JP2006017527A - Automatic testing apparatus of semiconductor device, conveyer, and test board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a testing apparatus of a semiconductor device and a test board that can perform continuous automatic test inexpensively with a socket for the testing apparatus having a structure capable of responding to many forms and a plurality of manufacturers. <P>SOLUTION: A socket section of a test board depending on the type of a BGA package of the semiconductor device is constituted so that the socket body section is common in various kinds of packages and only the socket cover section depends on each BGA package. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an automatic test method for a semiconductor device such as a memory element, and further includes an automatic test apparatus for a semiconductor device having a transport mechanism that can handle various types of semiconductor devices of package sizes and capable of continuous testing. And a test board for semiconductor devices.

  FIG. 4 shows a conventional automatic test apparatus for semiconductor devices, and FIG. 5 is a side view showing the structure of a test board used in the automatic test apparatus of FIG. In FIG. 4, 1 is an automatic test device, 2 is a transfer device, 3 is a controller, 4 is a test board, 5 is a semiconductor test device, and 6 is a test board storage shelf. The automatic test apparatus 1 includes a transfer device 2 and a controller 3 that controls the transfer device 2, and is connected to a semiconductor test device 5. The semiconductor test apparatus 5 automatically performs operation tests such as electrical tests and function tests of semiconductor devices.

  The transport apparatus 2 mainly performs handling for performing a one-cycle test of a semiconductor device to be tested (hereinafter abbreviated as an IC) and sequentially performing tests for testing a large number of various types of ICs. Device. The controller 3 gives an operation command to the transfer device 2 while taking a timing with the operation test of the semiconductor test apparatus 5, and so to speak, controls the entire semiconductor automatic test system.

  FIG. 5 is a side view of the test board 4 in the transport apparatus 2, 10 is a connection mechanism with the semiconductor test apparatus 5, 11 is a socket substrate part, and 12 is a socket part. Although not shown, an IC under test is mounted on the socket portion 12, and a terminal as a probe contact is incorporated in the socket portion 12. Ball bumps on the bottom surface of the IC package are electrically connected to the terminal of the socket portion 12. Connected.

  By the way, in order to perform high-density mounting on a printed circuit board, many ICs such as a BGA (Ball Grid Array) type have come to be used today. These BGA package ICs have ball bumps arranged in a matrix on the bottom surface of the package. Hereinafter, this type of semiconductor device is referred to as a BGA package. Since BGA packages that can be downsized can be expected to provide high-density mounting and high-quality waveform transmission within the package, surface-mount type ICs have become mainstream.

  In order to test these BGA packages at the element level, it is necessary that all ball bumps on the bottom surface of the BGA package are electrically connected to terminals of individual probe contacts of the test board 4. Normally, a pogo pin, which is a component developed as a terminal of the probe contact, is used for testing. Therefore, it is common to use the test board 4 in which pogo pins and pogo pin sockets as a required number of probe contacts are embedded at positions corresponding to individual BGA packages.

On the other hand, there are many types of these BGA package semiconductor devices in recent years, and the package sizes are different for each manufacturer even in the same type. For example, as shown in FIG. 3, the arrangement of BGAs is different such that company A has 5 × 7 columns, company B has 7 × 7 columns, and company C has 7 × 5 columns. Thus, conventionally, test boards 4 have been individually prepared for each BGA package size, but the development of these test boards 4 has taken considerable costs. Also, the automatic test is temporarily interrupted every time the product type or manufacturer changes, and the test board (A) in FIG. 4 is transferred from the test boards (B), (C), (D), etc. of the test board storage shelf 6 to the operator. Had to be replaced with a test board corresponding to BGA. There are known automatic test apparatuses that automatically select various types of test boards and continuously test them (for example, Patent Document 1), but these test boards 4 have expensive pogo pin components for each BGA package. The socket used was a very expensive test board.
JP 2001-83207 A

  In the present invention, the socket body portion of the BGA package is created so as to be common to each type of package, and only the socket cover is manufactured for each different BGA package. The purpose is to improve efficiency.

