CN115835519A - Method for manufacturing mini LED solder mask - Google Patents
Method for manufacturing mini LED solder mask Download PDFInfo
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- CN115835519A CN115835519A CN202211383652.9A CN202211383652A CN115835519A CN 115835519 A CN115835519 A CN 115835519A CN 202211383652 A CN202211383652 A CN 202211383652A CN 115835519 A CN115835519 A CN 115835519A
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Abstract
The invention provides a method for manufacturing mini LED solder mask, which comprises the steps of printing solder mask ink on a glass substrate twice according to two different screen printing plates, namely a first screen printing plate and a second screen printing plate, and finally forming a plurality of windowed solder mask ink layers, wherein the thickness of the solder mask ink layers in the windowed areas is smaller than that of the solder mask ink layers in other areas, and the thickness of the solder mask ink in the other areas is thicker than that of the existing solder mask ink layers, so that the reflectivity of the solder mask ink layers is improved to more than 93% from the existing 85%, the increase of the reflectivity reduces unnecessary processes, improves the product yield, reduces the thickness of the ink in the windowed areas, does not influence the printing of solder paste and the packaging of LED lamp beads, and maintains the stability of the existing processes.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a method for manufacturing a mini LED solder mask.
Background
With the continuous development of science and technology, the mini LED backlight becomes a new display industry focus; the chip size of the mini LED is between 50 mu m and 200 mu m, the mini LED is a product of further refining the small-distance LED, and compared with a common LED, the mini LED has the characteristics of higher resolution, contrast, color gamut range and the like, is lighter, thinner and energy-saving.
The mini LED backlight technology comprises the steps of firstly carrying out thick copper film coating on a glass substrate through a film coating technology, then exposing a circuit area and a non-circuit area through a yellow light technology, etching the non-circuit area through an etching process, and then developing to obtain a substrate with dense copper circuits; in order to prevent the copper circuit from being exposed to cause oxidation, a solder mask ink layer with the thickness of 32 +/-2 microns is usually required to be printed, the thickness of the solder mask ink layer is 32 +/-2 microns, so that the diffuse reflectance of the solder mask ink layer after exposure and development is more than or equal to 87%, and the diffuse reflectance of the solder mask ink layer more than or equal to 87% not only can provide higher imaging performance for products such as televisions, tablet computers, notebook computers, desktop computers and the like, but also can play a role in insulating and preventing the circuit from being scratched; the circuit pattern and the solder mask ink layer are both manufactured in an exposure mode, so that the accuracy of the size and the position of the circuit can be ensured.
At present, the mini LED backlight mainly uses a blue light source, the emission wavelength of the mini LED is between 420nm and 500nm, and the actual reflectivity value needs to be referred; the film thickness of the existing solder resist ink layer is in direct proportion to the reflectivity, the thicker the film thickness of the solder resist ink layer, the higher the reflectivity, and the lower the reflectivity otherwise; the film thickness of the solder resist ink layer is controlled to be 32 +/-2 mu m, so that the technical requirement on a printer is high; moreover, because the tolerance of the film thickness of the solder resist ink layer is small, the factors influencing the film thickness are more, such as: the screen mesh number, the screen-off distance, the scraper speed, the scraper pressure, the scraper hardness, the scraper angle, the ink viscosity and the like of the screen can influence the film thickness of the solder resist ink layer, the existing printing process needs to print twice if the film thickness of the solder resist ink layer reaches 32 +/-2 mu m, the first layer is printed at 16 +/-2 mu m, then prebaked for 80 ℃/20min, the second layer is printed at 32 +/-2 mu m, and exposure development is carried out after prebaked for 80 ℃/20min again.
Although the thickness of the printed solder resist ink layer is higher than 32 +/-2 microns, the requirement that the reflectivity is more than or equal to 87% can be met, the solder paste brushing can be influenced, when the LED lamp bead is higher than a paster or an IC (integrated circuit) position, the solder paste can be brushed bad or reflow soldering is formed in the subsequent processing process, so that the LED lamp bead is poor in welding, and even the LED lamp bead cannot be installed, the brightness of the LED lamp is uneven; the film thickness of the solder resist ink layer is less than 32 +/-2 microns, local polymerization reaction occurs after pre-baking, namely the ink is baked, if the ink is baked, development is not clean even if the ink is not exposed, and the reflectivity is lower than or equal to 87% of the required value, in this case, reflective paper needs to be added in a subsequent processing procedure to improve the reflectivity, the optical loss of the reflective paper is large, the improved reflectivity is small, the stiffness is not enough when large-size products are involved, the deformation is easy, the reflective paper is not resistant to folding, the folding mark is easy to generate, a large number of defective products can be generated in the using process, and the production efficiency and the production cost are directly influenced.
