JP2006266869A - Contact pin and socket for electrical component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contact pin having the small number of components and a simple structure, capable of taking a large expansion/contraction quantity, and a socket for an electrical component on which the contact pin is disposed. <P>SOLUTION: In this contact pin 16, contact parts 17, 18 which are formed of a plate-shaped conductive material, and to be brought into contact with other electrical components and to be electrically connected thereto are formed on both ends, and a spring part 19 is formed between both contact parts 17, 18. The contact pin 16 is constituted so that the whole body is bent cylindrically around the axis extending in the longitudinal direction, and that, as for the spring part 19, each tip part 19a bent and facing mutually in the circumferential direction is slid in the axial direction at the expansion/contraction time in the axial direction of the spring part 19. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a contact pin that is disposed in an electrical component socket that detachably houses an electrical component such as a semiconductor device (hereinafter referred to as an “IC package”) and is electrically connected to a terminal of the electrical component, and The present invention relates to an electrical component socket in which contact pins are provided.

  Conventionally, as this kind of thing, there exists a thing as described in patent document 1, for example. That is, as shown in FIG. 14 and FIG. 15, in this Patent Document 1, a “contact probe 1 (corresponding to a contact pin) is provided at a cylindrical holding body 2 and at both ends in the holding body 2. A pair of contact portions 3 and 4 and a spring body 5 which is accommodated in the holding body 2 and interposed between the pair of contact portions 3 and 4, and holds at least one of the contact portions 3 and 4. The movable contact portion is movable with respect to the body 2, and a part of the movable contact portion is always protruded outward by the urging force of the spring body 5. It is comprised by the elastic structure integrally molded by at least one of a pair of contact parts 3 and 4. ".

The contact portions 3 and 4 and the spring body 5 are formed on the outer peripheral surface of the cylindrical forming pin 40 as shown in FIG. 15C after the plate material is punched as shown in FIG. By being pressed and rounded so as to be wound along, it is not necessary to form the contact portions 3 and 4 and the spring body 5 as separate bodies, and the number of parts can be reduced.
Japanese Patent Laid-Open No. 2002-31648.

  However, in such a conventional device, the bent portions 5a and 5b facing each other are inserted between the opposite bent portions 5a and 5b in a state where the spring body 5 is rolled into a cylindrical shape. It is configured to be. That is, the bent part 5a is inserted between a pair of adjacent bent parts 5b, and the bent part 5b is inserted between a pair of adjacent bent parts 5a. Then, the adjacent bent portions 5a and 5b overlap in the axial direction of the contact probe 1, and when the spring body 5 is expanded and contracted, the adjacent bent portions 5a and 5b easily interfere with each other. The amount of expansion / contraction cannot be increased, and in particular, when the contact probe 1 cannot have a long overall length, the amount of expansion / contraction becomes shorter.

  Accordingly, an object of the present invention is to provide a contact pin having a small number of parts, a simple structure, and a large amount of expansion / contraction, and a socket for an electrical component provided with the contact pin. .

  In order to achieve such an object, the invention according to claim 1 is formed of a plate-like conductive material, and contact portions that are in contact with and electrically connected to other electrical components are formed at both ends. In the contact pin in which a spring portion is formed between both contact portions, the whole is bent into a cylindrical shape around an axis extending in the longitudinal direction, and the spring portions are bent and opposed to each other in the circumferential direction They are contact pins configured to slide in the axial direction when the spring portions extend and contract in the axial direction.

  In addition to the structure of Claim 1, the invention of Claim 2 is formed in a wave shape in the unfolded state before being bent into the cylindrical shape, and this is bent into a cylindrical shape. It is formed.

  According to a third aspect of the present invention, in addition to the configuration according to the first aspect, the spring portion has a plurality of long plate portions that are long in a direction perpendicular to the axis in a deployed state before being bent into the cylindrical shape. The long plate portion is formed with a slit along the direction perpendicular to the axis, and is formed by being bent into a cylindrical shape. It is characterized by that.

