KR20150062142A - Inspecting apparatus for electronic component, inspecting method for electronic component, and program of inspecting method - Google Patents

Abstract

The purpose of the present invention is to perform quick transfer by holding a plurality of electronic components in a lightweight holding member. The present invention relates to an apparatus for inspecting electronic components for inspecting electronic components based on an output signal outputted from the electronic components into which an inspection signal is inputted, or to a method for inspecting an electronic component. The apparatus for inspecting an electronic component comprises: a holding member holding the electronic components; an upper connection member inputting the inspection signal to the electronic components; and a lower connection member detecting the output signal outputted from the electronic components. The holding member is arranged between the upper and lower connection members when holding the electronic components at the time of inspection.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component inspecting apparatus, an electronic component inspecting method, and a program of an inspecting method and an inspecting method,

The present invention relates to an electronic component inspection apparatus and an electronic component inspection method.

An electronic component inspection apparatus is provided for inspecting an electronic component based on an output signal output from the electronic component in response to an input of an inspection signal. In the electronic component inspection apparatus, for example, a signal output from an inspection member (insert or the like) electrically connected to the output terminal of the electronic component is detected and the electronic component is inspected.

Patent Document 1 discloses a technique in which an electronic component to be tested is carried in advance using an insert electrically connected to a terminal of an electronic component to be tested (electronic component) in order to improve the operation rate of the test, And discloses a technology relating to an electronic component testing apparatus (inspection apparatus) for testing (inspecting).

Patent Document 1: International Publication No. 2010/004844 pamphlet

However, in the technique disclosed in Patent Document 1, since the conveying means (for example, a tray) having a plurality of inserts is required, the conveying means becomes large and it is difficult to convey the electronic components at a high speed. Further, in the technique disclosed in Patent Document 1, since a plurality of inserts and a plurality of electronic parts are transported in a state of being electrically connected for inspection, the electrically connected portions of the electronic parts may be wound and damaged.

Further, according to the technique disclosed in Patent Document 1, when a plurality of electronic components are inspected simultaneously, a plurality of inserts are required, so that the cost of the inspection apparatus has been increased in some cases.

SUMMARY OF THE INVENTION In view of the above circumstances, it is an object of the present invention to provide an electronic component inspection apparatus or an electronic component inspection method or a program of the inspection method which can hold a plurality of electronic components on a lightened holding member at high speed The purpose.

According to one aspect of the present invention,

An electronic component inspection apparatus for inspecting an electronic component based on an output signal outputted from an electronic component to which an inspection signal is inputted,

A holding member for holding the electronic component;

An upper connecting member for inputting the inspection signal to the electronic component,

And a lower connecting member for detecting the output signal output from the electronic component,

Wherein the holding member is disposed between the upper connecting member and the lower connecting member while holding the electronic component at the time of inspection.

And a return signal path for returning the output signal detected by the lower connecting member and outputting the inspection signal from the upper connecting member that has input the inspection signal.

The holding member may have a plurality of arrangements arranged in a lattice shape composed of a plurality of squeezing members, and a plurality of the electronic parts may be arranged in each of the plurality of arranging parts.

Each of the plurality of arrangement portions has a substantially square opening and has a support piece at four corners of the opening, and the support piece may support the electronic component.

The holding member may have a through hole on the outer side of the arrangement portion, and the return signal path may pass through the through hole of the holding member.

The inspection unit may check whether the operation of the electronic component is normal, or not, or whether there is any indication, by comparing the input inspection signal with the detected output signal.

Wherein the upper connecting member further includes an imaging section that detects the position of the lower connecting member, the lower connecting member is disposed based on a result of imaging the imaging section, And may be disposed at a desired position of the lower connecting member, depending on the position.

Wherein the lower connection member is fixed to a chuck stage of the prober and is connected to the plurality of electronic parts via a plurality of arrangement portions when the holding member is disposed on the lower connection member, The member may be electrically contacted.

The lower connecting member may be fixed to the chuck stage in a state where the lower connecting member is aligned with the chuck stage by the prober.

According to another aspect of the present invention,

An electronic component inspection method for inspecting an electronic component based on an output signal output from an electronic component to which an inspection signal is inputted,

A holding step of holding a plurality of the electronic parts in a plurality of the arranging parts using a holding member having a plurality of arranging parts arranged in a lattice shape;

A mounting step of electrically connecting the holding member holding the electronic component to the lower connecting member and arranging the holding member,

A signal input step of inputting the inspection signal to the electronic component from above the holding member by using the upper connecting member,

A signal detecting step of detecting the output signal outputted from the electronic component by using the lower connecting member in which the holding member is disposed;

A signal transmission step of transmitting the output signal detected by the lower connection member using a connection portion of the upper connection member which is electrically connected to the lower connection member through the holding member,

A step of inspecting the electronic component based on the transmitted output signal

And an electronic component inspecting method.

Further, it may be a program for causing the computer to execute the inspection method.

According to the electronic component inspecting apparatus or the electronic component inspecting method or the inspecting method program according to the present invention, a plurality of electronic components can be held on a lightened holding member and can be transported at a high speed.

