CN107359035A - The manufacture method of chip fixed resister and chip fixed resister - Google Patents
The manufacture method of chip fixed resister and chip fixed resister Download PDFInfo
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- CN107359035A CN107359035A CN201710570243.2A CN201710570243A CN107359035A CN 107359035 A CN107359035 A CN 107359035A CN 201710570243 A CN201710570243 A CN 201710570243A CN 107359035 A CN107359035 A CN 107359035A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
The invention provides a kind of manufacture method of chip fixed resister and chip fixed resister, it is related to electronic component field.First the first metal electrode layer is formed in the presetting region at a ceramic substrate back side；Again in the front pressing alloy foil layer of ceramic substrate；Then Alloy Foil material layer is performed etching, so that the surface of alloy foil layer forms graphical resistance pattern；Then the second metal electrode layer is formed in the electrode zone of graphical resistance pattern, series-parallel resistance lines is arranged in the resistance pattern functional area of graphical resistance pattern；Finally packaging protection layer and encapsulated layer successively outside alloy foil layer from inside to outside；From inside to outside Side-electrode layer, barrier layer and weld layer are sequentially formed at the both ends of ceramic substrate.The thickness of the chip fixed resister is low, meets the demand of device miniaturization currently on the market, and duplicate measurements is good, and Product Precision is high, temperature drift is low, noise is low, high frequency characteristics is good, noninductive no appearance, convenient welding.
Description
Technical field
The present invention relates to electronic component field, in particular to a kind of manufacture method of chip fixed resister with
Chip fixed resister.
Background technology
Resistor (Resistor) is general in daily life to be directly referred to as resistance.It is a current limiting element, resistance is connect
After in circuit, the resistance of resistor is fixed usually two pins, and it can limit big by the electric current on its institute's chord road
It is small.Resistance is unalterable to be referred to as fixed resister.Resistance variable referred to as potentiometer or variable resistance.Preferable resistor
Be it is linear, i.e., it is directly proportional to additional instantaneous voltage by the transient current of resistor.For the variable resistance of partial pressure, naked
On the resistive element of dew, one or two removable hard contact pressed against.Contact position determines the resistance between resistive element either end and contact
Value.
High-precision Alloy Foil fixed resister is mostly plug-in type Alloy Foil fixed resister above existing market, and plug-in type closes
Goldleaf fixed resister includes the lead segments of resistor, uses packing forms in the profile of product, plug-in type Alloy Foil fixes electricity
Hinder device volume is larger, thickness is very high, do not meet the demand of component miniaturization currently on the market, and compare cost of idleness,
Homogeneity of product is poor, and duplicate measurements is low, and Product Precision bottom, reliability is low, and is inconvenient to weld.
The content of the invention
It is an object of the invention to provide a kind of manufacture method of chip fixed resister and chip fixed resister, its purport
Improving the problem of above-mentioned.
The present invention provides a kind of technical scheme：
In a first aspect, the embodiments of the invention provide a kind of chip fixed resister manufacture method, the chip fixes electricity
Resistance device manufacture method includes：
The first metal electrode layer is formed in the presetting region at a ceramic substrate back side；
In the front pressing alloy foil layer of the ceramic substrate；
The alloy foil layer is performed etching, so that the surface of the alloy foil layer forms graphical resistance pattern；
The second metal electrode layer is formed in the electrode zone of the graphical resistance pattern, in the graphical resistance pattern
Resistance pattern functional area arrange series-parallel resistance lines；
Packaging protection layer and encapsulated layer successively outside alloy foil layer from inside to outside；
From inside to outside Side-electrode layer, barrier layer and weld layer are sequentially formed at the both ends of the ceramic substrate.
Further, it is described from inside to outside outside alloy foil layer successively packaging protection layer and the step of encapsulated layer it
Before, the chip fixed resister manufacture method also includes：
Resistance trimming is carried out to the resistance of current resistance.
