JP4378896B2 - Substrate underlaying method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
This invention is directed to a method receives under to that board receive the lower substrate by the lower receiving pins in the apparatus for mounting electronic components such as screen printing apparatus and an electronic component mounting apparatus.
[0002]
[Prior art]
As a substrate on which electronic components are mounted, there is a so-called double-sided mounting substrate in which electronic components are mounted on both sides as well as one side of the substrate. In the mounting process of the double-sided mounting substrate, first, mounting on the first surface is performed, and then the substrate is reversed and mounting operations such as solder printing, electronic component mounting, and reflow are performed on the second surface. At the time of mounting on this second surface, since the already mounted surface on which the electronic component has already been mounted faces downward, in an apparatus that needs to position and hold the board such as solder screen printing or component mounting, This already mounted surface is supported from below.
[0003]
However, when receiving an already mounted surface, the mounted component becomes an obstacle and cannot support the lower surface of the substrate. A method of supporting by a receiving pin is used. 2. Description of the Related Art Conventionally, as a receiving device used for receiving such an already mounted surface, a device in which receiving pins are arranged in accordance with a substrate on a pin plate provided with a large number of pin holes is known.
[0004]
[Problems to be solved by the invention]
However, in the conventional receiving device, it is necessary to perform a setup change in which pins are rearranged in a portion that can be received corresponding to a new substrate every time the work target substrate is changed. This setup change is a complicated and time-consuming work, such as attaching and detaching the pin plate, inserting the pin, and confirming the receiving state using the actual mounted substrate after inserting the pin. However, it takes a long time to hinder productivity improvement.
[0005]
The present invention aims to provide a method receiving under the board that put the electronic component mounting apparatus which can quickly perform setup change operations.
[0009]
[Means for Solving the Problems]
2. The substrate receiving method for an electronic component mounting apparatus according to claim 1, wherein the substrate mounting method for the electronic component mounting apparatus supports the substrate with the receiving pins in the electronic component mounting apparatus. A holding body that slidably moves in the vertical direction, a biasing means that biases the lower receiving pin held by the holding body upward, and a position that fixes the vertical position of the lower receiving pin at an arbitrary position. Arranging a plurality of receiving pin modules having fixing means on the receiving base portion to form the receiving portion; and among the plurality of receiving pin modules, at a specific position where no electronic component is present on the lower surface of the substrate. A preparatory work preparation process for fixing the vertical position of the lower support pin in the corresponding lower support pin module, and a warp correction plate is lowered and pushed onto the upper surface of the substrate held by the clamper. That step and, underlying the vertical position by the vertical position receives the lower fixed pin raising the lower receiving portion from below of the substrate on which the warp correcting plate is pressed against brought into contact with the substrate is fixed A step of causing the upper and lower positions of the lower receiving pins other than the receiving pins to conform to the shape of the lower surface of the substrate, and a step of fixing the position of the lower receiving pin in a state of conforming to the shape of the lower surface of the substrate by the position fixing means.
[0010]
According to the present invention, the holding body that slidably holds the lower receiving pin in the vertical direction, the urging means that urges the lower receiving pin held by the holding body upward, and the vertical direction of the lower receiving pin. A lower receiving pin module having a position fixing means for fixing the position at an arbitrary position is arranged on the lower receiving base portion to constitute the lower receiving portion. By pressing the board from above and fixing the position of the receiving pin while keeping the receiving pin in the shape of the lower surface of the board, the setup change work can be performed quickly even when targeting a wide variety of boards. It can be carried out.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of a screen printing apparatus according to an embodiment of the present invention, FIG. 2A is a front view of a substrate receiving apparatus according to an embodiment of the present invention, and FIG. FIG. 3, FIG. 4, FIG. 5 are cross-sectional views of a substrate underpinning module in an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 7 and 8 are explanatory diagrams of the underlay preparation work in the underlaying method of the substrate according to the embodiment of the present invention.
[0012]
First, referring to FIG. 1, the structure of a screen printing apparatus, which is an electronic component mounting apparatus in which a substrate receiving apparatus is incorporated, will be described. In FIG. 1, a substrate positioning unit 1 is configured by stacking a θ-axis table 4 on a moving table composed of a Y-axis table 2 and an X-axis table 3, and further disposing a Z-axis table 5 thereon. Yes. On the Z-axis table 5, a lowering device 6 for holding and receiving a substrate 10 on which electronic components are mounted is disposed. The lower receiving device 6 has a plurality of lower receiving pin units 9 arranged on the lower receiving base portion 8a (see FIG. 2) of the upper surface of the lower raising / lowering portion 8 provided so as to be movable up and down with respect to the Z-axis table 5. Configured.
