JP2007048576A - Adaptor socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adaptor socket that allows a mounted IC socket to be exchanged easily, can be exchanged easily, and can reduce its height without losing electrical characteristics. <P>SOLUTION: The adaptor socket comprises a first insulating substrate, a second one arranged under the first one, and a plurality of probes. The plurality of probes are arranged so that they can move up and down via a coil spring between the first and second insulating substrates. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an adapter socket in which an IC socket on which a semiconductor device such as an IC package is mounted can be exchanged for a test board or the like. More specifically, the IC socket can be easily exchanged and the adapter socket itself can be exchanged. It relates to the adapter socket that can be made

  Conventionally, when a semiconductor device such as an IC package is screened by performing an electrical test or a burn-in test, the socket for a semiconductor device ("IC socket") disposed on a printed wiring board such as a test board or a burn-in board is used. The electrical connection between the semiconductor device and the printed wiring board is made through the above.

  By the way, conventionally, the connection terminal of the IC socket is usually soldered through a through hole provided in a printed wiring board such as a test board. For this reason, when replacing an IC socket that can no longer be used due to its life, a printed wiring board such as a test board is also replaced at the same time.

  However, a printed wiring board such as the test board is more expensive and has a longer life than an IC socket. Therefore, in order to eliminate the waste of exchanging such an expensive and long-life printed wiring board every time the IC socket is replaced, that is, discarding it, only the IC socket can be exchanged by interposing between the IC socket and the printed wiring board. The adapter socket which was made is proposed (refer patent document 1).

  As such a contact shape of the adapter socket, as disclosed in Patent Documents 2 to 4, a round pin type or a thin plate that is formed by bending and proposing it has been proposed.

Japanese Patent No. 3246219 Japanese Patent No. 2967507 JP-A-5-326090 Japanese Utility Model Publication No. 6-72169

  The adapter socket which has been proposed so far is mounted by soldering through a through hole provided in a printed wiring board such as a test board as a usage pattern. Therefore, as in the case of the IC socket, it is difficult to replace or maintain the adapter socket due to the life of the adapter socket or to transfer to another test board. In addition, when testing semiconductor devices, there are cases where test boards are stacked at regular intervals in a test tank or a rack for transport, etc. When an IC socket is mounted on a test board using an adapter socket, The overall height of the board becomes high, and there are cases where conventional test equipment cannot be used.

  In view of such problems, the object of the present invention is to easily replace an IC socket to be mounted, and also to easily replace the IC socket itself. Further, it is possible to reduce the height without impairing electrical characteristics. It is to provide a feasible adapter socket.

  In order to achieve the above object, an adapter socket according to the present invention includes a first insulating substrate, a second insulating substrate disposed under the first insulating substrate, and a plurality of contacts. The contact is arranged between the first insulating substrate and the second insulating substrate so as to be movable up and down via a coil spring.

  More specifically, in the adapter socket according to the present invention, the contactor includes a pair of contact portions, a pair of elastic deformation portions, a wide flange portion and a terminal portion, and the coil spring is interposed via the wide flange portion. The contact may be urged downward, and the first insulating substrate may be provided with a slit in which a pair of contact portions of the contact is disposed, or the contact Includes a wide contact portion and a pair of elastically deformable legs, and the coil spring biases the contact upward through the wide contact portion, and a lower portion of the coil spring is tapered. The structure provided with the contact | adherence winding part containing a part may be sufficient.

  Moreover, it is preferable that the said contactor is produced by punching a metal plate by press work.

  The adapter socket according to the present invention has the above-described configuration, so that the structure is simple, but the electrical socket is highly reliable and the IC socket can be easily replaced, and the adapter socket itself can be easily replaced. It is. Furthermore, the height of the adapter socket can be reduced, it is easy to manufacture, and the manufacturing cost is low.

  Hereinafter, the details of the adapter socket according to the present invention will be described with reference to the drawings.

  First, an overall configuration for mounting a semiconductor device socket on a test board using an adapter socket according to the present invention will be described. FIG. 1 shows a schematic side view in which an IC socket and an adapter socket are mounted on a test board.

