JP2007294570A - Conveying tool for thin substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a conveying tool for a thin substrate which can prevent interruption of securing or working of a thin substrate by preventing a positioning pin from bending. <P>SOLUTION: The tool includes a positioning plate 1, and a carrier plate 20 removably placed on the surface of the positioning plate 1 and removably adhesion-holding a flexible wiring board for mounting an electronic component. A plurality of positioning pins 4 interfering with the flexible wiring board of the carrier plate 20 are vertically arranged on the surface of the positioning plate 1, and through-holes 24 for passing the positioning pins 4 are punched in the carrier plate 20. Each of the plurality of positioning pins 4 comprises a radially enlarged portion 5 planted on the surface of the positioning plate 1 and fitted in the through-hole 24 of the carrier plate 20, and a contracted portion 6 on the tip side elongating from the surface of the radially enlarged portion 5 and projecting in the direction of the outer surface from the inside of the through-hole 24, thereby forming a step. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a thin substrate transfer jig for positioning and holding a flexible wiring board or the like for mounting electronic components.

  Cellular phones, DVDs, etc. use flexible wiring boards (FPCs) that are excellent in processability and flexibility, and can be made thin, light, and compact. Since it is low, easily warped, and easily bent, it is difficult to mount various electronic components on the mounting line as they are.

  Therefore, conventionally, a technique has been proposed in which a flexible wiring board is fixed to a rigid plate body via a plurality of positioning pins, and an electronic component is mounted with the flexible wiring board being fixed (see Patent Document 1). However, apart from this technique, as shown in FIG. 6, a thin substrate transport jig having a positioning plate 1 and a carrier plate 20 has been proposed.

As shown in FIG. 6, this type of thin substrate conveyance jig includes a positioning plate 1 and a carrier plate 20 for conveyance which is stacked on the positioning plate 1 and holds a flexible wiring board. Are provided with a plurality of positioning pins 4A that are inserted into the positioning holes of the flexible wiring board held on the surface of the carrier plate 20, and the carrier plate 20 has through holes 24 that pass through the positioning pins 4A. Perforated.
Japanese Patent Laid-Open No. 1-198094

  The conventional thin substrate transfer jig is configured as described above, and has an excellent effect of facilitating mounting of electronic components on the flexible wiring board. However, the present inventors are not satisfied with such an effect, and the thin substrate They want to improve the transport jigs to add value and stimulate technological breakthroughs. Specifically, there is a demand to prevent the positioning pin 4A from being bent and to prevent the flexible wiring board from being fixed and the work from being interrupted.

  To explain this point, positioning pins 4A having a diameter of 1 mm or less are erected on the positioning plate 1 of the thin substrate transport jig. However, if the thin and long positioning pins 4A are merely erected, It is conceivable that the tip of the positioning pin 4A is bent by contact with the carrier plate 20 at the time of transportation, which may hinder the fixing and work of the flexible wiring board. This problem cannot be handled lightly as long as the mounting area of the flexible wiring board has increased in recent years and the positioning pins 4A have become smaller and smaller in diameter.

  As a method for solving such a problem, a method of shortening or thickening the positioning pin 4A can be considered. However, if the positioning pin 4A is shortened, the positioning pin 4A may not be inserted into the positioning hole of the flexible wiring board that is likely to warp. Therefore, there arises a new problem that it becomes difficult to fix the flexible wiring board which is easily warped. Furthermore, if the positioning pin 4A is made thick, the positioning hole of the flexible wiring board must be enlarged, and there is a possibility that the expansion of the mounting area of the flexible wiring board cannot be dealt with.

  The present invention has been made in view of the above, and an object of the present invention is to provide a thin substrate transport jig that can prevent a positioning pin from being bent and prevent a thin substrate from being fixed or interrupted.

In order to solve the above-described problems, the present invention includes a positioning body and a carrier plate that is stacked on the positioning body and detachably adheres to and holds a thin substrate for mounting an electronic component. A positioning pin that interferes with the substrate is erected (provided), and the carrier plate is provided with a through hole that penetrates the positioning pin,
A positioning pin is provided on the positioning body and is fitted into the through hole of the carrier plate. The widening portion extends from the widening portion and protrudes from the inside of the through hole to interfere with a thin substrate adhered and held on the carrier plate. It is characterized by comprising a reduced width portion.

