JPH08116150A - Formation of electrode wiring and resistance element - Google Patents

Abstract

PURPOSE: To form an electrode wiring and a resistance element which can cope with microstructure and high definition of an integrated circuit, etc. CONSTITUTION: After a conductive film 12 is formed on a substrate 1 by a thick film print method and photosensitive resin 13 which is patterned by photolithography is put on the conductive film 12, the following processes are executed; a first process for forming an electrode wiring by etching the conductive film 12 by using the photosensitive resin 13 as a mask material and a second process for forming a resistance element by putting photosensitive resin having a recessed part in a position corresponding to a resistance element by photolithography on a substrate and burying a resistance material in the recessed part and thereafter peeling the photosensitive resin. The first process and the second process can be inverted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistance element-equipped electrode wiring for an electronic device such as an integrated circuit element or an image display device and a method for forming the resistance element.

[0002]

2. Description of the Related Art Various electronic devices, especially IC chips and L
Recent development of the electronics industry is supported by miniaturization and high density of semiconductor integrated circuit components represented by SI. Among these semiconductor parts, modules and hybrid ICs have electrode wiring and resistance elements formed on an insulating substrate, and further include passive elements such as capacitors and active elements such as semiconductor ICs and individual semiconductor elements as constituent elements. It is an integrated circuit.

Taking a hybrid IC as an example, its manufacturing method can be divided into a thin film hybrid IC and a thick film hybrid IC. The latter occupies 90% or more of the whole. In manufacturing a thick film hybrid IC, first, a conductor paste and a dielectric paste are alternately printed on an insulating substrate such as ceramic, drying and firing are repeated, and upper and lower layers are connected by via holes provided in the dielectric. Then, a multi-layer circuit is formed. As for the resistance pattern, a resistance paste for thick film printing is printed, dried and fired.

[0004]

As described above, according to the prior art, since the thick film printing method is used as the pattern forming method of the constituent elements including the electrode wiring and the resistance element of the integrated circuit, the fine pattern of the formed pattern is used. However, there is a limit to the increase in density, and therefore, there has been a problem that it is not possible to proceed with the densification of integrated circuits. For example, in the case of electrode wiring, the conventional thick film printing method is 100
It cannot be applied to high-definition patterns of μm / line or less. Further, regarding the resistance element, the resistance value of the resistance element is determined by the size of the resistance element if the resistance paste is the same, and therefore, in the resistance element formed by the thick film printing method, depending on the dimensional accuracy. The resistance value easily deviates from the design value.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a method of forming an electrode wiring and a resistance element which can cope with miniaturization and high definition of an integrated circuit or the like. To provide.

[0006]

In order to achieve the above object, the first aspect of the present invention is a method for forming an electrode wiring and a resistance element in an electrode wiring with a resistance element, the method including at least the following steps. It is characterized by being manufactured in. (1) A conductive film is formed on a substrate by a thick film printing method, a photosensitive resin patterned by a photolithography method is placed on the conductive film, and the conductive resin is used as a mask material. Step of etching conductive film to form electrode wiring (2) A photosensitive resin having a recess at a position corresponding to a resistance element is set on a substrate by a photolithography method, and the resistance material is embedded in the recess. After that, the second step of peeling the photosensitive resin to form a resistance element

Alternatively, in the above method of forming the electrode wiring and the resistance element, the order of the first step of forming the electrode wiring and the second step of forming the resistance element is reversed.

In order to achieve the same object, a second aspect of the present invention is a method for forming an electrode wiring and a resistance element in an electrode wiring with a resistance element, the method including at least the following steps. It is characterized by that. (1) A conductive film is formed on a substrate by a thick film printing method, a photosensitive resin patterned by a photolithography method is placed on the conductive film, and the conductive resin is used as a mask material. Step of etching conductive film to form electrode wiring (2) A dielectric film having a recess at a position corresponding to the resistance element is formed on the substrate, and the resistance material is embedded in the recess to form the resistance element. Second step of forming

Alternatively, in the above method of forming the electrode wiring and the resistance element, the order of the first step of forming the electrode wiring and the second step of forming the resistance element is reversed.

