JP2006126063A - Semiconductor test apparatus and ic socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable a lot of ICs to be simultaneously conveyed and simultaneously tested without increasing any implementation area for IC sockets in a test board. <P>SOLUTION: A semiconductor test apparatus is provided with an IC socket 102 wherein a plurality of measuring sections for measuring an electric property of an IC being an object to be tested are arranged in parallel; belt conveyor control devices 104a, 104b which carry ICs in respective measuring sections and carry ICs out of respective measuring sections by using a conveyor way; and a tester main unit 106 which supplies respective measuring sections of the IC socket with test signals. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a semiconductor inspection apparatus for inspecting an IC to be tested and an IC socket for accommodating the IC to be tested.

  An IC test system capable of simultaneously inspecting a plurality of ICs is described in Patent Document 1, for example. In the IC test system described in Patent Document 1, a plurality of ICs are juxtaposed on an inspection board, and a test head is brought into contact with each IC simultaneously to measure predetermined electrical characteristics.

FIG. 7 is a perspective view showing an example of a configuration of a semiconductor inspection apparatus (conventional example) in which a plurality of ICs are juxtaposed on a common inspection board and simultaneous inspection of each IC can be performed. The semiconductor inspection apparatus has a tester main body 706 and an inspection board 704 disposed on the tester main body 706, and the tester main body 706 and the inspection board 704 are electrically connected via connection pins 705. Yes. On the inspection board 704, a plurality of IC sockets 701 for storing ICs to be inspected are provided. Each IC socket 701 includes a pressing lid 702 and a lower lid 703. The IC to be inspected is stored in each IC socket 701, and in this state, a test pattern is simultaneously supplied from the tester body 706 to each IC, and as a result, the level of the signal output from each IC is measured, etc. Simultaneous inspection of each IC is performed.
Japanese Patent Laid-Open No. 10-340937 (see FIG. 3)

  In the configuration of FIG. 7, since a plurality of IC sockets are arranged in a plane (two-dimensional) on the inspection board, an attempt to increase the number of simultaneous inspections of the IC inevitably requires mounting of the inspection board (inspection stage). Increases area. Therefore, the number of ICs that can be inspected simultaneously cannot be increased dramatically. Further, in the example described in FIG. 3 of Patent Document 1, the IC to be inspected is exchanged by exchanging a tray on which a plurality of ICs are mounted. In order to carry out this method, a large-scale apparatus is required, and it takes time to replace the tray. Therefore, it is not necessarily an efficient method from the viewpoint of continuous supply and unloading of ICs.

  An object of the present invention is to inspect a large number of ICs simultaneously and increase the number of ICs quickly and efficiently without increasing the mounting area of an inspection board (inspection stage).

  The semiconductor inspection apparatus according to the present invention includes an IC socket in which a plurality of measurement units for measuring the electrical characteristics of an IC to be tested are arranged in parallel with each other, the loading of the IC into each measurement unit, and each measurement unit from A transport device that carries out the IC in a conveyor manner; and a tester that supplies a test signal to each of the measurement units of the IC socket.

  By using an IC socket (a jig for measuring the electrical characteristics of an IC) that has a three-dimensional structure that allows multiple ICs to be inspected simultaneously by arranging each measurement unit in parallel, the number of ICs that can be inspected simultaneously It can be improved dramatically. In addition, the IC handling capability is dramatically improved by enabling the IC to be continuously carried into and out of each measuring unit by the conveyor system. Therefore, simultaneous inspection of a large number of ICs and quick and efficient IC handling can be achieved at the same time. That is, the number of simultaneous IC tests per inspection board can be dramatically increased, and the inspection time can be shortened. Furthermore, since the plurality of measuring units are arranged in parallel in the IC socket, the mounting area of the IC socket on the inspection board itself does not increase, and the device configuration can be made compact. Furthermore, by adopting a conveyor system (for example, a belt conveyor system), a large number of ICs can be transported very efficiently, and the inspection efficiency is further increased.

  In the present invention, a plurality of the IC sockets are provided in a transport path by the transport device. With this configuration, pipeline processing for IC inspection is possible, and very efficient IC inspection that has never been achieved is realized.

  An IC socket according to the present invention is an IC socket including a measuring unit that measures the electrical characteristics of an IC to be tested based on a test signal supplied from a tester, and includes a connection pin connected to an external connection terminal of the IC. And a connection substrate that can be retracted and returned from the transport path in synchronization with the loading and unloading of the IC transported by a conveyor system. With this configuration, it is possible to flexibly cope with simultaneous inspection of a large number of ICs, efficient loading and unloading of ICs, and various inspections of various ICs. Further, the configuration of the IC socket of the present invention is simplified, which is advantageous in terms of downsizing and cost of the apparatus.

