KR100922270B1 - Socket for semiconductor device - Google Patents

Abstract

The fixed side terminal 20C of the contact terminal 20ai accommodated in the cell 10CA of the adapter 10 contacts the contact portion 20t at a predetermined pressure against the electrode group 18E of the printed wiring board 18. The adapter 10 is fixed to the printed wiring board 18 through fixing pole parts 10NA-10ND fastened with a tapping screw (TBs).

Semiconductor socket

Description

Socket for semiconductor device {SOCKET FOR SEMICONDUCTOR DEVICE}

The present invention relates to a socket for a semiconductor device for electrically connecting a semiconductor device provided for a test to a printed wiring board.

BACKGROUND OF THE INVENTION In a semiconductor device mounted on an electronic device or the like, in general, a burn in test that is effective for removing an initial malfunctioning integrated circuit, for example, in order to remove the potential defect in a step prior to the mounting, is a semiconductor device. Through the socket.

The socket for a semiconductor device provided for such a test is generally called an IC socket, and is arrange | positioned on a printed wiring board (test board), for example, as shown also in Unexamined-Japanese-Patent No. 2004-355983. The printed wiring board is provided with an input / output unit for supplying a predetermined test voltage and outputting an abnormality detection signal indicating a short circuit or the like from a semiconductor device as an inspection object. In that case, the socket main-body part of an IC socket is fastened by the attachment screw and the nut through the some attachment hole provided in the printed wiring board, for example. In addition, in order to improve the test | inspection efficiency in an inspection line, 1C socket may be arrange | positioned in multiple pieces at high density and one printed wiring board.

Such an IC socket incorporates a group of contact terminals for electrically connecting a terminal of a semiconductor device and an input / output unit on a printed wiring board inside the socket body. Generally, the fixed terminal part of each contact terminal which comprises such a contact terminal group is soldered and fixed with respect to each plating through-hole of a printed wiring board.

As described above, when a plurality of IC sockets are arranged on one printed wiring board at a high density, when an abnormality occurs in one of the plurality of IC sockets, it is necessary to repair or replace the IC socket in which the abnormality occurs. There is a risk that the printed circuit board may not be usable for a certain period of time.

In such a case, it is also conceivable to prepare a spare test board with the same IC socket arranged to continue the inspection without interrupting the inspection of the inspection line for a relatively long time.

However, it is not profitable to prepare a spare test board because the installation cost in an inspection line becomes large. In addition, the soldering work of the fixed terminal portion of the contact terminal consumes a relatively long time for the replacement work, and also leads to a deterioration of the yield due to the breakage of the test board. It is desired that only the socket be easily operated and that the socket be replaced quickly.

In view of the above problems, the present invention is a socket for a semiconductor device for electrically connecting a semiconductor device provided for a test to a printed wiring board, and only an IC socket having an abnormality can be replaced in an easy operation and in a short time. An object of the present invention is to provide a socket for a semiconductor device.

In order to achieve the above object, the socket for a semiconductor device according to the present invention is provided with a socket main body having a semiconductor device accommodating portion for detachably accommodating the semiconductor device, and disposed in the semiconductor device accommodating portion, and selectively receiving terminals of the semiconductor device. A socket is detachably disposed on a wiring board having a pair of elastic contact pieces to be held therein, a first contact terminal having a fixed side terminal connected to the contact piece, and an electrode surface on which an electrode group is formed. The main body has a socket body connection surface to which the main body is detachably connected, and an adapter for supporting the socket main body and a fixed side terminal of the first contact terminal when the socket main body is disposed in the adapter and connected to the socket main body connection surface. A contact piece portion to be brought into contact with the contact piece portion and formed to be elastically displaceable in a direction orthogonal to the electrode surface of the wiring board; And a second contact terminal having a fixed-side terminal which contacts the terminal and electrically connecting the terminal of the semiconductor device accommodated in the semiconductor device accommodating portion to the electrode surface of the wiring board via the first contact terminal.

As is apparent from the above description, according to the socket for a semiconductor device according to the present invention, a socket main body in which an adapter is detachably disposed on a wiring board having an electrode surface on which an electrode group is formed, and the socket main body is detachably connected to the socket main body. Since the socket body has a connection surface and supports the socket body, the socket body can be easily removed from the adapter, so that only an IC socket having an abnormality can be easily replaced in a short time.

Other features of the present invention will be described in more detail with reference to the accompanying drawings in the following examples.

2 shows an example of a socket for a semiconductor device according to the present invention together with a printed wiring board as a test board. In addition, in FIG. 2, one of the sockets for semiconductor devices arrange | positioned in multiple numbers on a printed wiring board is shown as a representative.