In order to achieve the same object, a third aspect of the present invention is a method of forming an electrode wiring and a resistance element in an electrode wiring with a resistance element, which method includes at least the following steps. It is characterized by making. (1) First step of forming a concave portion at a position corresponding to the resistive element on the substrate and burying a resistive material in the concave portion to form the resistive element (2) Forming a conductive film on the substrate by a thick film printing method Then, a photosensitive resin patterned by a photolithography method is placed on the conductive film, and then the conductive film is etched using the photosensitive resin as a mask material to form an electrode wiring.

[0011]

According to the method of forming the electrode wiring and the resistance element having the above-mentioned structure, it is possible to mass-produce the conductive film by the thick film printing method and the photolithography method using the photosensitive resin. Since the electrode wiring is formed by applying the above method, it is possible to achieve high definition and high density of the electrode wiring, and thus the integrated circuit.

Furthermore, since the resistance element is formed by application of photolithography, this is also effective for high definition and high density of the integrated circuit. In addition, since the dimensional accuracy of the resistance element is improved, the resistance element having the resistance value as designed can be easily formed. Further, by embedding the resistance element in the dielectric film or the substrate, it is possible to reduce structural irregularities and facilitate mounting of a chip or the like on the electrode wiring.

[0013]

【Example】

(Embodiment 1) FIG. 1 shows a part of a constitutional example of electrode wiring with a resistance element manufactured according to the present invention.
Is a perspective view from the front surface of the substrate, and FIG. 6B is a sectional view taken along line XY in FIG.

As shown in the figure, the electrode element-equipped electrode wiring of this embodiment has an electrode wiring 2 formed on a substrate 1.
The electrode wiring 2 is composed of a linear lead 3 and a land 4 independent of the lead 3, and the lead 3 and the land 4 are electrically connected via a resistance element 5. Hereinafter, the electrode wiring 2 in the resistance-equipped electrode wiring of this structure 2
The forming method and the material thereof will be described with reference to the process chart shown in FIG.

In FIG. 2, a substrate 1 is a substrate for forming electrode wirings and resistance elements. The substrate 1 may be a flat surface or a curved surface and is chemically stable, and a ceramic substrate, a glass substrate, a resin substrate, or the like can be considered as the insulating substrate. However, in this embodiment, the glass substrate is used and before use. Was subjected to cleaning and annealing treatment. Further, if necessary, a dielectric paste was applied onto the substrate 1, dried and baked to form a dielectric film 11 as shown in FIG. 2 (a). The substrate 1 may be a metal plate, but in this case, the dielectric film 11 as described above may be formed on the surface to ensure insulation.

Then, a conductive paste is thick-film printed on the substrate 1, and the paste is dried and fired, as shown in FIG.
The conductive film 12 was formed as shown in FIG.
(B) In the following, illustration of the dielectric film 11 is omitted). This conductive film 12 is patterned into an electrode wiring 2 by an etching process in a later step. The material of the conductive paste is Au, Ag, Pt, Pd,
In addition to metals such as Cu, Al and Ni and alloys thereof, I
Any conductive oxide such as TO that can be formed into a paste for thick film printing and that can be chemically etched may be used. In this example, Au and Ag were good.

Next, as shown in FIG. 2C, a liquid photosensitive resin 13 was applied on the conductive film 12 and dried. The coating method may be any method such as spin coating, roll coating, blade coating, reverse coating, spraying or dipping as long as it is a method for coating a liquid material. Further, the photosensitive resin 13 does not have to be liquid, and a film resist can be used. When a film resist is used, it may be directly attached on the conductive film 12 using a laminator.

After that, as shown in FIG. 2D, the photosensitive resin 13 was exposed through the light shielding mask 14 on which the pattern of the electrode wiring 2, that is, the lead 3 and the land 4 was arranged. When the photosensitive resin is a film resist,
After the exposure, heat treatment is performed at 70 to 90 ° C. for about 5 to 15 minutes,
The pattern resolution was better when the resin curing in the exposed area was accelerated.