Further, the method for the resistance progress resistance trimming of current resistance is included：
The resistance pattern functional area is provided with multiple resistance adjustment points；
Using the current resistance of detection terminal identification resistance, and the current resistance according to resistance and the resistance of default target
Value determines to need the resistance adjustment point adjusted；
The resistance adjustment point is adjusted so that the current resistance of detection terminal identification reaches target resistance.
Further, the surface of the alloy foil layer is formed with multiple graphical resistance patterns to form a line, in institute
State from inside to outside before the step of both ends of the ceramic substrate sequentially form Side-electrode layer, barrier layer and weld layer, institute
Stating method also includes：
Folding grain is carried out to the ceramic substrate.
Further, the graphical resistance pattern that the surface of the alloy foil layer arranges formed with multiple arrays,
It is described from inside to outside before the step of both ends of the ceramic substrate sequentially form Side-electrode layer, barrier layer and weld layer,
Methods described also includes：
The ceramic substrate is carried out to split bar；
Side-electrode layer is formed at the both ends of each ceramic substrate for splitting the strip after bar；
After counterincision bar and formed with the Side-electrode layer ceramic substrate carries out folding grain；
Barrier layer is formed outside the Side-electrode layer on ceramic substrate after each folding grain；
Weld layer is formed outside each barrier layer.
Further, it is described to be wrapped the step of the presetting region at a ceramic substrate back side forms the first metal electrode layer
Include：
Sputter or be deposited or silk-screen printing by way of form in the presetting region at the ceramic substrate back side the
One metal electrode layer.
Further, it is described that the alloy foil layer is performed etching, so that the surface of the alloy foil layer forms figure
The step of shape resistance pattern, includes：
The alloy foil layer is performed etching by way of dry etching or chemical etching or electrochemical etching, so that
The surface of the alloy foil layer forms graphical resistance pattern.
Second aspect, the embodiment of the present invention additionally provide a kind of chip fixed resister, the chip fixed resister bag
Include ceramic substrate, protective layer, encapsulated layer, Side-electrode layer, barrier layer and weld layer, the back side of the ceramic substrate it is presetting
Region be each formed with the first metal electrode layer, the front pressing of the ceramic substrate has alloy foil layer, the alloy foil
The both sides of layer are disposed with series-parallel formed with the second metal electrode layer in the resistance pattern functional area of the alloy foil layer
Resistance lines；The alloy foil layer outer package matcoveredn, the protective layer covering are equipped with encapsulated layer；The ceramic substrate
Formed with Side-electrode layer, each Side-electrode layer is outer formed with barrier layer at both ends, formed with weld layer outside the barrier layer, and
The thickness of the whole chip fixed resister is in presetting threshold range.
Further, each Side-electrode layer is silver coating, and each barrier layer is nickel coating, each described
Weld layer is tin-lead coating.
Further, the thickness of the whole chip fixed resister is less than 1mm.
The manufacture method and the beneficial effect of chip fixed resister of chip fixed resister provided by the invention be：First
The first metal electrode layer is formed in the presetting region at a ceramic substrate back side；Closed again in the front pressing of the ceramic substrate
Golden foil layer；Then the alloy foil layer is performed etching, so that the surface of the alloy foil layer forms graphical resistance
Pattern；Then the second metal electrode layer is formed in the electrode zone of the graphical resistance pattern, in the graphical resistance view
The resistance pattern functional area of sample arranges series-parallel resistance lines；Finally encapsulation is protected successively outside alloy foil layer from inside to outside
Sheath and encapsulated layer；From inside to outside Side-electrode layer, barrier layer and weld layer are sequentially formed at the both ends of the ceramic substrate.Piece
The chip fixed resister thickness that the manufacture method of formula fixed resister is formed is low, meets device miniaturization currently on the market
Demand, duplicate measurements is good, Product Precision is high, temperature drift is low, noise is low, high frequency characteristics is good, noninductive no appearance, and reliability is high and square
Just weld.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below by embodiment it is required use it is attached
Figure is briefly described, it will be appreciated that the following drawings illustrate only certain embodiments of the present invention, therefore be not construed as pair
The restriction of scope, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to this
A little accompanying drawings obtain other related accompanying drawings.