  In FIG. 1, reference numeral 1 denotes a semiconductor device socket (hereinafter referred to as “IC socket”). As shown in FIG. 1, the IC socket 1 is formed by sandwiching the adapter socket 40 according to the present invention between the IC socket 1 and the printed wiring board 50 using, for example, a fixing bracket such as a bolt. It can be mounted on the test board 50 as a board in a replaceable manner. Alternatively, the IC socket 1 can be mounted on the test board 50 by being inserted from above into the adapter socket 40 according to the present invention that is attached to the test board 50 in a replaceable manner.

  The IC socket 1 shown in FIG. 1 includes a socket cover 10, a socket body 20 having a mounting portion (not shown) on which a semiconductor device is mounted, and a plurality of contacts 30 provided on the socket body 20. The contact 30 is in electrical contact with the semiconductor device mounted on the upper side, and is in electrical contact with the contact 46 of the adapter socket contact 45 of the adapter socket 40 on the lower side. The IC socket 1 shown in FIG. 1 is known as a so-called open top IC socket.

  The socket cover 10 is attached to the socket body 20 so as to be movable up and down. The semiconductor device is mounted on the socket body 20 by using the vertical movement of the socket cover 10.

  As will be described in detail below, the adapter socket 40 basically includes an insulating member and a plurality of contacts provided on the insulating member and biased by an elastic member such as a coil spring. The adapter socket 40 is assembled as shown in FIG. 1 to electrically connect the IC socket 1 and the test board 50. As a result, the semiconductor device mounted on the IC socket 1 and the test board are electrically connected.

  The adapter socket 40 according to the present invention is not limited to the open top type IC socket as shown in the figure as the IC socket 1 to be mounted.

  Further, the contact 30 of the IC socket 1 may have any shape as long as it is suitable for the semiconductor device to be mounted. For example, the contact 30 is electrically in contact with the external contact of the semiconductor device. Alternatively, it may be in electrical contact by abutting against an external contact of the semiconductor device. In short, any contact member that is in electrical contact with the semiconductor device to be mounted may be used.

(First embodiment)
2 to 5 show a first embodiment of an adapter socket according to the present invention. FIG. 2 is a top view of the adapter socket. 3 is a schematic cross-sectional view of the adapter socket shown in FIG. 2, (a) is an XX cross-sectional view of the adapter socket of FIG. 2, and (b) is an enlarged cross-sectional view of the main part of (a). It is. 4 is a schematic cross-sectional view of the adapter socket shown in FIG. 2, (a) is a YY cross-sectional view of the adapter socket of FIG. 2, and (b) is an enlarged cross-sectional view of the main part of (a). It is. FIG. 5 is an enlarged perspective view of a contact used in the adapter socket of FIG.

  The adapter socket 40 according to the present embodiment is roughly connected to the first insulating substrate 41, the second insulating substrate 42, the fixing cover 43, and the contact 30 of the IC socket 1 and the external terminal of the test board 50. A plurality of adapter socket contacts 45 are included.

  The first insulating substrate 41 is positioned below the top plate portion 41a so as to form a stepped portion with the top plate portion 41a having a substantially square shape when viewed from above, and the entire circumference of the top plate portion 41a. The flange part 41b which surrounds is provided.

  The top plate portion 41a of the first insulating substrate 41 is formed with insertion holes 41d arranged in a matrix (lattice) corresponding to the external terminals of the contacts 30 of the IC socket 1 (see FIG. 1) to be mounted. The A conical surface 41c that opens upward is preferably formed above the insertion hole 41d. By this conical surface 41c, the external terminal of the contact 30 of the IC socket 1 is smoothly guided into the insertion hole 41d. Below the insertion hole 41 c, a slit 41 e is formed so that a contact portion 46 a at the upper end of a contact (hereinafter simply referred to as “contact”) 46 of the adapter socket contact 45 can be disposed. The slit 41e is formed so as to be common to a plurality of insertion holes 41d (see FIG. 2) arranged in a horizontal row, as shown in FIGS. 3B and 4B, for example. Is preferred. The width s (see FIG. 4B) of the slit 41e is slightly larger than the thickness t (see FIG. 5) of the contact 46. By forming the slit 41e in this way, not only is the manufacturing easier than forming the slit corresponding to each insertion hole 41d, but also the rotation of the contact 46 around the longitudinal axis is prevented, and the contact portion 46a. There will be no hindrance to opening and closing. The slit 41e preferably further includes an inclined surface 41f that expands downward to facilitate introduction of the contact portion 46a of the contact 46.

