JP3766881B2

JP3766881B2 - Substrate holding mechanism and cream solder printing apparatus using the same

Info

Publication number: JP3766881B2
Application number: JP2001259797A
Authority: JP
Inventors: 真本間; 忍渡辺; 伸一郎川辺; 睦行矢作; 尚明橋本
Original assignee: 株式会社日立インダストリイズ
Priority date: 2001-08-29
Filing date: 2001-08-29
Publication date: 2006-04-19
Anticipated expiration: 2021-08-29
Also published as: JP2003062970A

Description

【０００１】
【発明の属する技術分野】
本発明は、基板を保持する基板保持機構に係り、特に凹凸のある基板の面を支持しても基板の水平を確保できる基板保持機構及びそれを用いたクリーム半田印刷装置に関する。
【０００２】
【従来の技術】
従来、クリーム半田印刷装置で基板に半田を印刷する際のその基板の保持手段としては、例えば１対の水平クランプ片で保持するという特開平２００１−６２９９２号公報に開示されたものがある。具体的にこの特開平２００１−６２９９２号公報に開示されたクリーム半田印刷装置では、搬送されてきた基板を上下に移動可能な複数のピンから成るピンユニット上に受け、押圧手段と協動して仮保持した後、その基板を水平クランプ片に受け渡して保持している。また、他の保持手段としては、基板の下面から保持用の板で保持するというものもある。
【０００３】
【発明が解決しようとする課題】
ここで、上記特開平２００１−６２９９２号公報にはピンユニットの詳細構成の開示はないが、一般的な従来のピンユニット方式では、ピンを土台となる多数の穴の開いた板に、操作者が基板サイズに応じて穴に差すという方法が取られている。
【０００４】
ところで、基板に搭載する部品は、先ずクリーム半田を塗った基板上に搭載し、そのクリーム半田を溶かして基板に固定している。ここで、基板には、その部品を片面にのみ搭載するものと、両面に搭載するものがある。例えば両面に搭載する場合は、基板の片面に部品を固定した後、その基板を裏返しにし、再度クリーム半田印刷装置に入れて反対の面にクリーム半田を転写している。その際、基板の保持面には先に固定した部品があるので、基板保持用のピン或いは保持用の板はその部品を避ける必要がある。
【０００５】
以上のことから、ピンで基板を保持する場合にあっては、装置の操作者が基板の下面に固定された部品を視認して、その部品を避けるようにピンの配置を設定していた。しかしながら、このような場合には、操作者は常に下面の部品の位置とピンの位置を意識して設定しなければならず、ピンの設定に非常に手間取ってしまう、という不都合があった。また、保持用の板で保持する場合にあっては、部品の位置を避けた板を作る必要があり、基板の種類が多い場合は多くの種類の板を用意し、その都度板を交換しなければならないので対応が非常にやりづらい、という不都合があった。かかる場合、基板の下面には配線も設けられているので、その配線にピンや保持用の板が強く接触して傷つけてしまう等の不都合もあった。
【０００６】
本発明は、かかる従来例の有する不都合を改善し、特に複数の基板保持ピンを用い、その基板保持ピンと当接する基板面に凹凸があっても水平に基板を保持できる基板保持機構を提供すると共に、両面に部品を設けたプリント基板に半田を印刷する場合であって、基板を保持する水平クランプ片に基板を受け渡す時に、自動的に水平状態を保って受け渡しができ、且つ高精度にクリーム半田を印刷できるクリーム半田印刷装置を提供することを、その目的とする。
【０００７】
【課題を解決するための手段】
上記目的を達成する為、本発明では、下面に部品等の凸部を有する基板の基板保持機構として、独立して往復移動可能な複数の基板保持ピンと、この基板保持ピンを支持すると共に往復移動させるピン駆動機構とを設けている。ここで、そのピン駆動機構は、内部に密閉空間を有するシリンダと、基板保持ピンを取着し且つシリンダ内を移動するピストンと、シリンダ内に気体を供給してピストンを移動させる第一及び第二の気体供給手段とを備えている。
【０００８】
具体的には、その第一気体供給手段を、シリンダの一方端に設け且つ前記密閉空間に連通する第一気体供給孔と、この第一気体供給孔からシリンダ内に低圧の気体を供給する低圧気体供給機構とで構成すると共に、前記第二気体供給手段を、シリンダの他方端に設け且つ前記密閉空間に連通する第二気体供給孔と、この第二気体供給孔からシリンダ内に高圧の気体を供給する高圧気体供給機構とで構成している。
【０００９】
【発明の実施の形態】
本発明のクリーム半田印刷装置の一実施形態について図１から図５に基づいて説明する。
【００１０】
先ず、本実施形態のクリーム半田印刷装置の構成について説明する。このクリーム半田印刷装置は、図１に示すが如く、プリント基板（以下、「基板」という）１０を搬入するベルトコンベアを備えた基板搬入部１と、この基板搬入部１から受け取った基板１０にクリーム半田を印刷するクリーム半田印刷部４と、クリーム半田が印刷された基板１０を排出するベルトコンベアを備えた基板搬出部５とを有する。
【００１１】
ここで、上記クリーム半田印刷部４について詳述する。このクリーム半田印刷部４は、基板搬入部１から受け取った基板１０をマスク３の下方まで搬送すると共に、その基板１０を基板搬出部５まで搬送するベルトコンベアの如き搬送ベルト６と、この搬送ベルト６で搬送されてきた基板１０を保持する印刷テーブル部２と、マスク３を保持するマスク保持機構９と、マスク３の上方に配設された図示しないクリーム半田塗布機とを有している。
【００１２】