  In the present invention, the connection board is replaceable. With this configuration, it is possible to easily and inexpensively test various ICs by simply exchanging the connection substrate and without preparing an expensive dedicated inspection board and IC socket. Further, even when a new IC product is developed, the connection board may be improved so as to be compatible with the IC, and a flexible and quick response is possible.

  According to the present invention, by using an IC socket having a three-dimensional structure capable of simultaneously inspecting a plurality of ICs, the number of ICs that can be inspected simultaneously can be dramatically improved. Therefore, the inspection time can be greatly shortened. Further, by transferring the IC to the IC socket by a conveyor system, a large number of ICs can be transferred quickly and efficiently.

(First embodiment)
FIG. 1 is a perspective view showing a configuration of an example of a semiconductor inspection apparatus of the present invention. As shown in the figure, an inspection board 107 is disposed on a tester main body 106, and both are electrically connected to each other via connection pins 105. At the center of the inspection board 107, an IC socket (auxiliary device for measuring the electrical characteristics of the IC) 102 is provided, and on both sides of the tester body 106, a belt conveyor control device ( 104a, 104b) are arranged. The IC socket 102 incorporates four measuring units inside a box-shaped housing (each measuring unit is provided in parallel at a different position in the vertical direction, and its specific structure is described later. 4 ICs can be tested simultaneously.

  Further, four IC conveyors (101a to 101d) for IC conveyance are provided horizontally by connecting the IC socket (102) and the belt conveyor control device (104a, 104b). These four IC conveyors (101a to 101d) are three-dimensionally arranged in a stacked manner at a predetermined interval in the vertical direction, and the operation of each IC conveyor (101a to 101d) is a belt conveyor control device. It is controlled by 104a and 104b. As a result, four ICs can be simultaneously loaded into the IC socket 102 (and four ICs can be simultaneously unloaded from the IC socket 102). By using a belt conveyor device, stable IC conveyance is possible.

  In the semiconductor inspection apparatus of FIG. 1, the tester body 106, the inspection board 107, the IC socket 102, and the IC conveyors (101a to 101d) are arranged in three dimensions, and the belt conveyor control devices (104a and 104b) are arranged on both sides thereof. It has become the composition. In other words, the main devices are stacked vertically to save space, the belt conveyor control devices are arranged on the left and right sides, and each device is connected by a three-dimensional IC transport path that runs horizontally, making it symmetrical A compact device without waste is realized. Therefore, a very compact semiconductor inspection apparatus is realized.

  Further, the IC socket 102 has a three-dimensional structure capable of simultaneously inspecting a plurality of (four in FIG. 1) ICs, and the number of ICs that can be simultaneously measured can be easily increased by increasing the height thereof. Can be increased. Therefore, the number of ICs that can be simultaneously inspected can be dramatically improved, and the inspection time can be greatly shortened. Further, a plurality of IC conveyors (101a to 101d) are arranged in a three-dimensional manner corresponding to each measurement unit (not shown in FIG. 1) built in the three-dimensional IC socket 102, and each IC conveyor (101a ˜101d), it is possible to continuously carry in a plurality of ICs to / from each measurement unit (not shown in FIG. 1) and to carry out a plurality of ICs from each measurement unit. improves.

(Second Embodiment)
FIG. 2 is a perspective view showing another example of the semiconductor inspection apparatus of the present invention. In FIG. 2, the same reference numerals are given to portions common to FIG. 1. The basic configuration of the semiconductor inspection apparatus of FIG. 2 is the same as that of the semiconductor inspection apparatus of FIG. However, the semiconductor inspection apparatus of FIG. 2 differs in that three IC sockets (102a to 102c) are provided in the IC transport path. That is, in the apparatus of FIG. 2, a plurality of IC sockets (102a to 102c) are provided in the IC conveyance path by the IC conveyors (101a to 101d), and different types of IC inspections are performed in each IC socket. carry out. As a result, pipeline processing for IC inspection becomes possible. Therefore, a very efficient IC inspection that is not possible conventionally is realized. Note that the three IC sockets (102a to 102c) are arranged at equal intervals. Therefore, the IC loading / unloading of each IC socket is synchronized. Thereby, there is no waste in the movement of the IC conveyors (101a to 101d), and all the IC sockets (102a to 102c) can be inspected at the same time.