Therefore, it is an urgent need for those skilled in the art to provide a method for manufacturing a solder resist ink layer that can improve the reflectivity and the yield of the product.
Disclosure of Invention
In view of the above, in order to solve the above problems, the invention provides a method for manufacturing a mini LED solder mask, which has the following technical scheme:
a manufacturing method of a mini LED solder mask comprises the following steps:
providing a glass substrate;
manufacturing a first screen printing plate, wherein a plurality of first blocking points are arranged on the first screen printing plate;
printing solder resist ink with a first preset thickness on the glass substrate based on the first screen printing plate and carrying out curing treatment to obtain a first solder resist layer; the first solder mask layer comprises a plurality of first windows, and orthographic projections of the first windows on the glass substrate correspond to orthographic projections of the first blocking points on the glass substrate one by one;
providing a second screen printing plate which is a blank screen printing plate;
printing solder resist ink with a second preset thickness on one side of the first solder resist layer, which is far away from the glass substrate, based on the second screen printing plate, and carrying out curing treatment to obtain a second solder resist layer; the second solder mask layer covers the first solder mask layer and the first window, and the second preset thickness is larger than the first preset thickness;
and exposing and developing the second solder mask layer to form second windows, wherein the second windows correspond to the first windows one to one.
Optionally, in the above manufacturing method, the exposing and developing the second solder resist layer includes:
exposing the second solder mask layer by using the designed exposure pattern;
and developing the second solder mask layer by using a developing solution.
Optionally, in the above manufacturing method, a thickness of the first predetermined thickness is in a range of 8 μm to 10 μm.
Optionally, in the above manufacturing method, the second predetermined thickness is in a range of 30 μm to 34 μm.
Optionally, in the above manufacturing method, the first screen is further provided with a first alignment mark point.
Optionally, in the manufacturing method, a second alignment mark point is disposed on the second screen.
Optionally, in the above manufacturing method, in the solder resist ink, the ratio of crude oil: hardening agent: the ratio of the diluent is 75.
Optionally, in the manufacturing method, the mesh number of the first screen is greater than the mesh number of the second screen.
Optionally, in the manufacturing method, a size of the first window is larger than a size of the second window.
Alternatively, in the above manufacturing method, the developing solution is 30deg.C1wt% Na 2 CO 3 And (3) solution.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a method for manufacturing a mini LED solder mask, which comprises the steps of printing solder mask ink with a first preset thickness on a glass substrate by utilizing a first screen printing plate and carrying out curing treatment to obtain a first solder mask layer, wherein the first solder mask layer printed on the glass substrate is provided with a plurality of first windows in one-to-one correspondence with first blocking points due to the existence of the first blocking points on the first screen printing plate; these first windowed areas are free of printed solder resist ink; printing solder resist ink with a second preset thickness on one side, away from the glass substrate, of the first solder resist layer by using a second screen printing plate and carrying out curing treatment to obtain a second solder resist layer, wherein the second solder resist layer covers the first solder resist layer and also covers the first windowing, at the moment, because only the solder resist ink with the second preset thickness exists in the first windowing area, the thickness of the solder resist ink layer in the first windowing area is thinner than that of the solder resist ink layer in other positions, then, exposing and developing are carried out on the second solder resist layer to form second windowing, the second windowing corresponds to the first windowing one by one, and the second windowing area does not have the solder resist ink layer after exposure and development; at the moment, the thickness of the solder resist ink layer of the second windowing area is thinner than that of the solder resist ink layer at other positions; compared with the thickness of the existing solder resist ink layer, the thickness of the solder resist ink layer in other areas except the second windowing area is thicker than that of the existing solder resist ink layer, so that the reflectivity is improved to more than 93% from the existing 85%, and the increase of the reflectivity also improves the product yield while reducing unnecessary processes.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a schematic flow chart of a method for manufacturing a mini LED solder mask according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional structure diagram of a mini LED solder mask provided by an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a first screen printing plate according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a first solder resist layer provided in an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a second screen printing plate according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a second solder resist layer provided in an embodiment of the present invention;
fig. 7 is a schematic structural diagram after exposure and development according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Referring to fig. 1, fig. 1 is a schematic flow chart of a method for manufacturing a mini LED solder mask according to an embodiment of the present invention; referring to fig. 2, fig. 2 is a schematic cross-sectional structure diagram of a mini LED solder mask provided by an embodiment of the present invention.