Next, as shown in FIG. 2 (e), the unexposed portion of the photosensitive resin 13 is chemically dissolved with a dedicated developer,
The pattern development of the layer of the photosensitive resin 13 is performed. Again, when the negative photosensitive resin 13 is used, the unexposed portion is dissolved as described above, and when the positive photosensitive resin 13 is used, the exposed portion is dissolved. Then, after the development process is completed, the photosensitive resin 13 is cured by heat treatment, if necessary. As a result of this curing treatment, the adhesion between the conductive film 12 and the photosensitive resin 13 is increased, and it is possible to prevent the etching failure that occurs during the etching treatment in the subsequent process.

Then, as shown in FIG. 2F, the conductive film 1 is formed by using the patterned photosensitive resin 13 as a mask material.
2 was chemically etched to form electrode wiring 2. After completing the etching process, cleaning and drying were performed.

After the etching process of the conductive film 12 is completed,
As shown in FIG. 2G, the photosensitive resin 13 was peeled off, and the substrate was washed and dried to form the electrode wiring 2 processed into a predetermined pattern.

After the above-mentioned electrode wiring forming process is completed, a resistance element is subsequently formed. The process of forming the resistance element will be described below with reference to the process diagram shown in FIG.

First, as shown in FIG. 3A, a photosensitive resin 13 was newly applied onto the substrate 1 on which the electrode wiring 2, that is, the leads 3 and the lands 4 had been formed in the above process. As the coating method of the photosensitive resin 13, any of the above coating methods may be used.
Alternatively, a film resist may be used.

Next, as shown in FIG. 3 (b), exposure was performed through the light shielding mask 14 so that a concave portion was formed at a predetermined position where the resistance element of the photosensitive resin 13 was arranged. When the photosensitive resin is a film resist, after exposure,
The pattern resolution was better when heat treatment was performed at 70 to 90 ° C. for about 5 to 15 minutes to accelerate the resin curing in the exposed area.

Subsequently, as shown in FIG. 3 (c), the unexposed portion of the photosensitive resin 13 is chemically dissolved with a dedicated developer,
Recess 1 for embedding a resistive material in the layer of photosensitive resin 13
3a was formed. At this time, when the negative photosensitive resin 13 is used, the unexposed portion is dissolved as described above, and when the positive photosensitive resin 13 is used, the exposed portion is dissolved. Then, after the development process is completed, the photosensitive resin 13 is cured by heat treatment, if necessary. As a result of this curing treatment, a stable photosensitive resin 13 can be formed even in the subsequent process.

Further, as shown in FIG. 3 (d), the resistance material 15 is embedded in the recess 13a. In this embodiment,
A RuO ₂ paste for thick film printing was used as a resistance material, the recess 13a was filled with the RuO ₂ paste, and then the paste was dried.

After filling the resistance material 15, the photosensitive resin 13 was peeled from the substrate to form the desired resistance element 5, as shown in FIG. 3 (e). RuO as the resistance material 15
_{When 2} is used, after peeling off the photosensitive resin 13,
The paste was fired to complete the resistance element 5.

In the above embodiment, in the formation of the electrode wiring with the resistance element, the electrode wiring is first formed and then the resistance element is formed. However, the order of these steps can be reversed. That is, first, the concave portion 13a is formed on the substrate 1.
After a step of forming a photosensitive resin 13 having the above-mentioned structure, embedding a resistance material in the concave portion 13a, and peeling the photosensitive resin 13 to form the resistance element 5, then a conductive film 12 is formed on the substrate. Then, a patterned photosensitive resin 13 is formed on the conductive film 12, the conductive film 12 is etched using the photosensitive resin 13 as a mask material, and then the photosensitive resin 13 is peeled off. The target electrode wiring with a resistance element is obtained.