The socket for semiconductor device is arrange | positioned at the predetermined position in the conductor pattern formed in the printed wiring board 18 which has a predetermined plate | board thickness, respectively. As shown enlarged in FIG. 1, the electrode group 18E which a contact part of the fixed side terminal of the contact terminal mentioned later contact | abuts is formed in the predetermined position in the conductor pattern. Moreover, around the conductor pattern, the substantially rectangular hole 18a into which each fixing pole part mentioned later is inserted is formed (refer FIG. 1). In addition, the shape of the hole 18a is not limited to this example, For example, a round hole or another shape may be sufficient.

2 and 4, the socket for a semiconductor device includes a socket main body 30 including a semiconductor device accommodating portion 14A, which will be described later, in which a semiconductor device DV as an inspection object is detachably disposed, and The contact terminals 40ai (i = 1 to n and n are positive integers) disposed in the center contact receiving portion in the socket main body 30 are supported by the socket main body 30 in a movable manner. And a cover member 12 for transmitting an operating force to a latch mechanism described later, and a semiconductor device DV detachably received, and positioning relative to the contact terminal 40ai of the electrode portion of the semiconductor device DV. The slider member 22 having the positioning part 14 (refer FIG. 8), and each electrode part of the semiconductor device DV accommodated in the positioning part 14 are urged toward a some contact terminal, and a semiconductor device Including the pressing members 16A and 16B for supporting the DV. An adapter 10 for supporting removably to the latch mechanism and the above-described socket body 30 on the printed circuit board 18 is configured to include as main components.

The semiconductor device DV provided in such a socket for semiconductor devices is, for example, a BGA type roughly square semiconductor device, and has an electrode surface on which a plurality of ball-shaped electrode portions are formed in the horizontal direction. .

The resin main body 30 is an end portion in which the lower end of the arm portion and the concave portion (not shown) in which the base end portions of the pressing members 16A and 16B enter each other enter each other when the cover member 12 described later is lowered. Have each in. 8, the contact accommodating part by which the single contact terminal 40ai is arrange | positioned corresponding to the electrode part of the semiconductor device DV is formed in the center of the inside of the socket main body 30. As shown in FIG.

The contact accommodating portion has a plurality of cells each accommodating each contact terminal 40ai. Each cell is formed vertically and horizontally at predetermined intervals. Adjacent cells are partitioned by partition walls 30 Pai (i = 1 to n, where n is a positive integer). Inside each cell, a press-fit portion for supporting the fixing portion 40B of the contact terminal 40ai to the inner wall surface is formed. The flat surface in which the slider member 22 mentioned later is movable so that the upper surface part of the contact accommodating part which the opening end of the cell opens is formed is formed.

The contact terminal 40ai as the first contact terminal is integrally formed by press working from an elastic thin sheet metal material and extends in a direction substantially perpendicular to the surface of the above-described printed wiring board 18. The contact terminal 40ai includes a pair of movable side contact piece portions 40m and a fixed side contact piece portion 40f for selectively sandwiching the above-mentioned electrode portion of the semiconductor device DV, and the adapter 10 described later. The fixed side terminal 40C having the contact portion 40t electrically connected to the contact 20ai of the connection, and the movable side contact piece portion 40m and the fixed side contact piece portion 40f and the fixed side terminal 40C. It is configured to include a fixed portion 40B,

In FIG. 8, the movable side contact piece portion 40m has elasticity so as to be close to or spaced apart from the fixed side contact piece portion 40f. In the upper end part of the movable side contact piece part 40m and the fixed side contact piece part 40f, the contact part which contacts the ball-shaped electrode part DVa of the semiconductor device DV is formed, respectively. Each contact part protrudes to the position of the positioning part 14 vicinity through the slit 22b of the slider member 22 mentioned later.

In addition, in FIG. 8, when the slider member 22 is moved in the direction shown by the arrow F, the contact part of the movable side contact piece part 40m is made of the slider member 22, as shown by a dashed-two dotted line. It presses by the press part 22a, and is spaced apart from the contact part of the fixed side contact piece part 40f. On the other hand, when the slider member 22 is moved in the direction shown by the arrow R, and is returned to the initial position from the spaced apart position, the contact portion of the movable side contact piece portion 40m is formed of the fixed side contact piece portion 40f. Proximity to the contacts.

The fixed side terminal 40C formed in a linear shape is coupled to the fixed portion 40B at one end thereof, and the contact portion 40t formed at the other end of the fixed side terminal 40C is illustrated in FIG. 9. As described above, the contact portion 20bc of the contact terminal 20ai provided in the adapter 10 to be described later is abutted.

Therefore, the soldering operation with respect to the electrode group 18E of the printed wiring board 18 in the fixed side terminal 40C of the contact terminal 40ai becomes unnecessary.

The slider member 22 moves in the direction shown by the arrow F in FIG. 8 by a cam mechanism (not shown) according to the lowering operation of the cover member 12. The cam mechanism includes a lever member and a coil spring as shown, for example, in JP-A-2003-17207.

