CN203386556U - Sheet type film fixed resistor with resistance range of 10-1 M omega - Google Patents
Sheet type film fixed resistor with resistance range of 10-1 M omega Download PDFInfo
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- CN203386556U CN203386556U CN201320387294.9U CN201320387294U CN203386556U CN 203386556 U CN203386556 U CN 203386556U CN 201320387294 U CN201320387294 U CN 201320387294U CN 203386556 U CN203386556 U CN 203386556U
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- inner electrode
- resistor
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Abstract
The utility model relates to a sheet type film fixed resistor with a resistance range of 10-1 M omega. The sheet type film fixed resistor comprises a base body, a metal resistor layer, inner electrode layers, outer electrode layers and a protection layer, wherein the metal resistor layer is arranged in the middle of the upper surface of the base body; the inner electrode layers wrap the base body at two sides of the metal resistor layer in a mirror symmetry manner and are respectively connected with a metal resistor body; the outer electrode layers wrap the inner electrode layers; the width of the protection layer is 4.8mm-5mm; the width of a surface electrode layer is 0.58mm-0.6mm; the width of a back electrode layer is 0.58mm-0.6mm; the length of each outer electrode is 3mm-3.2mm; the height of each outer electrode is 0.6mm-0.8mm. According to the sheet type film fixed resistor, the sizes of the surface electrode layer, the back electrode layer and each outer electrode can be effectively controlled, so that the resistance of the sheet type film fixed resistor disclosed by the utility model is controlled within 10-1 M omega on the basis that a material and the thickness of the metal resistor layer are not changed; simultaneously, the resistor has good moisture resistance and high-temperature resistance, so that the resistor is very suitable for precise electronic circuits.
Description
Technical field
The utility model belongs to field of electronic devices, relates to resistor, and especially a kind of Standard resistance range is at the chip film fixed resistor of 10 ~ 1M Ω.
Background technology
The developing direction of resistor is miniaturization and high reliability, so the application of wire resistor is more and more limited to, it is replaced by increasing carbon film or metalfilmresistor, wherein chip metal film fixed resistor is more and more favored, according to the difference of resistance value and application, metal film resistor is divided into thick film and thin film resistor.
Thin film resistor is mainly used in the precise electronic circuit, but due to the volume limitation, in metallic film and resistor, each electrode structure needs accurate Calculation, and, in order to increase the applicability of resistance, its Standard resistance range needs larger span, guarantee thus its dependability, but existing chip film fixed resistor failure rate is higher, and more seriously the resistance deviation is larger, easily circuit is damaged.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art part, provides a kind of and has that volume preferably is small and exquisite, the Standard resistance range of clear in structure is at the chip film fixed resistor of 10 ~ 1M Ω.
The technical scheme that the utility model adopts is:
A kind of Standard resistance range is at the chip film fixed resistor of 10 ~ 1M Ω, comprise matrix, the metal electric resistance layer, inner electrode layer, outer electrode layer and protective layer, at described body upper surface middle part, the metal electric resistance layer is installed, the symmetrical inner electrode layer that coats of mirror image on the matrix of metal electric resistance layer both sides, two inner electrode layers all join with the metal electric resistance body, all coat outer electrode layer outside each inner electrode layer, described protective layer width is 4.8 ~ 5mm, the inner electrode layer that is positioned at body upper surface is the face electrode layer, its width is 0.58 ~ 0.6mm, the inner electrode layer that is positioned at the matrix lower surface is dorsum electrode layer, its width is 0.58 ~ 0.6mm, two outer electrode layer mirror image symmetries, its length is 3 ~ 3.2mm, highly be 0.6 ~ 0.8mm.
And described metal electric resistance layer is metallic film.
And, add nickel alloy layer between described each inner electrode layer and outer electrode layer.
And; be coated with protective layer between the connecting portion of described two inner electrode layers and metal electric resistance layer; the complete covering metal resistive layer of this protective layer and the connecting portion of two inner electrode layers and metal electric resistance layer is compressed to the nickel alloy layer on protective layer both sides end face and face electrode layer and outer electrode layer crimping.
Advantage of the present utility model and beneficial effect are:
This resistor is by the Effective Regulation of opposite electrode layer, dorsum electrode layer and external electrode size; on the basis that does not change metallic resistance layer material and thickness; make this chip fixed resistance value be controlled at 10 ~ 1M Ω; multiple circuit is all had to good applicability, and the outer electrode layer height is controlled at 0.6 ~ 0.8mm, and protective layer width L is only 4.8 ~ 5mm; on this basis; this resistor has good moisture resistance and heat-resisting quantity, and Standard resistance range is large, is highly suitable for the precise electronic circuit.
The accompanying drawing explanation
Fig. 1 is structural front view of the present utility model;
The A-A that Fig. 2 is Fig. 1 is to cross-sectional view.