上記印刷テーブル部２には、上下，前後左右及び水平方向に移動可能なテーブルを有する基板保持機構７が設けられている。この基板保持機構７は、最上段のテーブルに設け且つ基板１０を下側より保持する複数本の基板保持ピン８を備えた基板保持ピン部と、この基板保持ピン部を上昇させて基板１０を持ち上げる上下移動可能な基板持ち上げ機構３６と、基板上面の位置を規制する為のその基板上面に対して半円形の矢印方向に移動可能な１対の基板押さえ６０ａ，６０ｂと、基板表面に対して平行に移動して基板外周部を保持する基板保持部材たる図５（ｂ）に示す１対のサイドクランプ１１ａ，１１ｂとを有する。
【００１３】
ここで、基板保持機構７の基板保持ピン部について詳述する。この基板保持ピン部は、上記複数本の基板保持ピン８と、その基板保持ピン８各々を支持すると共に上下移動させる図３に示すピン駆動機構とを有する。かかる基板保持ピン部において、各基板保持ピン８は、図２（ａ），（ｂ）に示すが如く、ピン挿入用中板７Ｕの縦，横方向に形成された複数の貫通孔に各々が独立して上下移動できるように挿通されている。また、この各基板保持ピン８は、図１に示すが如く、前述した搬送ベルト６を駆動する二つの搬送プーリ６Ｐの間に位置するよう配設されている。
【００１４】
次に、上記ピン駆動機構の一例を図３を用いて説明する。尚、図３（ａ）は基板保持ピン８が上昇している時の状態を，図３（ｂ）は基板保持ピン８が基板下面の配線や部品（本図においては図示略）に接触した状態を示すものであって、本装置に配設した状態において側面から見た断面図である。
【００１５】
本実施形態の基板保持ピン８のピン駆動機構は、内部に密閉空間を有するエアシリンダ室４０と、このエアシリンダ室４０内を上下方向に摺動するピストン４１と、エアシリンダ室４０側面の下部側に形成した上記密閉空間に連通する第一気体供給孔４２と、エアシリンダ室４０側面の上部側に形成した上記密閉空間に連通する第二気体供給孔４３と、第一気体供給孔４２からエアシリンダ室４０内に第一気体（低圧の気体）を供給する第一配管と、第二気体供給孔４３からエアシリンダ室４０内に第二気体（高圧の気体）を供給する第二配管とで構成される。かかるピン駆動機構において、基板保持ピン８は、エアシリンダ室４０の内部空間の気密性を確保した状態でその上面にて摺動可能に挿通され、ピストン４１に固定されている。即ち、基板保持ピン８は、ピストン４１の上下動によって協動する。また、図示しないが、第一配管には第一気体を送出する第一気体供給装置が，第二配管には第二気体を送出する第二気体供給装置が配設されている。ここで、第一気体，即ち低圧の気体とは、後述するが如く基板下面の配線や部品１５等の凸部に当接した基板保持ピン８が押し戻される（図３（ｂ）に示すような状態になる）程度のものをいう。
【００１６】
また、エアシリンダ室４０内の下部には、第一気体供給孔４２から低圧の圧縮気体が送られてきた際にピストン４１の下面に略均等に圧力が掛かるように、その内部空間と比して小さな空間部（空気室）４４が形成されている。更に又、第二気体供給孔４３は、少なくともその上端とエアシリンダ室４０内の上面との距離が基板下面の配線や部品１５等の凸部の高さよりも短くなるような位置に形成する。尚、エアシリンダ室４０内には、初期状態にて圧縮気体が供給されていないものとし、ピストン４１がエアシリンダ室４０内の下端に位置しているものとする。
【００１７】
次に、本実施形態のクリーム半田印刷装置の動作を説明する。ここでは、裏面（下面）にのみ部品が搭載されて凹凸ができた基板１０の上面（平面）を水平に位置決めする動作と印刷工程を説明する。
【００１８】
先ず、基板搬入部１から搬送されてきた基板１０は、クリーム半田印刷部４の搬送ベルト６上の所定の位置で停止する。次に、搬送ベルト６の両側に設けた図５（ｂ）に示す基板押さえ６０ａ，６０ｂを半円形の矢印方向に移動させる。この時、その基板押さえ６０ａ，６０ｂの一端をサイドクランプ１１ａ，１１ｂに当てることで、基板押さえ６０ａ，６０ｂにおける基板１０と当接する面がサイドクランプ１１ａ，１１ｂの上面と同じ高さになるようにする。
【００１９】
続いて、第一気体供給孔４２からエアシリンダ室４０内に低圧の気体を供給してピストン４１の下部に圧力を掛け、各基板保持ピン８のピストン４１をエアシリンダ室４０内の最上端まで移動させる。かかる状態で、基板持ち上げ機構３６を用いて、ピン挿入用中板７Ｕと共に基板保持ピン部を所定量（基板保持ピン８が基板１０の下面に接触する位置まで）上昇させる。その際、基板１０の下面に設けた配線や部品１５等の凸部に当接する基板保持ピン８は、その凸部に当接した位置で上昇が止まる。かかる状態において、その凸部に当接する基板保持ピン８を固定しているピストン４１は、その上方にて第二気体供給孔４３とエアシリンダ室４０内とが連通するようエアシリンダ室４０内の上端から下方の位置で停止している。
【００２０】
次に、上記の如きピストン４１の位置で第二気体供給孔４３から高圧の気体を供給し、第一気体供給孔４２からの低圧の気体の供給を停止すると、先ず基板１０の下面に当接している基板保持ピン８にあっては、その高圧の気体がピストン４１の側部に当たり、その圧力によってピストン４１の移動が阻止される（即ち基板保持ピン８の位置が固定される）。また、凸部に当接する基板保持ピン８にあっては、その高圧の気体がピストン４１の上方に流入するので、その圧力によってピストン４１が下降し、更に基板１０の下面から離間していく。そのピストン４１は、最終的にエアシリンダ室４０内の下端まで下降する。
【００２１】
このように、基板１０に当接する基板保持ピン８にあってはその位置で止まり、凸部に当接する基板保持ピン８にあっては下降させるので、即ち複数本の基板保持ピン８の内の何れかを基板１０の下面のみに当接させるものであるので、部品１５等の凸部への当接を回避することができる。
【００２２】