  In addition, positioning pins 41g are formed on the flange portion 41b of the first insulating substrate 41 so as to protrude downward at appropriate positions (in this embodiment, four locations).

  The second insulating substrate 42 is composed of a substantially square substrate body 42a having substantially the same size as the bottom surface outline of the IC socket 1 when viewed from above. In the central portion of the substrate body 42a, a plurality of through holes 42c arranged in a matrix corresponding to the insertion holes 41d arranged in the matrix provided in the first insulating substrate 41 are formed. A contact 46 is disposed in the through hole 42c. The lower side of the through hole 42c, that is, the printed wiring board 50 side, is formed as a small-diameter hole 42d that is reduced in diameter so that the terminal portion 46d of the contact 46 can pass through. Therefore, as shown in FIG. 3B, the through hole 42c forms a stepped portion 42e on the lower side.

  The second insulating substrate 42 accommodates the flange portion 41b of the first insulating substrate 41 on the upper surface of the substrate body 42a. The concave portion 42b whose outer shape is square when viewed from above is formed in a matrix. It is formed so as to surround the plurality of arranged through holes 42c. A positioning hole (not shown) for receiving a positioning pin 41g formed on the flange portion 41b of the first insulating substrate 41 is further formed on the bottom surface of the recess 42b. The depth of the recess 42b is set such that when the flange portion 41b is accommodated, the upper surface of the flange portion 41b and the upper surface of the substrate body 42a are flush with each other. Furthermore, fixing screw holes (four in this embodiment) 42f and an adapter socket 40 are mounted on the test board 50 together with the IC socket 1 at appropriate positions outside the recess 42b. Bolt holes for mounting only the adapter socket 40 on the test board 50 (in this embodiment, four locations; not shown) are formed.

  The fixing cover 43 has a substantially square shape having the same size as the second insulating substrate 42 when viewed from above, and has a substantially square opening slightly larger than the top plate portion 41a of the first insulating substrate 41 at the center. 43a. In the fixing cover 43, threaded fixing screw holes 43b (four in this embodiment) are formed corresponding to the fixing screw holes 42f of the second insulating substrate 42. The first insulating substrate 41 is fixed to the second insulating substrate 42 by the fixing cover 43 to constitute the adapter socket 40. At this time, the top plate portion 41a of the first insulating substrate 41 is accommodated in the opening 43a of the fixing cover 43, and as shown in FIG. 3A, the top surface of the fixing cover 43 and the top plate portion 41a. It is preferable that the upper surface of the surface is substantially flush. The fixing cover 43 also has bolt holes (in this embodiment, four locations) for mounting the adapter socket 40 together with the IC socket 1 to the test board 50 or mounting only the adapter socket 40 to the test board 50. ; Not shown). Further, positioning holes 43c (two locations in this embodiment) with the IC socket 1 are formed on the upper surface of the fixing cover 43. The fixing cover 43 is preferably made of metal in order to strengthen the adapter socket 40, but is not limited thereto. In the present embodiment, the first insulating substrate 41 and the fixing cover 43 are configured as separate members, but may be configured as a single member. In this case, it is obvious that the member is made of an insulating material and has the same shape as the second insulating substrate 42 as viewed from above.

  A contact 46 constituting the adapter socket contact 45 is shown in FIG. The adapter socket contact 45 includes a contact 46 that electrically connects the IC socket 1 and the test board 50, and a coil spring 48 that biases the contact 46 downward.

