JP3982655B2 - Manufacturing method of electronic parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing an electronic component.
[0002]
[Prior art]
As a prior art of a method for manufacturing an electronic component, a conductive paste is applied to the entire surface of an insulating substrate (original substrate), and after baking, patterning for individual electronic components is performed. A manufacturing method for cutting out electronic components individually is known. For example, in Japanese Patent Application Laid-Open No. 9-19985, in manufacturing a high-frequency inductor as an electronic component, a conductive paste such as silver is applied over the entire surface of an insulating substrate such as alumina, and after the conductive paste is sintered, photolithography is performed. For example, a manufacturing method is disclosed in which a number of spiral conductor patterns are formed by executing the process, and the spiral conductor patterns are cut out in the last process.
[0003]
In the case of this manufacturing method, as the number of electronic components that can be formed on a single insulating substrate increases, the mass productivity increases. Therefore, in order to increase the mass productivity, the electronic components must be made as small as possible and the plane of the insulating substrate can be increased. It is desirable to make the shape as large as possible.
[0004]
[Problems to be solved by the invention]
However, conventionally, since the conductive paste was applied to the entire surface of the insulating substrate, it has been found that there is a problem that the insulating substrate is warped in the process of baking the conductive paste on the insulating substrate.
[0005]
FIG. 8 is an explanatory view showing the warpage of the insulating substrate. A conductor film 6 is applied to the entire surface of one side of the insulating substrate 1. With such a configuration, in the step of baking the conductor film 6 on the insulating substrate 1, warping ΔG occurs due to stress generated at the interface between the conductor film 6 and the insulating substrate 1.
[0006]
This warpage deteriorates the adhesion between the photomask and the photoresist on the insulating substrate when patterning the conductor film by a photolithography process, and lowers the pattern accuracy.
[0007]
In addition, when a photoresist is applied on an insulating substrate by, for example, a spin coating method, the coating thickness of the photoresist varies on the insulating substrate, and the pattern accuracy and stability are also lowered.
[0008]
The warpage of the insulating substrate appears more prominently as the planar area of the insulating substrate is increased in order to increase mass productivity. For this reason, there has been a limit to improving the mass productivity by increasing the size of the insulating substrate.
[0009]
If the insulating substrate is thickened, the warpage can be suppressed to some extent. However, as the shape of the electronic component is made smaller, the horizontal or vertical width viewed in a plane and the thickness are approximated, and the stability (commonly known as sitting) when mounted on a circuit board becomes worse. . In addition, when the insulating substrate becomes thick, it takes a long time to individually take out the electronic components by cutting the insulating substrate, resulting in a decrease in mass productivity. Further, the conductor pattern for securing the function as an electronic component is small. In spite of the area, a conductor is formed on the entire surface of the insulating substrate, and most of the portion excluding the conductor pattern is removed by etching.
[0010]
[Problems to be solved by the invention]
The subject of this invention is providing the manufacturing method of the electronic component which can suppress that curvature generate | occur | produces in an insulated substrate.
[0011]
Another object of the present invention is to provide a method of manufacturing an electronic component capable of forming a high-precision and high-definition pattern.
[0012]
Yet another object of the present invention is to provide an electronic component manufacturing method capable of suppressing the occurrence of warpage even when a thin insulating substrate and an insulating substrate having a large flat area are used.
[0013]
Still another object of the present invention is to provide a method for manufacturing an electronic component excellent in mass productivity.
[0014]
[Means for Solving the Problems]
In order to solve the above-described problems, a method of manufacturing an electronic component according to the present invention includes applying a conductor paste on one surface of an insulating substrate made of an inorganic sintered body so as to form a mesh pattern, Forming a group of conductive coating films in a plurality of rows and then heat-treating the conductive coating film onto the insulating substrate;
[0015]
As described above, a conductive paste is applied on one surface of an insulating substrate made of an inorganic sintered body so as to form a mesh pattern to form a group of conductive coating films having a plurality of rows and a plurality of columns. As a result, it was confirmed that even if a heat treatment for baking the conductive coating film on the insulating substrate was performed, the insulating substrate was not warped. The reason for this is that the conductive coatings are arranged in a plurality of rows and columns, so that in the heat treatment step of baking the conductive coatings on the insulating substrate, thermal stress is individually applied to each of the conductive coatings. It is presumed to occur.
[0016]
Further, since the insulating substrate is not warped, the insulating substrate can be thinned. For this reason, an electronic component with good stability (sitting) when mounted on a circuit board can be manufactured.