1 is an explanatory view for explaining an inspection process of an electronic component inspection apparatus according to the present embodiment.
Fig. 2 is an explanatory view for explaining an inspection process of another inspection apparatus. Fig.
3 is an explanatory diagram for explaining an example of an electronic component inspected by the electronic component inspection apparatus according to the embodiment.
4 is a plan view for explaining another example of an electronic component inspected by the electronic component inspection apparatus according to the present embodiment.
5 is a plan view of a main part for explaining another example of an electronic component inspected by the electronic component testing apparatus according to the present embodiment.
6 is a schematic configuration diagram for explaining an outline of an electronic component inspection apparatus according to the present embodiment.
7 is a diagram showing an example of the arrangement of the holding member according to the present embodiment.
8 is a diagram showing an example of the arrangement of the holding member according to the present embodiment.
9 is a diagram showing an example of the configuration of an electronic component inspection apparatus according to the present embodiment.
10 is a diagram showing another example of the configuration of an electronic component testing apparatus according to the present embodiment.
11 is an explanatory view for explaining an example of a holding member of the electronic component testing apparatus according to the present embodiment.
12 is an explanatory view for explaining another example of the holding member of the electronic component testing apparatus according to the present embodiment.
13 is a plan view for explaining an example of a connection portion of an electronic component inspection apparatus according to the present embodiment.
14 is an explanatory view for explaining an example of a wiring portion of the electronic component testing apparatus according to the present embodiment.
Fig. 15 is a view for explaining the flow of signals and the electronic part inspection apparatus according to the present embodiment.
16 is a diagram for explaining a flow of a signal and an electronic part inspection apparatus according to the present embodiment.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention will be described with reference to the accompanying drawings, using an electronic component inspection apparatus according to an illustrative non-limiting embodiment. The electronic component inspection apparatus according to the present embodiment can be applied to an electronic component inspection apparatus that inputs signals to electronic components and detects operation states (normal, abnormal, or abnormal) of the electronic components based on signals output from the electronic components (Such as a device, a device, a unit, a system, and the like).

In the following description, the same or corresponding devices, parts or members described in all the accompanying drawings are denoted by the same or corresponding reference numerals, and redundant explanations are omitted. In addition, the drawings are not intended to show a definite relationship between an apparatus, a component or a member unless specifically described. Thus, a specific correlation may be determined by one of ordinary skill in the art in light of the following non-limiting embodiments.

[Inspection Process]

First, an inspection process using the electronic component inspection apparatus according to the present embodiment will be described with reference to Fig. For comparison, another example of the inspection process will be described with reference to Fig. Here, Fig. 1 is an explanatory view for explaining an inspection process using the electronic component inspection apparatus according to the present embodiment. 2 is an explanatory view for explaining an inspection process of another inspection apparatus.

As shown in Fig. 1, in the inspection process, electronic components (PKG in the drawing) to be inspected are manufactured in step Stp1-1 before inspection. 3 to 5 show examples of electronic parts to be inspected. 3 (a), 4 (a) and 5 (a) are side views of electronic parts. Figs. 3 (b), 4 (b) and 5 (b) are bottom views of electronic parts. On the other hand, the electronic components shown in Figs. 3 to 5 are examples, and the electronic components usable in the inspection process of the electronic component inspection apparatus according to the present embodiment are not limited to those shown in Figs. 3, 4, or 5 Do not.

The electronic component PKG of Figs. 3 to 5 has a terminal (hereinafter referred to as " connection terminal ") for outputting an electric signal to the bottom surface side of the electronic component PKG. As shown in Fig. 3 (b), the electronic component PKG may be provided with a substantially flat-plate-shaped connection terminal TMa on the outer edge of its bottom surface. As shown in Fig. 4 (b), the electronic component PKG may have a connection terminal TMb having a substantially hemispherical shape on its bottom surface. As shown in Fig. 5 (b), the electronic component PKG may be provided with a substantially rectangular parallelepiped connection terminal TMc on the outer periphery of its bottom surface.

After manufacturing the above-described electronic component PKG, the inspection process shown in Fig. 1 carries the electronic component PKG in step Stp1-2A. Here, as shown in the right side of Fig. 6, the inspection process is performed by holding the plurality of electronic components PKG at the same time by using the holding member 10 according to the present embodiment, Into the chuck stage (40) in the burr (101).

At this time, as shown in the entire schematic diagram on the right side of Fig. 6 and the enlarged view on the left chuck stage 40, the inspection process is carried out in a state where a plurality of carried electronic components PKG are held on the holding member 10 And between the upper connecting member 20 and the lower connecting member 30 according to the present embodiment.

Further, the inspection process is arranged at a position where the lower connecting member 30 is inspected in step Stp1-2B of Fig. 6, the inspection process aligns the lower connecting member 30 to the chuck stage 40 before the step Stp1-2A, fixes the lower connecting member 30 to the chuck stage 40, The holding member 10 is placed on the lower connecting member 30. Then, That is, in the inspection process, the holding member 10 is disposed on the lower connecting member 30 and the electronic component PKG held by the holding member 10 is electrically connected to the lower connecting member 30.

Subsequently, the inspection process checks the electronic component (PKG) in step Stp1-3 in Fig. Specifically, as shown in the entire schematic diagram on the right side of Fig. 6, the inspection process lifts the support portion 41 supporting the chuck stage 40 in the contact direction.