In addition, the slider member 22 has the slit 22b which the pair of movable side contact piece part 40m and the fixed side contact piece part 40f in the contact terminal 40ai pass in a longitudinal direction. Adjacent slits 22b in the same row are partitioned by the pressing section 22a. The slits 22b in different adjacent rows are partitioned by partition walls.

As shown in FIG. 3, the positioning unit 14 formed integrally with the slider member 22 accommodates the semiconductor device DV and contacts the terminal 40ai of the electrode portion of the semiconductor device DV. The semiconductor device accommodating part 14A which has the guide part which performs positioning with respect to each contact part of this invention is provided. In the semiconductor device accommodating portion 14A, the contact portion of the contact terminal 40ai described above protrudes, and the pressing members 16A and 16B are respectively provided on the opposing wall portions forming the semiconductor device accommodating portion 14A. The openings through which are respectively passed are formed.

The cover member 12 has the opening part in which the positioning part 14 of the slider member 22 mentioned above is movable so that it may be centered. When the semiconductor device DV is detached from the positioning unit 14, the semiconductor device DV passes through the opening.

As shown in FIG. 2, the cover member 12 is supported by a plurality of leg portions 12g respectively guided in the grooves formed in the outer circumferential portion of the socket body 10 so as to be movable up and down. In FIG. 2, only one of the plurality of leg portions 12g is shown.

In addition, between each spring receiving part 12d in the cover member 12 and the socket body 10, the cover member 12 is upward, that is, the cover member 12 is connected to the socket body 10, respectively. The coil spring 16 added in the direction spaced apart with respect to is provided. At that time, the pawl portion provided at the tip end of the leg portion 12g of the cover member 12 is engaged with the end portion of the groove, so that the cover member 12 is held at the uppermost position as shown in FIG. 2 and 4 show a state where the cover member 12 is held at the uppermost position, respectively.

The cover member 12 has an arm part (not shown) which presses the base end part of the pressing member 16A and 16B which comprised the latch mechanism, when it descends, as shown by the dashed-dotted line in FIG.

The pressing members 16A and 16B are rotatably supported at positions opposing each long side of the positioning portion 14 in the socket body 30, respectively. In addition, as shown in FIG. 2, the base end part of the press member 16A and 16B respectively clamps the semiconductor device DV attached to the positioning part 14 by the coil spring 17 by the front end part. Since it is added to the pushing direction, the front-end | tip part of 16 A and 16B of press members is arrange | positioned in the position which becomes upper position of the positioning part 14. As shown in FIG. On the other hand, when the proximal ends of the pressing members 16A and 16B are pressed against the force of the coil spring 17 by the arm of the cover member 12, the distal ends of the pressing members 16A and 16B are positioned. Spaced apart from (14) and placed in a predetermined waiting position,

As shown in FIG. 11, the bottom part of the socket main body 30 is selectively inserted in the slit 10Sa, 10SB of the connection surface of the adapter 10 mentioned later, respectively, and is detachably connected to the connection part. A plurality of pole portions 30N are formed. 11 shows one pole portion 30N among the plurality of pole portions 30N.

The pole part 30N protrudes so that it may become substantially perpendicular to the bottom face part. The tip end of the pole portion 30N can be elastically displaced in the thickness direction thereof.

2 and 4, an adapter 10 is disposed between the bottom of the socket body 30 and the electrode surface of the printed wiring board 18.

The adapter 10 is formed of a resin material, for example, and has a socket body connection surface 10CSA on which the bottom part of the socket body 30 is placed and connected as shown in FIGS. 5 and 6. have. When the bottom part of the socket main body 30 mentioned above is connected to socket main body connection surface 10CSA, the fixed side terminal 40C of the contact terminal 40ai mentioned above is inserted in the center part of socket main body connection surface 10CSA. A group of through holes 10hi (i = 1 to n, where n is a positive integer) is formed. Each through hole 10hi is formed corresponding to the above-described arrangement of the contact terminals 40ai at predetermined intervals. Each transmission hole 10hi is communicated with each cell 10CA in the contact accommodating part of the adapter 10, as shown in an enlarged view in FIG. Each cell 10CA is formed in the position which becomes just below each perforation hole 10hi inside the adapter 10, respectively.

Adjacent cells 10CA are partitioned off by partition 10Pai. In each cell 10CA, as shown in an enlarged manner in FIG. 9, a contact terminal 20ai is accommodated.

