CN211047441U - Etched copper-clad aluminum wire conductor circuit board using solder resist ink as anti-corrosion layer - Google Patents
Etched copper-clad aluminum wire conductor circuit board using solder resist ink as anti-corrosion layer Download PDFInfo
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- CN211047441U CN211047441U CN201921417836.6U CN201921417836U CN211047441U CN 211047441 U CN211047441 U CN 211047441U CN 201921417836 U CN201921417836 U CN 201921417836U CN 211047441 U CN211047441 U CN 211047441U
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Abstract
The utility model relates to an etching copper-clad aluminum conductor circuit board using solder resist ink as an anti-corrosion layer, in particular to a circuit board which is formed by arranging and coating conductors on a substrate with glue in parallel, printing the solder resist ink, exposing element pads and metal connection points on the conductors during printing, simultaneously exposing the parts of the conductors which need to be etched and disconnected, baking and solidifying, then printing the etch resist ink, printing etching-resistant ink on the bonding pad and the metal connecting point on the lead, then baking to form two ink etching-resistant layers, wherein the solder resist ink is not only a solder resist layer when the circuit board is used, but also a circuit protection layer when in etching, the exposed copper clad aluminum conductor is etched by using an aqueous solution of which the main components are hydrochloric acid, copper dichloride and aluminum trichloride to be disconnected, after etching, and removing the etching-resistant ink by using alkaline ink removing liquid, and reserving the solder-resistant ink to prepare the conductor circuit board of the etched copper-clad aluminum wire by using the solder-resistant ink as an anti-corrosion layer.
Description
Technical Field
The utility model relates to a circuit board field, concretely relates to with hinder welding ink and do etching copper clad aluminum wire circuit board of anti-corrosion layer.
Background
The utility model discloses a series of conductor board patents before people, for example: patent numbers: 201010232487.8, patent name: a single-sided circuit board manufactured by juxtaposing flat wires and a manufacturing method thereof are disclosed in the patent number: 201010232506.7, patent name: the method for manufacturing the single-sided circuit board by adopting the juxtaposed leads has the following patent numbers: 201010232506.7, patent name: the method comprises the following steps of respectively using insulating layers to simultaneously carry out hot pressing on two surfaces of a flat wire to manufacture a single-sided circuit board, wherein the method comprises the following steps: 201010232526.4, patent name: the single-sided circuit board is manufactured by bonding juxtaposed flat leads by using a thermosetting adhesive film, and the patent number is as follows: 201010232547.6, patent name: the method for manufacturing the single-sided circuit board by using the transshipment adhesive film and the juxtaposed flat wires adopts a mode of die cutting or drilling by a drilling machine to break the wires, and has the defects of high die opening cost and inflexible design due to the use of the die, difficulty in changing once the die opening is finished, high cost due to the adoption of a mode of heavy drilling for drilling, insufficient alignment precision and high defective scrap due to easy drilling deviation.
In order to overcome defect more than and not enough, the utility model discloses a with the wire parallel arrangement cover on the substrate of taking the glue, printing hinders solder ink, expose component pad and the metal tie point on the wire, it needs etching disconnection department to expose on the wire simultaneously, the anti etching ink of reprinting is protected and is lived pad and metal tie point, then bake, the wire of the position department that the wire circuit needs the disconnection exposes outside, the mode of taking the etching makes the wire etching disconnection that will expose, form the circuit, design flexibility like this, and is low in cost.
SUMMERY OF THE UTILITY MODEL
The utility model relates to an etching copper-clad aluminum conductor circuit board using solder resist ink as an anti-corrosion layer, in particular to a circuit board which is formed by arranging and coating conductors on a substrate with glue in parallel, printing the solder resist ink, exposing element pads and metal connection points on the conductors during printing, simultaneously exposing the parts of the conductors which need to be etched and disconnected, baking and solidifying, then printing the etch resist ink, printing etching-resistant ink on the bonding pad and the metal connecting point on the lead, then baking to form two ink etching-resistant layers, wherein the solder resist ink is not only a solder resist layer when the circuit board is used, but also a circuit protection layer when in etching, the exposed copper clad aluminum conductor is etched by using an aqueous solution of which the main components are hydrochloric acid, copper dichloride and aluminum trichloride to be disconnected, after etching, and removing the etching-resistant ink by using alkaline ink removing liquid, and reserving the solder-resistant ink to prepare the conductor circuit board of the etched copper-clad aluminum wire by using the solder-resistant ink as an anti-corrosion layer.
