JP4838522B2 - Electrical contact and socket for electrical parts - Google Patents

Electrical contact and socket for electrical parts Download PDF

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Publication number
JP4838522B2
JP4838522B2 JP2005089266A JP2005089266A JP4838522B2 JP 4838522 B2 JP4838522 B2 JP 4838522B2 JP 2005089266 A JP2005089266 A JP 2005089266A JP 2005089266 A JP2005089266 A JP 2005089266A JP 4838522 B2 JP4838522 B2 JP 4838522B2
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contact
plunger
cylindrical
electrical
cylindrical portion
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JP2006269366A (en
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久男 大島
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Enplas Corp
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Enplas Corp
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Description

この発明は、半導体装置(以下「ICパッケージ」という)等の第1の電気部品と配線基板等の第2の電気部品とを電気的に接続する電気接触子及び、この電気接触子が配設された電気部品用ソケットに関するものである。   The present invention provides an electrical contact that electrically connects a first electrical component such as a semiconductor device (hereinafter referred to as an “IC package”) and a second electrical component such as a wiring board, and the electrical contact is disposed. It is related with the socket for electrical components made.

従来から、この種の電気接触子としては、例えば図5に示すようなものがある(特許文献1参照)。すなわち、この電気接触子1は、プランジャ2とばね部材3とから構成され、この電気接触子1が、ソケット本体4の上側保持部材5及び下側保持部材6に保持されている。この電気接触子1により、配線基板7とこの上側に配設される図示省略の電気部品(ICパッケージ)とが電気的に接続されるように構成されている。   Conventionally, as this kind of electric contact, there is one as shown in FIG. 5, for example (see Patent Document 1). That is, the electric contact 1 is composed of a plunger 2 and a spring member 3, and the electric contact 1 is held by the upper holding member 5 and the lower holding member 6 of the socket body 4. By this electrical contact 1, the wiring board 7 and an electrical component (IC package) (not shown) disposed on the upper side are electrically connected.

より詳しくは、そのプランジャ2は、上端部にその電気部品に接触される接触部2aが形成されると共に、中間部に抜け止めとなるフランジ部2bが形成され、更に、このフランジ部2bの下側に軸部2cが形成されている。   More specifically, the plunger 2 is formed with a contact portion 2a that comes into contact with the electrical component at the upper end portion, and a flange portion 2b that is prevented from coming off at an intermediate portion, and is further provided under the flange portion 2b. A shaft portion 2c is formed on the side.

また、ばね部材3は、線材が伸縮自在に巻かれた通常巻部3aと、線材が密着して巻かれた密着巻部3bとが上下に連続して形成され、その通常巻部3a内に、プランジャ2の軸部2cが挿入されている。そして、そのばね部材3とプランジャ2とが互いに接触されることにより電気的に接続され、そのばね部材3の密着巻部3bが配線基板7の電極部7aに電気的に接続されるようになっている。   The spring member 3 includes a normal winding portion 3a in which a wire is wound in an expandable manner and a close-up winding portion 3b in which the wire is wound in close contact with each other. The spring member 3 is continuously formed in the normal winding portion 3a. The shaft portion 2c of the plunger 2 is inserted. Then, the spring member 3 and the plunger 2 are electrically connected by being brought into contact with each other, and the tightly wound portion 3 b of the spring member 3 is electrically connected to the electrode portion 7 a of the wiring board 7. ing.

このようなものにあっては、プランジャ2の上側に電気部品が収容され、この電気部品により、プランジャ2が下方に押されると、ばね部材3の通常巻部3aが圧縮されてプランジャ2が下降する。この圧縮力がプランジャ2の接触部2a及びばね部材3の密着巻部3bに作用することにより、その接触部2aが電気部品の端子に、又、密着巻部3bが配線基板7の電極部7aに所定の接圧で、接触することとなる。   In such a case, an electrical component is accommodated on the upper side of the plunger 2, and when the plunger 2 is pushed downward by the electrical component, the normal winding portion 3a of the spring member 3 is compressed and the plunger 2 is lowered. To do. When this compressive force acts on the contact portion 2a of the plunger 2 and the tightly wound portion 3b of the spring member 3, the contact portion 2a serves as a terminal of the electrical component, and the tightly wound portion 3b serves as the electrode portion 7a of the wiring board 7. The contact is made at a predetermined contact pressure.

これにより、電気部品の端子と配線基板7の電極部7aとが電気的に接続され、この状態で、電気部品(ICパッケージ)のバーンイン試験等が行われることとなる。
特開平10−239349号公報。
Thereby, the terminal of the electrical component and the electrode portion 7a of the wiring board 7 are electrically connected, and in this state, a burn-in test or the like of the electrical component (IC package) is performed.
Japanese Patent Laid-Open No. 10-239349.

