JP2007200583A - Electric contact and socket for electric component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electric contact which is easy to form, inexpensive, and lightweight, and can reduce sliding resistance without generating a shrinkage hole in its circumference. <P>SOLUTION: This contact pin 15 includes: a first contact member 26 having a first contact part 26a brought into contact with an IC package 12; a second contact member 27 having a second contact part 27d brought into contact with a wiring board 13; and a coil spring 28 for energizing both the first and second contact members 26 and 27 in directions opposite to each other; wherein the first and second contact members 26 and 27 are each formed into a tubular shape by bending a plate material having conductivity. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electrical contact that electrically connects a first electrical component such as a semiconductor device (hereinafter referred to as an “IC package”) and a second electrical component such as a wiring board, and the electrical contact is arranged. The present invention relates to a socket for electrical parts.

  Conventionally, as this kind of electric contact, there is one as shown in FIG. 9, for example (see Patent Document 1). That is, the electric contact 1 is composed of a plunger 2 and a spring member 3, and the electric contact 1 is held by the upper holding member 5 and the lower holding member 6 of the socket body 4. By this electrical contact 1, the wiring board 7 and an electrical component (IC package) (not shown) disposed on the upper side are electrically connected.

  More specifically, the plunger 2 is formed with a contact portion 2a that comes into contact with the electrical component at the upper end portion, and a flange portion 2b that is prevented from coming off at an intermediate portion, and is further provided under the flange portion 2b. A shaft portion 2c is formed on the side.

  The spring member 3 includes a normal winding portion 3a in which a wire is wound in an expandable manner and a close-up winding portion 3b in which the wire is wound in close contact with each other. The spring member 3 is continuously formed in the normal winding portion 3a. The shaft portion 2c of the plunger 2 is inserted. Then, the spring member 3 and the plunger 2 are electrically connected by being brought into contact with each other, and the tightly wound portion 3 b of the spring member 3 is electrically connected to the electrode portion 7 a of the wiring board 7. ing.

  In such a case, an electrical component is accommodated on the upper side of the plunger 2, and when the plunger 2 is pushed downward by the electrical component, the normal winding portion 3a of the spring member 3 is compressed and the plunger 2 is lowered. To do. When this compressive force acts on the contact portion 2a of the plunger 2 and the tightly wound portion 3b of the spring member 3, the contact portion 2a serves as a terminal of the electrical component, and the tightly wound portion 3b serves as the electrode portion 7a of the wiring board 7. The contact is made at a predetermined contact pressure.

Thereby, the terminal of the electrical component and the electrode portion 7a of the wiring board 7 are electrically connected, and in this state, a burn-in test or the like of the electrical component (IC package) is performed.
Japanese Patent Laid-Open No. 10-239349.

  However, in such a conventional device, since the plunger 2 is formed by cutting a cylindrical pin, it is difficult to form, expensive, and heavy. In addition, there is a problem that a sliding resistance is increased when the plunger 2 moves up and down because a tear is generated around the plunger 2 by cutting.

  Accordingly, an object of the present invention is to provide an electrical contact and a socket for an electrical component that are easy to mold, inexpensive, lightweight, and capable of reducing the sliding resistance without any difficulty in the periphery.

  In order to achieve such an object, the invention described in claim 1 includes a first contact member having a first contact portion that is in contact with the first electrical component, and a second contact that is in contact with the second electrical component. And a biasing means for biasing the first and second contact members in opposite directions, and the first and second contact members are made of a conductive plate. The electric contact is formed into a tubular shape by bending.

  According to a second aspect of the present invention, in addition to the configuration of the first aspect, at least one of the first contact portion of the first contact member or the second contact portion of the second contact member has a crown shape. It is characterized by being.

  According to a third aspect of the present invention, in addition to the configuration of the first or second aspect, an end of the second contact member is opened to provide an opening, and the first contact member is inserted from the opening. In addition, the biasing means is provided in the second contact member.

  According to a fourth aspect of the present invention, in addition to the configuration according to the third aspect, the first contact member has a bulging portion having a larger diameter than other portions formed in an intermediate portion in the longitudinal direction. Features.