The electronic component PKG held by the holding member 10, the lower connecting member 30 and the upper connecting member 20 are electrically connected to each other by lifting the supporting portion 41 supporting the chuck stage 40 in the contact direction .

At this time, the chuck stage 40 is a conductive member, and the bottom of the lower connecting member 30, which is in contact with the chuck stage 40 when placed on the chuck stage 40, is an insulating member.

The lower connection member 30 disposed on the chuck stage 40 is in an electrically floating state from the chuck stage 40. [

On the other hand, the lower connecting member 30 may be electrically connected to the chuck stage 40 by using the bottom of the lower connecting member 30 as a conductive member according to the inspection contents.

In this state, the inspection process checks the plurality of electronic components (PKG) using the tester 60. [ After the inspection, the inspection process cuts the electrical connection of the electronic component PKG, the lower connecting member 30 and the upper connecting member 20 by lowering the supporting portion 41 in the releasing direction.

The prober 101 contacts a probe (for example, refer to 31t in Fig. 7) to the electronic component PKG in order to flow electricity and inspects the tester 60 in order to check the operation of the electronic component PKG, . The tester 60 executes the inspection based on the output signal output from the electronic component PKG.

The prober 101 can perform positioning in units of several microns by rotation of the chuck stage 40 and movement on the xy plane by using the positioning mechanism of the support portion 41. [ Therefore, once the chuck stage 40 and the lower connecting member 30 are aligned, the positioning of the plurality of electronic components PKG on the holding member 10 can be precisely performed using the stepping function of the prober 101 And can be performed at a high speed.

Thereafter, the inspection process stores the holding member 10 holding the electronic component (PKG) after the inspection in step Stp1-4 in Fig. Specifically, as shown in Fig. 6, the inspection process may be performed by stacking a plurality of holding members 10 (electronic parts) in the storage unit 80 and storing them.

On the other hand, the inspection process may include a process of transporting a plurality of electronic components at a time to a subsequent process, using a holding member holding a plurality of electronic components after inspection. Further, the inspection process may classify the electronic parts according to a predetermined order based on the inspected inspection results. Further, the inspection process may stop or stop the inspection process based on the inspection result.

On the other hand, in another inspection process shown in Fig. 2, the electronic parts manufactured in step Stp2-1 are first placed on the transporting tray, and the electronic parts are transported (step Stp2-2). Next, in another inspection process, in step Stp2-3, a plurality of electronic parts are arranged in the inspection tray (for example, a plurality of inserts) immediately before inspection. At this time, in another inspection process, the connection terminals of the plurality of electronic components and the inspecting tray (the plurality of inserts) are conveyed in a state in which they are electrically connected to each other, so that the electrical connection portions of the electronic components may be wound and damaged . Further, since the transfer means (e.g., a tray) having a plurality of inserts is required, it is difficult to transfer the electronic component (PKG) at a high speed because the transfer means becomes large. In the other inspection process, as compared with the inspection process (Fig. 1) according to the present embodiment, the transport time of the electronic component PKG is long, and as a result, the total time required for inspection of the electronic component PKG increases.

Subsequently, in another inspection process, the electronic components are inspected in step Stp2-4. Here, in another inspection process, for example, a plurality of electronic parts electrically connected to a plurality of inserts are arranged in the test stage, respectively. Therefore, in the other inspection process, positioning is required for each electronic component as compared with the inspection process (FIG. 1) according to the present embodiment, and the time required for positioning is increased.

In the other inspection process, the reverse order of steps Stp2-3 and Stp2-2 is carried out in steps Stp2-5 and Stp2-6, and a plurality of electronic components after inspection are transferred to the carrying tray, Thereafter, they are each conveyed to a subsequent process.

As described above, the inspection process (FIG. 1) according to the present embodiment can transport the electronic component PKG at a high speed in comparison with other inspection processes (FIG. 2). That is, in the inspection process (Fig. 1) according to the present embodiment, the holding member 10 and the lower connecting member 30 are divided, and a plurality of electronic parts PKG are held on the lightening holding member 10 The electronic component PKG can be transported at a high speed.

In addition, the inspection process (FIG. 1) according to the present embodiment does not require a plurality of expensive inserts, so the cost of the inspection process (manufacturing cost of the inspection apparatus) can be reduced. In addition, since the inspection process (Fig. 1) according to the present embodiment can carry a plurality of electronic parts by using a lightweight holding member and can hold a plurality of electronic parts at the time of inspection, And can shorten the conveyance time of the electronic component (PKG). As a result, the total time required for the inspection of the electronic component (PKG) can be shortened, and the number of inspection processes of the electronic component Can increase.

[Overview of electronic parts inspection apparatus]

(Outline of Configuration)

Next, an outline of an electronic component inspection apparatus according to the present embodiment will be described. Here, a package test (inspection of a packaged semiconductor device) using the electronic component testing apparatus 100 according to the present embodiment will be described. As shown in Fig. 6, the electronic component testing apparatus 100 according to the present embodiment includes a prober 101 and a tester 60. As shown in Fig.

The prober 101 includes a holding member 10, an upper connecting member 20, a lower connecting member 30, a chuck stage 40, an imaging unit 50, a carrying unit 70, a storage unit 80, And a control unit 90.