しかしながら、このような従来のものにあっては、プランジャ2の軸部2cの周囲にばね部材3の通常巻部3aが位置し、この軸部2cと両保持部材5,6の保持孔5a,6aの内壁5b,6bとの間に、そのばね部材3の伸縮自在な通常巻部3aが介在しているため、この内壁5b,6bと軸部2cとの間に、通常巻部3aが伸縮可能なように比較的余裕を持った隙間が必要となることから、プランジャ2の上下動時に軸部2c等が傾き、安定した上下動作が得られないと共に、軸部2cとばね部材3との接触安定性も良好とは言い難い。   However, in such a conventional one, the normal winding portion 3a of the spring member 3 is positioned around the shaft portion 2c of the plunger 2, and the holding holes 5a, Since the normal winding part 3a of the spring member 3 that can be expanded and contracted is interposed between the inner walls 5b and 6b of the 6a, the normal winding part 3a is expanded and contracted between the inner walls 5b and 6b and the shaft part 2c. Since a relatively large clearance is required as possible, the shaft portion 2c and the like is inclined when the plunger 2 moves up and down, and stable vertical movement cannot be obtained, and the shaft portion 2c and the spring member 3 are It is difficult to say that the contact stability is good.

また、この軸部2cと両保持部材5,6の保持孔5a,6aの内壁5b,6bとの間を極力狭くして軸部2cが傾くのを防止しようとすると、ばね部材3の通常巻部3aの伸縮時に、軸部2cと保持孔5a,6aの内壁5b,6bとの間に、通常巻部3aが挟まれて、ばね部材3の伸縮動作に支障を来す虞がある。   Further, when the shaft portion 2c and the inner walls 5b, 6b of the holding holes 5a, 6a of the holding members 5, 6 are made as narrow as possible to prevent the shaft portion 2c from tilting, the normal winding of the spring member 3 is performed. When the portion 3a is expanded and contracted, the normal winding portion 3a may be sandwiched between the shaft portion 2c and the inner walls 5b and 6b of the holding holes 5a and 6a, which may hinder the expansion and contraction operation of the spring member 3.

そこで、この発明は、プランジャの上下動作及びばね部材の伸縮動作の安定性、プランジャとばね部材との接触安定性を図る電気接触子及び電気部品用ソケットを提供することを課題としている。   Therefore, an object of the present invention is to provide an electrical contactor and an electrical component socket that achieve the stability of the up-and-down movement of the plunger and the expansion and contraction of the spring member and the contact stability between the plunger and the spring member.

かかる課題を達成するために、請求項1に記載の発明は、第1の電気部品に接触されるプランジャ側接触部及び該プランジャ側接触部に連続する筒部を有する導電性材料から成るプランジャと、該プランジャの筒部内に挿入される導電性材料から成るばね部材とを備えた電気接触子において、前記ばね部材は、一体に形成された、前記筒部内に挿入される伸縮自在な通常巻部と、前記筒部から外部に突出して第2の電気部品に接触されるばね側接触部が設けられた密着巻部とを有し、該密着巻部は、前記筒部に設けられた開口の内部側近傍から該開口の外部にわたって突出するように設けられ、外周部が該筒部の内壁面と摺接することにより該筒部と電気的に接続されている電気接触子としたことを特徴とする。 In order to achieve the above object, the invention according to claim 1 is a plunger made of a conductive material having a plunger side contact portion in contact with the first electrical component and a cylindrical portion continuous to the plunger side contact portion; An electric contact provided with a spring member made of a conductive material inserted into the cylindrical portion of the plunger, wherein the spring member is integrally formed and is a telescopic normal winding portion inserted into the cylindrical portion. And a tightly wound portion provided with a spring-side contact portion that protrudes outward from the tubular portion and comes into contact with the second electrical component, and the tightly wound portion is an opening provided in the tubular portion. An electrical contact is provided so as to project from the inside near the outside of the opening and the outer peripheral portion is in sliding contact with the inner wall surface of the cylindrical portion, thereby being electrically connected to the cylindrical portion. To do.

請求項2に記載の発明は、請求項1に記載の構成に加え、前記プランジャは、導電性を有する板材が筒状に折曲げられることにより、筒状の前記プランジャ側接触部及び、該プランジャ側接触部より径の大きい前記筒部が形成されたことを特徴とする。   According to a second aspect of the present invention, in addition to the configuration according to the first aspect, the plunger is configured such that the plunger-side contact portion and the plunger are formed by bending a conductive plate material into a cylindrical shape. The cylindrical portion having a larger diameter than the side contact portion is formed.

請求項3に記載の発明は、請求項1又は2に記載の構成に加え、前記密着巻部は、上下方向の中間部に他の部分より径の大きいストッパ部が形成されていることを特徴とする。   According to a third aspect of the present invention, in addition to the configuration according to the first or second aspect, the tightly wound portion is formed with a stopper portion having a diameter larger than that of other portions at an intermediate portion in the vertical direction. And

請求項4に記載の発明は、請求項1乃至3の何れか一つに記載の構成に加え、前記筒部は、開口部側の端縁部又は近傍に、内側に径を狭くした縮径部が形成される一方、前記密着巻部の、前記筒部の前記内壁面と摺接する部分よりも下の部分は、前記通常巻部より径が細く形成され、前記縮径部により、前記通常巻部の前記筒部からの抜け止めを行ったことを特徴とする請求項1乃至3の何れか一つに記載の電気接触子。 According to a fourth aspect of the present invention, in addition to the configuration according to any one of the first to third aspects, the cylindrical portion has a reduced diameter whose diameter is narrowed inward at or near an edge portion on the opening side. The portion of the tightly wound portion below the portion that is in sliding contact with the inner wall surface of the cylindrical portion is formed to have a diameter smaller than that of the normal winding portion. The electrical contact according to any one of claims 1 to 3, wherein the winding part is prevented from coming off from the cylindrical part.