  According to a fifth aspect of the present invention, in addition to the configuration according to the third or fourth aspect, the first contact member is a protrusion having a smaller diameter than the other portion at the end inserted into the second contact member. And a coil spring as the urging means is fitted to the protrusion.

  According to a sixth aspect of the present invention, the second electrical component is a wiring board, the socket body is disposed on the wiring board, and the first electrical component is accommodated on the upper side, and the socket body It is set as the socket for electrical components which is arrange | positioned and has the some electrical contactor as described in any one of Claims 1 thru | or 5.

  According to the invention described in claim 1, since both the first contact member and the second contact member of the electric contact are formed into a cylindrical shape by bending the plate-like conductive material, Since it is not what was shape | molded by cutting unlike the past, shaping | molding is easy, can be made cheap, and can also reduce a weight. And since many electrical contacts are arranged in one electrical component socket, if one electrical contact can be reduced in weight, the overall electrical component socket can be significantly reduced in weight. Therefore, the burden on the wiring board on which a large number of sockets for electrical parts are arranged can be reduced.

  Moreover, since these 1st contact members and 2nd contact members are not formed by cutting, since the tear by cutting does not generate | occur | produce on a surrounding surface, at the time of the up-and-down motion of these 1st contact members and 2nd contact members Sliding resistance can be reduced.

  According to the invention of claim 2, in addition to the effect of claim 1, at least one of the first contact portion of the first contact member or the second contact portion of the second contact member has a crown shape. Therefore, the crown-shaped first contact portion of the first contact member can be formed very easily by forming it with a press as compared with the case of forming it by cutting.

  According to the third aspect of the present invention, the end portion of the second contact member is opened to provide an opening, and the first contact member is inserted from the opening, whereby the second contact member and the second contact member are Since the one-contact member can be electrically connected, the conduction performance can be improved.

  According to the invention described in claim 4, since the first contact member has a bulging portion having a diameter larger than that of the other portion in the middle portion in the longitudinal direction, the bulging portion is formed by cutting or the like. Compared with the case where the corresponding part is formed, it can be formed easily and inexpensively.

  According to the fifth aspect of the present invention, the first contact member is formed with a projection having a smaller diameter than the other portion at the end inserted into the second contact member, and the projection is biased by the biasing means. Since a certain coil spring is fitted, the coil spring does not get caught in the sliding portion between the first contact member and the second contact member. Smooth expansion and contraction of the two-contact member can be performed.

  According to the sixth aspect of the present invention, the socket body in which the first electrical component is accommodated, and the plurality of electrical contacts according to any one of claims 1 to 5 disposed in the socket body. Therefore, the electrical component socket having the above-described effects can be provided.

Embodiments of the present invention will be described below.
Embodiment 1 of the Invention

  1 to 7 show a first embodiment of the present invention.

  First, the configuration will be described. Reference numeral 11 in the figure denotes an IC socket as an “electrical component socket”. By accommodating an IC package 12 as a “first electric component” in the IC socket 11, the IC package 12 And the wiring board 13 which is the “second electrical component” are electrically connected via the IC socket 11.

  This IC package 12 is a so-called BGA (Ball Grid Array) type. A large number of substantially spherical solder balls 12a as “terminals” are arranged in columns and rows on the lower surface of a rectangular package body 12b. Are arranged in a shape.

  The IC socket 11 has a socket body 14 that is mounted on a wiring board 13, and a plurality of contact pins 15 that are “electrical contacts” are disposed on the socket body 14.

  As shown in FIG. 2, the socket body 14 is held by inserting the contact pins 15 into the holding holes 18a and 19a of the upper holding member 18 and the lower holding member 19 which are attached to each other by bolts not shown. Yes.

  Further, the floating plate 20 is arranged on the upper side of the upper holding member 18 so as to be movable up and down by a guide pin (not shown) and stopped at a predetermined height, and is biased upward by a spring (not shown). Has been.

  The upper side of the contact pin 15 is inserted into the insertion hole 20 a of the floating plate 20.

  The contact pin 15 includes a first contact member 26 electrically connected to the IC package 12, a second contact member 27 electrically connected to the wiring board 13, the first contact member 26 and the second contact member 26. It comprises a coil spring 28 as “biasing means” for urging the contact member 27 in opposite directions.