  The present invention is arranged in a matrix corresponding to all the ball bumps of a plurality of types of semiconductor devices at the same pitch as that of a semiconductor device having ball bumps arranged at a predetermined pitch on the bottom surface of the BGA package. A socket body composed of a group of terminals that can be electrically connected to the bumps, and a socket cover that serves as a guide for disposing the semiconductor device at a position where all the ball bumps of the semiconductor device can be appropriately connected to the socket body. The socket body is shared by a plurality of types of BGA packages, and the test board of the automatic test device for semiconductor devices is configured so that only the socket cover is prepared for each BGA package.

  According to the socket cover system in which the socket body and the socket cover of the present invention are separated, an expensive socket body can be used in common, and only the socket cover needs to be prepared corresponding to the semiconductor device, which greatly reduces the cost. In addition, a plurality of tests can be performed with one test board, and further, by using this socket, there is an advantage that it is possible to continuously test different BGA packages.

  BGA package test boards that differ for each manufacturer and element have been developed for each type. By sharing the expensive socket body and preparing only the socket cover separately, the cost of the test board can be reduced. Realized.

  1 and 2 illustrate an embodiment of a test board according to the present invention. FIG. 1 is a configuration diagram of an automatic test apparatus according to the present invention. FIG. 2 is a diagram of a test board showing details of a socket portion according to the present invention. It is a side view. 1, the same components as those in FIGS. 4 and 5 are denoted by the same reference numerals, and the description thereof is omitted. In the present invention, the socket portion 12 in FIG. 5 is separated into a socket body 13 and a socket cover 14 as shown in FIG. In FIG. 2, 15 is a pressing plate that presses the IC mounted on the socket body 13 from above, and 16 is a piston cylinder of the hand portion of the conveying device 2, and the pressing plate 15 is further pressed from above to set the IC. The ball bump on the bottom of the package is brought into contact with the pogo pin of the socket body.

  In the socket body, pogo pins are embedded in a matrix so as to be compatible with all BGA package sizes such as Company A, Company B and Company C illustrated in FIG. That is, as shown in FIG. 2, the pogo pin 17 embedded in the socket body 13, the pogo pin socket 18 embedded in the socket substrate 11, and the coaxial cable through the internal wiring of the socket substrate 11 are connected to the test board 4, Further, it is connected to the semiconductor test apparatus 5. In other words, the IC on the test board 4 can be tested in a state equivalent to that mounted on the IC socket in the semiconductor test apparatus 5.

  FIG. 6 is a schematic operation explanatory view of the transfer device 2 using the test board of the present invention. In FIG. 6, 20 is an IC tray for supply, and 21 is a defective box. Prior to the test, the hand unit arranges the socket cover 14 corresponding to the BGA package to be tested at a predetermined position of the socket body 13 of the test board 4. The supply IC tray 20 is loaded with a large number of devices under test of the same type, and the IC tray 20 is stored in a plurality of layers, and the IC tray 20 is sequentially stacked from the IC tray 20 at the top. Is set on the socket main body 13 of the test board 4, and the IC is pressed from above with the socket pressing plate 15 so as to contact the pogo pin, thereby achieving electrical conduction. The tested non-defective product is returned again to the same IC tray 20, and the defective product is transferred to the defective product box 21. When all of the ICs in one supply IC tray 20 have been tested, the trays are moved to a predetermined location as tested IC trays 20 and are sequentially mounted on a plurality of supply IC trays waiting for testing. The IC on the top 20 IC tray 20 is tested.

  When the IC under test is gripped from the IC tray 20 or placed on the socket main body 13, the IC is operated by the hand portion of the transport device 2. FIG. 7 is a plan view of the handling unit of the transport device, FIG. 8 is a side view of the handling unit of the transport device, and supplementary explanation of the schematic operation of the transport device described in FIG. The hand unit 24 of the transfer device moves to a predetermined position by combining the movements of the X-axis robot 22 and the Y-axis robot 23. The robot's hand unit 24 operates in the vertical direction to handle the IC with air when a handling mechanism for transporting the selected socket cover 14 onto the socket body 13 or when an IC gripped from the IC tray 20 is placed on the socket. A rubber pad 25 for sucking and a piston cylinder 16 for holding the IC by the holding plate 15 operate in conjunction with each other.