請求項5に記載の発明は、前記第2の電気部品が配線基板であり、該配線基板上に配設され、上側に前記第1の電気部品が収容されるソケット本体と、該ソケット本体に配設され、請求項1乃至4の何れか一つに記載の複数の電気接触子とを有している電気部品用ソケットとしたことを特徴とする。   According to a fifth aspect of the present invention, the second electrical component is a wiring board, the socket body is disposed on the wiring board, and the first electrical component is accommodated on the upper side, and the socket body It is set as the socket for electrical components which is arrange | positioned and has the several electrical contactor as described in any one of Claims 1 thru | or 4.

請求項1に記載の発明によれば、第1の電気部品に接触されるプランジャ側接触部及びこのプランジャ側接触部に連続する筒部を有する導電性材料から成るプランジャと、プランジャの筒部内に挿入される導電性材料から成るばね部材とを備えた電気接触子において、ばね部材は、筒部内に挿入される伸縮自在な通常巻部と、筒部から外部に突出して第2の電気部品に接触されるばね側接触部が設けられた密着巻部とを有する電気接触子としたため、その通常巻部が筒部とソケット本体の保持孔の内壁との間に介在することがなく、上下動するプランジャの筒部の外周面が、保持孔の内周面を摺動することから、プランジャは従来と異なり、その保持孔の内周面に案内されることから、このプランジャが従来のように傾くことがなく、安定した上下動作を得ることができ、又、プランジャの筒部とばね部材の密着巻部との接触安定性を確保することができる。   According to the first aspect of the present invention, there is provided a plunger made of a conductive material having a plunger-side contact portion that is in contact with the first electric component and a cylindrical portion that is continuous with the plunger-side contact portion; In the electrical contactor provided with the spring member made of the conductive material to be inserted, the spring member is extended and retracted from the cylindrical portion into the second electric component. Because the electric contact having the contact winding portion provided with the contact portion on the spring side to be contacted, the normal winding portion does not intervene between the cylindrical portion and the inner wall of the holding hole of the socket body, and the vertical movement Since the plunger outer surface slides on the inner peripheral surface of the holding hole, the plunger is guided to the inner peripheral surface of the holding hole unlike the conventional one. Stable without tilting It is possible to obtain the upper and lower operation, also, it is possible to ensure contact stability with the contact winding portion of the plunger of the cylinder portion and the spring member.

また、その通常巻部が、プランジャの筒部とソケット本体の保持孔の内壁との間に介在されていないため、ばね部材の通常巻部の伸縮時に、プランジャの筒部と保持孔の内壁との間に、通常巻部が挟まれることなく、ばね部材の伸縮動作に支障を来すことがない。   Further, since the normal winding portion is not interposed between the plunger cylindrical portion and the inner wall of the holding hole of the socket body, when the normal winding portion of the spring member is expanded and contracted, the plunger cylindrical portion and the inner wall of the holding hole In the meantime, the normal winding portion is not sandwiched, and the expansion and contraction operation of the spring member is not hindered.

請求項2に記載の発明によれば、請求項1に記載の構成に加え、プランジャは、導電性を有する板材が筒状に折曲げられることにより、筒状のプランジャ側接触部及び、このプランジャ側接触部より径の大きい筒部が形成されたため、切削等にて成形する場合より容易に成形できる。   According to the second aspect of the present invention, in addition to the configuration of the first aspect, the plunger has a cylindrical plunger-side contact portion and this plunger by bending a conductive plate material into a cylindrical shape. Since the cylindrical portion having a larger diameter than the side contact portion is formed, it can be formed more easily than when forming by cutting or the like.

請求項3に記載の発明によれば、請求項1又は2に記載の構成に加え、密着巻部は、上下方向の中間部に他の部分より径の大きいストッパ部が形成されているため、ソケット本体からのばね部材の抜け止めを行うことができる。   According to the invention described in claim 3, in addition to the configuration described in claim 1 or 2, since the tightly wound portion is formed with a stopper portion having a larger diameter than other portions in the middle portion in the vertical direction, The spring member can be prevented from coming off from the socket body.

請求項4に記載の発明によれば、請求項1乃至3の何れか一つに記載の構成に加え、筒部は、開口部側の端縁部又は近傍に、内側に径を狭くした縮径部が形成される一方、密着巻部の、前記筒部の前記内壁面と摺接する部分よりも下の部分は、通常巻部より径が細く形成され、縮径部により、通常巻部の筒部からの抜け止めを行ったため、プランジャとばね部材とが組み付けられて一体となっていることから、電気接触子をソケット本体に配設する前の状態等において取り扱いが便利である。 According to the invention described in claim 4, in addition to the configuration described in any one of claims 1 to 3, the cylindrical portion is a contraction having a diameter narrowed inward at or near the edge portion on the opening side. While the diameter portion is formed, the portion of the tightly wound portion below the portion that is in sliding contact with the inner wall surface of the cylindrical portion is formed to have a diameter smaller than that of the normal winding portion. Since the plunger and the spring member are assembled together because they are prevented from coming off from the cylindrical portion, handling is convenient in a state before the electric contactor is disposed in the socket body.