[0017]
In addition, since the insulating substrate can be thinned, the work time required for cutting the insulating substrate and the like can be shortened, and mass productivity can be improved.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
1-6 is a figure which shows the process included in the manufacturing method of the electronic component based on this invention. First, as shown in FIG. 1, an insulating substrate 1 made of an inorganic sintered body is prepared. The insulating substrate 1 may be an insulating substrate in which the conductive paste can be baked, and a ceramic material is appropriate. In particular, an inorganic sintered body having a composite composition of a ceramic component and a glass component is desirable.
[0019]
Next, as shown in FIG. 2, a conductive paste is applied on one surface of the insulating substrate 1 so as to form a mesh pattern, and a conductive coating film having an array of a plurality of n rows and a plurality of m columns. A group of Q11 to Qnm is formed. The conductive paste is a paint obtained by mixing a conductive component, glass frit, an organic vehicle and a solvent. A screen printing method is suitable as a means for applying the conductor paste. Between each of the plurality of n rows and between each of the plurality of m columns, a region 3 where the surface of the insulating substrate 1 is exposed without applying the conductive paste is provided in a strip shape.
[0020]
Moreover, since the edge part 4 of the circumference | surroundings of the insulated substrate 1 becomes a part cut off, the electroconductive coating films Q11-Qnm are not formed. Since this region 4 is obtained in the process of manufacturing the electronic component, for example, by providing a marker 5 as a reference for positioning, it can be subjected to an automated process by image processing. In this embodiment, since the marker 5 is provided between each row and column, it is possible to obtain individual electronic components by cutting at the marker 5 portion.
[0021]
Next, the conductive coating films Q11 to Qnm are baked on the insulating substrate 1 by heat treatment. It is desirable to dry the applied conductor paste before baking.
[0022]
The baking temperature is determined by the conductive paste, and is selected, for example, in the range of 600 to 900 ° C. The insulating substrate 1 made of an inorganic sintered body having a composite composition of a ceramic material, particularly a ceramic component and a glass component, tends to soften during the baking heat treatment of the conductive coating films Q11 to Qnm. Caused warping. On the other hand, in the present invention, a conductive paste is applied on one surface of the insulating substrate 1 made of an inorganic sintered body so as to form a mesh pattern, and an arrangement of a plurality of n rows and a plurality of m columns. It is confirmed that the insulating substrate 1 is not warped even when a heat treatment for baking the conductive coatings Q11 to Qnm on the insulating substrate 1 is performed. . The reason for this is that the conductive coatings Q11 to Qnm are arranged separately in a plurality of n rows and a plurality of m columns, and therefore in the heat treatment step of baking the conductive coatings Q11 to Qnm on the insulating substrate 1, Is presumed to occur individually in each of the conductive coating films Q11 to Qnm.
[0023]
In addition, since the insulating substrate 1 is not warped, the insulating substrate 1 can be thinned. For this reason, an electronic component with good stability (sitting) when mounted on a circuit board can be manufactured.
[0024]
In addition, since the insulating substrate 1 can be thinned, the work time required for cutting the insulating substrate 1 can be shortened and the mass productivity can be improved.
[0025]
Since the surfaces of the conductive coating films Q11 to Qnm baked on the insulating substrate 1 are usually rough, it is preferable to perform polishing with weak buffing. As a result, the surfaces of the conductive coating films Q11 to Qnm can be smoothed and an extremely fine pattern can be formed with high accuracy.
[0026]
Next, the insulating substrate 1 shown in FIG. 2 is subjected to a patterning process. The patterning process includes a photolithography process and a chemical etching process.
[0027]
The photolithography process is suitable for forming a high-precision and high-definition pattern. In the photolithography process, first, a photoresist 6 is applied as shown in FIG. Specifically, the photosensitive resist 6 is applied to the entire surface of the insulating substrate 1 including the conductive coating films Q11 to Qnm by spin coating on the insulating substrate 1. After the coating, the photoresist is heat-treated and primarily cured according to a normal process.
[0028]
Next, as shown in FIG. 4, a photomask 7 is brought into contact with the surface of the photoresist 6 coated on the insulating substrate 1, exposed, and developed. As a result, as shown in FIG. 5, a portion D <b> 1 exposed and developed according to the pattern of the photomask 7 is generated in the photoresist 6. In this case, since the warp of the insulating substrate 1 is extremely small in the present invention, the photomask 7 can be reliably brought into contact with the surface of the photoresist 6 to improve the pattern accuracy and to be stabilized.
