JPH04343300A - Board support device - Google Patents

Abstract

PURPOSE:To enable a board support pin to be easily moved and easily and accurately set at a required position. CONSTITUTION:In a board support device which supports a board by board support pins 17 vertically implanted on a board support pin mount 16 provided under the board, an electromagnet is provided to either the board support pin mount 16 or the board support pins 17, and the other is made to serve as an object attracted by the former.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate support device for supporting a substrate on which electronic components are mounted.

0002

2. Description of the Related Art Conventionally, a component mounting device provided with a substrate support device has been used. As shown in FIG. 7, this component mounting device follows the board surface of a printed circuit board (hereinafter simply referred to as a board) 2 placed on a pair of guides 1 and 1 that are provided on the same plane so as to be able to approach and separate from each other. By moving the chuck device that holds the component in two directions (hereinafter referred to as the A predetermined location on the bottom surface of the printed circuit board is supported by a plurality of board support pins 3 from the underside of the printed circuit board 2, and the chuck device is raised and lowered in a direction perpendicular to the board surface of the printed circuit board (hereinafter referred to as the Z-axis direction) to remove the component. I am trying to install it. When mounting the components, it is necessary to change the position of the board support pins 3 in accordance with the size of the board 2 each time the type of board 2 is changed in high-mix, low-volume production. Therefore, an iron stand 4 is placed below the board 2.
Provided so that its upper surface is approximately parallel to the lower surface of the substrate 2,
A plurality of substrate support pins 3 having a base 5 made of a permanent magnet were magnetically attached to predetermined positions on the table 4 in an upright manner, and the substrate 2 was supported by the plurality of substrate support pins 3. The attractive force of the magnet of the substrate support pin base 5 is relatively large because it requires a force sufficient to prevent the substrate support pin 3 from moving unnecessarily.

0003

However, in the board support device of such a conventional component mounting apparatus, the position of the board support pin 3 must be changed every time the type of board 2 used changes. Although it is necessary to set the board support pin 3 in a delicate position, the magnetic adhesion force of the board support pin base 5 to the base 4 of the board support pin 3 is relatively large as described above. There was a problem in that a large force was required to move the substrate support pins 3, and it was difficult to accurately set the substrate support pins 3 at predetermined positions. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate support device that can easily move substrate support pins and accurately and easily set the substrate support pins at predetermined positions. purpose.

0004

[Means for Solving the Problems] In order to achieve the above object, the present invention supports a substrate with guides arranged oppositely at intervals in the horizontal direction, and a plurality of guides located between the guides and in contact with the lower surface of the substrate. In a substrate support device that supports a substrate with a substrate support pin, the substrate support pin is provided on a substrate support pin mount located on the bottom surface of the substrate, and one of the substrate support pin mount and the plurality of substrate support pins is provided. One is provided with an electromagnet, and the other is made of a magnetized object.

[0005]

[Operation] The board support pin is magnetically attached to the board support pin mount by the force of the electromagnet, and the magnetization of the board support pin magnetically attached to the board support pin mount is released or this magnetic force is removed by the force of the electromagnet. Since the number of substrate support pins is reduced, it becomes easy to move the substrate support pins and install the substrate support pins at predetermined positions on the substrate support pin mount.

[0006]

Embodiment A first embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 is a perspective view of a component mounting device, in which 11 is a main body, 14 is a nozzle head that is provided on the main body 11, holds a component (chip) and moves in the XYZ directions shown in the figure, and 12 is a nozzle head. A servo motor for rotating parts held in the nozzle head 14 around the Z axis, 13 a tape feeder for supplying chip parts to the nozzle head 14, and 15 a tape feeder for supplying chip parts to the nozzle head 14 (
16 is a substrate support pin mount, and 17 is a substrate support pin fixed to the substrate support pin mount 16.

As shown in FIG. 2, the board support pin mounting base 16 has a coil 1 installed in a recess 18 formed on the side surface of an iron plate.
9 is wound around the base, and the coil 19 is turned into an electromagnet 20 by energizing the coil 19. The upper surface of the board support pin mount 16 is parallel to the lower surface of the board. The board support pin mount 16 is vertically movable and fixed at a predetermined position in the vertical direction. A substrate support pin 17 is magnetically attached upright on the substrate support pin mount 16 so that its position can be changed. The substrate support pin 17 is made up of a base 17a and a pin part 17b, and the base 17a is made of a permanent magnet or a ferromagnetic material, that is, a magnetized object. The upper end of the pin portion 17b is tapered and its tip is rounded.

