JP2006278563A - Chip-shaped electronic component holder - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip-shaped electronic component holder with a structure capable of preventing a component holding elastic material from being shaved by a pusher pin on an internal surface of a hole or the like or getting broken as much as possible. <P>SOLUTION: A first frame member 1 is constituted of a platelike rigid material 11 and has numerous through holes 12 opened on both surfaces in the thickness direction. A second frame member 2 has numerous electronic component holding holes 22 whose rigid substrate 21 overlaps the through-hole 12 provided on the first frame member 1. An elastic coating film 23 covers an inner wall face of the hole 22. The first and second frame members 1 and 2 are detachably overlaid in such a relation that the through-holes 12 and the electronic component holding holes 22 overlap each other. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a holder used for holding chip-shaped electronic components.

  Chip-shaped electronic components such as a chip capacitor and a chip inductor have terminal electrodes that are connected to the outside at opposite ends of the base. When such a terminal electrode is provided, a step of arranging the chip-shaped electronic components so that the end portions are oriented in a certain direction and applying an electrode paste to the end portions is employed. The holder according to the present invention is mainly used for arranging and holding chip-shaped electronic components in this step.

  As a conventional holder of this type, a silicon rubber having a large number of through holes in a rigid body made of a metal such as aluminum and a large number of holes corresponding to the holes provided in the rigid body on both sides where the through holes are opened. Then, one end of the chip-like electronic component is inserted into the hole of the elastic body, and a terminal electrode or the like is applied in that state.

  Next, the pusher pin 6 is inserted into the hole from the side opposite to the one side into which the chip-shaped electronic component is inserted, and the chip-shaped electronic component is extruded.

  The problem with this holder is that since the pusher pin 6 enters the inside of the hole of the elastic body made of silicon rubber or the like, the elastic body is scraped or damaged by the pusher pin 6 on the inner surface of the hole. However, this has become a contamination source for chip-shaped electronic components, which may cause poor quality.

  As another conventional technique, for example, one described in Patent Document 1 is known. The holder of Patent Document 1 is obtained by integrally attaching an elastic body such as an elastomer to a portion made of a rigid body such as metal. The rigid body is provided with a component transfer hole, and the elastic body is provided with a component holding hole corresponding to the component transfer hole. A chip-shaped electronic component such as a multilayer ceramic capacitor is transferred into a component transfer hole provided in a rigid body, and then received and aligned in the component transfer hole.

  However, in the holder of Patent Document 1, since an elastic body such as an elastomer is integrally attached to a portion made of a rigid body such as metal, when the elastic body is worn by repeated use, Only the elastic body cannot be replaced, and the entire holder must be replaced.

Also, the rigidity of the entire holder is secured by a rigid body, but the elastic body itself must secure the thickness required for component holding, so the elastic body is elastically deformed, which is applied to the terminal electrode coating. There is a possibility that the displacement of the chip-shaped electronic component in the process is induced, and the terminal electrode application region is changed.
JP-A-11-135385

  An object of the present invention is to provide a chip-shaped electronic component holder having a structure capable of suppressing as much as possible that a component-holding elastic material is scraped off or damaged by a pusher pin on an inner surface of a hole or the like. .

  Another object of the present invention is to provide an economical chip-like electronic component holder that can easily replace only the portion having an elastic body when the elastic material for holding the component is worn.

  Another object of the present invention is to provide a chip-shaped electronic component holder that can ensure a sufficient component holding force and rigidity.

  In order to solve the above-described problems, a chip-shaped electronic component holder according to the present invention includes a first frame member and a second frame member, and is used for holding a chip-shaped electronic component. The first frame member is formed of a plate-like rigid body and has a large number of through holes that open on both sides in the plate thickness direction.

  The second frame member includes a plate-like rigid base and an elastic coating film. The rigid base has a large number of holes for holding electronic components that overlap the through holes provided in the first frame member. The elastic coating film covers an inner wall surface of the electronic component holding hole.

  The first frame member and the second frame member are detachably stacked so that the through hole and the electronic component holding hole are connected to each other.

  As described above, in the holder according to the present invention, the second frame member includes a plate-like rigid base body having a large number of electronic component holding holes and an elastic coating film. The inner wall surface of the electronic component holding hole is covered. Therefore, using the elasticity of the elastic coating film, one end of a chip-like electronic component such as a multilayer ceramic capacitor is inserted and held inside the electronic component holding hole, and a terminal electrode is provided on the other end side. Etc. can be applied.

  Further, since the second frame member is a combination of a plate-like rigid base and an elastic coating film, the elastic coating film functions exclusively as a part for elastically holding the electronic component, The mechanical strength and rigidity that cannot be shared by the elastic coating film can be compensated by the rigid substrate.

  In addition, the elastic coating film covers the inner wall surface of the electronic component holding hole, and the chip-like electronic component is supported by the rigid substrate with the elastic coating film interposed therebetween.

  For this reason, the elastic displacement amount of the elastic coating film can be kept small, the positional displacement of the chip-shaped electronic component in the terminal electrode application step can be suppressed, and the terminal electrode can be reliably applied to the predetermined region.