(Second Embodiment) In the first embodiment, the resistance element 5 is formed on the substrate 2.
Can be embedded in the dielectric film 11. Hereinafter, a method of forming the electrode element-equipped electrode wiring having this structure will be described. Since the process of forming the electrode wiring 2 is the same as that of the first embodiment, its explanation is omitted here, and the resistance element 5 is formed on the substrate 1 on which the leads 3 and the lands 4 are already formed.
The process of forming the film will be described with reference to the process diagram shown in FIG.

First, as shown in FIG. 4A, a dielectric film 11 having a recess 11a for burying a resistance material was formed. The dielectric film 11 may be formed by thick film printing by a screen printing method, which facilitates the formation of the recess 11a. A glass paste may be used as the dielectric paste. However, when high accuracy is required as the dimensional accuracy of the resistance element 5, the recess 11a may be processed by the sandblast method instead of the screen printing method. When the recess 11a is processed by the sandblast method, first, the dielectric paste is thick-film printed on the substrate 1 and then the paste is dried to form the dielectric film 11, and then the recess 11a is formed.
A mask material made of a photosensitive resin excluding a predetermined amount to be formed is formed on the dielectric film 11, a recess 11a is formed by a sandblast method, the photosensitive resin is peeled off, and then the dielectric film 11 is baked. Then, a structure similar to that shown in FIG. 4A is obtained. The advantage of using the sandblast method is that pattern processing is performed by a photolithography method using a photosensitive resin instead of the screen printing method, so that submicron pattern accuracy can be obtained.

Subsequently, as shown in FIG. 4B, the resistance material 15 was embedded in the recess 11a formed in the dielectric film 11 to form the resistance element 5. In this example, a RuO ₂ paste for thick film printing was used as the resistance material, and after the paste was filled, the paste was dried and fired to form the resistance element 5. As is clear from FIG. 4 (b), the advantage of this structure is flatness without structural irregularities.

In the above-described embodiment, the electrode wiring is first formed, and then the resistance element is formed. However, as in the case of the first embodiment, the order of these steps can be reversed. Further, when the substrate 1 is an insulating substrate such as a ceramic substrate or a glass substrate, as shown in FIG. 5, the recess 1a is directly formed in the substrate 1 and the resistance material 15 is embedded in the recess 1a. It is also possible to form the resistance element 5 with. In this case, the recess 1a may be formed by a sandblast method or an etching method. After the resistance material 15 is embedded in the recess 1a and the resistance element 5 is formed in the substrate 1, the electrode wiring is formed by the same process as in the method described in the first embodiment. Can be made.

(Third Embodiment) In the first and second embodiments described above, a method for forming electrode element-equipped electrode wiring for an electronic device such as an integrated circuit has been mainly described. Especially as electrode wiring with resistance element for image display device,
An example of forming an anode group and a resistance element for a gas discharge display panel will be described.

FIG. 6 is a schematic view of the anode group and the resistance element for the gas discharge display panel formed in this example. This figure is a perspective view of the panel substrate as seen from the front, and is an enlarged view of a part of the panel.

The anode group is composed of an anode bus 21 corresponding to a lead, an anode terminal 22 for image display on a land, and an auxiliary anode 23. The anode bus 21 and the anode terminal 22 are resistance elements for controlling current. It is electrically connected via 5. Then, a discharge is generated between each anode terminal 22 and a cathode formed on the substrate facing the anode terminal 22 to emit light in the display cell to perform display.

When the anode group wiring and the resistance element shown in FIG. 6 were formed by the method of the first embodiment, the size was 350 × 15.
The resistance element 5 having a resistance value of 0 × 10 μm and a resistance value of about 1 MΩ could be uniformly formed. The factors that determine the resistance value of the resistance element 5 are, in addition to the dimensional accuracy of the resistance element 5 itself, the anode bus 21 and the anode terminal 22 that determine the effective dimension of the resistance element 5.
There is also distance accuracy with. By applying a photolithography method using a photosensitive resin, it is possible to form a uniform resistive element 5 for the first time by highly accurate electrode and resistive element processing. Since the control of the variation in the resistance value directly leads to the uneven brightness of each display cell, it is an important issue in the image display device.