  According to a fourth aspect of the present invention, there is provided a socket body that is disposed on the wiring board and accommodates electrical components, and the contact pin according to any one of the first to third aspects is provided on the socket body. For electrical components, wherein the contact portion on one end side of the contact pin is electrically connected to the electrode of the wiring board, and the contact portion on the other end side is electrically connected to the terminal of the electrical component. It is a socket.

  According to the first aspect of the present invention, the entire contact pin is bent into a cylindrical shape around an axis extending in the longitudinal direction, and the spring portions are bent and the tip portions facing each other in the circumferential direction, Since it is configured to slide in the axial direction when the spring part is expanded or contracted in the axial direction, the contact pin and the spring part are integrally formed, so that the number of parts can be reduced and the spring part can be reduced. Since the tip parts of the spring parts are spaced apart in the circumferential direction, the tip parts do not interfere with each other at the time of expansion and contraction of the spring part. Even if the total length of the contact pin is short, the amount of expansion and contraction can be secured. Therefore, it is possible to reduce the size of the electrical component socket in which the contact pins are arranged. Moreover, since the tip portions slide and conduct, the electrical conductivity of the spring portion can be improved.

  According to a fourth aspect of the present invention, there is provided a socket body which is disposed on the wiring board and accommodates electrical components, and the contact pin according to any one of the first to third aspects is provided on the socket body. An electrical component socket, wherein the contact portion on one end side of the contact pin is electrically connected to the electrode of the wiring board, and the contact portion on the other end side is electrically connected to the terminal of the electrical component. For this reason, since the contact pins capable of shortening the overall length are provided in a state where the amount of expansion and contraction is ensured, the electrical component socket can be reduced in size.

Embodiments of the present invention will be described below.
Embodiment 1 of the Invention

  1 to 5 show a first embodiment of the present invention.

  First, the configuration will be described. Reference numeral 11 in FIG. 1 denotes a surface mount IC socket as an “electrical component socket”. The IC socket 11 is used to perform a performance test of the IC package 12 as an “electrical component”. The solder balls 12b that are “terminals” of the IC package 12 and the wiring board P on the IC test apparatus side are electrically connected.

  The IC package 12 is a so-called BGA (Ball Grid Array) type package, and a large number of solder balls 12b protrude downward from the bottom surface of a rectangular plate-shaped package body 12a (see FIG. 3).

  On the other hand, the IC socket 11 has a base member 14 and an adapter member 15 in which the socket body 13 has insulation properties, and a plurality of contact pins 16 are disposed on the IC socket 11.

  As shown in FIG. 4, the contact pin 16 is formed of a plate-like conductive material, contact portions 17 and 18 are formed at both ends, and a spring portion 19 is provided between the contact portions 17 and 18. Is formed.

  Both the contact portions 17 and 18 and the spring portion 19 are bent in a cylindrical shape around an axis O extending in the longitudinal direction.

  The contact portions 17 and 18 are respectively composed of base end portions 17a and 18a having large diameters and tip side portions 17b and 18b having smaller diameters, and the tip side portions 17b and 18b are respectively provided with concave and convex crowns. Shaped crown portions 17c and 18c are formed.

  The crown portion 17c of the one contact portion 17 is in contact with and electrically connected to the solder ball 12b of the IC package 12, and the crown portion 18c of the other contact portion 18 is in contact with the electrode of the wiring board P. To be electrically connected.

  Further, the spring portion 19 is formed in a wave shape as shown in FIG. 5 in a deployed state before being bent into a cylindrical shape, and is formed by being bent into a cylindrical shape. As shown in FIG. 4, in a state where it is bent into a cylindrical shape, the tip portions 19a facing each other are configured to slide in the axial direction when the spring portion 19 expands and contracts in the axial direction. Yes. The corner portions 19b of the tip portions 19a are formed in an R shape, and are configured such that the R shape corner portions 19b come into contact with each other and slide when they are shortened.

  The contact pin 16 is inserted and disposed in the through holes 14 a and 15 a formed in the base member 14 and the adapter member 15.