請求項5に記載の発明によれば、第2の電気部品が配線基板であり、配線基板上に配設され、上側に第1の電気部品が収容されるソケット本体と、ソケット本体に配設され、請求項1乃至4の何れか一つに記載の複数の電気接触子とを有している電気部品用ソケットとしたため、上記各効果を有する電気部品用ソケットを提供できる。   According to the fifth aspect of the present invention, the second electrical component is a wiring board, and is disposed on the wiring board. The socket body that accommodates the first electrical component on the upper side is disposed on the socket body. And since it was set as the socket for electrical components which has the some electrical contactor as described in any one of Claims 1 thru | or 4, the socket for electrical components which has said each effect can be provided.

以下、この発明の実施の形態について説明する。
[発明の実施の形態1]
Embodiments of the present invention will be described below.
Embodiment 1 of the Invention

図1及び図2には、この発明の実施の形態1を示す。   1 and 2 show a first embodiment of the present invention.

まず構成を説明すると、図中符号11は「電気部品用ソケット」としてのICソケットで、このICソケット11に「第1の電気部品」であるICパッケージ12を保持することにより、このICパッケージ12と「第2の電気部品」である配線基板13とをICソケット11を介して電気的に接続するようにしている。   First, the configuration will be described. Reference numeral 11 in the figure denotes an IC socket as an “electrical component socket”. By holding an IC package 12 as a “first electric component” in the IC socket 11, the IC package 12 And the wiring board 13 which is the “second electrical component” are electrically connected via the IC socket 11.

このICパッケージ12は、いわゆるBGA(Ball Grid Array)タイプと称されるもので、方形状のパッケージ本体12bの下面に「端子」としての多数の略球形状の半田ボール12aが縦列と横列にマトリックス状に配列されている。   This IC package 12 is a so-called BGA (Ball Grid Array) type, and a large number of substantially spherical solder balls 12a as “terminals” are arranged in rows and columns on the lower surface of a rectangular package body 12b. Are arranged in a shape.

そのICソケット11は、配線基板13上に取り付けられるソケット本体14を有し、このソケット本体14に、「電気接触子」である複数のコンタクトピン15が配設されている。   The IC socket 11 has a socket body 14 that is mounted on a wiring board 13, and a plurality of contact pins 15 that are “electrical contacts” are disposed on the socket body 14.

そのソケット本体14は、図1及び図2に示すように、互いに図示省略のボルトにより取り付けられた上側保持部材18及び下側保持部材19の保持孔18a,19aにそれらコンタクトピン15が挿入されて保持されている。   As shown in FIGS. 1 and 2, the socket body 14 has the contact pins 15 inserted into the holding holes 18a and 19a of the upper holding member 18 and the lower holding member 19 which are attached to each other by bolts not shown. Is retained.

さらにまた、その上側保持部材18の上側に、フローティングプレート20が図示省略の構造により上下動自在で、所定の高さで停止するように配設され、又、図示省略のスプリングにより上方に付勢されている。   Further, the floating plate 20 is arranged on the upper side of the upper holding member 18 so as to be movable up and down by a structure (not shown) and stopped at a predetermined height, and is biased upward by a spring (not shown). Has been.

そして、このフローティングプレート20の挿通孔20aに、コンタクトピン15の上部側が挿入され、更に、このフローティングプレート20上には、図示は省略するが、ICパッケージ12の収容時に案内するガイド部が設けられている。   The upper side of the contact pin 15 is inserted into the insertion hole 20a of the floating plate 20, and a guide portion is provided on the floating plate 20 to guide the IC package 12 when it is accommodated. ing.

一方、そのコンタクトピン15は、ICパッケージ12に電気的に接続されるプランジャ22と、配線基板13に電気的に接続されるばね部材23とから構成されている。   On the other hand, the contact pin 15 is composed of a plunger 22 electrically connected to the IC package 12 and a spring member 23 electrically connected to the wiring board 13.

そのプランジャ22は、導電性を有する板材が筒状に折曲げられることにより、形成され、ICパッケージ12の半田ボール12aに接触されるプランジャ側接触部22a及びこのプランジャ側接触部22aの下側に設けられた筒部22bが形成されている。   The plunger 22 is formed by bending a conductive plate material into a cylindrical shape, and is formed on a plunger side contact portion 22a that is in contact with the solder ball 12a of the IC package 12 and below the plunger side contact portion 22a. The provided cylinder part 22b is formed.