  The contact 46 is produced by punching a conductive metal plate into a vertically long U shape by pressing. The contact 46 is electrically connected to a pair of contact portions 46a, a pair of elastic deformation portions 46b capable of opening and closing the pair of contact portions 46a, a wide flange portion 46c, and an external terminal of a test board 50 as a printed wiring board. The terminal part 46d which contacts is included. The contact 46 constitutes an adapter socket contact 45 together with a coil spring 48 placed above the flange 46 c, and is disposed in the through hole 42 c of the second insulating substrate 42. The width w of the flange 46c is slightly smaller than the diameter of the through hole 42c of the second insulating member 42 to be disposed, and is larger than the diameter of the small diameter hole 42d formed below the through hole 42c. It is set slightly larger than the outer diameter.

  When the adapter socket 40 is assembled, the contact 46 is urged downward by the coil spring 48 via the flange 46c. At this time, the flange portion 46c comes into contact with the stepped portion 42e in the through hole 42, and the contact 46 is prevented from popping out. In this state, the terminal portion 46d is set so as to protrude from the bottom surface of the second insulating substrate 42 through the small diameter hole 42d. Specifically, it is set as follows. That is, when the adapter socket 40 is mounted on the test board 50 as a printed wiring board, the contact 46 moves upward by the amount of protrusion of the terminal portion 46d, thereby compressing the coil spring 48 by this amount of protrusion. Therefore, the contact pressure between the terminal portion 46 d and the external contact of the test board 50 is determined by the amount of protrusion of the terminal portion 46 d from the bottom surface of the second insulating substrate 42 and the spring constant of the coil spring 48.

  More preferably, the coil spring 48 is in a pre-compressed state, that is, in a pre-pressurized state (preload) when the adapter socket 40 is assembled. In this case, the contact pressure is a preload pressure. With this configuration, the amount of compression of the coil spring 48 can be increased with respect to the amount of protrusion of the terminal portion 46 d of the contact 46, and therefore the contact pressure due to manufacturing variations of the contact 46, the second insulating substrate 42, or the coil spring 48. Can reduce the impact.

  From the above, when the desired contact pressure and the spring constant of the coil spring 48 are determined, the protruding amount of the terminal portion 46d is determined. Further, when the adapter socket 40 is mounted on the test board 50, the contact portion 46a of the terminal portion 46 is positioned in consideration of the fact that it moves upward by the protruding amount of the terminal portion 46d of the contact 46 as described above. It will be understood that the depth of the slit 41e of the first insulating member 41 may be set slightly larger than this protruding amount.

  The contact 46 of the adapter socket contact 45 in the present embodiment is also configured to sandwich the external terminal of the contact 30 of the IC socket 1 by opening and closing the pair of contact portions 46a. At this time, the contact 46 itself does not move up and down. As a result, the contact 46 can be made smaller and the vertical movement of the contact 46 can be omitted. As a result, the height of the adapter socket contact 45 can be reduced, and consequently the height of the adapter socket 40 can be reduced. Can be kept low.

  As described above, the coil spring 48 as the elastic member constituting the adapter socket contact 45 urges the contact 46 downward, and its outer diameter is the width w of the flange 46c of the contact 46. The width is set slightly smaller and larger than the width s of the slit 41e formed in the top plate portion 41a of the first insulating member 41. Therefore, when the adapter socket 40 is assembled, the coil spring 48 has its upper end abutted against the bottom surface of the top plate portion 41a of the first insulating member 41 and its lower end abutted against the flange portion 46a of the contact 46, The contact 46 is biased downward.

  Here, the process of assembling the adapter socket 40 and finally mounting the IC socket 1 in this embodiment will be briefly described.