Fig. 1 is the flow chart of the manufacture method of chip fixed resister provided in an embodiment of the present invention；
Fig. 2 is structural representation of the chip fixed resister provided in an embodiment of the present invention after grain is rolled over；
Fig. 3 is the cross-sectional view after chip fixed resister provided in an embodiment of the present invention installs.
Icon：101- ceramic substrates；The metal electrode layers of 102- first；103- alloy foil layers；The metal electrodes of 104- second
Layer；105- resistance lines；106- protective layers；107- encapsulated layers；108- Side-electrode layers；109- barrier layers；110- weld layers.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, rather than whole embodiments.The present invention implementation being generally described and illustrated herein in the accompanying drawings
The component of example can be configured to arrange and design with a variety of.
Therefore, below the detailed description of the embodiments of the invention to providing in the accompanying drawings be not intended to limit it is claimed
The scope of the present invention, but be merely representative of the present invention selected embodiment.It is common based on the embodiment in the present invention, this area
The every other embodiment that technical staff is obtained under the premise of creative work is not made, belong to the model that the present invention protects
Enclose.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent accompanying drawing in individual accompanying drawing.
In the description of the invention, it is to be understood that term " " center ", " on ", " under ", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " interior ", " outer " be based on orientation shown in the drawings or position relationship, or should
Invention product using when the orientation usually put or position relationship, or the orientation or position that those skilled in the art usually understand
Relation is put, it is of the invention necessary with simplified description, rather than the equipment or element of instruction or hint meaning to be for only for ease of description
With specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second ", " the 3rd " etc. are only used for distinguishing description, and it is not intended that instruction or hint
Relative importance.
In the description of the invention, it is also necessary to explanation, unless otherwise clearly defined and limited, term " setting ",
" installation ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or one
Connect body；Can be mechanical connection or electrical connection；Can be joined directly together, can also be indirect by intermediary
It is connected, can is the connection of two element internals.For the ordinary skill in the art, on being understood with concrete condition
State the concrete meaning of term in the present invention.
Embodiment one
Referring to Fig. 1, a kind of chip fixed resister manufacture method is present embodiments provided, the chip fixed resister
Manufacture method includes：
Step S101：The first metal electrode layer 102 is formed in the presetting region at the back side of a ceramic substrate 101.
Ceramic substrate 101 has good electrical insulation performance, high heat conduction characteristic and high adhesive strength, and can be as pcb board
Various figures can be equally etched, there is very big current capacity.Therefore, ceramic substrate 101 can be used as high-power electric electricity
The basic material of sub-circuit structure technology and interconnection technique., can be through but not limited to sputtering or evaporation or silk screen in the present embodiment
The mode of printing forms the first metal electrode layer 102 in the presetting region at the back side of ceramic substrate 101.
Step S102：In the front pressing alloy foil layer 103 of the ceramic substrate 101.
In the present embodiment, alloy foil layer 103 is very thin alloying metal piece.
Step S103：The alloy foil layer 103 is performed etching, so that the surface of the alloy foil layer 103 is formed
Multiple graphical resistance patterns.
In the present embodiment, through but not limited to dry etching or chemical etching or electrochemical etching (for example, it is also possible to be wet
The mode of method etching performs etching to the alloy foil layer 103, so that the surface of the alloy foil layer 103 is formed graphically
Resistance pattern.The mode of etching can be that photoresist first is carried out into photolithographic exposure processing, then realize corrosion otherwise
The part of removing needed for disposing.For example, dry etching is the technology that using plasma carries out film etching；Wet etching is
Etachable material is immersed in the technology corroded in corrosive liquid.