次に、基板持ち上げ機構３６を作動させることによって、基板１０を、その下面に接触している基板保持ピン８で持ち上げ、搬送ベルト６から離間させる。その基板１０は、基板上面の両端部が図５（ｂ）に示すが如く基板押さえ６０ａ，６０ｂの下面に接触すると、この高さを上限として上昇が止まる。続いて、サイドクランプ１１ａ，１１ｂを基板１０側に水平移動させることによって、基板１０を両端から挟んで固定する。
【００２３】
次に、基板１０とマスク保持機構９に保持されているマスク３の位置を図示しないカメラ等の位置計測機構で計測し、その計測結果に基づいて両者の位置補正を印刷テーブルを駆動して行う。そして、基板１０とマスク３の位置合わせが終了すると、印刷テーブルの上昇機構を用いて、基板１０をマスク３に接触する位置，又は印刷可能位置まで上昇させる。かかる状態でマスク３上面からクリーム半田塗布機を用いてクリーム半田を基板面に印刷する。
【００２４】
印刷終了後、クリーム半田が印刷された基板１０を印刷テーブルの上昇機構を用いて所定位置まで下げ、サイドクランプ１１ａ，１１ｂを解除し、更に基板保持ピン８を、基板持ち上げ機構３６を用いて搬送ベルト６の搬送面より下の位置になるまで下降させる。これにより、その基板１０が搬送ベルト６の搬送面に乗せられる。そして、その基板１０は、搬送ベルト６を駆動して基板搬出部５に送られ、そこから次の工程に運ばれる。
【００２５】
尚、その基板１０の次にクリーム半田を印刷する基板がその基板１０と同一の凸部を有する（即ち同じ部品配置の）基板である場合は、上記の如き状態から基板保持ピン８のピン駆動機構を作動させず、基板持ち上げ機構３６を作動させて基板の上下移動を行えばよい。これにより、基板保持ピン８個々の上下移動を行わずとも、基板保持ピン８を基板下面の部品に接触させることなく印刷位置まで上昇させることができる。
【００２６】
以上示したが如く、本実施形態のクリーム半田印刷装置を用いることによって、基板１０へのクリーム半田の印刷時に従来は人手で行っていた、基板下面の部品実装箇所を避ける基板保持ピン８の設定を自動的に行うことができる。更に、従来は裏面に部品のある箇所のピンは多少余裕を見て人が抜いていたので、基板面に対して部品のある場所が大きいと基板１０の支持箇所が少なくなり、印刷の際、上から印刷の圧力を掛けたときにその箇所（ピンの無い部分）で基板１０が撓む虞があった。しかしながら、本実施形態の如く基板保持ピン８のピン駆動機構を設けることによって、部品に当接する基板保持ピン８だけを確実に基板１０から離間させることができるので、基板１０を支持する基板保持ピン８が極端に少なくなることを回避でき、精度良く基板１０を支持することが可能となる。
また、各気体供給孔４２，４３の形成位置を工夫することで、部品に当接する基板保持ピン８の押圧力を、基板１０に当接する基板保持ピン８の押圧力よりも小さくすることもでき、部品を傷つけずに基板１０を支持することも可能となる。更に又、従来例の如き種々の保持用板を設けずとも基板１０を有効に保持することができるので、基板１０に対応して保持用板を変更する必要が無くなり、作業性の向上を図ることができる。
【００２７】
次に、前述した第一実施形態の基板保持ピン８のピン駆動機構の変形例を説明する。このピン駆動機構と第一実施形態のピン駆動機構との相違点は、ピストン４１の側面（円周面）に、図３に破線で示す凹部４６を設けた点にある。この凹部４６は、ピストン４１がエアシリンダ室４０内の上端に位置するときに第二気体供給孔４３と対向するよう形成される。これにより、前述した第一実施形態の効果に加えて、以下の如き効果を奏することができる。即ち、第一実施形態に示したが如き基板１０の下面に当接する基板保持ピン８にあっては、第二気体供給孔４３から高圧気体が供給されるとその高圧気体が凹部４６の面を押圧し、ピストン４１の移動をより効果的に抑制することができる。そして、これにより更に確実に基板１０を支持することが可能となる。
【００２８】
次に、前述した第一実施形態の基板保持ピン８のピン駆動機構の他の変形例を説明する。このピン駆動機構と第一実施形態のピン駆動機構との相違点は、ピストン４１に、図４（ａ），（ｂ）に示すが如く、その側面から下面に連通する導通孔４５を設けた点にある。ここで、この導通孔４５のピストン側面側は、ピストン４１がエアシリンダ室４０内の上端に位置するときに第二気体供給孔４３と対向する位置に設けられる。これが為、この導通孔４５は、第二気体供給孔４３から供給される高圧気体の流路を成す。
【００２９】
このような導通孔４５を有するピストン４１を設けることによって、前述した第一実施形態の如く第二気体供給孔４３から高圧の気体を供給し、第一気体供給孔４２からの低圧の気体の供給を停止すると、先ず基板１０の下面に当接している基板保持ピン８にあっては、その高圧気体が導通孔４５を経てピストン４１下方の低圧気体室内に流入し、ピストン４１を更に押し上げる大きな力が働く。これが為、かかる状態で第一気体供給孔４２からの低圧気体の供給を停止しても、その位置でのピストン４１（基板保持ピン８）の保持が図れる。
【００３０】
また、凸部に当接する基板保持ピン８にあっては、ピストン４１の側面が第二気体供給孔４３を閉塞しているので、低圧の気体の供給を停止することで、例えばピストン４１等の自重で下降する。そして、その下降につれてピストン４１の上方に第二気体供給孔４３と連通する空間ができるので、その空間に第二気体供給孔４３から高圧の気体が流入して、ピストン４１をシリンダ４０内の最下端位置まで押し下げ、かかる位置を保持する。これにより、凸部に接触した各基板保持ピン８は、完全に基板１０と接触しない状態になる。
【００３１】
【発明の効果】
本発明に係る基板保持機構及びそれを用いたクリーム半田印刷装置は、基板保持面に部品が搭載された基板を基板保持ピンで保持する場合に、作業者が部品の搭載位置に応じて基板保持ピンを設定する必要が無いので作業者の手間を大幅に省くことができ、基板へのクリーム半田印刷時の装置の段取り等の作業性向上を図ることができる、という従来にない優れた基板保持機構及びそれを用いたクリーム半田印刷装置を得ることが可能となる。
【図面の簡単な説明】
