CN112770517A - Manufacturing method of high-precision vehicle-mounted aluminum substrate - Google Patents
Manufacturing method of high-precision vehicle-mounted aluminum substrate Download PDFInfo
- Publication number
- CN112770517A CN112770517A CN202011531066.5A CN202011531066A CN112770517A CN 112770517 A CN112770517 A CN 112770517A CN 202011531066 A CN202011531066 A CN 202011531066A CN 112770517 A CN112770517 A CN 112770517A
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- Prior art keywords
- aluminum substrate
- manufacturing
- printing
- precision
- exposure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Abstract
The invention relates to the technical field of substrate manufacturing, and discloses a manufacturing method of a high-precision vehicle-mounted aluminum substrate, which comprises S1 and pretreatment; s2, screen printing; s3, etching; s4, stripping; s5, solder resist printing; s6, pre-baking; s7, solder resist exposure, development and drying after development; and S8, performing stamping, electrical detection, OSP surface treatment and appearance inspection on the dried aluminum substrate to obtain the high-precision vehicle-mounted aluminum substrate meeting the requirements. The invention adopts the mode of manufacturing the pattern by the screen printing method to replace the traditional exposure method to manufacture the circuit, obviously has less processing steps, high processing precision and simple processing technology, is easy to operate, can greatly reduce the manufacturing cost and improve the economic benefit.
Description
Technical Field
The invention relates to the technical field of substrate manufacturing, in particular to a manufacturing method of a high-precision vehicle-mounted aluminum substrate.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a single-sided board generally comprises a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer. Commonly found in LED lighting products. The LED lamp has a front surface and a back surface, wherein the white surface is welded with an LED pin, and the other surface is in an aluminum natural color and is generally coated with heat conduction slurry and then contacted with a heat conduction part. But also ceramic substrates and the like.
The traditional method for manufacturing the existing vehicle-mounted aluminum substrate is to manufacture a circuit by using an exposure method, then manufacture a solder mask by using the exposure method, and the process steps for manufacturing the circuit are as follows: pretreatment → film application → exposure → development → etching → peeling → solder resist printing, and 7 process steps in total, the whole manufacturing process has many flows, the process is complex, and the manufacturing cost is high, so that the manufacturing method of the high-precision vehicle-mounted aluminum substrate is provided.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the manufacturing method of the high-precision vehicle-mounted aluminum substrate, which has the advantages of less manufacturing process flow, simple process, low manufacturing cost and the like, and solves the problems of more process flows, complex process and high manufacturing cost in the existing circuit manufacturing method by using the exposure method.
(II) technical scheme
In order to achieve the purposes of reducing the process flow and reducing the manufacturing cost, the invention provides the following technical scheme: a manufacturing method of a high-precision vehicle-mounted aluminum substrate comprises the following steps:
s1, grinding the copper foil surface of the aluminum substrate, wherein the roughness of the grinding brush is 1000 #;
s2, performing line printing by using a composite stainless steel screen printing plate, and automatically feeding the aluminum substrate into a UV machine for curing after printing;
s3, automatically conveying the cured aluminum substrate into an etching machine, etching the unnecessary copper foil by using an acid etching solution during etching, and reserving the required part to form a circuit pattern;
s4, automatically feeding the etched aluminum substrate into a stripping machine, stripping ink on the surface of the copper foil, automatically feeding the stripped aluminum substrate into a grinding machine for grinding the surface of the copper foil, wherein the roughness of a grinding brush is 1000#, then washing the aluminum substrate with DI water, and drying the aluminum substrate with hot air until the surface of the aluminum substrate is completely dried;
s5, punching a 2.0mm positioning hole on the aluminum substrate, grinding the edge of the aluminum substrate after punching, and then performing resistance welding pretreatment and printing treatment;
s6, after solder resist printing, standing for 55-65 minutes, pre-baking for 45-55 minutes at the temperature of 70-80 ℃, and after pre-baking, placing the aluminum substrate and cooling to room temperature;
s7, performing solder mask exposure on the pre-baked aluminum substrate, developing after exposure is completed, and drying after development is completed;
and S8, performing stamping, electrical detection, OSP surface treatment and appearance inspection on the dried aluminum substrate to obtain the high-precision vehicle-mounted aluminum substrate meeting the requirements.
Further, in step S2, the mesh number of the silk screen printed by the composite stainless steel screen is 400, the wire diameter during printing is 23um, and the hardness of the glue scraper is 80 degrees.
Further, in step S2, the ink used in printing is UV curable, and the UV curing conditions are as follows: the curing energy is 650-750 mj/cm2, and the curing speed is 7-8 m/min.
Further, in step S4, the stripping solution used for stripping is 3% sodium hydroxide.
Further, in step S7, a full-automatic CCD alignment exposure machine is selected for exposure, the exposure lamp is a 9KW halogen lamp, and the exposure precision is ± 0.05 mm.