The contact terminal 20ai as the second contact terminal is integrally formed by press working from an elastic thin sheet metal material and extends in a direction substantially perpendicular to the surface of the printed wiring board 18. The strip | belt-shaped contact terminal 20ai which has a predetermined | prescribed width and thickness has the contact piece part 20BC which selectively fits the fixed side terminal 40C of the contact terminal 40ai mentioned above in cooperation with the surface of the partition 10Pai. ), A fixed side terminal 20C having a contact portion 20t in contact with the electrode group 18E of the printed wiring board 18, and a fixed portion connecting the contact piece portion 20BC and the fixed side terminal 20C ( 20B) is configured.

In FIG. 9, the contact piece portion 20BC has elasticity so as to add the above-mentioned fixed side terminal 40C inserted into the cell 10CA through the through hole 10hi toward the surface of the partition 10Pai. The strip | belt-shaped contact piece part 20BC which has a predetermined | prescribed width is bent so that the front end may face the electrode group 18E side of the printed wiring board 18. As shown in FIG. At the tip end portion of the contact piece portion 20BC, a contact portion 20bc is formed in contact with the contact portion 40t of the fixed side terminal 40C of the contact terminal 40ai. Thereby, the contact area of the contact part 20bc and the contact part 40t is ensured reliably.

The fixed side terminal 20C formed in a curved shape has elasticity and is coupled to the fixed portion 20B at one end thereof. A bent portion 20ct of a circular arc smaller than the curved portion is formed in the portion between the other end portion and the curved portion where the contact portion 20t of the fixed side terminal 20C is formed. Moreover, the contact part 20t formed in the other end of the fixed side terminal 20C is in contact with the electrode group 18E of the printed wiring board 18 at a predetermined pressure. Therefore, the soldering work with respect to the electrode group 18E of the printed wiring board 18 in the fixed side terminal 20C of the contact terminal 20ai becomes unnecessary.

In the socket body connection surface 10CSA, slits 10SA and 10SB into which the above-described pole portions 30N are inserted are formed, respectively. The slits 10SA face each other with a group of through holes 10hi (i = 1 to n, n being a positive integer) formed in the center portion of the socket main body connecting surface 10CSA, and are each predetermined along two long sides thereof. It is formed at intervals of and is formed in four places in total. The slits 10SB are formed so as to face each other on the short sides with the through holes 10hi interposed therebetween. The slits 10SA and 10SB are respectively shown in FIGS. 5 and 7 in the adapter 10. It communicates with the opening part 10HA and 10HB formed in the side surface of a long side, and the side surface of a short side.

In connecting the bottom part of the socket main body 30 to the socket main body connection surface 10CSA, first, as shown in FIG. 13, the pole part 30N of the socket main body 30 is located above the slit 10SA and 10SB. After being aligned so as to be a position, the bottom portion of the socket body 30 is placed on the socket body connecting surface 10CSA in the direction indicated by the arrow. As a result, the tip of the fixed side terminal 40C of the contact terminal 40ai is inserted into the cell 10CA through the through hole 10hi. In addition, the pawl portion 30N is inserted into the slits 10SA and 10SB, so that the locking portion at the tip of the pawl portion 30N is formed at the periphery of the slits 10SA and 10SB and the openings 10HA and 10HB. It is locked to the connecting portion 10EW. Therefore, the contact portion 40t of the fixed side terminal 40C is electrically connected to the contact portion 20bc of the contact terminal 20ai.

On the other hand, when removing the socket main body 30 from the socket main body connection surface 10CSA of the adapter 10, as shown to A of FIG. 14, the locking part of each pole part 30N is first connected to the connection part 10EW. In the state where the locking portion of the pawl portion 30N is pressed at the distal end of the jig JIG inserted through each of the openings 10HA and 10HB so as to be spaced apart from each other, in the direction indicated by the arrow in FIG. The socket body 30 is dropped. As a result, each pole portion 30N is pulled out through the slits 10SA and 10SB, and the socket main body 30 is connected to the socket body of the adapter 10 because the fixed side terminal 40C is pulled out through the through hole 10hi. Away from the face 10CSA.

As shown in FIG. 2 and FIG. 4, fixing pawl portions 10NA, 10NB, 10NC, and 10ND are integrally formed at four locations on the bottom of the adapter 10 at predetermined intervals. Since the fixing pole parts 10NA, 10NB, 10NC, and 10ND have the same structure as each other, the fixing pole parts 10NC will be described, and the description of the other fixing pole parts 10NA, 10NB, and 10ND will be described. Omit.

As shown in an enlarged view in FIG. 1, the fixing pawl portion 10NC has two branched lock pieces 10N1 and 10N2 spaced apart from each other along the short side of the adapter 10. Tapered holes 10Ns are formed between the lock pieces 10N1 and 10N2.

The respective locking portions 10n protruding from the ends of the lock pieces 10N1 and 10N2 toward the outside are elastically displaceable in a direction close to each other or in a direction away from each other. That is, each locking portion 10n is close to each other such that each locking portion 10n passes through the hole 18a, and each locking portion 10n is locked to the periphery of the opening end of the hole 18a on the lower surface side. To be spaced apart from each other.