Step S104：The second metal electrode layer 104 is formed in the electrode zone of the graphical resistance pattern, in the figure
The resistance pattern functional area of shape resistance pattern arranges series-parallel resistance lines 105.
In the present embodiment, the second metal electrode is made using the less metal material of resistivity as far as possible.In the present embodiment, figure
Shape metal patterns include two the second metal electrodes, and two the second metal electrodes are respectively positioned at the relative of graphical resistance pattern
Both sides.It should be noted that in the present embodiment, the resistance pattern functional area is provided with multiple resistance adjustment points.
Step S105：Resistance trimming is carried out to the resistance of current resistance.
Specifically, in the present embodiment, the concrete mode of resistance trimming can be：
Using the current resistance of detection terminal identification resistance, and the current resistance according to resistance and the resistance of default target
Value determines to need the resistance adjustment point adjusted；The resistance adjustment point is adjusted so that the current resistance of detection terminal identification reaches mesh
Mark resistance.
In the present embodiment, each resistance can be adjusted to the increasable resistance of point to be reduced successively, it is possible to achieve accurate resistance trimming,
Resistance adjustment point is melted by laser or manually resistance adjustment point is adjusted using draw point, so that resistance is adjusted
Integral point carries out the resistive conductor of script series connection to become in parallel, so as to reach the purpose of resistance trimming.
Step S106：Packaging protection layer 106 and encapsulated layer 107 successively outside alloy foil layer 103 from inside to outside.
Protective layer 106 is used to protect the alloy foil layer 103 etched, and encapsulated layer 107 is used for the protective layer 106 to inside
And alloy foil layer 103 is fixed and protected.
Step S107：From inside to outside Side-electrode layer 108, barrier layer 109 are sequentially formed at the both ends of the ceramic substrate 101
And weld layer 110.
In order to improve the chip fixed resister for making ceramic substrate 101, the ceramic substrate that step S101~S106 is provided
101 area is very big, and step S107 includes：
Step S1071：The ceramic substrate 101 is carried out splitting bar.
As shown in Fig. 2 the graphical resistance pattern that the surface of alloy foil layer 103 arranges formed with multiple arrays.It is right
Ceramic substrate 101 is carried out after splitting bar, generates the ceramic substrate 101 of multiple bar shapeds for including the graphical resistance pattern of a row.
Step S1072：Side-electrode layer 108 is formed at the both ends of each ceramic substrate 101 for splitting the strip after bar.
In the present embodiment, Side-electrode layer 108 is applied using the relatively low metal of silver coating or copper coating or some other resistivity
Layer.Side-electrode layer 108 is uniformly formed to the both ends of each ceramic substrate 101 for splitting the strip after bar, and one by one to single pottery
Porcelain substrate 101 forms Side-electrode layer 108 and compared, and improves the efficiency for making chip fixed resister.In the present embodiment, Ke Yili
Ceramic substrate 101 is carried out with the mode of laser cutting to split bar.
Step S1073：After counterincision bar and formed with the Side-electrode layer 108 ceramic substrate 101 carries out folding grain.
In the present embodiment, as shown in Fig. 2 folding grain can be carried out to ceramic substrate 101 using the mode of laser cutting, grain is rolled over
Chip fixed resister independent one by one is deformed into afterwards.
Step S1074：Barrier layer 109 is formed outside the Side-electrode layer 108 on ceramic substrate 101 after each folding grain.
In the present embodiment, the mode of plating can be utilized to form barrier layer 109 outside Side-electrode layer 108, each resistance
Barrier 109 can use nickel coating.
Step S1075：Weld layer 110 is formed outside each barrier layer 109.
In the present embodiment, the mode of plating can be utilized to form weld layer 110, each weld layer outside Side-electrode layer 108
110 can use tin-lead coating or pure tin coating, not be limited herein.
Multiple chip fixed resisters may finally be disposably formed using the above-mentioned method split bar, roll over grain, so as to improve
Make the efficiency of chip fixed resister.