Next, the operation of the substrate supporting device constructed as described above will be explained. The required setting position of the board support pin 17 differs depending on the type of board to be worked on, so whenever the type of board is changed, the setting of the board support pin 17 is changed to the required position corresponding to this board. be done. In this case, if the base 17a of the board support pin 17 is a permanent magnet, the board support pin mounting base 1
Only when the coil 19 of No. 6 is de-energized and the substrate support pin 17 is moved, the coil 19 is energized so that the magnet at the base 17a of the substrate support pin 17 and the substrate support pin mounting base 16, that is, the electromagnet 20 repel each other. Ru. As a result, when the board support pin 17 is moved, the magnetic attraction force of the board support pin 17 to the board support pin mount 16 is eliminated, and the movement of the board support pin 17 on the board support pin mount 16 is facilitated. . Therefore, when the board support pin 17 is moved to a predetermined position, the coil 19 of the board support pin mount 16
The energization of the substrate support pin 17 is stopped, and the substrate support pin 17 is magnetically attached to the substrate support pin mounting base 16 by the magnetic force of the base portion 17a. Therefore, the board support pin 17 can be accurately and easily set at a predetermined position on the board support pin mount 16.

Further, when the base 17a of the board support pin 17 is made of a ferromagnetic material such as iron, the board support pin mount 16 is normally excited and becomes an electromagnet 20, and the board is attached to the board support pin mount 16. A support pin 17 is magnetically attached. When the board support pin 17 is moved, as a means, the excitation of the board support pin mount 16 is released,
The board support pins 17 can be easily moved on the board support pin mount 16. Therefore, when the board support pin 17 is moved to a predetermined position, the board support pin mount 16 is energized again, and the board support pin 17 is fixed at a predetermined position on the board support pin mount 16.

As another means, the residual magnetism when the board support pin mount 16 is de-energized is taken into consideration, and the coil 19 is connected to the board support pin 17 to the board support pin mount 16.
A relatively small current is passed in the opposite direction to that when the pins are magnetized, and a repulsive force equal to the weight of the board support pins 17 is generated, which causes the board support pins 17 to be repelled from the board support pin mounting base 16. As a result, this repulsive force and the weight of the board support pin 17 substantially cancel each other out, and the board support pin 17 can be easily moved on the board support pin mount 16. Therefore, when the board support pin 17 is moved to a predetermined location, the board support pin mount 16 is excited so that the board support pin 17 can be magnetically attached, and the board is supported at a predetermined location on the board support pin mount 16. Pin 17 is fixed. Thereafter, electronic components are mounted on the board while the board is supported by the board support pins 17.

According to this embodiment, the board support pin mounting base 1
6 and the substrate support pin 17, the substrate support pin 17 is moved and the substrate support pin 17 is moved to a predetermined position on the substrate support pin mounting base 16.
This makes installation extremely easy, and it is possible to shorten the setup change time of the substrate support device when changing the type of substrate in the substrate production process.

Next, a second embodiment of the present invention will be described with reference to FIGS. 3 and 4.
The explanation will be based on. In this embodiment, a lattice-shaped groove 22 is formed on the upper surface of a board support pin mount 21 made of a ferromagnetic material such as iron, and a conductive wire 23 is wired within this lattice-shaped groove 22. . A plurality of substrate support pins 17 are placed on the upper surface of the substrate support pin mount 21 . Then, when a current is made to flow only through the desired conducting wire 23 within the groove 22, only the vicinity where the current has passed is strongly excited and becomes an electromagnet 24. Therefore, by selecting the conducting wire to be energized according to the type of board used and adjusting the magnitude of the excitation current, the board support pin 1
7 can be easily attached to and detached from the board support pin mounting base 21. Moreover, this makes it possible to eliminate wasteful generation of magnetic fields and unnecessary currents. Further, by sequentially changing the excited position of the board support pin mount 21, the board support pin 17 can be moved to a desired position.