The manufacturing method comprises the following steps:
s101: a glass substrate 01 is provided.
In this step, providing the glass substrate 01 may have solder resist ink printed thereon, as shown in fig. 2, the solder resist ink being printed on the glass substrate 01.
S102: manufacturing a first screen 02, wherein a plurality of first blocking points 021 are arranged on the first screen 02.
In this step, the first screen 02 to be manufactured may be a rectangular polyester screen of 600mm × 900mm, the mesh number of the polyester screen may be set to 420 meshes, and the screen tension of the polyester screen may be 22 ± 1N; the mesh number and the screen tension of the polyester screen are only examples of the embodiment of the present invention, and the shape, the size, the mesh number, and the tension of the polyester screen are not specifically limited, and the material of the screen is not specifically limited.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a first screen printing plate according to an embodiment of the present invention; the first screen 02 is provided with a plurality of first blocking points 021, as shown in fig. 3, the plurality of first blocking points 021 are arranged in an array, and when the first blocking points 021 are rectangular as shown in fig. 3, the side lengths of orthogonal projections of the rectangular first blocking points 021 on the glass substrate 01 are a and B, respectively, for example, a =2310 μm, B =2660 μm, and the like.
It should be noted that, in the present invention, the arrangement of the first stopping point 021 is only described as an example, the arrangement of the first stopping point 021 is not specifically limited, and the shape and the size of the first stopping point 021 are not specifically limited, the setting of the rectangle and the side length is only an example of the embodiment of the present invention, and when the first stopping point 021 is in other shapes, the setting is only required to be performed according to the specific embodiment.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a first solder mask layer according to an embodiment of the present invention.
S103: printing solder resist ink with a first preset thickness L on the glass substrate 01 based on the first screen printing plate 02 and carrying out curing treatment to obtain a first solder resist layer 03; the first solder mask layer 03 includes a plurality of first windows 031, and an orthographic projection of the first windows 031 on the glass substrate 01 corresponds to an orthographic projection of the first stopping points 021 on the glass substrate 01.
In this step, it is necessary to print the solder resist ink of the first predetermined thickness L on the glass substrate 01 based on the first screen 02 in the step S101.
Optionally, in another embodiment of the present invention, the first predetermined thickness L has a thickness in a range of 8 μm to 10 μm.
Specifically, the thickness of the first predetermined thickness L may range from 8 μm to 10 μm, for example, the thickness of the first predetermined thickness L may be 8 μm, 9 μm, 10 μm, and the like, inclusive.
Before printing, solder resist ink needs to be prepared.
Alternatively, in another embodiment of the present invention, in the solder resist ink, the ratio of crude oil: hardening agent: the ratio of the diluent is 75.
Specifically, in the invention, solder resist ink is prepared according to 75 parts of crude oil, 25 parts of hardening agent and 2 parts of diluting agent, the prepared solder resist ink is firstly manually stirred for 2 to 3 minutes, and then stirred for 15 minutes at 600 revolutions per minute by using a high-speed ink stirrer, so that the final solder resist ink capable of being printed is obtained.
When printing, the first screen 02 has a plurality of first blocking points 021, so that the first solder resist layer 03 obtained on the glass substrate 01 after printing has a plurality of first windows 031, as shown in fig. 4, the plurality of first windows 031 are arranged in an array, and when the first windows 031 are rectangles as shown in fig. 4, the side lengths of orthographic projections of the rectangular first windows 031 on the glass substrate 01 are a and b, for example, a =1310 μm, b =1660 μm, and the like.