そのプランジャ側接触部22aは、筒状を呈し、上端部が冠形状に形成され、この冠形状の上側に半田ボール12aが載せられて接触され、電気的に接続されるようになっている。   The plunger side contact portion 22a has a cylindrical shape, and an upper end portion is formed in a crown shape, and a solder ball 12a is placed on and contacted with an upper side of the crown shape to be electrically connected.

また、筒部22bは、そのプランジャ側接触部22aより径が大きく、両保持部材18,19の保持孔18a,19aの内壁に上下に摺動するように構成されている。   Further, the cylindrical portion 22b has a larger diameter than the plunger side contact portion 22a, and is configured to slide up and down on the inner walls of the holding holes 18a and 19a of the holding members 18 and 19.

この筒部22bが保持孔18a,19aの大径部18b,19b内に収容され、保持孔18aの小径部18cからプランジャ側接触部22aが上方に突出している。その筒部22bは保持孔18aの小径部18cより大きく形成されているため、プランジャ22が上方に抜けないように構成されている。   The cylindrical portion 22b is accommodated in the large diameter portions 18b and 19b of the holding holes 18a and 19a, and the plunger side contact portion 22a protrudes upward from the small diameter portion 18c of the holding hole 18a. Since the cylindrical portion 22b is formed larger than the small diameter portion 18c of the holding hole 18a, the plunger 22 is configured so as not to come out upward.

さらに、ばね部材23は、導電性を有する材料で形成され、筒部22b内に挿入される伸縮自在な通常巻部23aと、この通常巻部23aの下方に連続して形成され、その筒部22bから外部(下方)に突出する密着巻部23bとを有している。   Further, the spring member 23 is formed of a conductive material, and is formed continuously from a telescopic normal winding portion 23a inserted into the cylindrical portion 22b and below the normal winding portion 23a. The contact winding portion 23b protrudes outward (downward) from 22b.

その通常巻部23aの外径と、筒部22bの内壁とが略等しい径に形成されている。   The outer diameter of the normal winding portion 23a and the inner wall of the cylindrical portion 22b are formed to have substantially the same diameter.

また、密着巻部23bは、下部側に配線基板13の電極部13aに接触されるばね側接触部23cが設けられると共に、プランジャ22が最も上昇した図1に示す状態で、上端部23dがプランジャ22の下端部に僅かに挿入されている。これにより、密着巻部23bがプランジャ22の筒部22b内に摺接して電気的に接続されている。また、ばね部材23が押し縮められたときに、プランジャ22の筒部22bの中にばね部材23の密着巻部23bがさらに挿入されるときの案内性を良くしている。そして、この密着巻部23bには、上下方向の中間部に他の部分より径の大きいストッパ部23eが形成されている。   Further, the contact winding portion 23b is provided with a spring-side contact portion 23c that is in contact with the electrode portion 13a of the wiring board 13 on the lower side, and the upper end portion 23d is a plunger in the state shown in FIG. 22 is slightly inserted into the lower end portion. As a result, the tightly wound portion 23 b is slidably contacted and electrically connected to the cylindrical portion 22 b of the plunger 22. Further, when the spring member 23 is compressed, the guideability when the tightly wound portion 23b of the spring member 23 is further inserted into the cylindrical portion 22b of the plunger 22 is improved. In the tightly wound portion 23b, a stopper portion 23e having a diameter larger than that of other portions is formed at an intermediate portion in the vertical direction.

このストッパ部23eは、下側保持部材19の保持孔19aの大径部19bと略同じ径に形成され、この保持孔19aの小径部19cより大きい径に形成されており、下方に抜けないように構成されている。   The stopper portion 23e is formed to have substantially the same diameter as the large-diameter portion 19b of the holding hole 19a of the lower holding member 19, and is formed to have a diameter larger than the small-diameter portion 19c of the holding hole 19a so as not to come down downward. It is configured.

次に、作用について説明する。   Next, the operation will be described.

まず、ICパッケージ12を収容する場合について説明する。図示省略のカバー部材を開いた状態で、ICパッケージ12を自動機等により搬送してフローティングプレート20上に収容する(図1参照)。この際には、このICパッケージ12は、ガイド部材により案内されて所定位置に収容され、図1に示すように、半田ボール12aがフローティングプレート20の挿通孔20aに挿入された状態となる。   First, the case where the IC package 12 is accommodated will be described. With the cover member (not shown) opened, the IC package 12 is conveyed by an automatic machine or the like and accommodated on the floating plate 20 (see FIG. 1). At this time, the IC package 12 is guided by the guide member and accommodated in a predetermined position, and the solder ball 12a is inserted into the insertion hole 20a of the floating plate 20 as shown in FIG.

この状態から、カバー部材を閉じて行き、このカバー部材で、ICパッケージ12を下方に押圧する。すると、フローティングプレート20がスプリングの付勢力に抗して下降され、半田ボール12aがコンタクトピン15のプランジャ側接触部22aに当接し、このプランジャ22が下方に向けて、ばね部材23の通常巻部23aの付勢力に抗して変位される。   From this state, the cover member is closed, and the IC package 12 is pressed downward by this cover member. Then, the floating plate 20 is lowered against the urging force of the spring, the solder ball 12a comes into contact with the plunger side contact portion 22a of the contact pin 15, and the plunger 22 faces downward so that the normal winding portion of the spring member 23 is placed. It is displaced against the urging force of 23a.