Next, a third embodiment of the present invention is shown in FIGS. 5 and 6.
The explanation will be based on. In this embodiment, as shown in FIG. 6, a comb-shaped anode 32 and a cathode 33 are arranged on the upper surface of a substrate support pin mounting base 31 made of a ferromagnetic material, and a conductor 32a and a conductor 33a corresponding to comb teeth, respectively. An electrode 34 is provided in which the electrodes are inserted alternately.
A board support pin 35 is placed on top of the board. As shown in FIG. 5, this board support pin 35 has a base portion 36 and a pin portion 3.
7, and the upper end is tapered and closed.
An electromagnet 39 is provided in the base 36 of the base 3 .
Contacts 40 and 41 are provided at the lower end of 6 and are insulated from the cylindrical body 38 and spaced apart from each other. A switch 42 is fixedly provided at a predetermined location within the pin portion 37, and an operating portion 43 of this switch 42 protrudes outside the pin portion 37 through a hole 44 formed in the middle of the pin portion 37. . One end of a conductive wire forming a coil of the electromagnet 39 is connected to the contact 40 , and the other end of the conducting wire forming the coil is connected to the contact 41 via a switch 42 .

Then, with the switch 42 in the ON state, the board support pin 35 is mounted on the board support pin mount 31 so that the contacts 40 and 41 are in contact with the anode 32 and the cathode 33, respectively.
is moved and the electrode 34 is energized, from the electrode (anode 32) 34 to the contact 40 (or contact 41), the conductor of the coil of the electromagnet 39, the switch 42, the contact 41 (or contact 40), and the electrode (cathode 33). ), and the electromagnet 39 is excited. As a result, the board support pin 35 is magnetically fixed onto the board support pin mount 31. When moving the board support pin 35 from the state where the board support pin 35 is magnetically attached to the board support pin mounting base 31, the switch 42 is turned OFF by operating the operating section 43 of the switch 42.
By setting F, the excitation of the electromagnet 39 is released, the magnetic force of the board support pin 35 to the board support pin mount 31 disappears, and the movement of the board support pin 35 on the board support pin mount 31 becomes extremely difficult. It becomes easier. According to this example,
Since the switch 42 can be turned on and off simply by grasping the board support pin 35 by the operator, it is extremely easy to move the board support pin 35 and install the board support pin 35 at a predetermined position on the board support pin mounting base 31. It becomes easier.

[0015]

According to the present invention, by controlling the force of the electromagnet provided on one of the board support pin mount and the board support pin, the power of the electromagnet causes the board support pin to be attached to the board support pin mount. is magnetized, and the magnetization of the board support pin magnetically attached to the board support pin mount is canceled or the magnetic attraction force is reduced by the force of the electromagnet, so that the board support pin is moved and the board support pin is mounted on the board support pin mount. It becomes easy to accurately install the substrate support pins at predetermined positions, and the time required to change the setup of the substrate support device when changing the type of substrate in the substrate production process is shortened.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a first embodiment of the present invention.

FIG. 2 is a side sectional view of essential parts showing a first embodiment of the present invention.

FIG. 3 is a side view of essential parts showing a second embodiment of the present invention.

FIG. 4 is a plan view of main parts showing a second embodiment of the present invention.

FIG. 5 is a side sectional view of a substrate support pin showing a third embodiment of the present invention.

FIG. 6 is a perspective view of a board support pin mount showing a third embodiment of the present invention.

FIG. 7 is a perspective view showing main parts of a conventional substrate support device.

[Explanation of symbols]

16, 21, 31 Board support pin mounting base 17, 35
Board support pins 20, 24, 39 Electromagnet

Claims (1)

[Claims] 1. A substrate support device in which a substrate is supported by guides arranged opposite to each other at intervals in the horizontal direction, and the substrate is supported by a plurality of substrate support pins located between the guides and in contact with the lower surface of the substrate. The support pin is provided on a board support pin mounting base located on the bottom surface of the board, an electromagnet is provided on one of the board support pin mounting base and the plurality of board support pins, and the other is made of a magnetized object. A substrate support device characterized by: