10. The method of manufacturing a current sense resistor of claim 9, further comprising:
and arranging a first metal layer on the outer surface of the first copper conducting electrode layer, arranging a second metal layer on the outer surface of the first metal layer, arranging a third metal layer on the outer surface of the second copper conducting electrode layer, and arranging a fourth metal layer on the outer surface of the third metal layer.
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| CN113628820A (en) * | 2021-08-11 | 2021-11-09 | 南京萨特科技发展有限公司 | Alloy chip resistor and preparation method thereof |
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