Further, in step S7, a 1% sodium carbonate solution is selected as the developing solution for development, and the development is performed at a temperature of 30 ℃.
Further, in step S7, the temperature conditions during drying are: drying at 90 deg.C for 45min in stage 1; second stage drying at 120 deg.C for 30 min; the third stage was dried at 150 ℃ for 60 min.
(III) advantageous effects
Compared with the prior art, the invention provides a manufacturing method of a high-precision vehicle-mounted aluminum substrate, which has the following beneficial effects:
1. the method adopts the mode of manufacturing the pattern by the screen printing method to replace the traditional exposure method to manufacture the circuit, and obtains the aluminum substrate with the pattern through five steps of pretreatment, screen printing, etching, stripping and solder resist printing, compared with the traditional process, the method has the advantages of obviously few processing steps, simple and easy operation of the processing process, capability of greatly reducing the manufacturing cost and improving the economic benefit;
2. according to the invention, during the solder resist printing process step, the positioning holes are punched on the aluminum substrate after the circuit printing is basically completed, so that the positioning accuracy in the subsequent exposure process can be improved, and the processing accuracy is improved.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a high-precision vehicle-mounted aluminum substrate according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a method for manufacturing a high-precision vehicle-mounted aluminum substrate includes the following steps:
s1, pretreatment: grinding the copper foil surface of the aluminum substrate, wherein the roughness of a grinding brush is 1000 #;
s2, screen printing: carry out the line printing with combined type stainless steel half tone, the silk screen mesh number 400 meshes of combined type stainless steel screen printing, line diameter 23um during the printing, the gluey scraper hardness of adoption is 80 degrees, and the printing ink that adopts during the printing is the UV solidification type, and the automatic UV machine solidification that gets into of aluminium base board after the printing is accomplished, and UV machine solidification condition is: the curing energy is 700mj/cm2, and the curing speed is 7.5 m/min;
s3, etching: automatically feeding the cured aluminum substrate into an etching machine, etching the unnecessary copper foil by using an acid etching solution during etching, and reserving the required part to form a circuit pattern;
s4, stripping: automatically feeding the etched aluminum substrate into a stripping machine, stripping ink on the surface of the copper foil by adopting 3% sodium hydroxide, automatically feeding the stripped aluminum substrate into a grinding machine for grinding the surface of the copper foil, wherein the roughness of a grinding brush is 1000#, then washing by using DI water, and drying by hot air until the surface of the aluminum substrate is completely dried;
s5, solder resist printing: punching a 2.0mm positioning hole on the aluminum substrate to facilitate the positioning of a subsequent exposure machine, grinding the edge of the aluminum substrate after punching is finished to prevent an insulating layer at the edge from falling off to cause poor solder resist printing, and then performing solder resist pretreatment and printing treatment;
s6, pre-baking: after solder resist printing, standing for 60 minutes to release ink bubbles during printing, pre-baking for 50 minutes at the temperature of 75 ℃, and then placing and cooling the aluminum substrate to room temperature;
s7, solder resist exposure, development and drying: solder resist exposure is conducted on the pre-baked aluminum substrate, a full-automatic CCD (charge coupled device) alignment exposure machine is selected during exposure, an exposure lamp tube of the exposure machine is a 9KW halogen lamp tube, the exposure precision is +/-0.05 mm, development is conducted at the temperature of 30 ℃ after exposure is completed, 1% of sodium carbonate solution is used for a developing solution, the developing solution is dried after the development is completed, and the temperature condition during drying is as follows: drying at 90 deg.C for 45min in stage 1; second stage drying at 120 deg.C for 30 min; the third stage is dried for 60min at the temperature of 150 ℃;
and S8, performing stamping, electrical detection, OSP surface treatment and appearance inspection on the dried aluminum substrate to obtain the high-precision vehicle-mounted aluminum substrate meeting the requirements.
The method is adopted to manufacture the aluminum substrate, the aluminum substrate with the pattern can be obtained through five steps of pretreatment, screen printing, etching, stripping and solder resist printing, compared with the traditional process, the method has the advantages of obviously few processing steps, simple processing process and easy operation, and can greatly reduce the manufacturing cost and improve the economic benefit.