It should be noted that, in the present invention, the arrangement of the first windows 031 is described as an example, the arrangement of the first windows 031 is not specifically limited, and the shape and size of the first windows 031 are not specifically limited, and the setting of the rectangle and the side length is merely an example description of the embodiment of the present invention, and when the first windows 031 are other shapes, the setting only needs to be performed according to the specific embodiment; in this embodiment, the first stopping point 021 corresponds to the shape of the first open window 031.
Since the first window 031 is directly printed by the first blocking point 021, and the printing precision is lower than that of exposure and development, and there is a problem of poor printing, which may cause ink overflow, for example, the size of the orthographic projection of the required first window 031 on the glass substrate 01 is 1310 μm × 1660 μm, and if the size of the orthographic projection of the ink overflow first window on the glass substrate 01 is smaller than 1310 μm × 1660 μm, the size of the first blocking point 021 on the first screen 02 is larger than the target size of the first window 031, in this embodiment, the size of the first blocking point 031 may be larger than the target size of the first window 031 by 1000 μm; although the sizes are not the same, the orthographic projection of the first window 031 on the glass substrate 01 corresponds to the orthographic projection of the first baffle point 021 on the glass substrate 01.
In order to print the first window 031 at a desired position, a point on the first screen 02 to be aligned needs to be designed.
Optionally, in another embodiment of the present invention, the first screen 02 is further provided with a first alignment mark point 022.
Specifically, as shown in fig. 3, the first alignment mark 022 is disposed to align the first screen 02 when printing on the glass substrate 01, that is, when the first screen 02 covers the glass substrate 01, the first alignment mark 022 is aligned according to specific requirements, so that the first blocking point 021 is located at a correct position; note that the first registration mark point 022 is reserved in advance to facilitate the capture by the post exposure apparatus.
After the first solder mask layer 03 is printed on the glass substrate 01 based on the first screen printing plate 02, the glass substrate is placed into a hot air circulation drying oven for curing, the setting value of the hot air circulation drying oven is 150deg.C/30min, and then the subsequent steps are carried out on the cured first solder mask layer 03.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a second screen printing plate according to an embodiment of the present invention.
S104: providing a second screen printing plate 04, wherein the second screen printing plate 04 is a blank screen printing plate.
In this step, the size of the second screen 04 is the same as the size of the first screen 02; the screen mesh number of the polyester screen can be set to 150 meshes, and the screen tension of the polyester screen can be 22 +/-1N; the mesh number and the screen tension of the polyester screen are only examples in the embodiment of the present invention, and the shape, size, mesh number, and tension of the polyester screen are not specifically limited, and the material of the screen is not specifically limited, and only needs to correspond to the first screen 02.
The second screen 04 is a blank screen, that is, the second screen 04 can be completely covered at the time of printing.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a second solder mask layer according to an embodiment of the present invention.
S105: printing solder resist ink with a second preset thickness M on one side, away from the glass substrate 01, of the first solder resist layer 03 based on the second screen printing plate 04, and performing curing treatment to obtain a second solder resist layer 05; the second solder mask layer 05 covers the first solder mask layer 03 and the first window 031, and the second preset thickness M is greater than the first preset thickness L.
In this step, it is necessary to print solder resist ink of a second preset thickness M on the side of the first solder resist layer 03 away from the glass substrate 01 based on the second screen 04 in the step S104.
Optionally, in another embodiment of the present invention, the second predetermined thickness M is in a range of 30 μ M to 34 μ M.
Specifically, the thickness of the second predetermined thickness M may range from 30 μ M to 34 μ M, for example, the thickness of the second predetermined thickness M may be 30 μ M, 32 μ M, 33 μ M, and the like, including the end points; it should be noted that the second predetermined thickness M is higher than the first predetermined thickness L.
The solder resist ink is still the solder resist ink prepared in step S103.
During printing, since the second screen 04 is a blank screen, the solder resist ink covers the first solder resist layer 03 and the first window 031, and at this time, the thickness of the solder resist ink in the first window 021 area is lower than that in other areas due to the existence of the first window 021.
Optionally, in another embodiment of the present invention, a second alignment mark point 041 is disposed on the second screen 04.
Specifically, as shown in fig. 5, the second alignment mark point 041 is arranged to facilitate grabbing by the post-exposure device for accurate exposure.