A counterbore region formed on the carrier plate and having a depth greater than or equal to the thickness of the thin substrate, and provided in the vicinity of the counterbore region, is opposed to the thick portion of the thin substrate and absorbs the thickness. A thickness absorption hole (thickness absorption region) can be included.
Also, a counterbore region formed on the carrier plate and having a depth greater than or equal to the thickness of the thin substrate, an adhesive layer adhered to the counterbore region and detachably adhered to the thin substrate, and the vicinity of the adhesive layer And a thickness absorption hole (thickness absorption region) that opposes the thick portion of the thin substrate and absorbs the thickness thereof.

  Further, a counterbore region formed on the surface of the carrier plate and having a depth equal to or greater than the thickness of the thin substrate, an adhesive layer adhered to the counterbore region and detachably attached to the thin substrate, and the adhesive layer A thin substrate that includes a thickness absorption hole (thickness absorption region) that opposes the thick portion of the thin substrate and absorbs the thickness of the thin substrate, and is adhesively held on the surface of the carrier plate and the adhesive layer The surface height can be substantially aligned.

  Here, the thin substrate in the claims includes at least one flexible wiring board and printed wiring board. Further, all the positioning pins may be constituted by the widened portion and the reduced width portion, or a part of the positioning pins may be constituted by the widened portion and the reduced width portion. This positioning pin may be cylindrical, prismatic, etc., may be positioned by contacting the periphery of a thin substrate, or may be positioned by being inserted into a positioning hole drilled in the thin substrate. .

  According to the present invention, when the carrier plate is stacked on the positioning body, the widened portion of the positioning pin standing from the positioning body is fitted while interfering with the through hole of the carrier plate, but the narrowed width is narrower than the widened portion of the positioning pin. The portion protrudes from the carrier plate without contacting the through hole of the carrier plate.

  According to the present invention, it is possible to prevent the positioning pins from being bent and to prevent the thin substrate from being fixed or the work from being interrupted. In addition, since it is not necessary to shorten the entire positioning pin, even if the thin substrate is likely to warp, it is possible to prevent the thin substrate from being difficult to fix. Furthermore, since the entire portion of the positioning pin is not thickened, it is possible to cope with expansion of the mounting area of the thin substrate.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. A thin substrate transport jig in the present embodiment includes a positioning plate 1 having rigidity and the positioning plate as shown in FIGS. 1 is provided with a carrier plate 20 for transporting which is detachably stacked on the surface of 1 and holds a plurality of flexible wiring boards 10, and the positioning plate 1 has a plurality of interferences with the flexible wiring boards 10 held by the carrier plates 20. The positioning pins 4 are erected, and the carrier plate 20 is perforated with round through holes 24 penetrating through the positioning pins 4, and the plurality of positioning pins 4 are formed from the enlarged diameter portion 5 and the reduced diameter portion 6. It is configured to have different steps.

  As shown in FIG. 2 and FIG. 3, the positioning plate 1 is formed into a plane rectangular flat plate using a material such as lightweight aluminum having excellent workability, and one corner portion 2 of the four corner portions is notched obliquely. The notched corner 2 functions as a mark for alignment of the carrier plate 20.

  Of the four corners of the surface of the positioning plate 1, the positioning pins 3 for the carrier plate 20 are vertically press-fitted and planted in the three corners, and a plurality of positioning pins are provided on most of the surface of the positioning plate 1. The pins 4 are implanted in a predetermined pattern, and the plurality of positioning pins 4 function to be inserted into the positioning holes 12 of the flexible wiring board 10 for positioning.