  First, the adapter socket contact 45 is inserted into the through hole 42 c of the second insulating member 42. Subsequently, the first insulating member 41 is stacked on the second insulating member 42 so that the flange portion 41 b is accommodated in the recess 42 b of the second insulating member 42. At this time, the positioning pin 41g of the flange 41b of the first insulating member 41 is fitted into a positioning hole (not shown) formed in the recess 42 of the second insulating member 42, so that the first insulating member 41 is fitted. The center of the insertion hole 41d formed in the top plate portion 41a and the through hole 42c formed in the second insulating substrate 42 are aligned. Accordingly, the contact portion 46 a of the contact 46 is introduced into a slit 41 e extending below the top plate portion 41 a of the first insulating member 41. Subsequently, the fixing cover 43 is stacked on the second insulating member 42 so that the top plate portion 41a of the first insulating member 41 is accommodated in the opening 43a. At this time, the first insulating substrate 41 is sandwiched between the second insulating substrate 42 and the fixing cover 43. Finally, the fixing bracket 60 such as a flat head screw is attached through the fixing screw hole 42f provided in the second insulating substrate 42 and the fixing screw hole 43b provided in the fixing cover 43 correspondingly. By using and fixing, the assembly of the adapter socket 40 alone is completed.

  The adapter socket 40 assembled in this manner is further attached to the test board 50 as shown in FIGS. 2 and 3A using a fixing fitting 70 such as a bolt. At this time, as described above, the contact 46 moves upward by the protruding amount of the terminal portion 46d, and the contact portion 46a moves up in the slit 41e of the first insulating substrate 41, and the first insulating substrate 41 The top plate portion 41a is positioned directly below the insertion hole 41d formed corresponding to the contact portion 46a, and the terminal portion 46d is electrically connected to the corresponding external contact of the test board 50 with a predetermined contact pressure. To touch.

  Next, in order to mount the IC socket 1, a positioning pin (not shown) of the IC socket 1 is aligned with the positioning hole 43 c of the adapter socket 40 and the IC socket 1 provided in the fixing cover 43. The pin-shaped external terminal of the contact 30 of the IC socket 1 is inserted into the insertion hole 41 d formed in the top plate portion 41 a of the insulating member 41. The pin-shaped external terminal of the contact 30 of the IC socket 1 enters between the pair of contact portions 46a of the contact 46, deforms the pair of elastic deformation portions 46b, and is thereby sandwiched between the pair of contact portions 43a. As a result, the semiconductor device mounted on the IC socket 1 is electrically connected to the test board 50. The IC socket 1 may be fixed to the test board 50 by using a fixing bracket 70 such as a bolt used when the adapter socket 40 is attached to the test board 50.

  Since the adapter socket in the present embodiment can be easily assembled as described above, it is easy to replace each component. Moreover, the contact of the adapter socket can be easily produced by pressing. Furthermore, the length of the contact of the adapter socket can be shortened because it is sufficient to ensure that the external terminal of the IC socket can be inserted between the pair of contact portions. As a result, the height of the adapter socket can be reduced, and the contact length can be shortened, so that the electrical circuit length of the contact through which the current flows (the length of the contact in this embodiment) is also shortened. It becomes possible to flow. Moreover, since it is comprised so that the contact force between terminals may be acquired by a repulsive force of a pair of elastic deformation part or a coil spring, it becomes possible to obtain the stable electrical contact force, and does not impair electrical reliability. . Further, since the electrical contact between the adapter socket and the test boat as the printed wiring board is not based on soldering, the adapter socket itself can be easily replaced. Further, it is easy to attach the IC socket to the adapter socket.

(Second embodiment)
6 and 7 show a second embodiment of the adapter socket according to the present invention. FIG. 6 is an enlarged cross-sectional view of a main part similar to FIG. 3B of the adapter socket according to the present embodiment. FIG. 7 is an enlarged perspective view of a contact used in the adapter socket according to the present embodiment, where (a) shows a plunger, and (b) shows a coil spring unit as a terminal portion.

  In this embodiment, the configuration of the contact used is greatly different from that of the adapter socket of the first embodiment, and accordingly, the structure of the first insulating substrate is slightly different.

  The adapter socket 80 in the present embodiment generally includes a first insulating substrate 81, a second insulating substrate 82, and adapter socket contacts 85.