【図１】本発明に係るクリーム半田印刷装置の第一実施形態の概略構成を示す側面図である。
【図２】本実施形態の基板保持ピンの配置を示す図であって、図２（ａ）はその斜視図で、図２（ｂ）はその側面図である。
【図３】本実施形態のピン駆動機構の構成を側面から見た断面図であって、図３（ａ）は基板保持ピンが上昇している状態を示す図で、図３（ｂ）は基板保持ピンが基板下面の凸部に接触した状態を示す図である。
【図４】本実施形態のピン駆動機構の他の変形例の構成を側面から見た断面図である。
【図５】本実施形態の基板保持機構の動作説明図であって、図５（ａ）は側面から見た側面図、図５（ｂ）は基板の移動方向側から見た図である。
【符号の説明】
１基板搬入部
２印刷テーブル部
３マスク
４クリーム半田印刷部
５基板搬出部
６搬送ベルト
７基板保持機構
８基板保持ピン
９マスク保持機構
１０基板
１１ａ，１１ｂサイドクランプ
４０シリンダ
４１ピストン
４２第一気体供給孔
４３第二気体供給孔
４５導通孔[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate holding mechanism that holds a substrate , and more particularly, to a substrate holding mechanism that can ensure the level of a substrate even when a surface of an uneven substrate is supported, and a cream solder printing apparatus using the same .
[0002]
[Prior art]
Conventionally, as a means for holding a substrate when printing solder on the substrate with a cream solder printing apparatus, there is one disclosed in Japanese Patent Application Laid-Open No. 2001-62992 in which the substrate is held by a pair of horizontal clamp pieces. Specifically, in the cream solder printing apparatus disclosed in Japanese Patent Laid-Open No. 2001-62992, the conveyed substrate is received on a pin unit composed of a plurality of pins that can move up and down, and cooperates with the pressing means. After temporarily holding, the substrate is transferred to and held by a horizontal clamp piece. In addition, as another holding means, there is a method of holding from a lower surface of the substrate with a holding plate.
[0003]
[Problems to be solved by the invention]
Here, the detailed configuration of the pin unit is not disclosed in the above Japanese Patent Laid-Open No. 2001-62992. However, in the general conventional pin unit method, the pin is placed on a plate with a large number of holes serving as a base. A method is adopted in which the hole is inserted into the hole according to the substrate size.
[0004]
By the way, components to be mounted on a substrate are first mounted on a substrate coated with cream solder, and the cream solder is melted and fixed to the substrate. Here, there are boards that mount the components on only one side and boards that mount on both sides. For example, when mounting on both sides, after fixing a part to one side of the board, the board is turned over, and again put into the cream solder printing apparatus, and the cream solder is transferred to the opposite side. At that time, since there is a component fixed on the holding surface of the substrate, it is necessary to avoid the component for the substrate holding pin or the holding plate.