It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A manufacturing method of a high-precision vehicle-mounted aluminum substrate is characterized by comprising the following steps:
s1, grinding the copper foil surface of the aluminum substrate, wherein the roughness of the grinding brush is 1000 #;
s2, performing line printing by using a composite stainless steel screen printing plate, and automatically feeding the aluminum substrate into a UV machine for curing after printing;
s3, automatically conveying the cured aluminum substrate into an etching machine, etching the unnecessary copper foil by using an acid etching solution during etching, and reserving the required part to form a circuit pattern;
s4, automatically feeding the etched aluminum substrate into a stripping machine, stripping ink on the surface of the copper foil, automatically feeding the stripped aluminum substrate into a grinding machine for grinding the surface of the copper foil, wherein the roughness of a grinding brush is 1000#, then washing the aluminum substrate with DI water, and drying the aluminum substrate with hot air until the surface of the aluminum substrate is completely dried;
s5, punching a 2.0mm positioning hole on the aluminum substrate, grinding the edge of the aluminum substrate after punching, and then performing resistance welding pretreatment and printing treatment;
s6, after solder resist printing, standing for 55-65 minutes, pre-baking for 45-55 minutes at the temperature of 70-80 ℃, and after pre-baking, placing the aluminum substrate and cooling to room temperature;
s7, performing solder mask exposure on the pre-baked aluminum substrate, developing after exposure is completed, and drying after development is completed;
and S8, performing stamping, electrical detection, OSP surface treatment and appearance inspection on the dried aluminum substrate to obtain the high-precision vehicle-mounted aluminum substrate meeting the requirements.
2. The method for manufacturing a high-precision on-vehicle aluminum substrate according to claim 1, wherein in step S2, the mesh number of the silk screen printed by the composite stainless steel screen is 400, and the hardness of the glue scraper used is 80 degrees when the line diameter is 23um during printing.
3. The method for manufacturing a high-precision vehicle-mounted aluminum substrate according to claim 1, wherein in step S2, the ink used in printing is UV curable, and the UV curing conditions are as follows: the curing energy is 650-750 mj/cm2, and the curing speed is 7-8 m/min.
4. The method for manufacturing a high-precision on-vehicle aluminum substrate according to claim 1, wherein in step S4, the stripping solution used in the stripping is sodium hydroxide with a concentration of 3%.
5. The method of claim 1, wherein in step S7, a full-automatic CCD aligner is used for exposure, and the exposure lamp is a 9KW halogen lamp with an exposure accuracy of ± 0.05 mm.
6. The method for manufacturing a high-precision on-vehicle aluminum substrate according to claim 1, wherein in step S7, a 1% sodium carbonate solution is selected as a developing solution for development, and the development is performed at a temperature of 30 ℃.
7. The method for manufacturing a high-precision on-vehicle aluminum substrate according to claim 1, wherein in step S7, the temperature conditions during drying are as follows: drying at 90 deg.C for 45min in stage 1; second stage drying at 120 deg.C for 30 min; the third stage was dried at 150 ℃ for 60 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011531066.5A CN112770517A (en) | 2020-12-22 | 2020-12-22 | Manufacturing method of high-precision vehicle-mounted aluminum substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011531066.5A CN112770517A (en) | 2020-12-22 | 2020-12-22 | Manufacturing method of high-precision vehicle-mounted aluminum substrate |
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| CN112770517A true CN112770517A (en) | 2021-05-07 |
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| CN202011531066.5A Pending CN112770517A (en) | 2020-12-22 | 2020-12-22 | Manufacturing method of high-precision vehicle-mounted aluminum substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115319407A (en) * | 2022-07-15 | 2022-11-11 | 苏州市信天游光电材料有限公司 | Manufacturing process of horn net for automobile |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101699935A (en) * | 2009-11-02 | 2010-04-28 | 广东达进电子科技有限公司 | Method for producing locatable high heat conduction ceramic circuit board |
| US20110198112A1 (en) * | 2010-02-12 | 2011-08-18 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method for manufacturing the same |
| CN108966520A (en) * | 2018-07-02 | 2018-12-07 | 昆山万源通电子科技有限公司 | Anti- plagiarism shielded type PCB printing technology |
| CN209914173U (en) * | 2019-04-02 | 2020-01-07 | 重庆霖萌电子科技有限公司 | Circuit board capable of directly printing printed circuit diagram |
| CN211047441U (en) * | 2019-08-24 | 2020-07-17 | 王定锋 | Etched copper-clad aluminum wire conductor circuit board using solder resist ink as anti-corrosion layer |
-
2020
- 2020-12-22 CN CN202011531066.5A patent/CN112770517A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101699935A (en) * | 2009-11-02 | 2010-04-28 | 广东达进电子科技有限公司 | Method for producing locatable high heat conduction ceramic circuit board |
| US20110198112A1 (en) * | 2010-02-12 | 2011-08-18 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method for manufacturing the same |
| CN108966520A (en) * | 2018-07-02 | 2018-12-07 | 昆山万源通电子科技有限公司 | Anti- plagiarism shielded type PCB printing technology |
| CN209914173U (en) * | 2019-04-02 | 2020-01-07 | 重庆霖萌电子科技有限公司 | Circuit board capable of directly printing printed circuit diagram |
| CN211047441U (en) * | 2019-08-24 | 2020-07-17 | 王定锋 | Etched copper-clad aluminum wire conductor circuit board using solder resist ink as anti-corrosion layer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115319407A (en) * | 2022-07-15 | 2022-11-11 | 苏州市信天游光电材料有限公司 | Manufacturing process of horn net for automobile |
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Application publication date: 20210507 |