Referring to Fig. 3, the embodiment of the present invention additionally provides a kind of chip fixed resister, chip fixed resister includes pottery
Porcelain substrate 101, protective layer 106, encapsulated layer 107, Side-electrode layer 108, barrier layer 109 and weld layer 110.Ceramic substrate 101
The presetting region at the back side be each formed with the first metal electrode layer 102, the front pressing of ceramic substrate 101 has alloy foil
Layer 103.The both sides of alloy foil layer 103 are formed with the second metal electrode layer 104, in the resistance pattern work(of alloy foil layer 103
Energy region is disposed with series-parallel resistance lines 105.The outer package matcoveredn 106 of alloy foil layer 103, the covering of protective layer 106
Equipped with encapsulated layer 107.The both ends of ceramic substrate 101 are outer formed with barrier layer formed with Side-electrode layer 108, each Side-electrode layer
109, barrier layer 109 is outer formed with weld layer 110.
In the present embodiment, each Side-electrode layer 108 is silver coating, and each barrier layer 109 is nickel coating, each welding
Layer 110 is tin-lead coating.It is whole in the present embodiment and the thickness of whole chip fixed resister is in presetting threshold range
The thickness of individual chip fixed resister is less than 1mm.Of course, the model for the chip fixed resister that the present embodiment provides can be
The type of metric system 2012, the type of metric system 3216, the type of metric system 5025 and the type of metric system 6332 etc., are not limited herein.
The manufacture method and the beneficial effect of chip fixed resister of chip fixed resister provided by the invention be：First
The first metal electrode layer 102 is formed in the presetting region at the back side of a ceramic substrate 101；Again in the front of ceramic substrate 101
Press alloy foil layer 103；Then the alloy foil layer 103 is performed etching, so that the surface of the alloy foil layer 103
Form graphical resistance pattern；Then the second metal electrode layer 104 is formed in the electrode zone of the graphical resistance pattern,
The resistance pattern functional area of the graphical resistance pattern arranges series-parallel resistance lines 105；Finally closing from inside to outside
Packaging protection layer 106 and encapsulated layer 107 successively outside golden foil layer 103；From inside to outside at the both ends of the ceramic substrate successively shape
Into Side-electrode layer 108, barrier layer 109 and weld layer 110.The chip that the manufacture method of chip fixed resister is formed fixes electricity
It is low to hinder the thickness of device, meets the demand of device miniaturization currently on the market, duplicate measurements is good, Product Precision is high, temperature drift is low,
Noise is low, high frequency characteristics is good, noninductive no appearance, and reliability is high and conveniently welds, and area occupied is small, and model is more, resistance model
Enclose up to hundreds of kilohms, precision has reached 0.005% level, is widely used in the equipment such as highly sophisticated device instrument.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (10)
1. a kind of chip fixed resister manufacture method, it is characterised in that the chip fixed resister manufacture method includes：
The first metal electrode layer is formed in the presetting region at a ceramic substrate back side；
In the front pressing alloy foil layer of the ceramic substrate；
The alloy foil layer is performed etching, so that the surface of the alloy foil layer forms graphical resistance pattern；
The second metal electrode layer is formed in the electrode zone of the graphical resistance pattern, in the electricity of the graphical resistance pattern
Hinder pattern functional area and arrange series-parallel resistance lines；
Packaging protection layer and encapsulated layer successively outside alloy foil layer from inside to outside；
From inside to outside Side-electrode layer, barrier layer and weld layer are sequentially formed at the both ends of the ceramic substrate.
2. chip fixed resister manufacture method according to claim 1, it is characterised in that closed from inside to outside described
Outside golden foil layer successively packaging protection layer and the step of encapsulated layer before, the chip fixed resister manufacture method also includes：
Resistance trimming is carried out to the resistance of current resistance.