[0037]

As described above, according to the method of forming the electrode wiring and the resistance element of the present invention, high-precision electrode and resistance element processing is realized by applying the photolithography method using the photosensitive resin, It is possible to form a pattern that is compatible with miniaturization and high density of integrated circuits. Further, since the film is formed by the thick film printing method, mass production is easy.

Further, by forming the electrode wiring for the image display device by the method of the present invention, it is possible to form the electrode wiring in which the resistance element having a uniform resistance value is arranged for each display cell, Therefore, the formed electrode wiring with the resistance element can enable image display without uneven brightness while controlling the current.

[Brief description of drawings]

1A and 1B show a part of a configuration example of an electrode wiring with a resistance element manufactured according to the present invention, FIG. 1A is a perspective view from the front surface of a substrate, and FIG. 1B is FIG. 1A. 3 is a sectional view taken along line XY in FIG.

FIG. 2 is a first part of the forming method according to the first aspect of the present invention.
It is a flowchart for explaining a process.

FIG. 3 is a second part of the forming method according to the first aspect of the present invention.
It is a flowchart for explaining a process.

FIG. 4 is a second part of the forming method according to the second aspect of the present invention.
It is a flowchart for explaining a process.

FIG. 5 is a first diagram of a forming method of a third aspect according to the present invention.
It is sectional drawing for demonstrating a process.

FIG. 6 is a schematic view of an anode group and a resistance element for a gas discharge display panel to which the forming method of the present invention is applied.

[Explanation of symbols]

 1 Substrate 2 Electrode Wiring 3 Lead 4 Land 5 Resistance Element 11 Dielectric Film 12 Conductive Film 13 Photosensitive Resin 14 Light-shielding Mask 15 Resistive Material 21 Anode Bus 22 Anode Terminal 23 Auxiliary Anode

Claims (5)

[Claims] 1. A method of forming an electrode wiring and a resistance element in an electrode wiring with a resistance element, which is characterized by including at least the following steps. (1) A conductive film is formed on a substrate by a thick film printing method, a photosensitive resin patterned by a photolithography method is placed on the conductive film, and the conductive resin is used as a mask material. Step of etching conductive film to form electrode wiring (2) A photosensitive resin having a recess at a position corresponding to a resistance element is set on a substrate by a photolithography method, and the resistance material is embedded in the recess. After that, the second step of peeling the photosensitive resin to form a resistance element 2. The method of forming an electrode wiring and a resistance element according to claim 1, wherein the order of the first step of forming the electrode wiring and the second step of forming the resistance element is reversed. Method for forming electrode wiring and resistance element to be used. 3. A method of forming an electrode wiring and a resistance element in an electrode wiring with a resistance element, the method including at least the following steps: a method of forming an electrode wiring and a resistance element. (1) A conductive film is formed on a substrate by a thick film printing method, a photosensitive resin patterned by a photolithography method is placed on the conductive film, and the conductive resin is used as a mask material. Step of etching conductive film to form electrode wiring (2) A dielectric film having a recess at a position corresponding to the resistance element is formed on the substrate, and the resistance material is embedded in the recess to form the resistance element. Second step of forming 4. The method of forming an electrode wiring and a resistance element according to claim 3, wherein the order of the first step of forming the electrode wiring and the second step of forming the resistance element is reversed. Method for forming electrode wiring and resistance element to be used. 5. A method of forming an electrode wiring and a resistance element in an electrode wiring with a resistance element, which is characterized by including at least the following steps. (1) First step of forming a concave portion at a position corresponding to the resistive element on the substrate and burying a resistive material in the concave portion to form the resistive element (2) Forming a conductive film on the substrate by a thick film printing method Then, a photosensitive resin patterned by a photolithography method is placed on the conductive film, and then the conductive film is etched using the photosensitive resin as a mask material to form an electrode wiring.