そして、このフローティングプレート20が更に下降されると、上側保持部材18の上面に当接し、ソケット本体14の全体が下降されて、下側保持部材19の底面が、配線基板13の電極部13aに当接するまで下降させられる(図2参照)。   When the floating plate 20 is further lowered, the floating plate 20 comes into contact with the upper surface of the upper holding member 18, the whole socket body 14 is lowered, and the bottom surface of the lower holding member 19 is brought into contact with the electrode portion 13 a of the wiring board 13. It is lowered until it comes into contact (see FIG. 2).

これにより、コンタクトピン15は、ばね部材23の通常巻部23aの付勢力に抗して圧縮されるため、この反力により、プランジャ側接触部22aがICパッケージ12の半田ボール12aに、又、ばね部材23のばね側接触部23cが配線基板13の電極部13aにそれぞれ同じ所定の接圧で接触されることとなる。   As a result, the contact pin 15 is compressed against the urging force of the normal winding portion 23a of the spring member 23, so that this reaction force causes the plunger side contact portion 22a to contact the solder ball 12a of the IC package 12, or The spring-side contact portion 23c of the spring member 23 is brought into contact with the electrode portion 13a of the wiring board 13 with the same predetermined contact pressure.

これで、コンタクトピン15を介してICパッケージ12と配線基板13とが電気的に接続され、バーンイン試験等が行われることとなる。   As a result, the IC package 12 and the wiring substrate 13 are electrically connected via the contact pins 15, and a burn-in test or the like is performed.

この際には、コンタクトピン15のプランジャ22の筒部22bと、ばね部材23の密着巻部23bとが接触しているため、通常巻部23aと筒部22bとの間で電流が流れる場合より、電流が流れ易くなり、高周波特性を向上させることができる。   At this time, since the cylindrical portion 22b of the plunger 22 of the contact pin 15 is in contact with the tightly wound portion 23b of the spring member 23, the current flows between the normal winding portion 23a and the cylindrical portion 22b. The current can easily flow and the high frequency characteristics can be improved.

また、そのコンタクトピン15は、プランジャ22の筒部22b内に、ばね部材23の通常巻部23aが挿入されているため、その通常巻部23aが筒部22bと保持孔18a,19aの内壁との間に介在することがなく、上下動するプランジャ22の筒部22bの外周面が、両保持孔18a,19aの内周面を摺動する。このように摺動することにより、プランジャ22は従来と異なり、その両保持孔18a,19aの内周面に案内されることから、このプランジャ22が従来のように傾くことがなく、安定した上下動作を得ることができ、又、プランジャ22の筒部22bとばね部材23の密着巻部23bとの接触安定性を確保することができる。   Further, since the normal winding portion 23a of the spring member 23 is inserted into the cylindrical portion 22b of the plunger 22, the normal winding portion 23a is connected to the cylindrical portion 22b and the inner walls of the holding holes 18a and 19a. The outer peripheral surface of the cylindrical portion 22b of the plunger 22 that moves up and down is slid on the inner peripheral surfaces of the holding holes 18a and 19a. By sliding in this way, the plunger 22 is guided to the inner peripheral surfaces of both the holding holes 18a and 19a, unlike the conventional case. The operation can be obtained, and the contact stability between the cylindrical portion 22b of the plunger 22 and the tightly wound portion 23b of the spring member 23 can be ensured.

さらに、その通常巻部23aが、プランジャ22の筒部22bと保持孔18a,19aの内壁との間に介在されていないため、ばね部材23の通常巻部23aの伸縮時に、プランジャ22の筒部22bと保持孔18a,19aの内壁との間に、通常巻部23aが挟まれることなく、ばね部材23の伸縮動作に支障を来すことがない。   Further, since the normal winding portion 23a is not interposed between the cylindrical portion 22b of the plunger 22 and the inner walls of the holding holes 18a and 19a, the cylindrical portion of the plunger 22 is expanded and contracted when the normal winding portion 23a of the spring member 23 is expanded and contracted. The normal winding portion 23a is not sandwiched between the inner wall of 22b and the holding holes 18a and 19a, and the expansion and contraction operation of the spring member 23 is not hindered.

さらにまた、ばね部材23の中間部に径の大きいストッパ部23eを形成したため、ばね部材23の抜け止めを行うことができる。   Furthermore, since the stopper portion 23e having a large diameter is formed at the intermediate portion of the spring member 23, the spring member 23 can be prevented from coming off.

また、そのプランジャ22は、導電性の板材を折曲げて筒状に形成することにより、切削等にて成形する場合より容易に成形できる。
[発明の実施の形態2]
Further, the plunger 22 can be formed more easily than when it is formed by cutting or the like by bending a conductive plate material into a cylindrical shape.
[Embodiment 2 of the Invention]

図3及び図4には、この発明の実施の形態2を示す。   3 and 4 show a second embodiment of the present invention.