  FIG. 9 is a flowchart showing one-cycle operation of the controller of the present invention. The controller 3 operates in cooperation with the semiconductor test apparatus 5 while coordinating the mechanical control timing and the function test timing while handling the IC under test of various BGA packages. First, the handling unit sets the corresponding socket cover 14 at a predetermined position on the socket body 13 (step S1). Next, the handling unit takes out the IC under test from the IC tray 20 while sucking it with air, transports it to the socket body 13 (step S2), and further presses the IC mounted on the socket with the pressing plate 15 (step S3). . Low temperature blowing is started to the socket part (step S4), and an electrical test is further performed (step S5). After that, air blowing is stopped (step S6), the holding plate 15 is raised right above (step S7), the tested IC is moved to the original IC tray 20 or the defective box 21 (step S8), and one cycle test is completed. To do.

It is a block diagram of the automatic test apparatus of this invention. It is a side view of the test board of this invention. Indicates the type of BGA package. It is explanatory drawing of the conventional automatic test apparatus. It is a side view which shows the structure of the conventional test board. It is a schematic operation | movement explanatory drawing of the conveying apparatus of this invention. It is a handling part top view of the conveying apparatus of this invention. It is a handling part side view of the conveying apparatus of this invention. It is a flowchart which shows 1 cycle operation | movement of the controller of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Automatic test apparatus 2 Conveyance apparatus 3 Controller 4 Test board 5 Semiconductor test apparatus 6 Test board storage shelf 6-9 No. 10 Connection mechanism 11 Socket board 12 Socket part 13 Socket main body 14 Socket cover 15 Holding plate 16 Piston cylinder 17 Pogo pin 18 Pogo pin Socket 19 Ball bump 20 IC tray 21 Defective product box 22 X-axis robot 23 Y-axis robot 24 Hand unit 25 Rubber pad

Claims (3)

It is arranged in a matrix corresponding to all the ball bumps of one or more kinds of semiconductor devices at the same pitch as the semiconductor device having ball bumps arranged at a predetermined pitch on the bottom surface of the package. A socket body composed of a group of terminals arranged to be connected to each other,
A socket cover that guides the semiconductor device to a position on the socket body that is prepared for each type of package of the semiconductor device, and where all the ball bumps of the semiconductor device can be properly connected;
A supply tray for supplying the semiconductor device to be tested;
A holding plate for pressing the semiconductor device disposed at a predetermined position from above the semiconductor device;
A socket cover selected according to the type of the semiconductor device to be tested, selected from the one or more socket covers, is moved to a predetermined position on the socket body, and the test target is removed from the supply tray. The semiconductor device is arranged at a predetermined position on the socket body by the guide of the socket cover, the pressing plate is pressed against the semiconductor device and brought into contact with the terminal group of the socket body, and the test of the semiconductor device is started. The device is moved to a predetermined tray according to the quality of the test result, and a transport control unit that sequentially supplies semiconductor devices to be tested in the same procedure,
An automatic test apparatus for semiconductor devices, comprising: It is arranged in a matrix corresponding to all the ball bumps of one or more kinds of semiconductor devices at the same pitch as the semiconductor device having ball bumps arranged at a predetermined pitch on the bottom surface of the package. A socket body composed of a group of terminals arranged to be connected to each other,
A socket cover that guides the semiconductor device to a position on the socket body that is prepared for each type of package of the semiconductor device, and where all the ball bumps of the semiconductor device can be properly connected;
A holding plate for pressing the semiconductor device disposed at a predetermined position from above the semiconductor device;
And sequentially supplying the semiconductor devices to be tested so that they can be tested. A test board for a test apparatus for testing a semiconductor device having ball bumps arranged at a predetermined pitch on the bottom surface of a package,
A socket comprising a group of terminals arranged in a matrix corresponding to all ball bumps of one or more semiconductor devices at the same pitch as the semiconductor device, and arranged so as to be electrically connected to the ball bumps The body,
A socket cover for guiding the semiconductor device to a position where it can be properly connected to all ball bumps of the semiconductor device to the socket body;
The socket body is shared by a plurality of types of semiconductor devices having ball bumps, and the socket cover is prepared for each type of package according to the arrangement of the ball bumps. Test board.

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