  As shown in FIG. 5, the plurality of positioning pins 4 are planted by being press-fitted on the surface of the positioning plate 1 in a standing state, and are fitted into the through-holes 24 of the carrier plate 20 to expand a latent disk shape. Carrier from the diameter portion 5 and the columnar diameter-reduced portion 6 extending vertically upward from the surface of the enlarged diameter portion 5 and projecting from the inside of the through hole 24 to the outside and inserted into the positioning hole 12 of the flexible wiring board 10 The plate 20 has a substantially convex shape in cross section having a length equal to or greater than the thickness of the plate 20.

  The positioning pin 4 is formed by using, for example, a material such as SUS so that the enlarged diameter portion 5 buried in the through hole 24 is formed to be φ1.5 mm, and the reduced diameter portion 6 having a rounded tip is formed to be φ1.0 mm or less. 5 and the reduced diameter portion 6 are formed to be narrower than the through hole 24 of the carrier plate 20.

  As shown in FIG. 1, the flexible wiring board 10 is formed by printing a predetermined conductive pattern on an insulating film such as polyester or polyimide, and has a thick connector portion 11 or a reinforcement at its end. A plate is formed, cream solder is applied in a state of being adhesively held on the carrier plate 20 of the thin substrate conveying jig, and then various electronic components are mounted. A plurality of positioning holes 12 inserted through the positioning pins 4 are perforated at predetermined intervals in a part of the peripheral portion of the flexible wiring board 10.

  As shown in FIGS. 1, 2, and 4, the carrier plate 20 is formed into a flat rectangular thin plate having substantially the same size as the positioning plate 1 using a material such as aluminum or glass epoxy, for example. Of these, one corner 21 is cut obliquely, and the cut one corner 21 is aligned with one corner 2 of the positioning plate 1 and functions as a mark. Of the four corners of the carrier plate 20, alignment holes 22 that are penetrated by the alignment pins 3 of the positioning plate 1 are respectively drilled in three corners, and most of the carrier plate 20 has a plurality of counterbore regions 23. The through-hole 24, the adhesive layer 25, and the planar rectangular thickness absorption hole 26 are disposed.

  The plurality of counterbore regions 23 are formed in a 2 × 2 pattern on, for example, most of the surface of the carrier plate 20, and each counterbore region 23 is formed in a size larger than the size of the flexible wiring board 10, A recess is formed with a depth greater than the thickness of the flexible wiring board 10. Further, the plurality of through holes 24 are drilled in and out of each spot facing region 23 with a size of, for example, about φ1.7 mm.

  Each adhesive layer 25 is formed into a thin sheet with weak adhesion using, for example, epoxy resin, silicone rubber, urethane rubber, fluoro rubber, and the like, and is adhered to the spot facing region 23 so that the flexible wiring board 10 is detachably adhered. Then, the surface of the flexible wiring board 10 and the surface of the carrier board 20 are substantially aligned so as to facilitate the application of cream solder to the flexible wiring board 10. Furthermore, each thickness absorption hole 26 is perforated in the vicinity of the counterbore region 23 and the adhesive layer 25 and absorbs the thickness of the flexible wiring board 10 so as to oppose the thick connector portion 11 and the reinforcing plate. The operation of applying cream solder to the wiring board 10 is made smooth.

  In the above, when the flexible wiring board 10 is fixed to the carrier board 20 of the thin substrate transport jig, first, the carrier board 20 is laminated on the surface of the positioning board 1 via the alignment pins 3, and the carrier board 20. The diameter-reduced portions 6 of the plurality of positioning pins 4 are exposed from the surface (see FIG. 1), and the flexible wiring board 10 is positioned and fixed to the adhesive layer 25 of the carrier plate 20 via the diameter-reduced portions 6 of the positioning pins 4. If the connector portion 11 and the reinforcing plate of the flexible wiring board 10 are disposed in the thickness absorption hole 26 and the thickness is absorbed, the flexible wiring board 10 can be appropriately fixed to the carrier plate 20.

  When the carrier plate 20 is stacked, the positioning pin 4 is fitted while the base-side enlarged diameter portion 5 is in contact with the through hole 24 of the carrier plate 20, but the reduced diameter portion 6 is the inner surface of the through hole 24 of the carrier plate 20. It is exposed as it is without contacting, and the reduced diameter portion 6 appropriately interferes with the flexible wiring board 10 without bending.