In each locking portion 10n, a slope portion 10S having a predetermined gradient is formed so as to be inclined downward from the outer surface of the tip of the lock piece N1. When the lock pieces 10N1 and 10N2 are fixed to the printed wiring board 18, each of the slopes 10S is formed in a hole formed in the lower surface of the printed wiring board 18 as shown in an enlarged view in FIG. 1. It is in contact with the periphery of the open end of 18a).

In fixing this fixing pole part 10NC to the hole 18a in the printed wiring board 18, first, after the lock pieces 10N1 and 10N2 are aligned with respect to the hole 18a, the adapter 10 The adapter 10 is pressed against the elastic force of the fixed side terminal 20C of the contact terminal 20ai protruding from the bottom of the (). As a result, when the end surfaces of the locking portions 10n of the lock pieces 10N1 and 10N2 are further pressed against the peripheral edge of the opening end of the hole 18a on the upper surface, they are elastically displaced once in a direction close to each other. Then, it passes through the hole 18a and elastically displaces by a restoring force in the direction spaced apart from each other. Therefore, as shown in an enlarged view in FIG. 12, each slope portion 10S abuts on the peripheral edge of the opening end of the hole 18a formed in the lower surface of the printed wiring board 18. At that time, the tapping screw TBs is screwed into the hole 10Ns.

Next, as shown enlarged in FIG. 1, the tapping screw TBs is further screwed into the hole 10Ns. As a result, the locking portions 10n of the lock pieces 10N1 and 10N2 are also displaced in the direction away from each other, so that the adapter 10 is attracted to the printed wiring board 18 while slidingly contacting each of the slope portions 10S. do. Therefore, since the clearance between the periphery of each slope part 10S and the periphery of the hole 18a does not arise due to the deviation of the plate thickness of the printed wiring board 18, the fixed-side terminal 20C of the contact terminal 20ai is carried out. Reduction of contact pressure below a predetermined value is avoided.

In such a configuration, in conducting a test of the semiconductor device DV, first, the pressing surface portion of the pressing member provided in the transfer robot, which is not shown, abuts on the upper surface of the cover member 12, and thus the coil spring described above. It is pressed with a predetermined stroke downwards against the biasing force of (16).

As a result, the pressure members 16A and 16B are spaced apart from each other to the standby position. In addition, for example, the position where the semiconductor device DV as the inspected object is sucked and supported by the transfer arm of the transfer robot, which is not shown, is directly above the opening and the positioning unit 14 of the cover member 12. Will be conveyed until.

Next, the semiconductor device DV sucked and supported by the transfer arm is lowered through the opening of the cover member 12 and positioned and mounted in the semiconductor device accommodating portion 14A of the positioning portion 14.

Subsequently, when the cover member 12 ascends in a state where the pressing surface portion of the pressing member is in contact with the upper surface of the cover member 12, the cover member 12 is raised to the uppermost position by the force of the coil spring 16 described above. . At that time, the contact portions at the tip ends of the pressing members 16A and 16B are rotated at approximately the same timing, respectively, to press the semiconductor device DV toward the contact terminal 40ai. In addition, as shown in an enlarged view in FIG. 10, each of the electrode portions DVa of the mounted semiconductor device DV has a pair of movable side contact piece portions 40m and fixed side contact piece portions 40f of the contact terminal 40ai. It is fitted by).

When the test signal is supplied to the input / output portion of the printed wiring board 18 while the cover member 12 is held at the uppermost position, the test signal is transmitted through the contact terminal 40ai and the contact terminal 20ai. When the abnormality of the circuit is detected while being supplied to the semiconductor device DV, the abnormality detection signal from the semiconductor device DV is supplied to the external failure diagnosis apparatus through the input / output unit.

15 shows a modification of the above-described adapter 10.

The fixed side terminal 40C of the contact terminal 40ai in the example shown in FIG. 9 is the contact portion (20BC) of the contact piece 20BC in the contact terminal 20ai disposed in the cell 10CA of the adapter 10. 20bc) and the wall surface of the partition wall part 10Pai are sandwiched by the wall surface of the contact terminal 40ai in the example shown in FIG. 15, On the other hand, the fixed side terminal 40C of the contact terminal 40ai is a pair of contact piece parts 32BC and 32AC. The contact portions 32ac and 32bc are sandwiched and supported.

In addition, in the adapter 10 'shown in FIG. 15, since the other structure in the adapter 10 mentioned above has the same structure, the duplication description is abbreviate | omitted.