  Specifically, as shown in FIG. 3, the through hole 14 a of the base member 14 has a different diameter between the upper side portion 14 b and the lower side portion 14 c, and the lower side portion 14 c is the base end of the contact portion 17 of the contact pin 16. The diameter of the part 17 a and the upper part 14 b are formed to have substantially the same diameter as the diameter of the tip side part 17 b of the contact part 17. As a result, the contact portion 17 inserted into the through hole 14a from below is such that the upper surface of the base end portion 17a contacts the stepped portion 14d at the boundary between the upper side portion 14b and the lower side portion 14c of the through hole 14a. This prevents the upward jumping out.

  The crown portion 17c of the contact portion 17 is set so as to protrude upward from the upper surface of the base member 14 by a predetermined length.

  Further, the diameter of the through hole 15a of the adapter member 15 is different between the upper side portion 15b and the lower side portion 15c, and the upper side portion 15b is formed to have substantially the same length as the diameter of the base end portion 18a of the contact pin contact portion 18. In addition, the lower side portion 15c is formed to have a diameter substantially the same as the diameter of the distal end side portion 18b of the contact portion 18. As a result, the contact portion 18 inserted into the through hole 15a from above has the bottom surface of the base end portion 18a abutting on the step portion 15d at the boundary between the upper side portion 15b and the lower side portion 15c of the through hole 15a. Therefore, it is configured to prevent downward falling.

  The crown portion 18c of the contact portion 18 is set so as to protrude downward from the lower surface of the adapter member 15 by a predetermined length before being attached to the wiring board P (see FIG. 3).

  The spring portion 19 biases both the contact portions 17 and 18 away from each other.

  The base member 14 and the adapter member 15 are positioned by the reference pin 21 and fixed by a bolt 22 and a nut 23, whereby the contact pin 16 is incorporated and disposed between them.

  Next, a method for forming the contact pin 16 of the IC socket 11 having such a configuration will be described.

  This contact pin 16 intermittently conveys a strip-shaped material by using a press apparatus that performs press molding, and sequentially presses and molds it using a plurality of dies arranged sequentially in this conveyance path.

  That is, first, a conductive plate material is punched out by pressing as shown in FIG. In this case, the width H1 of the portion that becomes the base end portions 17a and 18a of the contact portions 17 and 18 and the width H2 of the portion that becomes the spring portion 19 are formed to be equal, and the tip side portions of the contact portions 17 and 18 are formed. The width H3 of the portion that becomes 17b, 18b is formed narrower than the width H1 of the portion that becomes the base end portions 17a, 18a of the contact portions 17, 18.

  Next, this is sequentially press-molded by a plurality of molds so that the tip portions 19a of the spring portion 19 facing each other slide in the axial direction when the spring portion 19 extends and contracts in the axial direction. Form. Further, the corner portions 19b of the tip portions 19a are formed in an R shape, and are formed close to each other so that the R shape corner portions 19b slide with each other during expansion and contraction.

  At this time, the portion that becomes the stepped portion at the boundary between the base end portions 17a and 18a of the contact portions 17 and 18 and the distal end side portions 17b and 18b is formed by extending the material.

  The IC socket 11 is placed on the wiring board P, so that the crown part 18c protruding below the contact part 18 is in pressure contact with the electrode of the wiring board P.

  From this state, by accommodating the IC package 12 on the base member 14, the solder ball 12 b is pressed against the crown portion 17 c of the contact portion 17, and the contact portion 17 is lowered against the urging force of the spring portion 19. .

  Thereby, the crown portion 17c of the contact portion 17 is brought into contact with the solder ball 12b of the IC package 12 with a predetermined force by the biasing force of the spring portion 19, and the crown portion 18c of the contact portion 18 is made of the wiring board P. The electrode is brought into contact with the electrode with a predetermined force, and a predetermined conductivity can be ensured.

  At this time, the tip portions 19a of the spring portion 19 facing each other are formed so as to slide in the axial direction when the spring portion 19 expands and contracts in the axial direction. Since the tip portions 19a do not interfere with each other as in the prior art and the shortening does not stop, the amount of expansion / contraction can be increased compared to the conventional case, and even if the total length of the contact pin 16 is short, the amount of expansion / contraction can be reduced. Can be secured. Therefore, the IC socket 11 can be downsized. Moreover, since the corner portion 19b of the tip portion 19a is formed in an R shape, even if a slight molding error occurs, the tip portions 19a can be reliably connected to each other by sliding the corner portions 19b in contact with each other. Can be slid.