  According to the above configuration, the conventional thin positioning pin 4A is configured in a shape having the enlarged diameter portion 5 and the reduced diameter portion 6, so that when the carrier plate 20 is laminated on the positioning plate 1, the thin tip of the positioning pin 4 The reduced diameter portion 6 on the side and the thick through hole 24 of the carrier plate 20 do not interfere with each other. Therefore, the tip of the positioning pin 4 is bent by contact with the carrier plate 20 at the time of use or transportation, and there is no possibility that the fixing and work of the flexible wiring board 10 will be hindered. Further, since the positioning pins 4 are not shortened as a whole, it is possible to prevent the flexible wiring board 10 that is easily warped from being difficult to be fixed.

  Further, since the reduced diameter portion 6, not the enlarged diameter portion 5 of the positioning pin 4, is inserted into the positioning hole 12 of the flexible wiring board 10, it is possible to easily cope with the expansion of the mounting area of the flexible wiring board 10. . Further, since the positioning pins 4 are not tapered but are stepped, when the carrier plate 20 is laminated on the positioning plate 1, the carrier plate 20 can be completely laminated, and the flexible wiring board 10 can be fixed. It becomes possible to prevent troubles.

  Further, the diameter-reduced portion 6 on the distal end side of the positioning pin 4 is shorter than that of the conventional one, and is hard to bend and bend, so that it is possible to increase strength and rigidity. Further, since the surface of the flexible wiring board 10 and the surface of the carrier board 20 are aligned at the same height and there is no unevenness between them, cream solder can be applied smoothly and uniformly to the flexible wiring board 10. become.

  In addition, the positioning plate 1 and the carrier plate 20 of the said embodiment can be formed in a rectangle, a square, a polygon, a circle etc. as needed. Alternatively, the positioning pins 3 for the carrier plate 20 may be vertically press-fitted into the four corners of the surface of the positioning plate 1 and planted. Moreover, in the said embodiment, although the positioning pin 4 was press-fit and implanted in the positioning plate 1, it is not limited to this at all. For example, the positioning pin 4 may be screwed to the positioning plate 1 to stand up. Further, the spot facing region 23 and the thickness absorption hole 26 can be appropriately increased or decreased. Furthermore, the thickness absorption hole 26 may be a through-hole as long as it is recessed, and may not be so.

It is a perspective explanatory view showing typically an embodiment of a thin substrate conveyance jig concerning the present invention. It is a disassembled perspective explanatory drawing which shows typically the positioning board and carrier board in embodiment of the thin substrate conveyance jig which concerns on this invention. It is a perspective explanatory view showing typically the positioning plate in the embodiment of the thin substrate transport jig according to the present invention. It is a perspective explanatory view showing typically the carrier board in the embodiment of the thin substrate conveyance jig concerning the present invention. It is a section explanatory view showing typically a positioning pin in an embodiment of a thin substrate conveyance jig concerning the present invention. It is principal part cross-sectional explanatory drawing which shows a thin substrate conveyance jig | tool typically.

Explanation of symbols

1 Positioning plate (positioning body)
4 Positioning pin 4A Positioning pin 5 Expanded diameter (widened)
6 Reduced diameter part (reduced width part)
10 Flexible wiring board (thin board)
DESCRIPTION OF SYMBOLS 11 Connector part 12 Positioning hole 20 Carrier board 23 Counterbore area 24 Through-hole 25 Adhesion layer 26 Thickness absorption hole

Claims (1)

A positioning body and a carrier plate stacked on the positioning body and detachably adhesively holding a thin substrate for mounting electronic components; and positioning pins that interfere with the thin substrate of the carrier plate are erected on the positioning body; A thin substrate transport jig provided with a through hole penetrating the positioning pin in the carrier plate,
A positioning pin is provided on the positioning body and is fitted into the through hole of the carrier plate. The widening portion extends from the widening portion and protrudes from the inside of the through hole to interfere with a thin substrate adhered and held on the carrier plate. A thin substrate transfer jig comprising a reduced width portion.

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