According to the utility model provides an etch copper clad aluminum wire circuit board of anti-corrosion layer is done with hindering solder ink, include: a base material layer with glue on the bottom surface; a middle wire circuit layer; a front solder resist ink layer; a disconnection port of the wire circuit disposed on the intermediate wire circuit layer; a bonding pad and a metal connection point on the wire; the method is characterized in that a plurality of disconnection ports which are completely disconnected from the middle are formed on all leads or part of leads of a lead circuit, the completely disconnected leads are copper-clad aluminum leads, the disconnection ports of the copper-clad aluminum leads which are disconnected from the middle display a near-sighted C-shaped structure on the section of the leads which are cut towards the longitudinal direction (the long direction), aluminum in the middle of the leads forms a recess, a window is arranged at the disconnection port of the copper-clad aluminum leads in the middle, a solder mask ink layer is arranged on the front surface of the lead, the disconnection position of the lead is at the edge position of the solder mask ink window on the front surface, the disconnection surface of the lead and the edge of the solder mask ink window are on one section or close to one section, or the disconnection position of the lead is in the solder mask ink window, the lead at the disconnection position of the lead is exposed out of the window, the pads are positive and negative pads of an element, are arranged on two leads or on two, the metal connection points are connection points used for being connected with a power supply circuit or connection points used for interconnection between circuit boards, the solder mask ink layer is provided with a plurality of windows, wherein one part of the windows are a pad window and a metal connection point window, and one part of the windows are windows at the broken positions of the leads.
According to a preferred embodiment of the present invention, the copper-clad aluminum conductor circuit board with solder resist ink as the etching resistant layer is characterized in that the substrate with glue is polyimide PI substrate, or PET substrate, or epoxy glass fiber substrate, or phenolic aldehyde substrate, or ceramic substrate.
According to the utility model discloses a preferred embodiment, an etching copper clad aluminum wire circuit board of anti-corrosion layer is done to printing ink is hindered to use, its characterized in that, the wire of middle wire circuit layer all be copper clad aluminum wire, perhaps partly be copper clad aluminum wire, partly be the copper line, it is copper clad aluminum wire only to etch into complete disconnection.
According to a preferred embodiment of the present invention, the copper clad aluminum conductor circuit board with solder resist ink as the etching resistant layer is characterized in that the insulation ink is printed at the cut-off position of the etched copper clad aluminum conductor to form insulation protection at the cut-off.
According to a preferred embodiment of the present invention, the copper-clad aluminum conductor circuit board with solder resist ink as the etching resistant layer is characterized in that a metal plate with glue is attached to the back side of the conductor circuit board.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the reading of the specification in conjunction with the following drawings, a brief description of which follows.
Fig. 1 is a schematic plan view of a tape base material with wires arranged in parallel.
Fig. 2 is a schematic plan view of a solder resist printed on a conductive line.
Fig. 3 is a schematic plan view of the exposed component pads and metal contacts after printing of a resist ink.
FIG. 4 is a schematic cross-sectional view of a copper-clad aluminum wire at an etching cut-off position, a window is arranged on the front solder resist ink layer, and the cut-off surface of the copper-clad aluminum wire and the window edge of the solder resist ink are on a cross section.
FIG. 5 is a schematic cross-sectional view of a copper-clad aluminum wire at an etching cut-off position, a window is arranged on the front solder resist ink layer, the cut-off position of the copper-clad aluminum wire is in the solder resist ink window, and a lead at the cut-off position of the lead is exposed from the window.
FIG. 6 is a schematic cross-sectional view of applying insulating ink to the cut-off portion after etching of copper clad aluminum wire to form insulation protection at the cut-off portion.
FIG. 7 is a schematic plan view of an etched copper clad aluminum wire conductor circuit board with solder resist as the etch resistant layer.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
A plurality of coils of copper-clad aluminum conductors 2 are placed on a pay-off rack of a wire covering machine, and are positioned and distributed through a spacing rod mould arranged on the wire covering machine to be covered and adhered with a PI substrate 1 with glue at the bottom layer (as shown in figure 1).
On a coil screen printing machine, a copper-clad aluminum conductor 2 arranged on a PI substrate 1 is upwards arranged on a platform below a screen of the screen printing machine, solder resist ink 3 is printed, element pads 3.1a and 3.2a and metal connecting points 3.3a and 3.4a on the conductor are exposed during printing, positions 2.2a and 2.2b (shown in figure 2) needing etching disconnection on the copper-clad aluminum conductor 2 are exposed, after the solder resist ink is baked, etching resistant ink 3.1b, 3.2b, 3.3b and 3.4b are printed on the element pads 3.1a and 3.2a and the metal connecting points 3.3a and 3.4a (shown in figure 3) and then baked to form two-ink etching resistant layers, wherein the solder resist ink 3 is a solder resist layer when a circuit board is used, and is a circuit during etching, and the solder resist ink 3.1a and the metal connecting points 3.2a are used for welding components, the metal connection points 3.3a, 3.4a are used when the circuit board is connected with a power circuit or when the circuit board is interconnected, then the copper-clad aluminum conductor 2 exposed at the positions 2.2a and 2.2b to be disconnected is etched and disconnected by a chemical method by using an aqueous solution of which the main components are hydrochloric acid, copper dichloride and aluminum trichloride as an etching solution to form a circuit, because the etching speed of aluminum in the copper-clad aluminum conductor 2 is higher than that of copper, the section of the conductor cut towards the longitudinal direction (the long direction) forms a structure 2.1 which is nearly in a C shape at the position of the section after the etching disconnection, aluminum in the middle of the copper-clad aluminum conductor forms a recess, and the front solder resist ink layer is provided with a window at the etching disconnection position of the copper-clad aluminum conductor 2, the disconnection surface of the copper-clad aluminum conductor 2 and the window edge of the solder resist ink are on one section (as shown in figure 4), or the front solder resist ink layer is provided with a window at the etching disconnection position of, the disconnected position of the copper-clad aluminum wire is positioned in a solder resist ink window, the wire at the disconnected position of the wire is exposed from the window (shown in figure 5), the anti-etching line inks 3.1b, 3.2b, 3.3b and 3.4b printed on welding spots 3.1a, 3.2a, 3.3a and 3.4a are removed by caustic soda aqueous solution at a film removing section, then the insulating ink 4 is additionally printed at the disconnected position of the etched copper-clad aluminum wire to form insulating protection at the disconnected position (shown in figure 6), and the wire circuit board (shown in figure 5) is manufactured through the processes of silk-screen character printing, OSP surface anti-oxidation treatment, molding, FQC inspection, packaging and the like.