The adapter 10 'is formed of a resin material, for example, and has a socket body connection surface 10'CSA on which the bottom part of the socket body 30 is placed and connected. When the bottom part of the socket main body 30 mentioned above is connected to the socket main body connection surface 10'CSA in the center part of the socket main body connection surface 10'CSA, the fixed side terminal 40C of the contact terminal 40ai mentioned above. ) Is formed with a group of through holes 10'hi (i = 1 to n, where n is a positive integer). Each through hole 10'hi is formed corresponding to the above-described arrangement of the contact terminals 40ai at predetermined intervals. Each transmission hole 10'hi communicates with each cell 10'CA in the contact receiving portion of the adapter 10, as shown in an enlarged view in FIG. Each cell 10'CA is formed in the position which becomes just below each perforation hole 10'hi inside the adapter 10 ', respectively.

Adjacent cells 10'CA are partitioned off by partition 10'Pai. In each cell 10'CA, a contact terminal 32ai is accommodated as shown in an enlarged view in FIG.

The contact terminal 32ai is integrally formed by press working with a thin sheet metal material having elasticity, and extends in a direction orthogonal to the surface of the printed wiring board 18. The strip | belt-shaped contact terminal 32ai which has a predetermined | prescribed width and thickness is the contact piece part 32BC and 32AC which cooperate and hold | maintain the fixed side terminal 40C of the contact terminal 40ai mentioned above, and a printed wiring board ( It is comprised including the fixed side terminal 32C which has the contact part 32t which contacts the electrode group 18E of 18, and the fixed part 32B which connects the contact piece part 32BC and the fixed side terminal 32C. have,

The contact piece portions 32AC and 32BC formed to face each other have elasticity so as to add the above-mentioned fixed side terminals 40C inserted into the cells 10'CA through the through holes 10'hi, respectively, toward each other. Have The contact piece part 32AC and the contact piece part 32BC are respectively bent so that the front end may face the electrode group 18E side of the printed wiring board 18. As shown in FIG. At the tip ends of the contact piece portion 32AC and the contact piece portion 32BC, contact portions 32ac and 32bc are respectively formed to contact the contact portion 40t of the fixed side terminal 40C of the contact terminal 40ai.

The fixed side terminal 32C formed in a curved shape has elasticity and is coupled to the fixed portion 32B at one end thereof. The bent part 32ct of the arc smaller than the curved part is formed in the part between the other end part and the curved part in which the contact part 32t of the fixed side terminal 32C is formed. The contact portion 32t formed at the other end of the fixed-side terminal 32C is in contact with the electrode group 18E of the printed wiring board 18 at a predetermined pressure. Therefore, the soldering operation with respect to the electrode group 18E of the printed wiring board 18 in the fixed terminal 32C of the contact terminal 32ai becomes unnecessary.

FIG. 17A shows an example of a socket for a semiconductor device according to the present invention to which another example of the contact terminal used for the adapter 10 described above is applied. In addition, in the example shown to A of FIG. 17, and B of FIG. 17, the same code | symbol is shown about the same component in the example shown in FIG. 2, and the duplication description is abbreviate | omitted.

In the contact terminal 20ai shown in FIG. 9, the bent part 20ct of the arc smaller than the curved part is formed in the part between the other end part and the curved part in which the contact part 20t of the fixed side terminal 20C is formed. On the other hand, such a bent portion is not formed in the contact terminal 34ai shown in FIG. 17A.

The contact terminal 34ai is integrally formed by press working with an elastic thin metal material and extends in a direction substantially perpendicular to the surface of the printed wiring board 18.

As shown in FIG. 16A and B in FIG. 16, the contact terminal 34ai selectively cooperates with the surface of the partition 10Pai to selectively fix the terminal 40C of the contact terminal 40ai described above. The fixed side terminal 34C which has the contact piece part 34BC to be clamped, the contact part 34t which abuts on the electrode group 18E of the printed wiring board 18, the contact piece part 34BC, and the fixed side terminal 34C. ) Is configured to include a fixing portion (34B) for connecting.

In FIGS. 16A and 16B, the contact piece portion 34BC pushes the aforementioned fixed-side terminal 40C inserted into the cell 10CA through the through hole 10hi toward the surface of the partition 10Pai. It has elasticity to The contact piece portion 34BC is punched so that its tip faces the electrode group 18E side of the printed wiring board 18. As a result, the opening 34a is formed in the fixing portion 34B.

At the tip end portion of the contact piece portion 34BC, a contact portion 34bc is formed in contact with the contact portion 40t of the fixed side terminal 40C of the contact terminal 40ai.

The fixed-side terminal 34C formed in a curved shape has elasticity and is coupled to the fixed portion 34B at one end thereof. The contact portion 34t formed at the other end of the fixed-side terminal 34C is in contact with the electrode group 18E of the printed wiring board 18 at a predetermined pressure. Therefore, the soldering operation with respect to the electrode group 18E of the printed wiring board 18 in the fixed side terminal 34C of the contact terminal 34ai becomes unnecessary.