(Third embodiment)
FIG. 3 is an IC socket for explaining the outline of the configuration of the IC socket of the present invention and the operation of carrying the IC into the IC socket and carrying out the IC from the IC socket (operation when carrying the IC). FIG. FIG. 3 shows a cross-sectional view of the IC socket 102 in the semiconductor inspection apparatus of FIG. 1 as viewed from the A side in the drawing. In FIG. 3, the same reference numerals are given to the same parts as those in the previous drawings. As shown in the figure, inside the IC socket 102, there are four measurement units (in FIG. 3, the uppermost measurement unit is surrounded by a thick dotted line and is given a reference symbol Q. Other measurement units). Is also the same). In the figure, reference numerals 103a to 103d denote ICs to be inspected (double wavy lines are applied to the cross section of each IC). Reference numerals 201a to 201d denote connection substrates used for measuring the electrical characteristics of the IC (the cross-section of each connection substrate is given a fine oblique line from the upper left to the lower right. ). Reference numeral 205 indicates a connection pin for electrically connecting the IC socket 102 and the inspection board 107.

  The IC conveyors 101a and 101c and the IC conveyors 101b and 101d make a pair, and each move by a belt conveyor system (the moving direction is as indicated by an arrow on the right side of FIG. 3). In FIG. 3, the ICs (103 a and 103 b) are carried in from the right side surface of the IC socket 102, and the ICs (101 c and 101 d) are carried in from the left side surface of the IC socket 102. The connection substrates (201a to 201d) are in a state of being retracted downward from the IC conveyance path so as not to hinder the conveyance of the ICs (103a to 103d). Therefore, there is no problem in the movement of the IC conveyors (belt conveyors) 101a to 101d. It is also possible to adopt a method in which all ICs (103a to 103d) are carried into the IC socket 102 from the same direction.

  FIG. 4 is an IC socket for explaining the outline of the configuration of the IC socket of the present invention, and the operation of carrying the IC into the IC socket and carrying out the IC from the IC socket (operation during the inspection of the IC). FIG. As shown in the figure, the ICs (103a to 103d) to be inspected are four measuring units in the IC socket 102 (the uppermost measuring unit is indicated by reference symbol Q. The same applies to the other measuring units. Is set to each). In addition, the connection substrates (201a to 201d) are lifted from the retracted position and are in contact with the ICs (103a to 103d) (actually, electrical characteristic measurement pins are connected to the external connection terminals of the ICs). (This will be described in a later embodiment). As a result, the ICs (103a to 103d) and the tester main body 106 are electrically connected via the connection substrates (201a to 201d), so that each IC can be inspected simultaneously.

  The operation of raising (or lowering) the connection substrates (201a to 201d) is controlled by the belt conveyor control device (104a, 104b). That is, after each IC (103a to 103d) is conveyed to a predetermined position by the IC conveyor (101a to 101d) and set, the connection substrates (201a to 201d) are raised. In this way, the connection substrates (201a to 201d) are retreated to the retreat position or returned to the measurement position for the electrical characteristics of the IC by switching the descent and rise of the connection substrates (201a to 201d). be able to.

  As is apparent from FIGS. 3 and 4, a plurality of measurement units are provided in the vertical direction in one IC socket 102. Therefore, a plurality of ICs can be tested simultaneously. As a result, When testing a large number of ICs at the same time, it is not necessary to secure a particularly large mounting area for installing an IC socket on the inspection board.

(Fourth embodiment)
FIG. 5 is a cross-sectional view for explaining a specific configuration inside the IC socket of the present invention and a specific configuration of the connection substrate (lowered state) of the present invention. As shown in the figure, test signal buses 501a and 501b are arranged along the inner wall of the IC socket 102.

  Connection pins (504a to 504d) for ensuring electrical connection with the ICs (103a to 103d) are provided at the center of each connection substrate (201a to 201d). Each of the connection substrates (201a to 201d) is provided with embedded wiring (400a and 400b) for electrically connecting the connection pins (504a to 504d) and the test signal buses (501a and 501b). Yes. In addition, each of the connection substrates (501a to 501d) is supported by cams (elliptical members that can rotate around a support shaft) 502a to 502l. In FIG. 5, the cams (502a to 502l) have the long axis of the ellipse turned sideways, so that each of the connection boards (501a to 501d) is positioned below the IC (103a to 103d). ing.

  In this state, the connection pins (504a to 504d) are not in contact with the external connection terminals (in this embodiment, bump electrodes, but not shown) of the IC (103a to 103d), and thus are connected. The circuit boards (201a to 201d) and the ICs (103a to 103d) are not electrically connected. In this state, the IC (103a to 103d) can be carried into the IC socket 102, or the IC (103a to 103d) can be carried out from the IC socket 102. At this time, the connection substrates (201a to 201d) do not interfere with the IC transportation, and enable smooth and safe IC transportation. The rotation of the cams (502a to 502l) is controlled by the belt conveyor control device (104a, 104b).