The holding member 10 holds the electronic component PKG. The upper connecting member 20 inputs an inspection signal to the electronic component PKG. The lower connecting member 30 detects an output signal output from the electronic component PKG.

The chuck stage 40 has a means for holding by a suction or mechanical structure and a lifting means (supporting portion 41). The imaging unit 50 detects the position of the lower connecting member 30 disposed on the chuck stage 40. The lower connecting member 30 is fixed to the chuck stage 40 after positioning the chuck stage 40 and the lower connecting member 30 using the imaging unit 50. [

The carrying section 70 conveys the holding member 10 to the lower connecting member 30 disposed on the chuck stage 40. In this embodiment, the carrying unit 70 includes a holding member 10 and a holding member 10, which hold a part of the holding member 10, for example, in a state in which the holding member 10 holds a plurality of electronic parts Move it.

The control unit 90 controls each part of the electronic component testing apparatus 100. The control unit 90 takes alignment between the lower connecting member 30 and the chuck stage 40 based on the result of imaging by the imaging unit 50 and controls the alignment. The control unit 90 controls the whole of the prober 101 such as lifting and lowering of the support unit 41. [

The control unit 90 can control the operation of the electronic component testing apparatus 100 using a program (a control program, an application, or the like) stored in advance (for example, in the internal memory). The control unit 90 may also control the operation of the electronic component testing apparatus 100 based on information input from the outside of the electronic component testing apparatus 100 or the like. On the other hand, the control unit 90 may be constituted by an arithmetic processing unit including a CPU (Central Processing Unit) and a memory, etc., which are well known in the art.

The tester (60) inspects the electronic component based on the detected output signal.

(Overview of Operation)

The electronic component testing apparatus 100 according to the present embodiment is configured such that at the time of inspection, firstly, on the basis of the result of imaging by the imaging section 50, The lower connecting member 30 is disposed. At this time, the electronic component testing apparatus 100 fixes the disposed lower connecting member 30 by a means for fixing the chuck stage 40 by suction or a mechanical structure. Thus, once the chuck stage 40 and the lower connecting member 30 are aligned, the positioning of the plurality of electronic components PKG on the holding member 10 can be performed using the stepping function of the prober 101 And can be performed accurately and at high speed.

Next, the electronic component testing apparatus 100 conveys the holding member 10 using the carry section 70 and places the holding member 10 on the lower connection member 30. [ Subsequently, the electronic component testing apparatus 100 elevates the chuck stage 40 using the elevating means to electrically connect the electronic component PKG, the lower connecting member 30, and the upper connecting member 20 .

Thereafter, the electronic component testing apparatus 100 inputs an inspection signal to the electronic component PKG using the upper connecting member 20, and detects the output signal using the lower connecting member 30. [

Further, the electronic component inspection apparatus 100 uses the tester 60 to inspect the electronic components based on the detected output signals. Here, the electronic component testing apparatus 100 sequentially ascends and descends the chuck stage 40 to sequentially check any one of the plurality of electronic components held by the holding member 10 using the upper connecting member 20 .

The electronic component testing apparatus 100 according to this embodiment of the present invention takes out the holding member 10 holding a plurality of electronic components after inspection, for example, by using the carry section 70. Thereafter, the electronic component inspection apparatus 100 uses the storage section 80 to store the removed holding member 10.

As described above, the electronic component inspection apparatus 100 can sequentially inspect a plurality of electronic components by inputting inspection signals to the electronic components and detecting signals output from the electronic components.

[Detail of Arrangement and Configuration of Electronic Component Inspection Apparatus]

Next, the arrangement and configuration of the electronic component testing apparatus according to the present embodiment will be described in detail with reference to Figs. 7 to 10. Fig.

7 and 8 are views showing the arrangement of the holding member 10 between the lower connecting member 30 and the upper connecting member 20. 9 and 10 are diagrams showing an example of the configuration of the electronic component testing apparatus 100 according to the present embodiment.

(Details of placement)

7, the carry section 70 carries the holding member 10 holding a plurality of electronic components PKG and transfers the holding member 10 on the lower connecting member 30 fixed to the chuck stage 40 . As a result, the connection pin 31t (probe pin) of the connection portion 31 of the lower connection member 30 is connected to the connection terminal of the electronic component PKG 5). ≪ / RTI >

In this embodiment, the holding member 10 and the lower connecting member 30 are divided, and a plurality of electronic parts PKG are held and conveyed to the lightening holding member 10. Thus, the holding member 10 can be transported at a high speed. Further, the holding member 10 can simultaneously transport a plurality of electronic components (PKG). Each of the electronic components PKG held in the holding member 10 is conveyed in a state in which it is not misaligned with its own weight and is disposed on the lower connecting member 30. [ The connection terminals of the electronic component PKG are carried by the opening 12 of the holding member 10 without contacting the holding member 10 or the like during transportation as shown in Fig. 8, since the electronic component PKG comes into contact with the connection pin 31t only when it is disposed on the lower connection member 30, the connection terminal of the electronic component PKG is not damaged The electronic component PKG can be transported without being carried out.

8, the supporting portion 41 is raised in the contact direction, and the holding member 10 and the lower connecting member 30 are brought into contact with the upper connecting member 20. Next, Thus, as shown in Fig. 9, the state of the electronic component testing apparatus 100 according to the present embodiment becomes the state, and the electronic component PKG can be inspected.