Also in this example, since the socket main body 30 becomes detachable with respect to the adapter 10, when removing the socket main body 30 from the socket main body connection surface 10CSA of the adapter 10, it is shown in B of FIG. As shown, first, the locking portion of the pole portion 30N is pressed at the tip of the jig JIG, which is inserted through each of the openings 10HA and 10HB such that the locking portion of each pole portion 30N is spaced apart from the connecting portion 10EW. In this state, the socket main body 30 falls next in the direction indicated by the arrow. As a result, each pole portion 30N is pulled out through the slits 10SA and 10SB, and the socket main body 30 is connected to the socket body of the adapter 10 because the fixed side terminal 40C is pulled out through the through hole 10hi. Away from the face 10CSA.

In addition, the contact terminal accommodated in the cell 10CA of the adapter 10 is not limited to this example, For example, the contact terminal 36ai as shown to A and 18B of FIG. 18 may be sufficient.

The contact terminal 36ai is formed integrally by press working from an elastic thin metal material and extends in a direction substantially perpendicular to the surface of the printed wiring board 18. The contact terminal 36ai includes a contact piece portion 36BC for selectively holding the fixed side terminal 40C of the contact terminal 40ai described above in cooperation with the surface of the partition 10Pai, and the printed wiring board 18. The fixed side terminal 36C which has the contact part 36t which contacts the electrode group 18E, and the fixed part 36B which connects the contact piece part 36BC and the fixed side terminal 36C are comprised.

The contact piece portion 36BC has elasticity so as to add the above-mentioned fixed side terminal 40C inserted into the cell 10CA through the through hole 10hi toward the surface of the partition 10Pai. The contact piece portion 36BC is bent so that its tip faces the electrode group 18E side of the printed wiring board 18. At the tip end portion of the contact piece portion 36BC, a contact portion 36bc is formed in contact with the contact portion 40t of the fixed side terminal 40C of the contact terminal 40ai.

The fixed side terminal 36C formed in a curved shape has elasticity and is coupled to the fixed portion 36B at one end thereof. The contact portion 36t formed at the other end of the fixed side terminal 36C is brought into contact with the electrode group 18E of the printed wiring board 18 at a predetermined pressure.

In addition, as another example of the contact terminal accommodated in the cell 10CA of the adapter 10, the contact terminal 38ai as shown in FIG. 19A and FIG. 19B may be sufficient.

The contact terminal 38ai is integrally formed by a press working with an elastic thin metal material and extends in a direction substantially perpendicular to the surface of the printed wiring board 18. The contact terminal 38ai abuts against the contact piece portions 38BC and 38AC for cooperatively holding the fixed side terminal 40C of the contact terminal 40ai described above and the electrode group 18E of the printed wiring board 18. The fixed side terminal 38C which has the contact part 38t, and the fixed part 32B which connects the contact piece part 38BC and the fixed side terminal 38C are comprised.

The contact piece portions 38AC and 38BC formed to face each other have elasticity so as to add the above-mentioned fixed side terminal 40C inserted into the cell 10CA through the transmission hole 10hi toward each other. The contact piece portion 38AC and the contact piece portion 38BC are respectively bent so that their ends face the electrode group 18E side of the printed wiring board 18. Contact portions 38AC and 38BC which are in contact with the contact portion 40t of the fixed-side terminal 40C of the contact terminal 40ai are formed at the tip end portions of the contact piece portion 38AC and the contact piece portion 38BC, respectively.

The fixed-side terminal 38C formed in a curved shape has elasticity and is coupled to the fixed portion 38B at one end thereof. The contact portion 38t formed at the other end of the fixed-side terminal 38C is brought into contact with the electrode group 18E of the printed wiring board 18 at a predetermined pressure.

Therefore, the soldering of the electrode group 18E of the printed wiring board 18 at the fixed side terminal of the contact terminal 20 shown in Figs. 18A and 18B, 19A and 19B. The work becomes unnecessary.

In the above-mentioned example, when the slider member 22 which slides on the flat surface in the upper surface part of a contact accommodating part moves to a predetermined direction, the contact part of the movable side contact piece part 40m is an example of this invention, Although applied to the socket for semiconductor devices provided with the structure which presses by the press part 22a of the slider member 22, and is spaced apart from the contact part of the fixed side contact piece part 40f, it is not limited to this example. For example, as shown in Japanese Unexamined Patent Application Publication No. 2004-111215, a moving plate having partition walls disposed between the pair of contact pieces is moved along the up and down direction in the socket body so that a pair of It goes without saying that it may be applied to a socket for a semiconductor device having a structure in which both of the contact piece portions are moved to be spaced apart from each other.