[0029]
A step of buffing the surfaces of the conductive coating films Q11 to Qnm may be included before the photolithography step. By passing through such a process, the photoresist 6 and the photomask can be more closely adhered to each other, and the obtained pattern accuracy can be improved.
[0030]
Next, after performing a secondary curing process on the exposed and developed photoresist 6, a chemical etching process is performed to form a target pattern. In the chemical etching process, the insulating substrate 1 is immersed in an etching solution or put into a shower cleaning tank of the etching solution. The etching solution is selected corresponding to the constituent materials of the conductive coating films Q11 to Qnm. When the conductive coating films Q11 to Qnm are mainly composed of copper, a ferric chloride solution is used as an etching solution.
[0031]
In order to strengthen the adhesion between the conductive piece and the insulating substrate during baking, glass frit is mixed in the conductive paste. Since this glass frit is eroded by acid, an acidic etching solution cannot be used. When the conductive coatings Q11 to Qnm are formed using a conductive paste containing copper as a main component, an alkaline solution of ferric chloride can be used. Can be avoided.
[0032]
Next, after removing the photoresist 6, as shown in FIG. 6, the insulating substrate 1 is cut along the cutting line XX displayed in the region 3 between each column and row, and individual electronic components are cut. Get. The cutting process is performed using the marker 5 as a reference.
[0033]
In the embodiment, the case where the positive type photoresist 6 is used has been described as an example. However, a negative type photoresist may be used.
[0034]
1 to 6 are subdivided until each of the conductive coating films Q11 to Qnm corresponds to each finally obtained electronic component, but is not limited to such an example. It is good also as an electroconductive coating film containing some of the electroconductive coating films Q11-Qnm. An example is shown in FIG. In the example of FIG. 7, wide conductive coatings R11 to R33 including nine pieces of the conductive coatings Q11 to Qnm are arranged in a three-row, three-column network pattern.
[0035]
【The invention's effect】
As described above, according to the present invention, the following effects can be obtained.
(A) It is possible to provide a method for manufacturing an electronic component capable of suppressing the occurrence of warpage in an insulating substrate. (B) To provide a method for manufacturing an electronic component capable of forming a high-precision and high-definition pattern. it can.
(C) Even when a thin insulating substrate and an insulating substrate having a large plane area are used, it is possible to provide a method for manufacturing an electronic component that can suppress warping.
(D) It is possible to provide a method for manufacturing an electronic component excellent in mass productivity.
[Brief description of the drawings]
FIG. 1 is a perspective view showing one of steps included in a method of manufacturing an electronic component according to the present invention.
FIG. 2 is a diagram showing a step after the step shown in FIG.
3 is a diagram showing a step after the step shown in FIG. 2. FIG.
4 is a diagram showing a step after the step shown in FIG. 3. FIG.
5 is a diagram showing a step after the step shown in FIG. 4. FIG.
6 is a diagram showing a step after the step shown in FIG. 5. FIG.
FIG. 7 is a diagram showing another process example of the method for manufacturing an electronic component according to the present invention.
FIG. 8 is a diagram illustrating a conventional problem.
[Explanation of symbols]
1 Insulating substrate Q11 to Qnm Conductive coating film 6 Resist 7 Photomask

Claims (7)

A method for producing an electronic component, wherein a conductive paste is applied on one surface of an insulating substrate made of an inorganic sintered body so as to form a mesh pattern, and a conductive coating film having a plurality of rows and a plurality of columns. Form a group of
Next, by heat treatment, the conductive coating film is baked on the insulating substrate,
Then, including a step of patterning each of the conductive coating film ,
Manufacturing method of electronic components.  2. The method of manufacturing an electronic component according to claim 1, wherein the insulating substrate includes a ceramic component and a glass component.  3. The method of manufacturing an electronic component according to claim 1, wherein the conductive paste is applied using a screen printing method. 4. The method of manufacturing an electronic component according to claim 1 , wherein the step of patterning each of the conductive coating films includes a photolithography step and a chemical etching step. Production method. 5. The method of manufacturing an electronic component according to claim 4 , comprising a step of buffing the surface of the conductive coating film before patterning each of the conductive coating films. 6. The method of manufacturing an electronic component according to claim 4 , wherein the conductor paste contains copper as a main component and glass frit, and the chemical etching step includes ferric chloride solution. The manufacturing method of the electronic component performed using this. It is a manufacturing method of the electronic component in any one of Claim 3, 4, 5, or 6 , Comprising: After patterning each of the said conductive coating film, the said insulated substrate is made into the said conductive coating film. An electronic component manufacturing method including a step of cutting between rows and columns of a group.

Images