  Then, a burn-in test or the like is performed. In this case, a current flows between the wiring board P, the contact pins 16, and the IC package 12.

  In this case, since the tips 19a slide and conduct, the path of the current flowing through the contact pin 16 is shortened, and the high frequency characteristics can be improved.

  Further, by forming the width H1 of the portion that becomes the base end portions 17a and 18a of the contact portions 17 and 18 and the width H2 of the portion that becomes the spring portion 19, the width of the spring portion is increased as in the conventional case. However, as compared with the width of the contact portion, there is no need for useless members, and the yield can be improved.

Further, the contact pin 16 is composed of both contact portions 17 and 18 and a spring portion 19 and is not provided with the conventional holding body 2, so that the number of parts and the number of assembly steps can be reduced, and the base member 14 and Since it is only necessary to sandwich the adapter member 15, the arrangement can be performed very easily.
[Embodiment 2 of the Invention]

  6 to 8 show a second embodiment of the present invention.

  In the second embodiment, the structure of the spring portion 20 of the contact pin 16 is different from that of the first embodiment.

  That is, the spring portion 20 is in a developed state before being bent into a cylindrical shape, and as shown in FIG. 8, a plurality of long plate portions 24a that are long in a direction orthogonal to the axis O direction are connected by a connecting portion 24b. The long plate portions 24a are formed side by side in the direction of the axis O, and slits 24c are formed along a direction perpendicular to the direction of the axis O, which are bent into a cylindrical shape. The spring portion 20 expands and contracts in the axial direction by the slit 24c and the like.

Other configurations and operations are the same as those in the first embodiment, and thus description thereof is omitted.
Embodiment 3 of the Invention

  9 to 11 show a third embodiment of the present invention.

  The third embodiment is different from the first embodiment in that a short-circuit piece 20 is formed.

  That is, the short-circuit piece 20 is extended downward through the spring portion 19 from the upper contact portion 17 side, and the lower end portion 20a (tip portion) of the short-circuit piece 20 is slightly bent, and the lower side Is inserted into the contact portion 18.

  As shown in FIG. 10A, when the spring portion 19 is not compressed and the contact pin 16 is extended, the lower end portion 20a of the short-circuit piece 20 is brought into contact with the lower contact portion 18. Further, as shown in FIG. 10B, in a state where the spring portion 19 is compressed and the contact pin 16 is shortened (IC package accommodation state), the lower end portion 20a is in sliding contact with the contact portion 18. Thus, the upper contact portion 17 and the lower contact portion 18 are electrically connected via the short-circuit piece 20.

  As a result, since both the contact portions 17 and 18 are conducted through the short-circuit piece 20, the electric circuit can be further shortened and the high-frequency characteristics can be improved.

  Further, since the short-circuit piece 20 is integrally extended from the contact portion 17 as shown in a development view before forming the contact pin 16 shown in FIG. 11, it can be easily formed without increasing the number of parts. .

  Since other configurations and operations are the same as those of the first embodiment, description thereof is omitted.

  In the above embodiment, the present invention is applied to the IC socket 11 for the BGA type IC package 12. However, the present invention is not limited to this, and the LGA (Land Grid Array) type, the PGA (Pin Grid Array) type, etc. The present invention can be applied to an IC package in which terminals are provided on the lower surface of the IC package and IC sockets for IC packages in which terminals are extended from the side of the IC package, such as a QFP (Quad Flat Package) type. it can.

  In addition, the electrical component socket according to the present invention is provided with a so-called clamshell type IC socket having a cover for pressing the IC package, a so-called open top type IC socket, or a pusher for pressing the electrical component on the automatic machine side. It can also be applied to those that have been made.

  Furthermore, the spring portion is not limited to the ones in the above embodiments, and may have any shape as long as it elastically deforms and expands and contracts to generate an urging force.