After the second solder mask layer 05 is printed on the side, deviating from the glass substrate 01, of the first solder mask layer 03 based on the second screen printing plate 04, the first solder mask layer is placed into a hot air circulation drying oven to be cured, the setting value of the hot air circulation drying oven is 80deg.C/20min, and after curing is completed, exposure is carried out by using the alignment mark points as datum points through exposure equipment.
Referring to fig. 7, fig. 7 is a schematic structural diagram after exposure and development according to an embodiment of the present invention.
S106: and exposing and developing the second solder mask layer 05 to form a second window 061, wherein the second window 061 corresponds to the first window 031 in a one-to-one manner.
Alternatively, in another embodiment of the present invention, the exposing and developing the second solder resist layer 05 includes:
and exposing the second solder resist layer 05 by using the designed exposure pattern.
The second solder resist layer 05 is developed with a developing solution.
Specifically, when the second solder resist layer 05 is exposed by using the exposure pattern, the first alignment mark point 022 and the second alignment mark point 041 need to be exposed and captured, so that accurate exposure can be performed, so as to form the pattern shown in fig. 7.
The exposed pattern is the pattern shown in fig. 7, a second window 051 is formed by exposure and development, as shown in fig. 7, a plurality of second windows 061 are arranged in an array, and when the second windows 061 are rectangles shown in fig. 7, the side lengths of the orthogonal projections of the rectangular second windows 061 on the glass substrate 01 are c and d, for example, c =310 μm, d =660 μm, and the like.
Optionally, in another embodiment of the present invention, the size of the first window 031 is larger than the size of the second window 061.
Specifically, for example, the side lengths of the orthogonal projection of the first windowing 031 on the glass substrate 01 are a and b, for example, a =1310 μm and b =1660 μm, respectively, and the side lengths of the orthogonal projection of the second windowing 061 on the glass substrate 01 are c and d, for example, c =310 μm and d =660 μm, respectively.
Alternatively, in another embodiment of the invention, the developer is 30deg.C1wt% Na 2 CO 3 Solutions of。
Specifically, after completion of the exposure, development was carried out using a developing apparatus, using 30deg.C1wt% as Na 2 CO 3 The developing solution is developed at a developing speed of 4m/min, since the solder resist ink is a negative material, the exposed area will be left, the unexposed area will be washed away by the developing solution, and the pattern on the glass substrate 01 after the development is finished is shown in fig. 7.
It should be noted that, in the present invention, the arrangement of the second windowing 061 is described as an example, the arrangement of the second windowing 061 is not specifically limited, and the shape and the size of the second windowing 061 are not specifically limited, and the setting of the rectangle and the side length is merely an example description of the embodiment of the present invention, and when the second windowing 061 is in other shapes, the setting is only required to be performed according to the specific embodiment; in this embodiment, the second windows 061 correspond to the first windows 031 in shape, and the second windows 061 correspond to the first windows 031 in a one-to-one manner
Optionally, in another embodiment of the present invention, the mesh number of the first screen 02 is greater than that of the second screen 04.
Specifically, since the first solder resist layer 03 has a small thickness when printed and requires a larger screen mesh number, the screen mesh number for designing the first screen 02 is larger, and the screen mesh number for designing the second screen 04 is smaller because the second solder resist layer 05 has a large thickness when printed and requires a smaller screen mesh number.