Although the present invention has been described with specific examples, the present invention is not limited to these examples. It is intended that the scope of the following claims be broadly understood to cover all modifications and equivalent constructions and functions.

BRIEF DESCRIPTION OF THE DRAWINGS The partial sectional drawing which expands and shows principal part in the example of the socket for semiconductor devices which concerns on this invention.

2 is a front view showing an appearance of an example of a socket for a semiconductor device according to the present invention.

3 is a plan view in the example shown in FIG.

4 is a side view in the example shown in FIG.

Fig. 5 is a front view showing an adapter used for one example of a socket for a semiconductor device according to the present invention.

FIG. 6 is a plan view in the example shown in FIG. 5; FIG.

FIG. 7 is a side view in the example shown in FIG. 5; FIG.

FIG. 8 is a partial cross-sectional view showing a configuration of a contact terminal in the example shown in FIG. 2. FIG.

FIG. 9 is a partial cross-sectional view showing the structure of a contact terminal in the adapter shown in FIG. 5; FIG.

FIG. 10 is a partial cross-sectional view provided in an operating setting of a contact terminal in the example shown in FIG. 2. FIG.

FIG. 11 is a partial cross-sectional view partially showing an enlarged main part of a connection structure between a socket body shown in FIG. 2 and an adapter shown in FIG. 5; FIG.

12 is a partially enlarged cross-sectional view provided for explaining the fastening operation of the lock pawl portion in the example shown in FIG. 2.

Fig. 13 is a partially enlarged cross-sectional view provided for explaining the attachment procedure of the socket body to the adapter.

14A and 14B are partial enlarged cross-sectional views each provided for explaining a procedure of detaching a socket body from an adapter.

Fig. 15 is a partial sectional view showing a modification of the adapter used in the example of the socket for semiconductor device according to the present invention.

Fig. 16A is a front view showing another example of the contact terminal accommodated in the adapter used for the socket for semiconductor device according to the present invention, and Fig. 16B is a side view of A of Fig. 16;

FIG. 17A is a partial cross-sectional view showing an example of a socket for a semiconductor device according to the present invention to which another example of a contact terminal used for an adapter is applied; FIG. 17B is a description of the operation in the example shown in FIG. 17A Partial section provided on.

Fig. 18A is a front view showing still another example of a contact terminal housed in an adapter used for an example of a socket for a semiconductor device according to the present invention; Fig. 18B is a side view of A of Fig. 18;

FIG. 19A is a front view illustrating still another example of a contact terminal accommodated in an adapter used in one example of a socket for a semiconductor device according to the present invention; FIG. 19B is a side view of A of FIG. 19.

Claims (5)

A socket body having a semiconductor device accommodating portion for detachably accommodating the semiconductor device; A first contact terminal disposed in the semiconductor device accommodating portion and having a pair of elastic contact pieces for selectively sandwiching terminals of the semiconductor device, and a fixed side terminal connected to the contact pieces; An adapter detachably disposed on a wiring board having an electrode surface on which an electrode group is formed, the socket body having a socket body connection surface to which the socket body is detachably connected, and supporting the socket body; A contact piece portion disposed in the adapter and contacting the fixed side terminal of the first contact terminal when the socket body is connected to the socket body connection surface, and an electrode surface of the wiring board connected to the contact piece portion; A terminal of the semiconductor device which is formed so as to be elastically displaceable in a direction orthogonal to the electrode and abuts on the electrode surface, and which is accommodated in the semiconductor device accommodating portion, through the first contact terminal, the electrode surface of the wiring board. And a second contact terminal electrically connected to the socket for a semiconductor device. The method of claim 1, A plurality of fixing pieces which are integrally formed at the bottom of the adapter and have a pair of elastically displaceable lock pieces which are in an engaged state or a non-engaged state in the fixing hole of the wiring board, and for locking the adapter to the wiring board. Polbuwa, And a screw member for attaching the lock piece of the fixing pawl portion to the peripheral edge of the fixing hole of the wiring board. The method of claim 2, The engaging portion in the pair of lock piece portions formed in a two-pronged form has a slope portion engaged with the periphery of the fixing hole of the wiring board, and the screw member is a conical shape formed between the pair of lock piece portions. A socket for a semiconductor device, characterized in that it is screwed into a hole on the top. The method of claim 1, A pawl portion integrally formed at the bottom of the socket main body so as to be elastically displaceable and brought into an engaged state or a non-engaged state at the periphery of the slit formed on the socket body connecting surface of the adapter; An opening formed in the adapter and communicating with a circumference of the slit, A socket for a semiconductor device, characterized in that the pole portion is brought into a non-engaged state by a tip of a jig inserted through the opening. The method of claim 1, The contact piece portion and the fixed-side terminal in the second contact terminal are integrally formed by a press working with a strip-shaped thin metal material having a predetermined width and thickness.

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