  By the way, in FIG.12 and FIG.13, it shows about the case where the plate part is pressed and the spring part 29 is formed. That is, first, as shown in FIG. 13, the plate material is punched into a state where the substantially semicircular arc portions 30 are connected by the connecting portion 31. Then, the spring part 29 of a three-dimensional shape as shown in FIG. 12 is shape | molded by bend | folding in the predetermined direction from each fold line 32 shown with a dashed-two dotted line in FIG. Thus, the spring part 29 can be easily and inexpensively formed by punching the plate material and performing press forming.

  And although not shown in the upper and lower ends of such a spring part 29, a contact pin can be shape | molded by integrally forming a contact part. Such contact pins can be arranged in the IC socket of the first embodiment.

  Up to now, an example in which the plate material is formed by stamping by press working has been shown, but the present invention is not limited to this, and it can be formed by plating or etching.

It is a top view of the IC socket which concerns on Embodiment 1 of this invention. FIG. 2 is a cross-sectional view taken along line AA of FIG. 1 according to the first embodiment. It is a principal part expanded sectional view which shows the arrangement | positioning state of the contact pin of the IC socket which concerns on the same Embodiment 1. FIG. It is a figure which shows the contact pin which concerns on the same Embodiment 1, (a) is a front view of the contact pin, (b) is a right view of (a). FIG. 3 is a development view of the contact pin according to the first embodiment. It is a figure which shows the contact pin which concerns on Embodiment 2 of this invention, (a) is a front view of the contact pin, (b) is a top view of (a). FIG. 7 is a left side view of FIG. 6A showing a contact pin according to the second embodiment. It is an expanded view of the contact pin which concerns on the same Embodiment 2. It is a figure which shows the contact pin which concerns on Embodiment 3 of this invention, (a) is a front view, (b) is a top view. It is a figure which shows the contact pin which concerns on the same Embodiment 3, (a) is the front view which sectioned a part, (b) is a sectional view which shows the short circuit piece and the contact part of the state which shortened the spring part. It is an expanded view of the contact pin which concerns on the same Embodiment 3. It is a perspective view which shows the spring part of a contact pin. It is an expanded view of the spring part. It is sectional drawing of the contact probe which shows a prior art example. It is a perspective view which shows the shaping | molding method of the contact probe which shows the prior art example.

Explanation of symbols

11 IC socket (socket for electrical parts)
12 IC package (electrical parts)
12b Solder ball (terminal)
13 Socket body
14 Base material
14a Through hole
14d step
15 Adapter member
15a Through hole
15d step
16 Contact pin
17,18 Contact part
17a, 18a Base end
17b, 18b Tip side
17c, 18c crown
19,24 Spring
19a, 24d Tip
24a Long plate
24b connecting part
24c Slit O Longitudinal axis P Wiring board

Claims (4)

In a contact pin formed of a plate-like conductive material, a contact portion that is in contact with and electrically connected to another electrical component is formed at both ends, and a spring portion is formed between the two contact portions.
The whole is bent into a cylindrical shape around an axis extending in the longitudinal direction, and the tip portions of the spring portions that are bent and face each other in the circumferential direction are axially moved when the spring portions extend and contract in the axial direction. It is comprised so that it may slide in, The contact pin characterized by the above-mentioned.   The contact pin according to claim 1, wherein the spring portion is formed in a wave shape in a developed state before being bent into the cylindrical shape, and is formed by being bent into a cylindrical shape.   The spring portion is formed in a deployed state before being bent into the cylindrical shape, and a plurality of long plate portions that are long in a direction perpendicular to the axis are connected by a connecting portion and aligned in the axial direction. The contact pin according to claim 1, wherein a slit along the direction perpendicular to the axis is formed in the long plate portion, and the slit is bent into a cylindrical shape.   It has a socket main body which is arrange | positioned on a wiring board and accommodates an electrical component, The contact pin as described in any one of the said Claims 1 thru | or 3 is arrange | positioned in this socket main body, One end of this contact pin The electrical component socket, wherein the contact portion on the side of the part is electrically connected to the electrode of the wiring board, and the contact portion on the side of the other end is electrically connected to the terminal of the electrical component.

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