Embodiment
Below in conjunction with accompanying drawing and by specific embodiment, the utility model is described in further detail, and following examples are descriptive, are not determinate, can not limit protection range of the present utility model with this.
A kind of Standard resistance range is at the chip film fixed resistor of 10 ~ 1M Ω; comprise matrix 6, metal electric resistance layer 7, inner electrode layer 5, outer electrode layer 1 and protective layer 2; at the body upper surface middle part, the metal electric resistance layer is installed; this metal electric resistance layer is metallic film; the symmetrical inner electrode layer that coats of mirror image on the matrix of metal electric resistance layer both sides; two inner electrode layers all join with the metal electric resistance body; all coat outer electrode layer outside each inner electrode layer, add nickel alloy layer 4 between each inner electrode layer and outer electrode layer.
Innovative point of the present utility model is:
Protective layer width L is 4.8 ~ 5mm.
The inner electrode layer that is positioned at body upper surface is the face electrode layer, and its width M is 0.58 ~ 0.6mm.
The inner electrode layer that is positioned at the matrix lower surface is dorsum electrode layer, and its width N is 0.58 ~ 0.6mm.
Two outer electrode layer mirror image symmetries, its length W is 3 ~ 3.2mm, height T is 0.6 ~ 0.8mm, Effective Regulation by opposite electrode layer, dorsum electrode layer and external electrode size, on the basis that does not change metallic resistance layer material and thickness, make this chip fixed resistance value be controlled at 10 ~ 1M Ω, through check, this resistor continues 100h, its △ R≤± 2 Ω under 150 ℃ of conditions; 10 ℃ ~ 65 ℃ of temperature ﹣, under the condition of humidity 90% ~ 98%, △ R≤± 5 Ω.
Be coated with protective layer between the connecting portion of two inner electrode layers and metal electric resistance layer; the complete covering metal resistive layer of this protective layer and the connecting portion of two inner electrode layers and metal electric resistance layer is compressed to the nickel alloy layer on protective layer both sides end face and face electrode layer and outer electrode layer crimping.
Be shaped with product indicia district 3 at the protective layer upper surface.
Claims (4)
1. a Standard resistance range is at the chip film fixed resistor of 10 ~ 1M Ω, comprise matrix, the metal electric resistance layer, inner electrode layer, outer electrode layer and protective layer, it is characterized in that: at described body upper surface middle part, the metal electric resistance layer is installed, the symmetrical inner electrode layer that coats of mirror image on the matrix of metal electric resistance layer both sides, two inner electrode layers all join with the metal electric resistance body, all coat outer electrode layer outside each inner electrode layer, described protective layer width is 4.8 ~ 5mm, the inner electrode layer that is positioned at body upper surface is the face electrode layer, its width is 0.58 ~ 0.6mm, the inner electrode layer that is positioned at the matrix lower surface is dorsum electrode layer, its width is 0.58 ~ 0.6mm, two outer electrode layer mirror image symmetries, its length is 3 ~ 3.2mm, highly be 0.6 ~ 0.8mm.
2. Standard resistance range according to claim 1, at the chip film fixed resistor of 10 ~ 1M Ω, is characterized in that: described metal electric resistance layer is metallic film.
3. Standard resistance range according to claim 1, at the chip film fixed resistor of 10 ~ 1M Ω, is characterized in that: between described each inner electrode layer and outer electrode layer, add nickel alloy layer.
4. Standard resistance range according to claim 3 is at the chip film fixed resistor of 10 ~ 1M Ω; it is characterized in that: between the connecting portion of described two inner electrode layers and metal electric resistance layer, be coated with protective layer; the complete covering metal resistive layer of this protective layer and the connecting portion of two inner electrode layers and metal electric resistance layer is compressed to the nickel alloy layer on protective layer both sides end face and face electrode layer and outer electrode layer crimping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320387294.9U CN203386556U (en) | 2013-06-30 | 2013-06-30 | Sheet type film fixed resistor with resistance range of 10-1 M omega |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320387294.9U CN203386556U (en) | 2013-06-30 | 2013-06-30 | Sheet type film fixed resistor with resistance range of 10-1 M omega |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203386556U true CN203386556U (en) | 2014-01-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320387294.9U Expired - Fee Related CN203386556U (en) | 2013-06-30 | 2013-06-30 | Sheet type film fixed resistor with resistance range of 10-1 M omega |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203386556U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107359035A (en) * | 2017-07-13 | 2017-11-17 | 中国振华集团云科电子有限公司 | The manufacture method of chip fixed resister and chip fixed resister |
-
2013
- 2013-06-30 CN CN201320387294.9U patent/CN203386556U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107359035A (en) * | 2017-07-13 | 2017-11-17 | 中国振华集团云科电子有限公司 | The manufacture method of chip fixed resister and chip fixed resister |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140108 Termination date: 20160630 |