  The first insulating substrate 81 has a substantially square shape that is substantially the same size as the bottom surface of the IC socket (not shown) as viewed from above. Above the first insulating substrate 81, as in the first embodiment, a plurality of insertion holes 81a arranged in a matrix shape into which external terminals of IC socket contacts are inserted, and the upper ends of the insertion holes 81a. Is formed with a conical surface 81b that expands upward. In the present embodiment, the first insulating substrate 81 is further provided with a first receiving hole 81c for receiving the adapter socket contact 85 downward, following each insertion hole 81a. The diameter of the insertion hole 81a is set smaller than the diameter of the first accommodation hole 81c. Thereby, the adapter socket contact 85 is prevented from jumping upward.

  The second insulating substrate 82 has the same outer shape (square) as the first insulating substrate 81 when viewed from above, and a plurality of second insulating substrates 82 corresponding to the first accommodation holes 81 c opened in the first insulating substrate 81. The second accommodation hole 82a is formed. A small diameter hole 82b is formed below the second accommodation hole 82a, thereby preventing the adapter socket contact 85 from popping out downward. Therefore, when the first insulating substrate 81 and the second insulating substrate 82 are assembled to constitute an adapter socket, the adapter socket contact 85 is accommodated by the first accommodation hole 81c and the second accommodation hole 82a. A chamber is formed.

  The adapter socket contact 85 in the present embodiment includes a plunger 86 as a contact and a coil spring unit 87 as shown in FIGS.

  The plunger 86 as a contact is created by punching a conductive metal plate into a vertically long inverted U shape by pressing. The plunger 86 includes a wide contact portion 86a and a pair of elastic leg portions 86b. The wide contact portion 86a has an upper surface as a contact surface 86d that contacts an external terminal of the contact of the IC socket. In the present embodiment, the shape is not limited to this, but is formed as an arcuate surface. The contact surface 86d is preferably formed so that a large contact surface with the external terminal of the contact of the IC socket can be obtained, thereby ensuring electrical contact. A step portion 86e is formed at the connection portion between the wide contact portion 86a and the pair of leg portions 86b, and the upper end of the coil spring unit 87 contacts the step portion 86e. The width w2 of the wide contact portion 86a is set slightly smaller than the diameter of the first accommodation hole 81c. The ends of the pair of elastic leg portions 86b are rounded. Furthermore, it is preferable that the tip of each elastic leg part 86b is provided with a convex part 86c protruding outward.

  The coil spring unit 87 includes a coil spring portion 88 that biases a plunger 86 as a contact upward, and a tightly wound portion 89 below the coil spring portion 88. The outer diameter of the coil spring portion 88 is slightly smaller than the width w2 of the contact portion of the plunger 86, and the inner diameter is set so as to accommodate the pair of leg portions 86b of the plunger 86. Further, the tightly wound portion 89 includes a tapered portion 89a that is tapered downward. The lower end of the taper part 89 a of the tightly wound part 89 constitutes a terminal part 89 b that contacts the external terminal of the test board 50. The terminal portion 89 b that is the tip of the tightly wound portion 89 of the coil spring unit 87 penetrates the small diameter hole 82 from the bottom surface of the adapter socket 80 when accommodated in the second accommodation hole 82 a of the second insulating member 82. It is preferably set so as to protrude slightly. Therefore, when the adapter socket 80 is assembled and attached to the test board 50, the terminal portion 89b at the tip of the adapter socket contact 85 is pushed in by the test board 50, the coil spring portion 88 is deformed, and a repulsive force is generated. Maintain the stored state. As a result, a predetermined contact pressure can be obtained even if the movement amount (pushing amount) of the plunger 86 is small. Therefore, the adapter socket contact 85 can be made small, and as a result, the height of the adapter socket 80 can be reduced.

  In this embodiment, the plunger 86 as a contact of the adapter socket contact 85 has an external terminal of the IC socket contact inserted through the insertion hole 81a of the first insulating substrate 81, and the external terminal of the IC socket contact is By contacting the contact surface 86 d of the plunger 86, the plunger 86 is pushed down. As a result, the coil spring portion 88 of the coil spring unit 87 is elastically deformed, and the repulsive force between the external terminal of the contact of the IC socket and the rear of the contact portion 86 of the plunger 86, and the terminal portion 89b of the tightly wound portion 89 and the test board 50 A predetermined contact pressure can be obtained with the external terminal. Further, when the plunger 86 is pushed down, the tips of the pair of leg portions 86b come into contact with the inner surface of the taper portion 89a, and the pair of leg portions 86b are elastically deformed in the closing direction, and the repulsive force causes the plunger 86 and the coil spring unit 87 to A predetermined contact pressure can be obtained even during the interval.