As described above, in the present embodiment, the holding member 10 and the lower connecting member 30 are divided into a structure in which the holding member 10 does not have a motherboard or a metal part. Further, the holding member 10 is a frame structure having a plurality of openings 12 (through-holes). As a result, the holding member 10 is lightweight, and the electronic component PKG can be transported at a high speed. In addition, the contact portion between the electronic component PKG and the holding member 10 is minimized to prevent damage to the electronic component PKG due to friction during transportation.

(Detailed configuration)

The configuration of the electronic component testing apparatus 100 according to the present embodiment will be described. The electronic component testing apparatus 100 includes a holding member 10 for holding an electronic component PKG, an upper connecting member 20 for inputting an inspection signal to the electronic component PKG, And a lower connecting member 30 for detecting the output signal. The electronic component testing apparatus 100 is fixed to a chuck stage 40 that supports the lower connecting member 30. [ The upper connecting member 20 has a connecting portion 21 and a plate 20b. The holding member 10 is a tray-shaped member having a frame structure. In Fig. 9, a grate member 10a for holding the electronic component PKG is shown. The center of the squeezing member 10a is open. The lower connecting member 30 has a connecting portion (socket base) 31, a plate 30b, and a plate supporting member 30c. The lower connecting member 30 is adsorbed to the chuck stage 40 using a chuck mechanism, or mechanically fixed.

The electronic component testing apparatus 100 according to the present embodiment returns the output signal detected by the lower connecting member 30 and returns the return signal path 22T output from the upper connecting member 20, Respectively.

The electronic component testing apparatus 100 according to the present embodiment uses the upper connecting member 20 to input an inspection signal (optical signal Lt) to the detecting unit PKGi of the electronic component PKG. The electronic component testing apparatus 100 also detects an output signal output from the electronic component PKG into which the inspection signal is input by using the lower connecting member 30. [ The electronic component testing apparatus 100 also transmits the output signal detected by the lower connecting member 30 to the upper connecting member 20 through the return signal path 22T. On the other hand, the electronic component testing apparatus 100 may be configured to input or detect an electrical signal from the upper surface of the electronic component PKG using the upper connecting member 20. [

Specifically, the electronic component testing apparatus 100 inputs an inspection signal (optical signal Lt) from above the electronic component PKG in the present embodiment. The electronic component inspecting apparatus 100 further includes a connecting pin 31t of the connecting portion 31 of the lower connecting member 30 to the connecting terminal of the electronic component PKG , Thereby detecting an output signal from below the electronic component PKG. The return signal path 22T returns the output signal detected by the lower connecting member 30 by passing through the through hole of the holding member 10 and electrically connecting to the lower connecting member 30, And outputs the inspection signal from the input upper connecting member 20.

Accordingly, the electronic component inspection apparatus 100 according to the present embodiment checks the electronic component (PKG) by comparing the input inspection signal with the detected output signal. Based on the detected output signal, the electronic component testing apparatus 100 checks whether the operation of the electronic component (PKG) is normal, or whether there is any abnormality or not.

The electronic component testing apparatus 100 according to the present embodiment is characterized in that the holding member 10 holding the electronic component PKG is connected to the upper connecting member 20 and the lower connecting member 20 at the time of inspection (Stp1-3 in Fig. 1) And the connecting member (30). The electronic component inspecting apparatus 100 according to the present embodiment is characterized in that the electronic component PKG held by the holding member 10 is electrically connected to the lower connecting member 30 at the time of inspection (Stp1-3 in Fig. 1) . That is, the electronic component testing apparatus 100 according to the present embodiment can bring a plurality of electronic components into the test stage at the same time by using the holding member 10, A plurality of electronic components can be held in the housing. The electronic component testing apparatus 100 according to the present embodiment can electrically connect a plurality of electronic components held by the holding member 10 to the lower connecting member 30 at the same time.

According to the electronic component testing apparatus 100 according to the present embodiment, the signal output from the electronic component PKG to the signal input to the electronic component PKG to be inspected from the tester 60 side is sent to the tester 60 ). That is, in the electronic component testing apparatus 100, when an inspection signal is input / output between the electronic component PKG and the tester 60, it is possible to input and output signals from the tester 60 side. According to this, for example, in the case where the object to be inspected is the optical imaging device, the signal output from the optical imaging device to the optical signal input from the tester 60 to the optical imaging device can be returned to the tester 60 side. As a result, the tester 60 performs signal processing, and the inspection result can be outputted.

Since the chuck stage 40 shown in Fig. 6 is formed of metal, the chuck stage 40 can not have a function of passing an electric signal or an optical signal in a structured manner. Thus, in the present embodiment, a signal output from the electronic component PKG to the optical signal inputted to the electronic component PKG from the tester 60 side is sent to the electronic component testing device 100 to the tester 60 side It is possible to form a return signal path 22T that is turned and connect to the tester 60 by using the existing prober 101. [ Accordingly, the electronic part PKG can be inspected using the conventional prober 101 and the tester 60. [

The electronic component testing apparatus 100 according to the present embodiment is capable of checking the image sensor as an electronic component PKG by using the pixel signal converted by the photoelectric conversion element PKGi into which the light Lt is inputted Electric signals), it is possible to check the operation of each pixel of the image sensor. The electronic component testing apparatus 100 according to the present embodiment can be applied to an electronic component having a structure in which input / output terminals are not provided on the same surface, such as a CMOS sensor or a POP, Without limitation, electronic components can be inspected.