[0005]
From the above, when the board is held by the pins, the operator of the apparatus visually recognizes the parts fixed on the lower surface of the board and sets the pin arrangement so as to avoid the parts. However, in such a case, the operator must always set the position of the component on the lower surface and the position of the pin, and there is a problem that it takes a lot of time to set the pin. Also, when holding with a holding plate, it is necessary to make a plate that avoids the position of the parts. If there are many types of boards, prepare many types of plates, and replace the plates each time. There was an inconvenience that it was very difficult to deal with because it was necessary. In this case, since the wiring is also provided on the lower surface of the substrate, there is a disadvantage that the pin and the holding plate are in strong contact with the wiring and are damaged.
[0006]
The present invention improves the inconvenience of such a conventional example, and particularly provides a substrate holding mechanism that uses a plurality of substrate holding pins and can hold the substrate horizontally even if the substrate surface in contact with the substrate holding pins is uneven. When solder is printed on a printed circuit board with parts on both sides, when the board is delivered to a horizontal clamp piece that holds the board, it can be automatically delivered in a horizontal state and with high precision An object of the present invention is to provide a cream solder printing apparatus capable of printing solder.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, in the present invention, as a substrate holding mechanism for a substrate having a convex portion such as a component on the lower surface, a plurality of substrate holding pins that can be reciprocated independently, and the substrate holding pins are supported and reciprocated. And a pin drive mechanism to be operated. Here, the pin drive mechanism includes a cylinder having a sealed space therein, a piston that attaches a substrate holding pin and moves within the cylinder, and a first and a second that move the piston by supplying gas into the cylinder. Second gas supply means.
[0008]
Specifically, the first gas supply means is provided at one end of the cylinder and communicates with the sealed space, and the low pressure gas that supplies low-pressure gas into the cylinder from the first gas supply hole. A gas supply mechanism, and the second gas supply means is provided at the other end of the cylinder and communicates with the sealed space, and a high-pressure gas is introduced into the cylinder from the second gas supply hole. And a high pressure gas supply mechanism.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
One embodiment of the cream solder printing apparatus of the present invention will be described with reference to FIGS.
[0010]
First, the configuration of the cream solder printing apparatus of this embodiment will be described. As shown in FIG. 1, the cream solder printing apparatus includes a substrate carry-in unit 1 having a belt conveyor for carrying a printed circuit board (hereinafter referred to as “substrate”) 10, and a substrate 10 received from the substrate carry-in unit 1. It has the cream solder printing part 4 which prints cream solder, and the board | substrate carrying-out part 5 provided with the belt conveyor which discharges | emits the board | substrate 10 with which cream solder was printed.
[0011]
Here, the said cream solder printing part 4 is explained in full detail. The cream solder printing unit 4 conveys the substrate 10 received from the substrate carry-in unit 1 to the lower side of the mask 3 and conveys the substrate 10 to the substrate carry-out unit 5, and a conveyance belt 6 such as a belt conveyor. 6 includes a printing table unit 2 that holds the substrate 10 that has been transported in 6, a mask holding mechanism 9 that holds the mask 3, and a cream solder applicator (not shown) disposed above the mask 3.
[0012]
The printing table unit 2 is provided with a substrate holding mechanism 7 having a table that is movable in the vertical direction, front-rear direction, left-right direction and horizontal direction. The substrate holding mechanism 7 is provided on the uppermost table and has a substrate holding pin portion provided with a plurality of substrate holding pins 8 for holding the substrate 10 from the lower side, and the substrate holding pin portion is lifted to hold the substrate 10. A substrate lifting mechanism 36 that can be moved up and down, a pair of substrate holders 60a and 60b that can move in the direction of a semicircular arrow with respect to the upper surface of the substrate for regulating the position of the upper surface of the substrate, and a surface of the substrate It has a pair of side clamps 11a and 11b shown in FIG. 5B, which are substrate holding members that move in parallel and hold the outer peripheral portion of the substrate.
[0013]
Here, the substrate holding pin portion of the substrate holding mechanism 7 will be described in detail. The substrate holding pin portion includes the plurality of substrate holding pins 8 and a pin driving mechanism shown in FIG. 3 that supports and moves the substrate holding pins 8 up and down. In the board holding pin portion, as shown in FIGS. 2 (a) and 2 (b), each board holding pin 8 has a plurality of through holes formed in the vertical and horizontal directions of the pin insertion intermediate plate 7U. It is inserted so that it can move up and down independently. Further, as shown in FIG. 1, each of the substrate holding pins 8 is disposed between the two conveying pulleys 6P that drive the conveying belt 6 described above.
[0014]
Next, an example of the pin driving mechanism will be described with reference to FIG. 3A shows a state in which the substrate holding pin 8 is raised, and FIG. 3B shows a state in which the substrate holding pin 8 is in contact with wiring and components (not shown in the figure) on the lower surface of the substrate. It is a sectional view showing the state and seen from the side in the state of being disposed in the apparatus.