  Since the first frame member and the second frame member are stacked so that the through holes and the electronic component holding holes are connected to each other, the end portions of the chip-shaped electronic components held in the electronic component holding holes are arranged. The pusher pin 6 introduced through the through hole of the first frame member can be extruded. In this case, the majority of the length of the pusher pin 6 is located inside the through hole of the first frame member, and the pusher pin 6 can be held to the extent that the tip part is slightly inserted into the electronic component holding hole. For this reason, it can suppress as much as possible that an elastic coating film is scraped off by the pusher pin 6 in the inner surface etc. of a hole, or is damaged.

  Furthermore, since the first frame member and the second frame member are detachably stacked, the first frame member and the second frame member can be separated and combined as necessary. That is, when it is necessary to replace the elastic coating film of the second frame member, the second frame member is removed from the first frame member, and only the second frame member is replaced with a new one. Just enough.

As described above, according to the present invention, the following effects can be obtained.
(A) It is possible to provide a chip-shaped electronic component holder having a structure capable of suppressing as much as possible the component holding elastic material from being scraped off or damaged by the pusher pin 6 on the inner surface of the hole.
(B) It is possible to provide an economical chip-shaped electronic component holder that can easily replace only the portion having an elastic body when the elastic material for holding the component is worn.
(C) It is possible to provide a chip-shaped electronic component holder that can ensure a sufficient component holding force and rigidity.

  Other features of the present invention and the operational effects thereof will be described in more detail by way of examples with reference to the accompanying drawings.

  1 is a plan view of a holder for a chip-like electronic component (hereinafter referred to as a holder) according to the present invention, FIG. 2 is an exploded view of the holder shown in FIG. 1, and FIG. 3 is a view of the holder shown in FIGS. It is an expanded sectional view. The illustrated holder includes a first frame member 1 and a second frame member 2 and is used for holding a chip-shaped electronic component.

  The first frame member 1 is composed of a plate-like rigid body 11 and has a large number of through holes 12 that are open on both sides in the plate thickness direction. The first frame member 1 is composed of a rigid body 11 made of a metal material such as aluminum, for example. The thickness is not limited, but may be about 7 to 10 mm. The through holes 12 are arranged in a lattice pattern in the plane of the rigid body 11. The hole diameter and shape are selected according to the cross-sectional shape of the target chip-shaped electronic component, the shape of a pusher pin (described later), and the like.

The second frame member 2 includes a plate-like rigid base 21 and an elastic coating film 23. The rigid base 21 has a large number of electronic component holding holes 22 that overlap the through holes 12 provided in the first frame member 1.
The rigid base 21 can also be made of a metal material such as aluminum. The thickness is generally thinner than the first frame member 1. For example, when the thickness of the first frame member 1 is selected to be about 7 to 10 mm, it is about 3 to 5 mm. The hole diameter and shape of the electronic component holding hole 22 are set so that the electronic component can be reliably held by the elasticity of the elastic coating film 23. A typical example of such a form is a circular shape having a smaller diameter than the maximum passing dimension of the electronic component.

  The elastic coating film 23 covers the inner wall surface of the electronic component holding hole 22. In the embodiment, the elastic coating film 23 continuously covers one surface opposite to the one surface overlapped with the first frame member 1 and the electronic component holding hole 22. The elastic coating film 23 is preferably made of silicon rubber. The film thickness is preferably around 0.2 mm.

  The first frame member 1 and the second frame member 2 are detachably stacked with the through hole 12 and the electronic component holding hole 22 being connected to each other. Referring to FIGS. 1 and 2, the first frame member 1 and the second frame member 2 are fastened and fixed at the four corners by a coupler 3 such as a screw.

  Next, processing of the chip-shaped electronic component using the above-described holder according to the present invention will be described.

  First, as illustrated in FIG. 4, the load plate 4 in which the chip-like electronic components 5 are arranged in a predetermined state is opposed to the second frame member 4 side. Each chip-like electronic component 5 is not yet provided with a terminal electrode. In that sense, the chip-shaped electronic component is not yet completed, but is referred to as a chip-shaped electronic component.

  One end of these chip-like electronic components 5 is supported by the load plate 4, and the other end faces the electronic component holding hole 22 of the second frame member 2. Therefore, one end of the chip-like electronic component 5 is pushed in the direction of the arrow F1 with a pusher pin 6 (not shown). Thereby, the other end of the chip-like electronic component 5 enters the inside of the electronic component holding hole 22, and the state as shown in FIG. 5, that is, the other end of the chip-like electronic component 5 is the surface of the elastic coating film 23. It is held in a state of slightly protruding from.

  Here, in the holder according to the present invention, the second frame member 2 includes a plate-like rigid base 21 having a large number of electronic component holding holes 22 and an elastic coating film 23. The film 23 covers the inner wall surface of the electronic component holding hole 22.

  Therefore, by utilizing the elasticity of the elastic coating film 23, one end of the chip-like electronic component 5 such as a multilayer ceramic capacitor is inserted and held inside the electronic component holding hole 22, as shown in FIG. Further, a treatment such as providing a terminal electrode on the other end side can be performed. The terminal electrode application step is performed by a conventionally known process. For example, an electrode paste application process using a roll is a typical example.