As shown in Fig. 10, the electronic component testing apparatus 100 may input an inspection signal (not shown) from the upper connecting member 20 to the upper surface of the electronic component PKG. 10, the output signal outputted from the electronic component PKG is also detected from the upper surface of the electronic component PKG by using the return signal path 22T of the upper connecting member 20. [ That is, also in the electronic component testing apparatus 100, a signal output from the electronic component PKG to the optical signal input to the electronic component PKG from the tester 60 side is sent to the tester 60 through the return signal path 22T. (60). Accordingly, the electronic part PKG can be inspected using the conventional prober 101 and the tester 60. [ On the other hand, the other parts of the electronic component testing apparatus 100 of Fig. 10 are the same as those of Fig. 9, and a description thereof will be omitted.

[Example of holding member]

Next, an example of the holding member 10 of the electronic component testing apparatus 100 according to the present embodiment will be described with reference to Figs. 11 and 12. Fig. 11 (a), 11 (b), 12 (a) and 12 (b) show examples of the holding member 10.

On the other hand, the holding member 10 according to the present embodiment is not limited to those shown in Fig. 11 and Fig. That is, the holding member 10 according to the present embodiment can be appropriately changed in accordance with the specification (shape, size, weight, etc.) of the electronic component to be held. 11 shows an example of the holding member 10 capable of holding nine electronic components in three rows and three columns, the number of electronic components that can be held by the holding member according to the present embodiment is not limited. That is, the holding member according to the present embodiment may hold 16 electronic components in 4 rows and 4 columns, or 12 electronic components in 4 rows and 3 columns or the like.

As shown in Fig. 11 (a), the holding member 10 has a plurality of arranging portions 11P arranged in a lattice shape constituted by a plurality of squeezing members 10a. Here, the plurality of arrangement parts 11P are each arranged with a plurality of electronic parts. The arrangement section 11P has an approximately square or circular or elliptical opening 12 having no corner in the present embodiment. The arrangement section 11P also has support pieces 12s at four corners of the opening 12. That is, the retaining member 10 holds the electronic component PKG by supporting the four corners of the electronic component PKG with the support piece 12s. On the other hand, the shape of the opening 12 (arrangement of the plurality of squeezing members 10a) can be appropriately changed depending on the electronic component to be held.

The holding member 10 is provided with a plurality of through holes 13 adjacent to the arrangement portion 11P in a direction perpendicular to the longitudinal direction of the plurality of squeezing members 10a as shown in Figure 11 (a) Respectively. The return signal path 22T of the upper connecting member 20 is inserted into the through-hole 13. The return signal path 22T of the upper connecting member 20 penetrates the through hole 13 of the holding member 10 and is electrically connected to the lower connecting member 30. [

On the other hand, the shape and the number of the through-holes 13 can be appropriately changed in accordance with the return signal path 22T of the upper connecting member 20. [ 11 (b), the holding member 10 is provided with a plurality of through-holes 13 (for example, a plurality of through-holes 13a) adjacent to the arranging portion 11P in a direction perpendicular to the longitudinal direction of the plurality of squeezing members 10a And the plurality of squeezing members 10a may be provided with the through-holes 14. As shown in Fig. Here, the other portions of the holding member 10 are the same as those in the case of Fig. 11 (a), and a description thereof will be omitted.

As shown in Fig. 12 (a), the holding member 10 has a fan-shaped supporting piece 12sc at four corners of the opening 12 of the arrangement portion 11P. That is, the holding member 10 holds the electronic component by supporting the electronic component with the supporting piece 12sc. On the other hand, the other parts of the holding member 10 are the same as those in the case of Fig. 11 (a), and a description thereof will be omitted.

As shown in Fig. 12B, the holding member 10 is provided with a fan-shaped supporting piece 12sc at four corners of the opening 12 of the arrangement portion 11P, 12sd may be further provided. The other parts of the holding member 10 are the same as those in the case of Fig. 12 (a), and a description thereof will be omitted.

[Example of lower connecting member]

An example of the lower connecting member 30 of the electronic component testing apparatus 100 according to the present embodiment will be described with reference to Figs. 13 and 14. Fig. 13 is a plan view for explaining an example of the connection portion 31 of the lower connection member 30 according to the present embodiment. 14 is a plan view for explaining an example of the wiring portion 30b of the lower connection member 30 according to the present embodiment. 13 and Fig. 14 are examples of the lower connection member 30 corresponding to the holding member 10 having two openings in Fig. 11 (a).

As shown in Fig. 13, the connecting portion 31 of the lower connecting member 30 has a plurality of connecting pins 31t. Here, the plurality of connection pins 31t are electrically connected to the (connection terminal of) the electronic component PKG as shown in Figs. 13 and 14, and detect the output signal of the electronic component PKG. In other words, the plurality of connection pins 31t are selectively disposed at positions electrically connected to connection terminals of the electronic component PKG. The connecting portion 31 of the lower connecting member 30 may be configured such that a plurality of connecting pins 31t are fitted or taken out according to the arrangement of the connecting terminals (TMa in Fig. 3 to TMc in Fig. 5) .