[0013]
In this screen printing apparatus, cream solder is printed on the substrate 10 on which electronic components are already mounted on one side. The substrate 10 received by a transport conveyor (not shown) is clamped at both end portions thereof by the clamper 7 in a state where the already mounted surface is received by the receiving device 6. By driving the substrate positioning unit 1, the substrate 10 can be moved in the X direction and the Y direction to adjust the position of the substrate 10 during screen printing. The printed substrate 10 is carried out by a carry-out conveyor (not shown).
[0014]
A screen mask 11 is disposed above the substrate positioning unit 1, and the screen mask 11 is configured by mounting a mask plate 11b on a holder 11a. The substrate 10 is aligned with the mask plate 11b by the substrate positioning unit 1 and abuts from below the mask plate 11b. A squeegee unit 13 is disposed on the screen mask 11. The squeegee unit 13 includes two squeegees 13b that are driven up and down by a cylinder 13a. The squeegee unit 13 can reciprocate in the horizontal direction (Y direction) by a moving means (not shown).
[0015]
In a state where the substrate 10 is in contact with the lower surface of the mask plate 11b, cream solder is supplied onto the mask plate 11b, and the squeegee 13b is brought into contact with the surface of the mask plate 11b and slid on the surface of the substrate 10. The cream solder is printed through the pattern holes provided in the mask plate 11b.
[0016]
A substrate warp correction unit 14 (substrate pressing means) is disposed above the substrate positioning unit 1 so as to be able to advance and retract in the horizontal direction. The substrate warp correction unit 14 includes a warp correction plate 14b that can be moved up and down by a cylinder 14a. In a state where the warp correction plate 14b is moved above the substrate positioning portion 1 and lowered with respect to the substrate 10, the lower support raising / lowering portion 8 is raised and the lower support pin unit 9 is pressed against the lower surface of the substrate 10, The warp of the substrate 10 can be corrected.
[0017]
Next, the substrate support device 6 will be described with reference to FIG. In FIG. 2A, the Z-axis table 5 is provided with a lower support lift 8 that can be moved up and down by a lift mechanism (not shown). A plurality of lower receiving pin units 9 are mounted on the lower receiving base portion 8 a of the upper surface of the lower receiving lifting / lowering portion 8. The lower receiving pin unit 9 includes a plurality of lower receiving pin modules 20 (four in the present embodiment) that hold the lower receiving pins 21 arranged in a vertical posture so as to be movable up and down and can be set to any desired pin height. 2), as shown in FIG. 2B, by arranging the receiving pin unit 9 on the receiving base portion 8a according to the size of the substrate 10 and the receiving position, the substrate 10 A support portion corresponding to is configured. Of course, the lower receiving pin module 20 may be arranged alone on the lower receiving base portion 8a.
[0018]
Next, the structure of the receiving pin module 20 will be described with reference to FIG. In FIG. 3, reference numeral 22 denotes a prismatic holding block (holding body) that holds the receiving pin 21 in a vertical posture so as to be slidable in the vertical direction. The piston 23 is slid on the housing portion 22a formed inside. It fits freely. A hollow shaft receiving pin 21 is slidably inserted into an insertion hole 23a provided in the center of the piston 23, and a lower portion of the lower receiving pin 21 is inserted into a pin holding hole 22e. A spring 27 (biasing means) is mounted in the pin holding hole 22e, and the lower receiving pin 21 is biased upward by the spring 27.
[0019]
A seal member (not shown) for sealing the contact surface with the inner periphery of the housing portion 22a and the contact surface with the outer periphery of the lower receiving pin 21 is mounted on the outer peripheral surface of the piston 23 and the inner surface of the insertion hole 23a. The pressurized air is supplied from the air supply source 28 through the air supply hole 22c provided in the side surface into the pressurizing chamber 22b at the upper part of the housing portion 22a. Pushed down.
[0020]
A brake plate 24 provided with an insertion hole 24a through which the lower receiving pin 21 is inserted is supported below the piston 23 by a pin 25 at one end. The opposite side of the shaft support end of the brake plate 24 is urged in the direction of the arrow by a spring 26 attached to the spring seat 22d. The hole diameter of the insertion hole 24a is set to be somewhat larger than the diameter of the lower receiving pin 21, and when the brake plate 24 is horizontal, the insertion hole 24a does not contact the lower receiving pin 21 (see FIG. 4). 3, the edge of the insertion hole 24 a is set to contact the lower receiving pin 21 in a state where the brake plate 24 is inclined at a predetermined angle.
[0021]
As described above, the brake plate 24 is inclined from the horizontal posture in a state where it is biased by the spring 26. As a result, the edge of the insertion hole 24a is pressed against the outer peripheral surface of the lower receiving pin 21 by an urging force to generate “galling”, whereby the vertical position of the lower receiving pin 21 is fixed at an arbitrary position. That is, the brake plate 24 and the spring 26 provided with the insertion hole 24a are position fixing means for fixing the vertical position of the lower receiving pin 21 at an arbitrary position. The spring 26 is a pressing means that presses the insertion hole 24 a against the lower receiving pin 21.