Alternatively, a metal plate with adhesive can be attached to the back of the lead circuit board.
The present invention has been described in detail with reference to the accompanying drawings, in which the present invention is illustrated in detail with reference to the following examples of the etched copper-clad aluminum conductor circuit board using solder resist ink as an etch resist. It will be understood by those skilled in the art, however, that the foregoing is illustrative and descriptive of some specific embodiments only, and not limiting as to the scope of the invention, and particularly the scope of the claims.
Claims (5)
1. An etched copper-clad aluminum conductor circuit board using solder resist ink as an anti-corrosion layer comprises:
a base material layer with glue on the bottom surface;
a middle wire circuit layer;
a front solder resist ink layer;
a disconnection port of the wire circuit disposed on the intermediate wire circuit layer;
a bonding pad and a metal connection point on the wire;
the method is characterized in that a plurality of disconnection ports which are completely disconnected from the middle are formed on all leads or part of leads of a lead circuit, the completely disconnected leads are copper-clad aluminum leads, the disconnection ports of the copper-clad aluminum leads which are disconnected from the middle display a near-sighted C-shaped structure on the section of the leads which are cut towards the longitudinal direction (the long direction), aluminum in the middle of the leads forms a recess, a window is arranged at the disconnection port of the copper-clad aluminum leads in the middle, a solder mask ink layer is arranged on the front surface of the lead, the disconnection position of the lead is at the edge position of the solder mask ink window on the front surface, the disconnection surface of the lead and the edge of the solder mask ink window are on one section or close to one section, or the disconnection position of the lead is in the solder mask ink window, the lead at the disconnection position of the lead is exposed out of the window, the pads are positive and negative pads of an element, are arranged on two leads or on two, the metal connection points are connection points used for being connected with a power supply circuit or connection points used for interconnection between circuit boards, the solder mask ink layer is provided with a plurality of windows, wherein one part of the windows are a pad window and a metal connection point window, and one part of the windows are windows at the broken positions of the leads.
2. The etched copper-clad aluminum conductor circuit board taking solder resist ink as an anti-corrosion layer as claimed in claim 1, wherein the substrate with glue is polyimide PI substrate, PET substrate, epoxy glass fiber substrate, phenolic aldehyde substrate or ceramic substrate.
3. The circuit board of claim 1, wherein the conductor of the middle conductor circuit layer is copper-clad aluminum conductor, or a part of the conductor is copper-clad aluminum conductor, and a part of the conductor is copper conductor, and the conductor is etched to be completely broken, namely the copper-clad aluminum conductor.
4. The etched copper-clad aluminum conductor circuit board taking solder resist ink as an anti-corrosion layer as claimed in claim 1, wherein an insulating ink can be printed at the cut-off position of the etched copper-clad aluminum conductor to form insulation protection at the cut-off position.
5. The etched copper-clad aluminum conductor circuit board with solder resist ink as an anti-corrosion layer as claimed in claim 1, wherein a metal plate with glue is pasted on the back of the conductor circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921417836.6U CN211047441U (en) | 2019-08-24 | 2019-08-24 | Etched copper-clad aluminum wire conductor circuit board using solder resist ink as anti-corrosion layer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921417836.6U CN211047441U (en) | 2019-08-24 | 2019-08-24 | Etched copper-clad aluminum wire conductor circuit board using solder resist ink as anti-corrosion layer |
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| CN211047441U true CN211047441U (en) | 2020-07-17 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021036819A1 (en) * | 2019-08-24 | 2021-03-04 | 王定锋 | Novel wire circuit board of etched copper-clad aluminum wire and manufacturing method thereof |
| CN112770517A (en) * | 2020-12-22 | 2021-05-07 | 广州京写电路板有限公司 | Manufacturing method of high-precision vehicle-mounted aluminum substrate |
-
2019
- 2019-08-24 CN CN201921417836.6U patent/CN211047441U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021036819A1 (en) * | 2019-08-24 | 2021-03-04 | 王定锋 | Novel wire circuit board of etched copper-clad aluminum wire and manufacturing method thereof |
| CN112770517A (en) * | 2020-12-22 | 2021-05-07 | 广州京写电路板有限公司 | Manufacturing method of high-precision vehicle-mounted aluminum substrate |
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