On the other hand, the connection portion 31 of the lower connection member 30 according to the present embodiment is not limited to that shown in Fig. That is, the connection portion 31 of the lower connection member 30 according to the present embodiment is configured such that the specification (shape, arrangement of connection terminals, etc.) of the electronic component PKG to be held and the specification The arrangement of the route 22T, etc.).

As shown in Fig. 14, the wiring portion 30b of the lower connecting member 30 has a plurality of wirings 30b1. Here, the plurality of wirings 30b1 electrically connect the plurality of connecting pins 31t of the connecting portion 31 to the return signal path 22T of the upper connecting member 20.

On the other hand, the wiring portion 30b of the lower connection member 30 according to the present embodiment is not limited to that shown in Fig. That is, the wiring portion 30b of the lower connection member 30 according to the present embodiment is configured such that the specification (shape, arrangement of connection terminals, etc.) of the electronic component to be held and the specification of the upper connection member 20 22T), and the like).

The lower connection member 30 according to the present embodiment is constituted by laminating the connection portion 31 and the wiring portion 30b. Further, the lower connecting member 30 is disposed at a predetermined position of the chuck stage 40 at the time of inspection. Here, the electronic component testing apparatus 100 may position the lower connecting member 30 by picking up the position of the lower connecting member 30. The electronic component testing apparatus 100 may be disposed at a predetermined position by using a mechanical structure such as a suction mechanism (for example, a negative pressure chuck) or a guide (e.g., a rail mechanism or a pin fitting).

[Signal flow]

Finally, the flow of signals with the electronic component testing apparatus 100 according to the present embodiment will be described with reference to Figs. 15 and 16. Fig. 15 and 16 are diagrams for explaining an example of the flow of signals with the electronic component testing apparatus 100 according to the present embodiment.

In the conventional electronic component inspecting apparatus, when the input signal pin and the output signal pin of the electronic component are disposed on one surface of the electronic component and connected to the signal pin by the test socket accommodating the electronic component, So that the input / output signal is supplied to the electronic component inspection apparatus through the electronic component by electrically connecting with the electronic component inspection apparatus. In the case of inspection using a prober, the upper connection member 20 can be easily electrically connected by disposing the signal terminal side of the electronic component upward.

On the other hand, the electronic component to be inspected of the electronic component testing apparatus 100 according to the present embodiment receives optical signals such as CIS (CMOS Image Sensor) and CCD devices, (The back surface of the electronic component) of the electronic component is on the opposite surface. A signal can not be taken out from the signal terminal surface side to the chuck stage 40 side and can not be inspected because the signal can not pass through the chuck stage 40 of the prober 101, It is necessary to provide a method for achieving this.

Therefore, in the electronic component testing apparatus 100 according to the present embodiment, the output signal detected by the lower connecting member 30 is returned, and the return signal path (output signal) output from the upper connecting member 20, 22T are formed. Accordingly, the electronic component testing apparatus 100 according to the present embodiment can exchange bidirectional signals.

A signal input to the electronic component testing apparatus 100 from the tester 60 side and a signal output to the tester 60 side using the return signal path 22T will be described with reference to Figs.

15A shows a case where a signal returned from the light signal input from the light emitting element 110 to the electronic component testing apparatus 100 by using the return signal path 22T passes through the signal line SO, (60).

15B shows a state in which the optical signal inputted to the electronic component testing apparatus 100 from the light emitting element 110 and the signal inputted through the signal line SI from the tester 60 side have a return signal path 22T are outputted to the tester 60 side via the signal line SO are shown.

16 shows an example in which a signal returned from the tester 60 via the signal line SI is returned to the tester 60 via the signal line SO using a return signal path 22T or the like And the output is shown. In Fig. 16, connection terminals capable of inputting and outputting signals on both surfaces of the electronic component PKG are shown, and signals can be input and output on both surfaces of the electronic component PKG.

On the other hand, although signals from one direction are shown here for ease of explanation, bidirectional signals in which input and output are switched on the time axis, or a state in which a plurality of input pins and output pins are mixed.

As described above, in the electronic component testing apparatus 100 according to the present embodiment, the holding member 10 can be made lighter by dividing the holding member 10 and the lower connecting member 30. [ As a result, a plurality of electronic components (PKG) can be held at the holding member 10 at a high speed. Thus, the conveying time of the electronic component PKG can be shortened. Further, it is possible to shorten the positioning time of the plurality of electronic parts by the stepping operation of the prober 101. [ As a result, it is possible to increase the number of inspection processes of electronic components per unit time.

Further, according to the electronic component inspection apparatus or the electronic component inspection method according to an embodiment of the present invention, a plurality of electronic components can be carried by using a holding member for holding the electronic components, It does not require a plurality of expensive inserts. Therefore, according to the electronic component inspection apparatus or the electronic component inspection method according to the embodiment of the present invention, the manufacturing cost of the inspection apparatus can be reduced. Further, according to the electronic component inspection apparatus or the electronic component inspection method according to the embodiment of the present invention, the cost of the retaining member can be significantly reduced without requiring high precision machining on the retaining member. Further, according to the electronic component testing apparatus or the electronic component testing method according to the embodiment of the present invention, it is possible to carry out a plurality of electronic components by using a lightweight holding member and to hold a plurality of electronic components at the time of inspection Therefore, the conveying means can be downsized and simplified.