  FIG. 6 is a cross-sectional view for explaining a specific configuration of the inside of the IC socket of the present invention and a specific configuration of the connection substrate (raised state) of the present invention. In FIG. 6, the cams (502a to 502d) are rotated 90 degrees from the state shown in FIG. 5, and the long axis is directed in the vertical direction, so that each connection board (201a to 201d) is pushed upward. It is in a state of being (raised). In this state, the connection pins (504a to 504d) of the respective connection substrates (201a to 201d) are in pressure contact with the external connection terminals (bump electrodes or the like) of the respective ICs (103a to 103d). (504a to 504d), embedded wiring (400a to 400d), test signal buses (501a and 501b), connection pins (205a and 205b), and the inspection board 107, the ICs (103a to 103d) and the tester main body 106 Are electrically connected. Therefore, the test signal from the tester main body 106 is supplied to each IC (103a to 103d) to be inspected via the inspection board 107, the test signal buses (501a and 501b), and the connection substrates (201a to 201d). Similarly, a signal output from each IC can be sent to the tester body 106. Note that the test signal bus (501a, 501b) is a group of a large number of signal wirings, and which signal wiring is used is determined according to the type of IC to be inspected.

  The connection substrates (201a to 201d) are manufactured specifically for the IC to be inspected, and one or more connection substrates exist for each type of IC. Therefore, the connection substrates (201a to 201d) to be used are appropriately selected according to the type of IC to be inspected. That is, the connection substrates (201a to 201d) can be detachably attached to the IC socket 102 and can be exchanged. Therefore, even if the types of ICs to be inspected are diversified, it can be dealt with by simply replacing the connection substrate accordingly.

  In the above example, one IC socket is provided with four stages of measurement units in the vertical direction, but the present invention is not limited to this, and the number of stages can be further increased. Thereby, the number of ICs to be simultaneously inspected can be increased. At this time, since each measurement unit is stacked in the vertical direction, the occupied area itself on the inspection board 107 does not change. Therefore, unlike the conventional example, in order to install a large number of IC sockets, it is not necessary to prepare an inspection board having a large mounting area, and the space of the apparatus can be saved.

  The semiconductor inspection apparatus and IC socket of the present invention can dramatically improve the number of ICs that can be simultaneously inspected by using an IC socket having a three-dimensional structure that can inspect a plurality of ICs simultaneously. . Therefore, the inspection time can be greatly shortened. Also, by transporting ICs to the IC socket by a conveyor system, there is an effect that a large number of ICs can be transported quickly and efficiently, and a semiconductor inspection apparatus and test for inspecting ICs to be tested It is useful as an IC socket for storing the target IC.

The perspective view which shows the structure of an example of the semiconductor inspection apparatus of this invention The perspective view which shows the other example of the semiconductor inspection apparatus of this invention Cross-sectional view of an IC socket for explaining the outline of the configuration of the IC socket of the present invention, and the operation of carrying the IC into the IC socket and carrying out the IC from the IC socket (operation when carrying the IC) Cross-sectional view of an IC socket for explaining the outline of the configuration of the IC socket of the present invention, and the operation of carrying in and out of the IC into the IC socket (operation during IC inspection) Sectional drawing for demonstrating the concrete structure inside the IC socket of this invention, and the concrete structure of the board | substrate for connection (down state) of this invention. Sectional drawing for demonstrating the specific structure inside the IC socket of this invention, and the specific structure of the board | substrate for connection (raised state) of this invention. The perspective view which shows an example of the structure of the semiconductor test | inspection apparatus (conventional example) which can juxtapose several ICs on a common test | inspection board and can test simultaneously of each IC.

Explanation of symbols

101 (101a to 101d) IC conveyor 102 (102a to 102c9) IC socket 103 (103a to 103d) IC
104 (104a to 104d) Belt conveyor control device 105, 205, 504 Connection pin 106 Tester body 107 Inspection board 400 (400a to 400h) Embedded signal wiring 501 (501a, 501b) Test signal bus 502 (502a to 502l) Cam

Claims (4)

An IC socket in which a plurality of measuring units for measuring electrical characteristics of the IC to be tested are arranged in parallel;
A transport device that carries in the IC to each of the measurement units and carries out the IC from each of the measurement units in a conveyor system;
A tester for supplying a test signal to each of the measurement units of the IC socket;
A semiconductor inspection apparatus. The semiconductor inspection apparatus according to claim 1,
A semiconductor inspection apparatus in which a plurality of IC sockets are provided in a conveyance path by the conveyance apparatus. An IC socket including a measurement unit that measures electrical characteristics of an IC to be tested based on a test signal supplied from a tester,
An IC socket having a connection board that has a connection pin connected to an external connection terminal of the IC, and that can be retracted and returned from the transfer path in synchronization with loading and unloading of the IC conveyed by a conveyor system. An IC socket according to claim 3,
An IC socket in which the connection board is replaceable.

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