[0015]
The pin driving mechanism of the substrate holding pin 8 of the present embodiment includes an air cylinder chamber 40 having a sealed space therein, a piston 41 that slides in the air cylinder chamber 40 in the vertical direction, and a lower portion of the side surface of the air cylinder chamber 40. From the first gas supply hole 42 communicating with the sealed space formed on the side, the second gas supply hole 43 communicating with the sealed space formed on the upper side of the side surface of the air cylinder chamber 40, and the first gas supply hole 42 A first pipe for supplying a first gas (low pressure gas) into the air cylinder chamber 40; a second pipe for supplying a second gas (high pressure gas) into the air cylinder chamber 40 from the second gas supply hole 43; Consists of. In such a pin driving mechanism, the substrate holding pin 8 is slidably inserted on the upper surface of the air cylinder chamber 40 while ensuring the airtightness of the internal space of the air cylinder chamber 40, and is fixed to the piston 41. That is, the substrate holding pins 8 cooperate with the vertical movement of the piston 41. Moreover, although not shown in figure, the 1st gas supply apparatus which sends out 1st gas is arrange | positioned by 1st piping, and the 2nd gas supply apparatus which sends out 2nd gas is arrange | positioned by 2nd piping. Here, as will be described later, the first gas, that is, the low-pressure gas, is pushed back by the substrate holding pins 8 that are in contact with the wiring on the lower surface of the substrate or the convex portions of the component 15 (as shown in FIG. 3B). It will be in a state).
[0016]
In addition, the lower portion of the air cylinder chamber 40 is compared with its internal space so that when the low-pressure compressed gas is sent from the first gas supply hole 42, pressure is applied to the lower surface of the piston 41 substantially evenly. A small space (air chamber) 44 is formed. Furthermore, the second gas supply hole 43 is formed at a position where the distance between at least the upper end of the second gas supply hole 43 and the upper surface in the air cylinder chamber 40 is shorter than the height of the protrusions such as the wiring on the lower surface of the substrate and the component 15. In the air cylinder chamber 40, it is assumed that compressed gas is not supplied in the initial state, and the piston 41 is located at the lower end in the air cylinder chamber 40.
[0017]
Next, the operation of the cream solder printing apparatus of this embodiment will be described. Here, an operation and a printing process for horizontally positioning the upper surface (planar surface) of the substrate 10 in which the components are mounted only on the rear surface (lower surface) and the unevenness is formed will be described.
[0018]
First, the substrate 10 conveyed from the substrate carry-in unit 1 stops at a predetermined position on the conveyance belt 6 of the cream solder printing unit 4. Next, the substrate holders 60a and 60b shown in FIG. 5B provided on both sides of the conveyor belt 6 are moved in the direction of a semicircular arrow. At this time, one end of the substrate holders 60a and 60b is applied to the side clamps 11a and 11b so that the surfaces of the substrate holders 60a and 60b that are in contact with the substrate 10 are the same height as the upper surfaces of the side clamps 11a and 11b. To do.
[0019]
Subsequently, low pressure gas is supplied from the first gas supply hole 42 into the air cylinder chamber 40 to apply pressure to the lower portion of the piston 41, and the piston 41 of each substrate holding pin 8 is moved to the uppermost end in the air cylinder chamber 40. Move. In this state, the substrate holding mechanism 36 is used to raise the substrate holding pin portion together with the pin insertion intermediate plate 7U by a predetermined amount (to a position where the substrate holding pin 8 contacts the lower surface of the substrate 10). At that time, the board holding pins 8 that come into contact with the convex portions of the wiring, the component 15 and the like provided on the lower surface of the substrate 10 stop rising at the positions in contact with the convex portions. In such a state, the piston 41 that fixes the substrate holding pin 8 that abuts on the convex portion has an inside of the air cylinder chamber 40 so that the second gas supply hole 43 and the inside of the air cylinder chamber 40 communicate with each other. Stops at a position below the top edge.
[0020]
Next, when the high-pressure gas is supplied from the second gas supply hole 43 at the position of the piston 41 as described above and the supply of the low-pressure gas from the first gas supply hole 42 is stopped, it first comes into contact with the lower surface of the substrate 10. In the substrate holding pin 8, the high-pressure gas hits the side of the piston 41, and the movement of the piston 41 is blocked by the pressure (that is, the position of the substrate holding pin 8 is fixed). Further, in the substrate holding pin 8 that is in contact with the convex portion, the high-pressure gas flows above the piston 41, so that the piston 41 is lowered by the pressure and further separated from the lower surface of the substrate 10. The piston 41 finally descends to the lower end in the air cylinder chamber 40.
[0021]
In this way, the substrate holding pin 8 that contacts the substrate 10 stops at that position, and the substrate holding pin 8 that contacts the convex portion is lowered, that is, among the plurality of substrate holding pins 8. Since either one is brought into contact with only the lower surface of the substrate 10, it is possible to avoid contact with the convex portion of the component 15 or the like.
[0022]
Next, by actuating the substrate lifting mechanism 36, the substrate 10 is lifted by the substrate holding pins 8 that are in contact with the lower surface of the substrate 10 and separated from the transport belt 6. When both ends of the upper surface of the substrate 10 are in contact with the lower surfaces of the substrate holders 60a and 60b as shown in FIG. Subsequently, the side clamps 11a and 11b are horizontally moved to the substrate 10 side to fix the substrate 10 sandwiched from both ends.