According to the electronic component inspecting apparatus or the electronic component inspecting method according to the present embodiment, it is possible to easily change (the connecting portion of) the retaining member (the connecting portion of) the lower connecting member according to the shape of the electronic component, The versatility of the apparatus can be improved. Specifically, according to the electronic component testing apparatus or the electronic component testing method according to the embodiment of the present invention, the holding member can be easily changed according to the type of the electronic component, 30 can be easily changed. Therefore, according to the electronic component inspection apparatus or electronic component inspection method according to the present embodiment, even when different types of electronic components are inspected, the apparatus and method can be easily shared.

On the other hand, each function of the electronic component testing apparatus 100 according to the present embodiment may be realized by the control section 90 executing a program for causing the computer to execute the inspection method. The program may be stored in a recording medium readable by a computer. On the other hand, a recording medium includes a flexible disk (FD), a compact disk-ROM (CD-ROM), a compact disk-read only memory (CD-R), a digital versatile disk (DVD) ROM, a semiconductor memory, a memory card, a HDD (Hard Disc Drive), and other computer readable memories. The functions of the electronic component testing apparatus 100 may be executed by installing the program in the electronic component testing apparatus 100. [

Although the present invention has been described with reference to the present embodiment, the present invention is not limited to the above-described embodiment, and various changes or modifications may be made in light of the scope of the appended claims.

For example, the electronic component inspecting apparatus according to the present invention can have general versatility by changing the shape of the arrangement portion of the holding member in accordance with the size and shape of the electronic component to be transported. Specifically, in the case of transporting electronic devices having different shapes, the size and shape of the frame of the holding member need only be changed in accordance with the shape of the electronic device, and it is highly versatile. Since the retaining member has a frame structure, even when the size or shape of the frame of the retaining member is changed, when the retaining member is disposed on the lower connecting member as described above, the electronic device is brought into contact with the connecting pin of the lower connecting member, I can take it.

10: holding member 10a:
11P: arrangement part 12: opening
12s, 12sc, 12sd: supporting piece 13, 14: through hole
20: upper connecting member 22T: return signal path
30: lower connecting member 31: connecting portion
31t: connection pin 30b: wiring part
30b1: wiring 40: chuck stage
50: imaging section 60: tester
70: conveying section 80: storage section
90: control unit 100: electronic component inspection device
101: Prober PKG: Electronic parts
TMa, TMb, TMc: Connection terminal

Claims (10)

An electronic component inspection apparatus for inspecting an electronic component based on an output signal outputted from an electronic component to which an inspection signal is inputted,
A holding member for holding the electronic component;
An upper connecting member for inputting the inspection signal to the electronic component,
A lower connecting member for detecting the output signal output from the electronic component;
Lt; / RTI >
Wherein the holding member is disposed between the upper connecting member and the lower connecting member while holding the electronic component at the time of inspection. The electronic component inspection apparatus according to claim 1, further comprising a return signal path for returning an output signal detected by the lower connection member and outputting the inspection signal from the upper connection member to which the inspection signal is inputted. 3. The apparatus according to claim 2, wherein the holding member has a plurality of arrangements arranged in a lattice-like configuration composed of a plurality of grate members,
Wherein a plurality of the electronic parts are arranged in the plurality of arrangement parts, respectively. 4. The apparatus of claim 3, wherein each of the plurality of arrangements has a square-shaped opening, a support piece at four corners of the opening,
And the support piece supports the electronic component. 6. The image forming apparatus according to claim 3 or 4, wherein the holding member has a through-hole at an outer side of the arrangement portion,
And the return signal path is passed through the through-hole of the holding member. 5. The apparatus according to claim 4, further comprising a tester for checking whether the operation of the electronic component is normal, or whether there is an abnormality or not, by comparing the input inspection signal and the detected output signal Electronic component inspection device. The apparatus according to claim 4, wherein the lower connecting member is fixed to a chuck stage of a prober,
Wherein when the holding member is disposed on the lower connecting member, the plurality of electronic parts and the lower connecting member fixed to the chuck stage are electrically contacted through the openings of the plurality of arranging portions. The electronic component inspection apparatus according to claim 7, wherein the lower connecting member is fixed to the chuck stage in a state in which the lower connecting member is aligned with the chuck stage by the prober. An electronic component inspection method for inspecting an electronic component based on an output signal output from an electronic component to which an inspection signal is inputted,
A holding step of holding a plurality of the electronic parts in a plurality of the arranging parts using a holding member having a plurality of arranging parts arranged in a lattice shape;
A mounting step of electrically connecting the holding member holding the electronic component to the lower connecting member and arranging the holding member,
A signal input step of inputting the inspection signal to the electronic component from above the holding member by using the upper connecting member,
A signal detecting step of detecting the output signal outputted from the electronic component by using the lower connecting member in which the holding member is disposed;
A signal transmission step of transmitting the output signal detected by the lower connection member using a connection portion of the upper connection member which is electrically connected to the lower connection member through the holding member,
And inspecting the electronic component based on the transmitted output signal. A program for causing a computer to execute the electronic component inspection method according to claim 9.

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