  Further, since the second frame member 2 is a combination of the plate-like rigid base 21 and the elastic coating film 23, the elastic coating film 23 is a part exclusively for elastically holding the electronic component. The mechanical strength and rigidity that cannot be shared by the elastic coating film 23 can be compensated by the rigid base 21.

  Moreover, the elastic coating film 23 covers the inner wall surface of the electronic component holding hole 22, and the chip-like electronic component 5 is supported by the rigid base 21 with the elastic coating film 23 interposed therebetween. become.

  For this reason, the amount of elastic displacement of the elastic coating film 23 can be kept small, and the positional displacement of the chip-like electronic component 5 can be suppressed and the terminal electrode 51 can be reliably applied to a predetermined region in the terminal electrode application step of FIG. .

  As described above, after the terminal electrode 51 is applied and the drying process is performed, another holder B is placed on the holder A holding the chip-shaped electronic component 5 as shown in FIG. The holder B is preferably exactly the same as the holder A, but may be different. Then, the pusher pin 6 pushes one end of the chip-shaped electronic component 5 in the direction of the arrow F2, and the other end of the chip-shaped electronic component 5 is held in the electronic component holding hole 22 provided in the second frame member 2B of the holder B. Push in.

  The first frame member 1 and the second frame member 2 are held in the electronic component holding hole 22 of the holder A because the through hole 12 and the electronic component holding hole 22 are overlapped with each other. The end of the chip-shaped electronic component 5 is pushed in the direction of the holder B as indicated by an arrow F3 by the pusher pin 6 introduced through the through hole 12 of the first frame member 1 constituting the holder A. Can do. As a result, as shown in FIGS. 8 and 9, the holding of the chip-shaped electronic component 5 is transferred from the holder A to the holder B.

  In this case, most of the length of the pusher pin 6 is located inside the through hole 12 of the first frame member 1 constituting the holder A, and the tip of the electronic component holding hole 22 of the holder A has a tip. It can be kept to the extent that the part enters a little. For this reason, it can suppress as much as possible that the elastic coating film 23 is scraped off or damaged by the pusher pin 6 on the inner surface of the hole.

  Thereafter, as illustrated in FIGS. 10 and 11, the terminal electrode 52 is applied to the other end of the chip-like electronic component 5 held by the holder B.

  Holders A and B are subjected to repetition of the above-described steps. When the elastic coating film 23 of the second frame members 2A and 2B constituting the holders A and B is deteriorated due to fatigue or the like due to repetition of this process, the elastic coverage of the second frame members 2A and 2B is increased. It is necessary to replace the covering film 23. In the present invention, since the first frame member 1 and the second frame member 2 are detachably stacked, the first frame member 1 and the second frame member 2 are separated, if necessary. Bonding is possible. That is, when the elastic coating film 23 of the second frame member 2 needs to be replaced, the second frame member 2 is removed from the first frame member 1 and only the second frame member 2 is replaced with a new one. All you need is a replacement. For this reason, the maintenance cost is low and the replacement work is also short.

  Although the contents of the present invention have been specifically described above with reference to the preferred embodiments, it is obvious that those skilled in the art can take various modifications based on the basic technical idea and teachings of the present invention. It is.

It is a top view of the holder concerning the present invention. It is an exploded view of the holder shown in FIG. It is an expanded sectional view of the holder shown in FIG.1 and FIG.2. It is a figure which shows the processing method of the chip-shaped electronic component using the holder which concerns on this invention. It is a figure which shows the process after the process shown in FIG. FIG. 6 is a diagram showing a step after the step shown in FIG. 5. It is a figure which shows the process after the process shown in FIG. It is a figure which shows the process after the process shown in FIG. It is a figure which shows the process after the process shown in FIG. FIG. 10 is a diagram showing a step after the step shown in FIG. 9. It is a figure which shows the process after the process shown in FIG.

Explanation of symbols

1, 1A, 1B First frame member 2, 2A, 2B Second frame member
11 Rigid body
12 Through hole
21 Rigid substrate
22 Electronic component holding hole

Claims (3)

A holder that includes a first frame member and a second frame member, and is used for holding a chip-shaped electronic component,
The first frame member is composed of a plate-like rigid body, and has a large number of through holes that are open on both sides in the plate thickness direction.
The second frame member includes a plate-like rigid base and an elastic coating film,
The rigid base has a large number of electronic component holding holes that overlap the through holes provided in the first frame member;
The elastic coating film covers an inner wall surface of the electronic component holding hole,
The first frame member and the second frame member are detachably stacked with the through hole and the electronic component holding hole being connected to each other.
Holder for chip-shaped electronic components.   The holder for a chip-shaped electronic component according to claim 1, wherein the elastic coating film is made of silicon rubber.   3. The chip-shaped electronic component holder according to claim 1, wherein the elastic coating film includes one surface opposite to the first surface that overlaps the first frame member and the electronic component holding hole. A holder for chip-shaped electronic components that is continuously coated.

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