According to the method for manufacturing the mini LED solder mask, the first screen 02 is utilized to print the solder mask ink with the first preset thickness L on the glass substrate 01 and carry out curing treatment, so that the first solder mask layer 03 is obtained, and due to the existence of the first stopping points 021 on the first screen 02, the first solder mask layer 03 printed on the glass substrate 01 is provided with a plurality of first windows 031 corresponding to the first stopping points 021 in a one-to-one mode; these first windowed 031 areas have no solder resist ink printed; printing solder resist ink with a second preset thickness M on one side, away from the glass substrate 01, of the first solder resist layer 03 by using the second screen printing plate 04, and carrying out curing treatment to obtain a second solder resist layer 05, wherein the second solder resist layer 05 covers the first solder resist layer 03 and also covers the first windowing 031, at the moment, because only the solder resist ink with the second preset thickness M exists in the first windowing 031 area, the thickness of the solder resist ink layer in the first windowing 031 area is thinner than that of the solder resist ink layers in other positions, exposing and developing the second solder resist layer 05 to form a second windowing 061, wherein the second windowing 061 corresponds to the first windowing 031 one by one, and the second windowing 061 area does not contain the solder resist ink layer after exposure and development; at this time, the thickness of the solder resist ink layer in the second windowing region 061 is thinner than that of the solder resist ink at other positions; compared with the thickness of the existing solder resist ink layer, the thickness of the solder resist ink layer in other areas except the second windowing 061 area is thicker than that of the existing solder resist ink layer, so that the reflectivity is improved to be more than 93% from the existing 85%, reflection paper can be omitted due to the increase of the reflectivity, the problems caused by the reflection paper are directly reduced, the product yield is improved, when the thickness of the solder resist ink layer in the second windowing 061 area is not higher than that of the existing solder resist ink layer, the printing of solder paste and the packaging of the LED lamp beads are not affected, and the stability of the existing process is maintained.
The method for manufacturing the mini LED solder mask provided by the invention is described in detail, a specific example is applied in the text to explain the principle and the implementation mode of the invention, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include or include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A method for manufacturing a mini LED solder mask is characterized by comprising the following steps:
providing a glass substrate;
manufacturing a first screen printing plate, wherein a plurality of first blocking points are arranged on the first screen printing plate;
printing solder resist ink with a first preset thickness on the glass substrate based on the first screen printing plate and carrying out curing treatment to obtain a first solder resist layer; the first solder mask layer comprises a plurality of first windows, and orthographic projections of the first windows on the glass substrate correspond to orthographic projections of the first blocking points on the glass substrate one by one;
providing a second screen printing plate which is a blank screen printing plate;
printing solder resist ink with a second preset thickness on one side of the first solder resist layer, which is far away from the glass substrate, based on the second screen printing plate, and carrying out curing treatment to obtain a second solder resist layer; the second solder mask layer covers the first solder mask layer and the first window, and the second preset thickness is larger than the first preset thickness;
and exposing and developing the second solder mask layer to form second windows, wherein the second windows correspond to the first windows one by one.
2. The method of manufacturing according to claim 1, wherein said exposing and developing the second solder resist layer comprises:
exposing the second solder mask layer by using the designed exposure pattern;
and developing the second solder mask layer by using a developing solution.
3. The method of claim 1, wherein the first predetermined thickness is in a range of 8 μm to 10 μm.
4. The method of claim 1, wherein the second predetermined thickness is in a range of 30 μm to 34 μm.
5. The method according to claim 1, wherein the first screen plate is further provided with a first alignment mark point.
6. The method of claim 1, wherein the second screen has a second alignment mark disposed thereon.
7. The manufacturing method according to claim 1, wherein, in the solder resist ink, a ratio of crude oil: hardening agent: the ratio of the diluent is 75.
8. The manufacturing method according to claim 1, wherein the mesh number of the first screen is larger than that of the second screen.
9. The method of manufacturing of claim 1, wherein the first fenestration is larger in size than the second fenestration.
10. The method of claim 2, wherein the developer solution is 30deg.C.C1wt% Na 2 CO 3 And (3) solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202211383652.9A CN115835519A (en) | 2022-11-07 | 2022-11-07 | Method for manufacturing mini LED solder mask |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211383652.9A CN115835519A (en) | 2022-11-07 | 2022-11-07 | Method for manufacturing mini LED solder mask |
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| CN115835519A true CN115835519A (en) | 2023-03-21 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117580270A (en) * | 2023-11-08 | 2024-02-20 | 江门全合精密电子有限公司 | Method for controlling and manufacturing thickness of thick copper aluminum substrate U-shaped copper etching groove solder resist ink |
-
2022
- 2022-11-07 CN CN202211383652.9A patent/CN115835519A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117580270A (en) * | 2023-11-08 | 2024-02-20 | 江门全合精密电子有限公司 | Method for controlling and manufacturing thickness of thick copper aluminum substrate U-shaped copper etching groove solder resist ink |
| CN117580270B (en) * | 2023-11-08 | 2024-08-30 | 江门全合精密电子有限公司 | Method for controlling and manufacturing thickness of thick copper aluminum substrate U-shaped copper etching groove solder resist ink |
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