3. chip fixed resister manufacture method according to claim 2, it is characterised in that enter to the resistance of current resistance
The step of row resistance trimming, includes：
The resistance pattern functional area is provided with multiple resistance adjustment points；
Using the current resistance of detection terminal identification resistance, and current resistance according to resistance and default target resistance are true
The resistance for needing to adjust calmly adjusts point；
The resistance adjustment point is adjusted so that the current resistance of detection terminal identification reaches target resistance.
4. chip fixed resister manufacture method according to claim 1, it is characterised in that the table of the alloy foil layer
Face is formed with multiple graphical resistance patterns to form a line, described from inside to outside at the both ends of the ceramic substrate successively shape
The step of Side-electrode layer, barrier layer and weld layer before, methods described also includes：
Folding grain is carried out to the ceramic substrate.
5. chip fixed resister manufacture method according to claim 1, it is characterised in that the table of the alloy foil layer
The graphical resistance pattern that face arranges formed with multiple arrays, it is described from inside to outside at the both ends of the ceramic substrate successively
Before the step of forming Side-electrode layer, barrier layer and weld layer, methods described also includes：
The ceramic substrate is carried out to split bar；
Side-electrode layer is formed at the both ends of each ceramic substrate for splitting the strip after bar；
After counterincision bar and formed with the Side-electrode layer ceramic substrate carries out folding grain；
Barrier layer is formed outside the Side-electrode layer on ceramic substrate after each folding grain；
Weld layer is formed outside each barrier layer.
6. chip fixed resister manufacture method according to claim 1, it is characterised in that described in a ceramic base backboard
The step of presetting region in face forms the first metal electrode layer includes：
Sputter or be deposited or silk-screen printing by way of in the presetting region at the ceramic substrate back side form the first gold medal
Belong to electrode layer.
7. chip fixed resister manufacture method according to claim 1, it is characterised in that described to the alloy foil
Layer performs etching, so that the surface of the alloy foil layer includes the step of forming graphical resistance pattern：
The alloy foil layer is performed etching by way of dry etching or chemical etching or electrochemical etching, so that described
The surface of alloy foil layer forms graphical resistance pattern.
8. a kind of chip fixed resister, it is characterised in that the chip fixed resister includes ceramic substrate, protective layer, bag
Sealing, Side-electrode layer, barrier layer and weld layer, the presetting region at the back side of the ceramic substrate are each formed with the first gold medal
Belong to electrode layer, the front pressing of the ceramic substrate has alloy foil layer, and the both sides of the alloy foil layer are formed with the second gold medal
Belong to electrode layer, series-parallel resistance lines are disposed with the resistance pattern functional area of the alloy foil layer；The Alloy Foil
Material layer outer package matcoveredn, the protective layer covering are equipped with encapsulated layer；The both ends of the ceramic substrate formed with Side-electrode layer,
Each Side-electrode layer is outer formed with barrier layer, and the barrier layer is outer formed with weld layer, and the whole chip fix it is electric
The thickness of device is hindered in presetting threshold range.
9. chip fixed resister according to claim 8, it is characterised in that each Side-electrode layer is silver-colored painting
Layer, each barrier layer is nickel coating, and each weld layer is tin-lead coating.
10. chip fixed resister according to claim 8, it is characterised in that the whole chip fixed resister
Thickness is less than 1mm.
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| CN201710570243.2A CN107359035A (en) | 2017-07-13 | 2017-07-13 | The manufacture method of chip fixed resister and chip fixed resister |
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| CN201710570243.2A CN107359035A (en) | 2017-07-13 | 2017-07-13 | The manufacture method of chip fixed resister and chip fixed resister |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108922702A (en) * | 2018-05-24 | 2018-11-30 | 江苏时瑞电子科技有限公司 | A kind of electrode production process of zinc oxide varistor |
| CN110189875A (en) * | 2019-03-07 | 2019-08-30 | 北京七一八友晟电子有限公司 | High-accuracy chip Alloy Foil fixed resister and production method |
| CN112038025A (en) * | 2020-09-10 | 2020-12-04 | 深圳市开步电子有限公司 | Resistor and packaging method thereof |
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