[0022]
Then, as shown in FIG. 4, the pressurized chamber 22b is pressurized by supplying pressurized air from the air supply hole 22c, and the piston 23 is pushed downward by the applied pressure. As a result, the brake plate 24 is pushed down against the urging force of the spring 26 and becomes in a horizontal state. As a result, the insertion hole 24a does not contact the lower receiving pin 21, and the position fixing of the lower receiving pin 21 is released. That is, the piston 23 and the air supply source 28 serve as pressing release means.
[0023]
A suction hole 22f is provided in the holding hole 22e, and vacuum suction is performed from the suction hole 21a opened at the upper end portion of the lower receiving pin 21 by vacuum suction from the suction hole 22f by a vacuum suction source 29. Thereby, the substrate 10 can be sucked and held when the lower surface of the substrate 10 is received by the lower receiving pins 21, and not only is supported from below when receiving the substrate 10, but also the warpage of the substrate 10 is prevented. It can be corrected by the adsorption power.
[0024]
Note that a base pin module 20 ′ having a configuration as shown in FIG. 5 may be used as the base pin module. In this example, the same constituent elements as those of the lower receiving pin module 20 shown in FIG. 3 are combined in different arrangements, and the upper and lower positions of the lower receiving pins 21 ′ are fixed by the same action. In this example, when vacuum suction is performed from the suction hole 21'a of the lower receiving pin 21 ', the suction hole 22'f is communicated with an opening 21b provided in the middle of the lower receiving pin 21'. .
[0025]
The screen printing apparatus and the receiving apparatus are configured as described above, and the preparation process for receiving performed prior to screen printing will be described below with reference to FIGS. First, in accordance with the substrate 10 to be received, the lower receiving pin unit 9 is arranged on the lower receiving base portion 8a to constitute the lower receiving portion. Here, the quantity and arrangement of the receiving pin units 9 are determined according to the size of the substrate 10 and the position of the electronic component P on the already mounted surface (see FIG. 2).
[0026]
At this time, for the lower receiving pin module 20 corresponding to a specific position where the electronic component P does not exist on the lower surface of the substrate 10, the upper and lower sides of the lower receiving pin 21 (see the lower receiving pin 21A hatched in FIG. 6A). Keep the position fixed. The specific position is appropriately determined in accordance with the size and rigidity of the substrate as an appropriate position and number as a correction action point for applying a force for correcting the warp of the substrate 10.
[0027]
If the substrate 10 is held by the clamper 7, the substrate warp correction portion 14 (FIG. 1) is moved onto the substrate 10 as shown in FIG. 6A, and then the warp correction is performed as shown in FIG. 6B. The plate 14b is lowered and pressed against the clamper 7. Then, in this state, as shown in FIG. At this time, for the lower support pins 21 other than the lower support pins 21A in the specific position, pressurized air is supplied into the pressurizing chamber 22b in each lower support pin module 20, and the upper and lower positions of the lower support pins 21 are fixed. Cancel.
[0028]
When the lower support raising / lowering portion 8 is raised, the upper end portion of the lower support pin 21 of each lower support pin unit 9 comes into contact with the lower surface of the substrate 10 or the electronic component P. At this time, when the lower receiving pin 21A whose vertical position is fixed contacts the lower surface of the substrate 10, the substrate 10 is pushed up and pressed against the warp correction plate 14b. Thus, the vertical warping of the substrate 10 is corrected following the lower surface of the warp correction plate 14b.
[0029]
Further, the upper end portions of the lower receiving pins 21 whose vertical position is released are brought into contact with the electronic component P in the ascending process and pushed downward, and stop at a height corresponding to the shape of each electronic component P. As a result, the vertical position of each lower receiving pin 21 follows the shape of the lower surface of the substrate 10. In this state, the supply of pressurized air is stopped in each of the receiving pin modules 20. Thereby, the insertion hole 24a of the brake plate 24 is pressed against the lower receiving pin 21, and the vertical position of the lower receiving pin 21 is fixed.
[0030]
Next, as shown in FIG. 7B, the warp correction plate 14b is raised and the lower support raising / lowering portion 8 is lowered. As a result, the lower receiving base portion 8a on the upper surface of the lower receiving lift 8 is prepared with a lower receiving portion in which the height of each lower receiving pin 21 is set in accordance with the shape of the mounted surface of the target substrate 10. Complete. In the subsequent production of the substrate 10, the substrate receiving is performed by the receiving portion.