この実施の形態2は、プランジャ22の筒部22bの、開口部側の端縁部に、内側に折曲げられて径を狭くした縮径部22dが形成されている。また、ばね部材23の密着巻部23bは、筒部22b内に位置する大径ばね部23fと、この下側に連続して設けられた小径ばね部23gとから構成されている。   In the second embodiment, a diameter-reduced portion 22d that is bent inward and has a reduced diameter is formed at the end of the cylindrical portion 22b of the plunger 22 on the opening side. The tightly wound portion 23b of the spring member 23 is composed of a large-diameter spring portion 23f located in the cylindrical portion 22b and a small-diameter spring portion 23g provided continuously below this portion.

そして、この大径ばね部23fの下側に、プランジャ22の縮径部22dが係止し、小径ばね部23gがその筒部22bから下方に突出し、この小径ばね部23gが配線基板13の電極部13aに接触するように構成されている。   The reduced diameter portion 22d of the plunger 22 is locked below the large diameter spring portion 23f, the small diameter spring portion 23g protrudes downward from the cylindrical portion 22b, and the small diameter spring portion 23g is the electrode of the wiring board 13. It is comprised so that the part 13a may be contacted.

してみれば、プランジャ22とばね部材23とが組み付けられて一体となっているため、コンタクトピン15がソケット本体14に配設される前の状態等において取り扱いが便利である。   Accordingly, since the plunger 22 and the spring member 23 are assembled and integrated, the handling is convenient in a state before the contact pin 15 is disposed on the socket body 14.

ここで、縮径部22dは、プランジャ22の筒部22bの板材を内側に折曲げて形成したが、これに限られるものではなく、数点のかしめや、環状にかしめることでも形成することができる。また、縮径部22dの形成位置は、プランジャ22の筒部22bの、開口部側の端縁部近傍でも良い。   Here, the reduced diameter portion 22d is formed by bending the plate material of the cylindrical portion 22b of the plunger 22 inward, but is not limited thereto, and may be formed by caulking several points or by caulking in an annular shape. Can do. Further, the formation position of the reduced diameter portion 22d may be in the vicinity of the edge portion of the cylindrical portion 22b of the plunger 22 on the opening side.

なお、上記実施の形態では、「電気接触子」であるコンタクトピン15をICソケット11に適用したが、これに限らず、他のものにも適用できる。また、BGAタイプのICパッケージ12用のICソケット11に、この発明を適用したが、これに限らず、LGA(Land Grid Array)タイプ及びPGA(Pin Grid Array)タイプ等のICパッケージ下面に端子が設けられているICパッケージ並びに、QFP(Quad Flat Package)タイプ等、ICパッケージ側面から端子が延長されているICパッケージ用のICソケット等にも、この発明を適用することができる。   In the above embodiment, the contact pin 15 that is an “electrical contact” is applied to the IC socket 11, but the present invention is not limited to this, and can be applied to other types. Further, the present invention is applied to the IC socket 11 for the BGA type IC package 12, but the present invention is not limited to this, and terminals are provided on the lower surface of the IC package such as LGA (Land Grid Array) type and PGA (Pin Grid Array) type. The present invention can also be applied to an IC package for an IC package provided with terminals extended from the side of the IC package, such as an IC package provided and a QFP (Quad Flat Package) type.

また、この発明の電気部品用ソケットは、いわゆるオープントップタイプのICソケット、あるいは電気部品を押圧するプッシャーが自動機側に設けられたもの等にも適用できる。   In addition, the socket for electrical parts of the present invention can be applied to a so-called open top type IC socket or a socket provided with a pusher for pressing the electrical parts on the automatic machine side.

この発明の実施の形態1に係るICソケットのコンタクトピン配設部分を示す拡大断面図である。It is an expanded sectional view which shows the contact pin arrangement | positioning part of the IC socket which concerns on Embodiment 1 of this invention. 同実施の形態1に係る図1に示す状態からICパッケージを押圧した状態のコンタクトピン配設部分を示す拡大断面図である。FIG. 2 is an enlarged cross-sectional view showing a contact pin arrangement portion in a state where an IC package is pressed from the state shown in FIG. 1 according to the first embodiment. この発明の実施の形態2に係るICソケットのコンタクトピン配設部分を示す拡大断面図である。It is an expanded sectional view which shows the contact pin arrangement | positioning part of the IC socket which concerns on Embodiment 2 of this invention. 同実施の形態2に係る図3に示す状態からICパッケージを押圧した状態のコンタクトピン配設部分を示す拡大断面図である。FIG. 4 is an enlarged cross-sectional view showing a contact pin arrangement portion in a state where an IC package is pressed from the state shown in FIG. 3 according to the second embodiment. 従来例を示す拡大断面図である。It is an expanded sectional view which shows a prior art example.