  In the first contact member 26, a conductive plate is formed into a cylindrical shape by bending, and a crown-shaped first contact portion 26a that contacts the solder ball 12a is formed at the upper end portion, and the longitudinal direction (vertical direction). A bulging portion 26b having a diameter larger than that of other portions is formed in the intermediate portion.

  In addition, the first contact member 26 is fitted with a coil spring 28 in which a projection 26c having a smaller diameter than the other part is formed at an end (lower end) inserted into the second contact member 27. .

  On the other hand, the second contact member 27 has a conductive plate material formed into a cylindrical shape by bending, a large-diameter cylindrical portion 27a is formed on the upper side, and a small-diameter cylindrical portion 27b is formed on the lower side. The upper end portion (end portion) of the diameter tube portion 27a is opened to form an opening portion, and the first contact member 26 is inserted from above through the opening portion, and the protruding portion 26c of the first contact member 26, A coil spring 28 is interposed between the large diameter cylindrical portion 27a of the second contact member 27 and the stepped portion 27c of the small diameter cylindrical portion 27b, and is biased in a direction away from each other.

  In addition, a crown-shaped second contact portion 27 d that contacts the electrode portion 13 a of the wiring substrate 13 is formed at the lower end portion of the small diameter cylindrical portion 27 b.

  The holding hole 18a of the upper holding member 18 of the socket body 14 is formed with a small diameter hole 18b on the upper side and a large diameter hole 18c on the lower side, and the first contact member 26 in the large diameter hole 18c. The bulging portion 26b is inserted, and the bulging portion 26b comes into contact with the stepped portion 18d between the small-diameter hole portion 18b and the large-diameter hole portion 18c, so that the rising of the first contact member 26 is stopped. And is configured to be retained.

  Further, the second contact member 27 is configured such that in the lowest lowered state, the stepped portion 27c abuts on the upper surface of the lower holding member 19 and the lowering is stopped to prevent it from coming off.

  On the other hand, in the socket body 14, an opening / closing member 31 is rotatably disposed by a rotation shaft 32, and the opening / closing member 31 is biased in a direction to be opened by a spring (not shown). A pressing member 33 that presses the IC package 12 is disposed on the opening / closing member 31 so as to be movable up and down in the closed state shown in FIG. 1 and is urged downward by a spring 34.

  The socket body 14 is provided with a hook member 35 that is engaged with and disengaged from a locking portion formed at the tip of the opening / closing member 31 so as to be rotatable by a shaft 36. The closed state can be maintained.

  Next, a method for manufacturing the contact pin 15 will be described.

  First, in order to manufacture the first contact member 26 of the contact pin 15, a conductive flat plate is punched into a predetermined shape to form a chevron shape corresponding to the crown-shaped first contact portion 26a, and the bulge is formed. A portion corresponding to the portion 26b is formed.

  Thereafter, the punched plate material is bent (curled) to form a cylindrical shape, whereby the first contact member 26 is formed.

  In order to manufacture the second contact member 27, similarly to the second contact member 26, a conductive flat plate is punched into a predetermined shape and formed into a chevron shape corresponding to the crown-shaped second contact portion 27d. In addition, a portion corresponding to the stepped portion 27c is formed.

  Next, the punched plate material is bent (curled) to form a cylindrical shape, whereby the second contact member 27 is formed.

  As shown in FIG. 6, the bending direction of the first contact member 26 and the second contact member 27 is bent so that a so-called sagging surface at the time of punching is located at the outer peripheral surface side abutting portion P. The inner peripheral surface-side abutting portion Q is subjected to beveling so that no shaving due to burrs occurs during sliding.

  The coil spring 28 is accommodated in the large-diameter cylindrical portion 27a of the second contact member 27 thus molded, and the first contact member 26 is inserted into the large-diameter cylindrical portion 27a of the second contact member 27. Thus, the assembly of the contact pin 15 is completed.

  The contact pin 15 thus formed is inserted and held in the holding holes 18 a and 19 a of the upper holding member 18 and the lower holding member 19 of the socket body 14.