[0031]
By using the base plate device 6 combined with the base pin module 20 that can fix and release the vertical position in any position, electronic components can be mounted on the already mounted surface as conventionally required. There is no need to perform a complicated preparation work for selecting a non-existing baseable part for each substrate and mounting a base pin on each baseable part. Accordingly, the efficiency of the setup change work can be improved, and the receiving position can be set at an appropriate support interval regardless of the presence or absence of the possible receiving part. Can be improved.
[0032]
FIG. 8 shows an example in which such a receiving device is used for screen printing. FIG. 8A shows the screen printing apparatus shown in FIG. 1, in which the upper surface of the substrate 10 on which the electronic component P is mounted on the lower surface is aligned with the mask plate 11b of the screen mask 11, A state in which the height of the lower receiving pin 21 is made to conform to the shape of the lower surface of the substrate 10 is shown. At this time, the arrangement of the lower receiving pin units 9 on the lower receiving base portion 8a of the lower receiving lift unit 8 is such that the lower receiving pins 21 are arranged not only in the range of the substrate 10 but also in the outer portion of the substrate 10. It is a base pin arrangement.
[0033]
In a state after the preparation work, the upper and lower positions of the lower support pins 21 outside the range of the substrate 10 are fixed at a height position that follows the lower surface of the mask plate 11b. As a result, in the screen printing operation in which the squeegee 13b is slid on the screen mask 11, not only the substrate 10 but also the lower surface of the mask plate 11b in the peripheral portion of the substrate 10 as shown in FIG. Is supported from below.
[0034]
For this reason, the mask plate 11b located in the peripheral part of the board | substrate 10 does not droop down in squeezing. As a result, the adhesion failure between the mask plate 11b and the upper surface of the substrate 10 due to partial deformation of the mask plate 11b does not occur, and the printing quality can be stabilized.
[0035]
In the above example, an example in which the receiving device is used for a screen printing device has been shown. However, in addition to this, for devices that need to receive a substrate after mounting an electronic component on one side, such as an electronic component mounting device. The present invention can be applied to this.
[0036]
【The invention's effect】
According to the present invention, the holding body that slidably holds the lower receiving pin in the vertical direction, the urging means that urges the lower receiving pin held by the holding body upward, and the vertical direction of the lower receiving pin. A lower receiving pin module having a position fixing means for fixing the position at an arbitrary position is arranged on the lower receiving base portion to constitute the lower receiving portion. Since the position of the receiving pin is fixed in a state where the substrate is pressed from above and the receiving pin is made to conform to the shape of the lower surface of the substrate, the setup change operation can be performed quickly for various types of substrates. .
[Brief description of the drawings]
FIG. 1 is a front view of a screen printing apparatus according to an embodiment of the present invention. FIG. 2 (a) is a front view of a substrate receiving apparatus according to an embodiment of the present invention. FIG. 3 is a cross-sectional view of a substrate underpinning module in an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 5 is a cross-sectional view of a substrate receiving pin module in an electronic component mounting apparatus. FIG. 5 is a cross-sectional view of a substrate receiving pin module in an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 7 is an explanatory diagram of the base preparation work in the base board method of the embodiment. FIG. 7 is an explanatory diagram of the base preparation work in the base board method of the embodiment of the present invention. An explanation of the preparation work for the substrate in the substrate substrate method of the embodiment Figure [Description of the code]
DESCRIPTION OF SYMBOLS 1 Board | substrate positioning part 6 Lower receiving apparatus 8 Lower receiving raising / lowering part 8a Lower receiving base part 9 Lower receiving pin unit 10 Substrate 14 Warpage correction part 20 Lower receiving pin module 21 Lower receiving pin 24 Brake plate

Claims (1)

A substrate underlaying method in an electronic component mounting apparatus for supporting a substrate by a receiving pin in the electronic component mounting apparatus,
A holding body for slidably holding the lower receiving pin in the vertical direction, an urging means for urging the lower receiving pin held by the holding body upward, and a vertical position of the lower receiving pin at an arbitrary position Arranging a plurality of lower receiving pin modules having a position fixing means for fixing on the lower receiving base portion to constitute the lower receiving portion;
A base preparation process for fixing the vertical position of the base pin in the base pin module corresponding to a specific position where no electronic component is present on the lower surface of the substrate among the plurality of base pin modules;
A step of lowering and pressing the warp correction plate against the upper surface of the substrate held by the clamper;
Said warp correcting plate from below the substrate the vertical position is the lower receiving pin fixed is brought into contact with the substrate the vertical position is lower receiving non pins secured raise the lower receiving portion which is pressed against A process of aligning the upper and lower positions of the receiving pins to the shape of the lower surface of the substrate;
And a step of fixing the position of the receiving pin in a state of being in the shape of the lower surface of the substrate by the position fixing means.

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