符号の説明Explanation of symbols

11 ICソケット(電気部品用ソケット)
12 ICパッケージ(電気部品)
12a 半田ボール(端子)
12b パッケージ本体
13 配線基板
13a 電極部
14 ソケット本体
15 コンタクトピン(電気接触子)
18 上側保持部材
19 下側保持部材
20 フローティングプレート
22 プランジャ
22a プランジャ側接触部
22b 筒部
22d 縮径部
23 ばね部材
23a 通常巻部
23b 密着巻部
23c ばね側接触部
23e ストッパ部
11 IC socket (socket for electrical parts)
12 IC package (electrical parts)
12a Solder ball (terminal)
12b Package body
13 Wiring board
13a Electrode section
14 Socket body
15 Contact pin (electric contact)
18 Upper holding member
19 Lower holding member
20 Floating plate
22 Plunger
22a Plunger side contact part
22b Tube
22d reduced diameter part
23 Spring member
23a Normal winding part
23b Adhering winding part
23c Spring side contact
23e Stopper

Claims (5)

第1の電気部品に接触されるプランジャ側接触部及び該プランジャ側接触部に連続する筒部を有する導電性材料から成るプランジャと、該プランジャの筒部内に挿入される導電性材料から成るばね部材とを備えた電気接触子において、
前記ばね部材は、一体に形成された、前記筒部内に挿入される伸縮自在な通常巻部と、前記筒部から外部に突出して第2の電気部品に接触されるばね側接触部が設けられた密着巻部とを有し、
該密着巻部は、前記筒部に設けられた開口の内部側近傍から該開口の外部にわたって突出するように設けられ、外周部が該筒部の内壁面と摺接することにより該筒部と電気的に接続されている、
ことを特徴とする電気接触子。
A plunger made of a conductive material having a plunger-side contact portion that is in contact with the first electrical component and a cylindrical portion continuous to the plunger-side contact portion, and a spring member made of a conductive material inserted into the cylindrical portion of the plunger In an electrical contact with
The spring member is provided with an integrally formed stretchable normal winding portion that is inserted into the tube portion, and a spring-side contact portion that protrudes outward from the tube portion and contacts the second electrical component. A tightly wound portion,
The tightly wound portion is provided so as to protrude from the vicinity of the inner side of the opening provided in the cylindrical portion to the outside of the opening, and the outer peripheral portion is in sliding contact with the inner wall surface of the cylindrical portion to thereby electrically connect the cylindrical portion. Connected,
An electrical contact characterized by that.
前記プランジャは、導電性を有する板材が筒状に折曲げられることにより、筒状の前記プランジャ側接触部及び、該プランジャ側接触部より径の大きい前記筒部が形成されたことを特徴とする請求項1に記載の電気接触子。   The plunger is characterized in that the conductive plate member is bent into a cylindrical shape, thereby forming the cylindrical plunger-side contact portion and the cylindrical portion having a larger diameter than the plunger-side contact portion. The electrical contact according to claim 1. 前記密着巻部は、上下方向の中間部に他の部分より径の大きいストッパ部が形成されていることを特徴とする請求項1又は2に記載の電気接触子。   3. The electric contact according to claim 1, wherein the tightly wound portion is formed with a stopper portion having a larger diameter than other portions at an intermediate portion in the vertical direction. 前記筒部は、開口部側の端縁部又は近傍に、内側に径を狭くした縮径部が形成される一方、前記密着巻部の、前記筒部の前記内壁面と摺接する部分よりも下の部分は、前記通常巻部より径が細く形成され、前記縮径部により、前記通常巻部の前記筒部からの抜け止めを行ったことを特徴とする請求項1乃至3の何れか一つに記載の電気接触子。 The cylindrical portion is formed with a reduced diameter portion whose diameter is narrowed on the inner edge portion or in the vicinity of the opening portion side, whereas the tightly wound portion is slidably in contact with the inner wall surface of the cylindrical portion. The lower part is formed with a diameter smaller than that of the normal winding part, and the reduced diameter part prevents the normal winding part from coming off from the cylindrical part. The electrical contact according to one. 前記第2の電気部品が配線基板であり、
該配線基板上に配設され、上側に前記第1の電気部品が収容されるソケット本体と、
該ソケット本体に配設され、請求項1乃至4の何れか一つに記載の複数の電気接触子とを有していることを特徴とする電気部品用ソケット。
The second electrical component is a wiring board;
A socket body disposed on the wiring board and accommodating the first electrical component on the upper side;
An electrical component socket, comprising: a plurality of electrical contacts according to claim 1 disposed on the socket body.
JP2005089266A 2005-03-25 2005-03-25 Electrical contact and socket for electrical parts Expired - Fee Related JP4838522B2 (en)

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JP5624746B2 (en) * 2009-10-23 2014-11-12 株式会社ヨコオ Contact probe and socket
KR101156802B1 (en) * 2010-01-15 2012-06-18 아이피워크스 테크놀로지 코포레이션 Probe pin and probe card using the same
JP5378273B2 (en) * 2010-03-12 2013-12-25 株式会社アドバンテスト Contact probe and socket, method for manufacturing tubular plunger, and method for manufacturing contact probe
KR101337427B1 (en) 2011-06-30 2013-12-06 리노공업주식회사 A Probe For Testing the Semiconductor
JP2015105834A (en) * 2013-11-28 2015-06-08 東京エレクトロン株式会社 Electronic component inspection device, electronic component inspection method, and program for inspection method
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