  Next, the operation will be described.

  First, the case where the IC package 12 is accommodated will be described. By previously placing the IC socket 11 on the wiring board 13, the second contact member 27 of the contact pin 15 is brought into contact with the electrode portion 13 a of the wiring board 13. As a result, the second contact member 27 of the contact pin 15 projecting downward from the socket body 14 is pushed by the wiring board 13 and pushed into the socket body 11 (see FIG. 4).

  Then, with the opening / closing member 31 open, the IC package 12 is conveyed by an automatic machine or the like and accommodated on the floating plate 20. At this time, the IC package 12 is placed at a predetermined position on the floating plate 20, and the solder balls 12 a are inserted into the insertion holes 20 a of the floating plate 20 as shown in FIG. 4.

  From this state, the opening / closing member 31 is closed, and the hook member 35 is engaged with the opening / closing member 31, whereby the IC package 12 is pressed downward by the pressing member 33 of the opening / closing member 31. Then, the floating plate 20 is lowered against the urging force of the spring, the solder ball 12a comes into contact with the first contact portion 26a of the first contact member 26 of the contact pin 15, and the first contact member 26 faces downward. Thus, the coil spring 28 is displaced against the urging force (see FIG. 3).

  As a result, the contact pin 15 is compressed against the urging force of the coil spring 28, so that the reaction force causes the first contact portion 26a to be applied to the solder ball 12a of the IC package 12 and the second contact portion 27d. Are brought into contact with the electrode portion 13a of the wiring board 13 with the same predetermined contact pressure.

  As a result, the IC package 12 and the wiring substrate 13 are electrically connected via the contact pins 15, and a burn-in test or the like is performed.

  At this time, since the first contact member 26 of the contact pin 15 is inserted into and in contact with the second contact member 27, the first contact member 26 and the second contact member 27 have only the coil spring 28. As compared with the case where the current flows through, the current flows more easily, and the high frequency characteristics can be improved.

  In such a case, since both the first contact member 26 and the second contact member 27 are formed into a cylindrical shape by bending a plate-like conductive material, Since it is not what was shape | molded by cutting, shaping | molding is easy, can be made cheap, and can also reduce a weight. Since a large number of contact pins 15 are arranged in one IC socket 11, if one contact pin 15 can be reduced in weight, the IC socket 11 as a whole can be significantly reduced in weight. Accordingly, it is possible to reduce the burden on the wiring board 13 on which a large number of IC sockets 11 are arranged.

  Further, since the first contact member 26 and the second contact member 27 are not formed by cutting, there is no breakage due to cutting on the peripheral surface. The sliding resistance during vertical movement can be reduced.

  Furthermore, since the first contact member 26 can integrally form the bulging portion 26b serving as a stopper for restricting the upward withdrawal, compared to the case where the portion corresponding to the bulging portion 26b is formed by cutting or the like. It can be easily and inexpensively molded.

  Moreover, the crown-shaped first contact portion 26a of the first contact member 26 can be formed very easily by forming it with a press as compared with the case of forming it by cutting.

Further, since the first contact member 26 is formed with a protrusion 26c and the coil spring 28 is fitted to the protrusion 26c, the first contact member 26 and the second contact member 27 are positioned. The coil spring 28 is not caught in the sliding portion between the two. Accordingly, the first contact member 26 and the second contact member 27 can be smoothly expanded and contracted.
[Embodiment 2 of the Invention]

  FIG. 8 shows a second embodiment of the present invention.

  A contact pin 39 which is an “electric contactor” of the second embodiment is different from that of the first embodiment.

  That is, the contact pin 39 includes a substantially cylindrical first contact member 40 and second contact member 41, and a coil spring 42 disposed between both the members 40 and 41.

  Each of the contact members 40 and 41 is formed into a cylindrical shape by bending (curling) a conductive plate material, and has large-diameter cylindrical portions 40a and 41a and small-diameter cylindrical portions 40b and 41b. . And it arrange | positions in the state in which the both ends of the coil spring 42 were inserted in both large diameter cylinder parts 40a and 41a.