[0023]
Next, the position of the mask 3 held by the substrate 10 and the mask holding mechanism 9 is measured by a position measuring mechanism such as a camera (not shown), and based on the measurement result, the position of both is corrected by driving the printing table. . When the alignment between the substrate 10 and the mask 3 is completed, the substrate 10 is raised to a position where the substrate 10 comes into contact with the mask 3 or a printable position by using a lifting mechanism of the printing table. In this state, the cream solder is printed on the substrate surface from the upper surface of the mask 3 using a cream solder application machine.
[0024]
After the printing is finished, the substrate 10 on which the cream solder is printed is lowered to a predetermined position by using the lifting mechanism of the printing table, the side clamps 11a and 11b are released, and the substrate holding pins 8 are transported by using the substrate lifting mechanism 36. The belt 6 is lowered to a position below the conveying surface of the belt 6. Thereby, the substrate 10 is placed on the transport surface of the transport belt 6. And the board | substrate 10 drives the conveyance belt 6, is sent to the board | substrate carrying-out part 5, and is carried to the next process from there.
[0025]
If the substrate on which the cream solder is printed next to the substrate 10 is a substrate having the same protrusions as the substrate 10 (that is, having the same component arrangement), the pin driving of the substrate holding pins 8 from the above state The substrate may be moved up and down by operating the substrate lifting mechanism 36 without operating the mechanism. Thus, the substrate holding pins 8 can be raised to the printing position without being brought into contact with the components on the lower surface of the substrate without moving the substrate holding pins 8 up and down.
[0026]
As described above, by using the cream solder printing apparatus of the present embodiment, setting of the board holding pins 8 that avoids the component mounting position on the lower surface of the board, which is conventionally performed manually when the cream solder is printed on the board 10. Can be done automatically. In addition, since the pin where the component is located on the back side has been pulled out by a person with some margin in the past, if the location where the component is large with respect to the substrate surface is large, the support location of the substrate 10 is reduced. When printing pressure is applied from above, there is a possibility that the substrate 10 bends at the portion (portion where there is no pin). However, by providing a pin driving mechanism for the substrate holding pins 8 as in this embodiment, only the substrate holding pins 8 that contact the components can be reliably separated from the substrate 10, so that the substrate holding pins that support the substrate 10. 8 can be avoided from being extremely reduced, and the substrate 10 can be supported with high accuracy.
Further, by devising the formation positions of the gas supply holes 42 and 43, the pressing force of the substrate holding pin 8 that contacts the component can be made smaller than the pressing force of the substrate holding pin 8 that contacts the substrate 10. It is also possible to support the substrate 10 without damaging the components. Furthermore, since the substrate 10 can be effectively held without providing various holding plates as in the conventional example, there is no need to change the holding plate in accordance with the substrate 10, and workability is improved. be able to.
[0027]
Next, a modification of the pin driving mechanism of the substrate holding pin 8 of the first embodiment described above will be described. The difference between this pin drive mechanism and the pin drive mechanism of the first embodiment is that a concave portion 46 indicated by a broken line in FIG. 3 is provided on the side surface (circumferential surface) of the piston 41. The recess 46 is formed to face the second gas supply hole 43 when the piston 41 is located at the upper end in the air cylinder chamber 40. Thereby, in addition to the effect of 1st embodiment mentioned above, there can exist the following effects. That is, in the substrate holding pin 8 that contacts the lower surface of the substrate 10 as shown in the first embodiment, when the high-pressure gas is supplied from the second gas supply hole 43, the high-pressure gas passes through the surface of the recess 46. It is possible to suppress the movement of the piston 41 more effectively. As a result, the substrate 10 can be more reliably supported.
[0028]
Next, another modification of the pin driving mechanism of the substrate holding pin 8 of the first embodiment described above will be described. The difference between this pin drive mechanism and the pin drive mechanism of the first embodiment is that, as shown in FIGS. 4A and 4B, the piston 41 is provided with a conduction hole 45 communicating from the side surface to the lower surface. In the point. Here, the piston side surface side of the conduction hole 45 is provided at a position facing the second gas supply hole 43 when the piston 41 is located at the upper end in the air cylinder chamber 40. For this reason, the conduction hole 45 forms a flow path for the high-pressure gas supplied from the second gas supply hole 43.
[0029]
By providing such a piston 41 having the conduction hole 45, a high-pressure gas is supplied from the second gas supply hole 43 as in the first embodiment, and a low-pressure gas is supplied from the first gas supply hole 42. First, in the substrate holding pin 8 that is in contact with the lower surface of the substrate 10, the high-pressure gas flows into the low-pressure gas chamber below the piston 41 through the conduction hole 45 and further increases the piston 41. Work. For this reason, even if the supply of the low-pressure gas from the first gas supply hole 42 is stopped in this state, the piston 41 (substrate holding pin 8) can be held at that position.
[0030]
Moreover, in the board | substrate holding pin 8 contact | abutted to a convex part, since the side surface of piston 41 has obstruct | occluded the 2nd gas supply hole 43, by stopping supply of low pressure gas, for example, piston 41 grade | etc., It descends under its own weight. Then, as it descends, a space communicating with the second gas supply hole 43 is formed above the piston 41, so that high-pressure gas flows into the space from the second gas supply hole 43, and the piston 41 is moved to the innermost position in the cylinder 40. Press down to the lower end position and hold this position. Thereby, each board | substrate holding pin 8 which contacted the convex part will be in the state which does not contact the board | substrate 10 completely.