  The assembly of the adapter socket, the mounting of the adapter socket on the test board, and the mounting of the IC socket on the adapter socket are substantially the same as those in the first embodiment, and are omitted here.

  Since the adapter socket in the present embodiment can be easily assembled as in the first embodiment, replacement of each component is also easy. Moreover, the plunger can be easily produced by press working. Furthermore, since the contact pressure with the external terminal of the contact of IC socket should just be ensured, the length of the contact for adapter sockets can be shortened. As a result, the height of the adapter socket can be reduced and the contact length can be shortened, so that the electrical path length of the contact through which the current flows (in this embodiment, the length of the plunger + a part of the taper portion of the tightly wound portion) is also achieved. Thus, a relatively large current can be passed. Moreover, since it is comprised so that the contact force between terminals may be obtained by the repulsive force of a pair of leg part or a coil spring, it becomes possible to obtain the stable electrical contact force, and does not impair electrical reliability. Further, since the electrical contact between the adapter socket and the test boat as the printed wiring board is not based on soldering, the adapter socket itself can be easily replaced. Further, it is easy to attach the IC socket to the adapter socket.

  As described above, the present specification has been described as an adapter socket used for an IC socket on which a semiconductor device such as an IC package is mounted. However, the adapter socket includes SIP (Single Inline Package), DIP (Dual Inline Package), It can also be used as a socket for directly mounting a semiconductor device such as a PGA (Pin Grid Array Package).

It is a schematic side view in which an IC socket and an adapter socket are mounted on a test board. It is a top view of the adapter socket which concerns on the 1st Example of this invention. It is a schematic sectional drawing of the adapter socket shown in FIG. 2, (a) is XX sectional drawing of the adapter socket of FIG. 2, (b) is a principal part expanded sectional view of (a). It is a schematic sectional drawing of the adapter socket shown in FIG. 2, (a) is YY sectional drawing of the adapter socket of FIG. 2, (b) is a principal part expanded sectional view of (a). It is an expansion perspective view of the contact used for the adapter socket of FIG. It is a principal part expanded sectional view similar to FIG.3 (b) of the adapter socket which concerns on the 2nd Example of this invention. It is an expansion perspective view of the contact used for the adapter socket of FIG. 6, (a) shows a plunger, (b) shows the coil spring unit as a terminal part.

Explanation of symbols

1 IC socket 10 Socket cover 20 Socket body 30 IC socket contacts 40, 80 Adapter sockets 41, 81 First insulating substrates 42, 82 Second insulating substrates 45, 85 Adapter socket contacts 46, 86 Contacts 48, 88 Coil spring 50 Printed wiring board (test board)
60 Fixing tool 70 Fixing tool

Claims (5)

A first insulating substrate; a second insulating substrate disposed under the first insulating substrate; and a plurality of contacts.
The plurality of contacts are arranged so as to be movable up and down via a coil spring between the first insulating substrate and the second insulating substrate. The contact includes a pair of contact portions, a pair of elastic deformation portions, a wide collar portion and a terminal portion,
The coil spring biases the contact downward through a wide collar,
The adapter socket according to claim 1, wherein the first insulating substrate is formed with a slit in which a pair of contact portions of the contact is disposed.   The adapter socket according to claim 2, wherein the slit can accommodate a pair of contact portions of a plurality of sets of the contacts. The contact includes a wide contact portion and a pair of elastically deformable legs,
The coil spring urges the contact upward through the wide contact portion,
The adapter socket according to claim 1, wherein the coil spring includes a tightly wound portion including a tapered portion below the coil spring. The adapter socket according to any one of claims 1 to 4, wherein the contact is manufactured by punching a metal plate by press working.

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