  And the 1st contact part 40c formed in the small diameter cylinder part 40b of the 1st contact member 40 is on the solder ball 12a of the IC package 12 similar to Embodiment 1, and the small diameter of the 2nd contact member 41 The second contact portion 41c formed in the tube portion 41b is electrically connected to the electrode portion 13a of the wiring board 13 similar to that in the first embodiment.

  Such a contact pin 39 has a simpler structure than that of the first embodiment, and the contact members 40 and 41 are electrically connected via the coil spring 42.

  Since other configurations and operations are the same as those of the first embodiment, description thereof is omitted.

  In the above-described embodiment, the contact pin 15 that is an “electrical contact” is applied to the IC socket 11, but the present invention is not limited to this and can be applied to other types. Further, the present invention is applied to the IC socket 11 for the BGA type IC package 12, but the present invention is not limited to this, and terminals are provided on the lower surface of the IC package such as LGA (Land Grid Array) type and PGA (Pin Grid Array) type. The present invention can also be applied to an IC package for an IC package provided with terminals extended from the side of the IC package, such as an IC package provided and a QFP (Quad Flat Package) type.

  In addition, the socket for electrical parts of the present invention can be applied to a so-called open top type IC socket or a socket provided with a pusher for pressing the electrical parts on the automatic machine side.

It is the side view which carried out the cross section of the left half of the IC socket which concerns on Embodiment 1 of this invention. It is an expanded sectional view which shows the contact pin arrangement | positioning part of IC socket which shows the state before IC package accommodation based on the Embodiment 1. FIG. It is an expanded sectional view which shows the contact pin arrangement | positioning part of IC socket which shows the IC package accommodation state which concerns on the same Embodiment 1. FIG. It is an expanded sectional view which shows the socket main body and the contact pin in the contact pin arrangement | positioning part of the IC socket which concerns on the same Embodiment 1. FIG. It is a figure which shows the 1st contact member of the contact pin of the IC socket which concerns on the same Embodiment 1, (a) is a front view of the 1st contact member, (b) is a right view of (a). It is a cross-sectional view showing the first contact member of the contact pin of the IC socket according to the first embodiment. It is sectional drawing which shows the connection state etc. of the 1st contact member of the contact pin of the IC socket which concerns on the same Embodiment 1, and a coil spring. It is an expanded sectional view of the contact pin which concerns on Embodiment 2 of this invention. It is an expanded sectional view which shows a prior art example.

Explanation of symbols

11 IC socket (Socket for electrical parts)
12 IC package (electrical parts)
12a Solder ball (terminal)
12b Package body
13 Wiring board
13a Electrode section
14 Socket body
15 Contact pin (electric contact)
18 Upper holding member
19 Lower holding member
20 Floating plate
26 First contact member
26a First contact part
26b bulge
26c protrusion
26d obstruction piece
27 Second contact member
27a Large diameter tube
27b Small diameter cylinder
27c Step
27d Second contact part
28 Coil spring

Claims (6)

A first contact member having a first contact portion in contact with the first electrical component; a second contact member having a second contact portion in contact with the second electrical component; and both the first and second contacts. Biasing means for biasing the members in opposite directions,
The electric contact according to claim 1, wherein the first and second contact members are formed into a cylindrical shape by bending a conductive plate material.   The electrical contact according to claim 1, wherein at least one of the first contact portion of the first contact member or the second contact portion of the second contact member has a crown shape.   The end of the second contact member is opened to provide an opening, the first contact member is inserted from the opening, and the urging means is provided in the second contact member. The electrical contact according to claim 1, wherein:   The electric contact according to claim 3, wherein the first contact member is formed with a bulging portion having a diameter larger than that of the other portion at an intermediate portion in the longitudinal direction.   In the first contact member, a protrusion having a smaller diameter than that of the other part is formed at an end inserted into the second contact member, and a coil spring as the urging means is fitted into the protrusion. The electric contact according to claim 3, wherein the electric contact is provided. The second electrical component is a wiring board;
A socket body disposed on the wiring board and accommodating the first electrical component on the upper side;
An electrical component socket, comprising: a plurality of electrical contacts according to any one of claims 1 to 5 disposed in the socket body.

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