[0031]
【The invention's effect】
The board holding mechanism and the cream solder printing apparatus using the board holding mechanism according to the present invention hold the board according to the mounting position of the component when the board holding pin holds the board on which the board is mounted with the board holding pin. the need to configure the pin is not able to save much time and effort for the worker, it is possible to improve workability setup of the apparatus at the time of solder paste printing on the substrate, excellent substrate holding unprecedented that It becomes possible to obtain a mechanism and a cream solder printing apparatus using the mechanism .
[Brief description of the drawings]
FIG. 1 is a side view showing a schematic configuration of a first embodiment of a cream solder printing apparatus according to the present invention.
2A and 2B are views showing the arrangement of substrate holding pins according to the present embodiment, in which FIG. 2A is a perspective view thereof, and FIG. 2B is a side view thereof.
3 is a cross-sectional view of the configuration of the pin driving mechanism of the present embodiment as viewed from the side, and FIG. 3 (a) is a diagram showing a state in which the substrate holding pins are raised, and FIG. It is a figure which shows the state which the board | substrate holding pin contacted the convex part of the board | substrate lower surface.
FIG. 4 is a cross-sectional view of a configuration of another modified example of the pin drive mechanism of the present embodiment as viewed from the side.
5A and 5B are operation explanatory views of the substrate holding mechanism of the present embodiment, in which FIG. 5A is a side view seen from the side, and FIG. 5B is a view seen from the moving direction side of the substrate.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate carrying-in part 2 Print table part 3 Mask 4 Cream solder printing part 5 Substrate carrying-out part 6 Conveyor belt 7 Substrate holding mechanism 8 Substrate holding pin 9 Mask holding mechanism 10 Substrate 11a, 11b Side clamp 40 Cylinder 41 Piston 42 First gas supply Hole 43 Second gas supply hole 45 Conduction hole

Claims

In the substrate holding mechanism for holding the supplied substrate at its working position,
A plurality of substrate holding pins for holding the substrate, a cylinder having a sealed space inside each of the substrate holding pins, a piston moving in the cylinder, and a first gas supplying low pressure gas to one end of the cylinder A gas supply hole, and a second gas supply hole for supplying a high-pressure gas to the other end of the cylinder,
When the piston is driven to move to the other end of the cylinder by driving the piston, a concave groove to which high-pressure gas from the second gas supply hole is supplied is provided,
A substrate holding mechanism, wherein the substrate holding pin is fixed to the piston and is raised by supplying a low-pressure gas from the first gas supply hole.

In the substrate holding mechanism for holding the supplied substrate at its working position,
A plurality of substrate holding pins for holding the substrate, a cylinder having a sealed space inside each of the substrate holding pins, a piston moving in the cylinder, and a first gas supplying low pressure gas to one end of the cylinder A gas supply hole, and a second gas supply hole for supplying a high-pressure gas to the other end of the cylinder,
The piston, when moved to the located on the other end of the cylinder by driving the piston, provided with a guide hole communicating between the said first gas supply hole second gas supply hole,
A substrate holding mechanism, wherein the substrate holding pin is fixed to the piston and is raised by supplying a low-pressure gas from the first gas supply hole.

Cream solder comprising a transport belt for transporting a substrate to be printed to a printing unit, a substrate holding mechanism for holding the substrate at a predetermined height, and a mask holding mechanism for holding a mask for applying cream solder In the printing device,
As the substrate holding mechanism, a plurality of substrate holding pins, a pin driving mechanism for reciprocating the substrate holding pins, and a substrate holding member for holding the outer peripheral portion of the substrate are provided.
The pin driving mechanism includes: a cylinder having a sealed space therein; a piston that attaches the substrate holding pin and moves within the cylinder; and a gas that supplies gas into the cylinder and moves the piston. A second gas supply means,
The first gas supply means includes a first gas supply hole provided at one end of the cylinder and communicating with a sealed space formed between the lower portion of the piston and the cylinder, and a low pressure from the first gas supply hole. A low-pressure gas supply mechanism for supplying a gas of
The second gas supply means includes a second gas supply hole provided at the other end of the cylinder and communicating with a sealed space formed between the upper portion of the piston and the cylinder, and the second gas supply hole from the second gas supply hole. It consists of a high-pressure gas supply mechanism that supplies high-pressure gas that is higher than low pressure,
The piston has a concave groove that holds the position of the piston by supplying the high-pressure gas from the second gas supply hole when the piston is driven to move to the other end of the cylinder. And
By supplying low pressure gas from the first gas supply means to the sealed space between the lower part of the piston and the cylinder through the first gas supply hole, the piston and the substrate holding pin attached to the piston are provided. Abut against the substrate or the convex part of the substrate,
Next, a high pressure gas is supplied from the second gas supply means through the second gas supply hole to the sealed space formed between the piston and the cylinder formed by the convex portion, and a downward force is applied to the piston. This is a cream solder printing device.

The piston, when moved to the located on the other end of the cylinder by driving the piston, provided with a guide hole communicating between the said first gas supply hole second gas supply hole, the second gas The cream solder printing apparatus according to claim 3, wherein the piston position is maintained by supplying high-pressure gas from the supply hole to the communication hole.